CN102915933A - 一种祼晶的表面贴装焊接工艺 - Google Patents

一种祼晶的表面贴装焊接工艺 Download PDF

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CN102915933A
CN102915933A CN2012103356593A CN201210335659A CN102915933A CN 102915933 A CN102915933 A CN 102915933A CN 2012103356593 A CN2012103356593 A CN 2012103356593A CN 201210335659 A CN201210335659 A CN 201210335659A CN 102915933 A CN102915933 A CN 102915933A
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chip
metal electrode
pad
substrate
crystalline substance
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廖泳
黄锦良
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XIAMEN RXD ELECTRONICS CO Ltd
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XIAMEN RXD ELECTRONICS CO Ltd
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Priority to PCT/CN2013/075996 priority patent/WO2014040423A1/zh
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Abstract

本发明公开了一种祼晶的表面贴装焊接工艺，其特征在于先提供覆晶结构的晶圆级芯片，并置于暂存容器中；该芯片的一面具有金属电极；该金属电极还可包括延伸至该芯片侧面的部分；然后提供一基板，该基板上具有可匹配的焊盘；该焊盘上预先采用钢网印刷的方式设置锡膏；再采用真空吸嘴将该芯片从该暂存容器中吸出，并置于该基板的该焊盘上；该芯片的金属电极利用该锡膏的表面张力暂时固定于该基板上；最后将暂时相互固定的该焊盘和金属电极通过回流焊接的方式连通。本技术方案节省了裸晶的后道封装工艺步骤和成本,提升了产品的竞争力.并且可以基本沿用现有的SMT设备，不需要作额外硬件的大量投入，避免了封装线的成本和工艺时间，其量产的实现较容易。

