CN202075772U - 接触式ic卡模块 - Google Patents

接触式ic卡模块 Download PDF

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CN202075772U
CN202075772U CN2011200399282U CN201120039928U CN202075772U CN 202075772 U CN202075772 U CN 202075772U CN 2011200399282 U CN2011200399282 U CN 2011200399282U CN 201120039928 U CN201120039928 U CN 201120039928U CN 202075772 U CN202075772 U CN 202075772U
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conductive layer
card module
contact type
contact
pad
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李建军
魏云海
王久君
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CHINA ELECTRICS SMART CARD Co Ltd
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CHINA ELECTRICS SMART CARD Co Ltd
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Abstract

本实用新型公开了一种接触式IC卡模块，其包括PCB电子载板和芯片，所述电子载板的一面设有接触式IC卡模块的触点，另一面设有多个焊盘；所述芯片具有多个导电凸点，采用表面组装技术(SMT)方式将所述芯片的导电凸点贴装在电子载板的焊盘上。本实用新型由于采用PCB电子载板来代替传统的载带式引线框架，采用表面组装技术(SMT)方式将所述芯片导电凸点贴装在电子载板的焊盘上代替传统超声热压的方式将金丝焊接在引线框架焊盘上，简化生产工艺、提升了产品性能，提高了生产效率，节省了原材料成本和加工成本。

Description

接触式IC卡模块
技术领域
本实用新型是有关于一种接触式IC卡模块，特别是关于一种采用PCB电子载板并采用表面组装技术(SMT)工艺加工的接触式IC卡模块。
背景技术
IC卡模块具有接触式IC卡模块和非接触式IC卡模块两种。
参见图1c所示，传统的接触式IC卡模块包括载带1’和芯片2’。载带1’具有金属表面11’和绝缘层12’，绝缘层连接在金属表面的上方。芯片2’的底部通过装片胶贴装在载带1’上，且芯片2’上的焊点和载带1’上的焊盘采用超声热压的方式进行金属线键合。采用环氧或模塑料之类的包封胶5’将装载在卷状条带上经过贴片和压焊后的芯片封装起来，以起到防水、防尘等保护作用。
上述接触式IC卡模块中，其芯片2’与载带1’之间需通过金属线键合，其键合力较弱，使得产品的合格率低。而且，芯片2’最终需要通过包封胶5’进行封装，即芯片2’整个最终处于包封胶内，使得制造工艺繁杂。
参见图1所示，传统的IC卡模块的封装方法包括以下步骤：
A、提供载带1’，参见图1a所示，载带1’具有金属表面11’和绝缘层12’，绝缘层12’连接在金属表面11’的上方；
B、贴片，参见图1b所示，将晶片上的单个芯片2’通过装片胶3’贴装在载带1’的载片台上，贴装后经在线固化炉烘干；
C、压焊，将芯片2’上的焊点和载带1’上的焊盘采用超声热压的方式进行金属线4’键合；
D、包封或塑封，参见图1c所示，采用环氧或模塑料之类的包封胶5’将装载在卷状条带上经过贴片和压焊后的芯片封装起来，以起到防水、防尘等保护作用；
E、测试，将塑封后的IC卡模块经过电性能测试，确认模块加工后是否电性能合格，合格的产品最终成为IC卡模块，参见图2至图4所示。
上述IC卡模块的封装方法的每一个步骤都需要采用IC卡专用设备生产，设备价格贵，加工工艺繁琐；而且，该封装方法的加工效率低，对引线框架精度要求高，引线框架的制备工艺难度大，均进一步提高了智能卡模块的制作成本。
实用新型内容
本实用新型的目的是，提供一种接触式IC卡模块，其能提高生产效率，简化工艺、节省原材料成本。
本实用新型的上述目的可采用下列技术方案来实现：
一种接触式IC卡模块，所述IC卡模块包括PCB电子载板和芯片，所述电子载板的一面设有接触式IC卡模块触点，另一面表面设有多个焊盘；所述芯片具有多个导电凸点，通过表面组装方式将所述芯片的导电凸点贴装在电子载板的焊盘上。
在优选的实施方式中，所述PCB电子载板包括绝缘层，绝缘层的一面设有第一导电层，绝缘层的另一面设有第二导电层，所述第一导电层的一面设有接触式IC卡模块的触点，所述第二导电层的另一面设有多个焊盘，所述绝缘层上设有使第一、二导电层相连的导电通道。
在优选的实施方式中，所述第一导电层的一面电镀形成第一保护层，所述第一保护层形成接触式IC卡模块的触点；所述第二导电层的另一面电镀形成第二保护层，所述第二保护层形成焊盘。
在优选的实施方式中，所述PCB电子载板包括绝缘层，绝缘层的一面设有第一导电层，所述第一导电层的另一面设有接触式IC卡模块的触点，绝缘层上设有能使第一导电层的一面具有外露部分的焊盘孔，所述第一导电层经焊盘孔外露部分的一面形成焊盘。
在优选的实施方式中，所述第一导电层的一面电镀形成第一保护层，所述第一保护层形成接触式IC卡模块的触点；所述第一导电层的外露部分的另一面电镀形成第二保护层，所述第二保护层形成焊盘。
在优选的实施方式中，所述导电凸点为锡球凸点，所述焊盘上设有助焊剂，通过上述表面组装方式将所述芯片导电的凸点借助助焊剂贴装在电子载板的焊盘上，通过回流焊接进行连接。
在优选的实施方式中，所述芯片的底部与PCB电子载板之间填充有胶水。
在优选的实施方式中，所述第一导电层为铜层或铝层，所述第一、二保护层分别为镀金或镀银层。
在优选的实施方式中，所述第二导电层的一面在所述焊盘外的区域设有阻焊层。
本实用新型的接触式IC卡模块的特点和优点是：
1、由于采用PCB电子载板来代替传统的载带式引线框架，即利用PCB电子载板作为载体入料和出料，从而可提高生产效率，节省原材料成本。
2、其克服了芯片与载带之间需通过金属线键合而使得键合力较弱的缺点，而是使得芯片的导电凸点与PCB电