Description

一种祼晶的表面贴装焊接工艺
技术领域
本发明涉及一种对祼晶(晶圆级芯片)进行直接表面贴装焊接的工艺。
背景技术
随着半导体技术的发展，大规模/超大规模的集成电路在许多领域都得到广泛运用，这直接导致了芯片封装工艺的发展，其特点是，将已经蚀刻、生长处理完毕的晶圆级芯片（裸晶），通过封装封装于一个特别的外壳之中，从而可以使芯片应用于具体的电路基板上时，可以直接与封装上的电极实现连接，例锡焊接、碰焊等。这种方式已经形成了成熟的工艺，可以使小体积的裸晶能够可靠地通过通用的焊接工艺直接为下游厂家使用。
所以，裸晶的封装工艺就成了现代集成电路生产工艺中一个不可或缺的步骤，一方面，需要耗用大量的封装材料包括树脂、金属等，并且其封装工艺会针对每一个芯片进行处理，必然耗用相当的封装时间。如此，增加了芯片从成型到应用的使用周期，同时限制了必要的物料成本支出。另一方面，封装工艺会直接作用于芯片本体，芯片会受到封装工艺的影响，其封装出来的成品可靠性必然受到封装工艺的制约。
所以，在产品被大量应用时，封装工艺的芯片，总是难以避免封装结构带来过高的物料成本和繁杂物料带来的工艺流程太长，而且可靠性不高的问题。
发明内容
针对上述封装工艺带来的过高的物料、工艺成本以及可靠性不高的问题，本发明的主要目的在于提供一种祼晶表面贴装焊接的制造方法，解决祼晶大规模应用于生产时因为封装导致的上述问题，其技术方案如下：
一种祼晶的表面贴装焊接工艺，包括以下步骤：
编排：提供覆晶结构的晶圆级芯片，并置于暂存容器中；该芯片的一面具有金属电极；该金属电极还可包括延伸至该芯片侧面的部分；
印刷：提供一基板，该基板上具有可匹配该芯片其金属电极的焊盘；该焊盘上预先采用锡膏印刷机通过预设的网板在该焊盘上用钢网印刷的方式设置锡膏；
贴装：采用真空吸嘴将该芯片从该暂存容器中吸出，并置于该基板的该焊盘上；该金属电极与所述焊盘相对应；且该芯片的金属电极利用该锡膏的表面张力暂时固定于该基板上；以及
焊接：将暂时相互固定的该焊盘和金属电极通过回流焊接的方式连通。
作为该工艺技术方案的优选者，可以有如下方面的改进：
较佳实施例中，该暂存容器为编带或托盘；且该编排步骤中，该金属电极朝向该编带或托盘容置空间的底部；该编带或托盘置于一自动进给的贴片机供料台上，并受控逐个进给。
较佳实施例中，该焊接步骤包括以下流程：
传板：将已经贴装好的该基板传送如回流焊接设备，并使其受控行进；
预热：将所述锡膏中的辅助溶剂挥发，使基板及祼晶完成预热
保温：活化所述锡膏中的助焊剂，并蒸发多余溶剂；
回流焊接：使该金属电极与基板其焊盘间的锡膏熔化，形成新的合金层使二者导通；以及
冷却：使所述锡膏、金属电极、焊盘的温度降低至冷却温度；并将该基板传出回流设备。
较佳实施例中，该芯片上金属电极表包括单一金属或合金。
较佳实施例中，当该金属电极具有延伸于该芯片的侧面部分时，可以采用不对称的形式。
本发明带来的有益效果是:
1.将裸晶通过表面贴装的方式直接焊接在基板上,节省了裸晶的后道封
装工艺步骤和成本,提升了产品的竞争力.
2.通过本发明所列方式,裸晶的贴片工艺可以基本沿用现有的SMT设备，
不需要作额外硬件的大量投入，避免了封装线的成本和工艺时间，其
量产的实现较容易；
附图说明
以下结合附图实施例对本发明作进一步说明：
图1是本发明实施例一所用的祼晶10其侧视图；
图2是本发明实施例一其编排步骤中裸晶10位于暂存容器20中的剖视示意图；
图3是本发明实施例一编排步骤中裸晶10位于暂存容器20中的俯视图；
图4是本发明实施例一印刷步骤的侧视剖视图；
图5是本发明实施例一贴装步骤中真空吸嘴70将裸晶10取出暂存容器20的状态图；
图6是本发明实施例一贴装步骤中，真空吸嘴70将裸晶10与基板30的焊盘31位置相互对其的状态图；、
图7是本发明实施例一贴装步骤中，裸晶10依靠焊锡膏50张力暂时固定于基板30上的状态图；
图8是本发明实施例一焊接步骤完毕的侧视剖视图。
图9是本发明实施例二其裸晶10的侧视图；
图10是本发明实施例二裸晶10置于暂存容器20中侧视剖视图；
图11是本发明实施例二裸晶10置于暂存容器20中的俯视图；
图12是本发明实施例二焊接步骤完毕的正视剖视图。
具体实施方式
实施例一：
图1,图2所示，本实施例一所利用的祼晶10，在祼晶10的底面设置了可供焊接的金属电极11。
如图2和图3所示，在编排的步骤中，将祼晶10逐个放入暂存容器20中予以保存，本实施例用到的暂存容器20为线性编带的结构，及长形的编带设置多个直线排列的容置空间23，每一个裸晶10占据一个容置空间23，彼此独立；并且祼晶10的金属电极11全部朝向容置空间23的底部。当祼晶10置入容置空间23完毕，暂存容器20的开口处会有保护膜21将容置空间23封闭，以为保护。编带沿其长度方向具有定位孔22，方便编带机的棘轮等机构抓取并驱动其行进，实现逐个自动进给。本实施例的这种编带适用于所有贴片产品的贴片机，具有良好的通用性。
图4为本实施例一印刷步骤的示意图。基板30为最终需要固定裸晶10的承载物，其上具有焊盘31，且焊盘31已经和基板30上表面的其他导体组成合适的线路。采用钢网印刷的工艺，锡膏印刷机上设有网板40，网板40的网孔41与焊盘31位置相互对应，并且网板40与焊盘31的相对高度经过每个产品不同的需求进行设计。当网板40设置完毕后，锡膏印刷机上的刮刀60将锡膏50反复推送，直至锡膏50妥善填充入网板40的网孔41内，如图4.此过程后需要撤离网板40.
图5所示为本实施例一贴装步骤的一个状态，在该状态下，真空吸嘴70贴近裸晶10的上表面，将其从暂存容器20的容置空间23向上提拉而出，并且将其搬运至基板30处以待贴装。
图6是实施例一贴装步骤的第二个状态，该状态下真空吸嘴70在精确控制下将裸晶10同姿态运送至基板30上方，并且使裸晶10的金属电极11与基板30上的焊盘31一一对应。
如图7，利用锡膏50本身的张力，金属电极11和焊盘31二者得以暂时固定，而不会因为气流、晃动而随意错位。
在此之后，锡膏在回流焊机经过了以下步骤：
传板：将已经贴装好的该基板30传送如回流焊接设备，并使其受控行进；
预热：将锡膏50中的辅助溶剂挥发，使基板30及祼晶10完成预热
保温：活化锡膏50中的助焊剂，并蒸发多余溶剂；
回流焊接：使该金属电极11与基板其焊盘间的锡膏50熔化，形成新的合金层使二者导通；以及
冷却：使锡膏50、金属电极11、焊盘31的温度降低至冷却温度；并将该基板传出回流设备。
完成上述过程后，如图8所示，已经贴装并固定完毕的祼晶10，金属电极11与焊盘31已经由熔融后的锡膏50所固定并保持连通，实现金属电极11与焊盘31的电气导通和机械固定。
可见，将祼晶10直接采用暂存容器20装载的方式，使祼晶10的使用避免了封装，最终不需要单个封装就可以将祼晶固定并连通于基板30上，完全节省了单个祼晶的封装工艺步骤及生产成本；另一方面，祼晶10所有的贴片工艺可以基本沿用现有的SMT设备，不需要作额外硬件的投入，避免了封装线的成本和工艺时间，其量产的实现较容易,成本较低。
实施例二：
如图9至图12，为本发明实施例二的部分工序图。
从图9可知，该裸晶10的金属电极具有延伸于裸晶10侧面的部分，并且，图10和图11显示，该裸晶10所使用的暂存容器20乃是托盘的形态，所以裸晶10采用阵列的方式分布于暂存容器10的容置空间23中，并且，其金属电极11也是朝向于容置空间的底部。
该实施例的贴装步骤与实施例一相同，在图12中展示出，锡膏50不但介于金属电极11和焊盘31之间，而且还有附着于金属电极11在裸晶10侧面的部分，这种焊接的方式机械强度高，焊点电流大，特别地，从图12看出，在左右方向，金属电极11为对称的形式，但也可以使用不对称的形式予以实现。
以上所述，仅为本发明较佳实施例而已，故不能依此限定本发明实施的范围，即依本发明专利范围及说明书内容所作的等效变化与修饰，皆应仍属本发明涵盖的范围内。

Claims (5)

1.一种祼晶的表面贴装焊接工艺，其特征在于：包括以下步骤：
编排：提供覆晶结构的晶圆级芯片，并置于暂存容器中；该芯片的一面具有金属电极；该金属电极还可包括延伸至该芯片侧面的部分；
印刷：提供一基板，该基板上具有可匹配该芯片其金属电极的焊盘；该焊盘上预先采用锡膏印刷机通过预设的网板在该焊盘上用钢网印刷的方式设置锡膏；
贴装：采用真空吸嘴将该芯片从该暂存容器中吸出，并置于该基板的该焊盘上；该金属电极与所述焊盘相对应；且该芯片的金属电极利用该锡膏的表面张力暂时固定于该基板上；以及
焊接：将暂时相互固定的该焊盘和金属电极通过回流焊接的方式连通。
2.根据权利要求1所述一种祼晶的表面贴装焊接工艺，其特征在于：该暂存容器为编带或托盘；且该编排步骤中，该金属电极朝向该编带或托盘容置空间的底部；该编带或托盘置于一自动进给的贴片机供料台上，并受控逐个进给。
3.根据权利要求1所述一种祼晶的表面贴装焊接工艺，其特征在于：该焊接步骤包括以下流程：
传板：将已经贴装好的该基板传送如回流焊接设备，并使其受控行进；
预热：将所述锡膏中的辅助溶剂挥发，使基板及祼晶完成预热
保温：活化所述锡膏中的助焊剂，并蒸发多余溶剂；
回流焊接：使该金属电极与基板其焊盘间的锡膏熔化，形成新的合金层使二者导通；以及
冷却：使所述锡膏、金属电极、焊盘的温度降低至冷却温度；并将该基板传出回流设备。
4.根据权利要求1至3中任一项所述一种祼晶的表面贴装焊接工艺，其特征在于：该芯片上的金属电极表包括单一金属或合金。
5.根据权利要求1至3中任一项所述一种裸晶的表面贴装焊接工艺，其特征在于：当该金属电极具有延伸于该芯片的侧面部分时，可以采用不对称的形式。
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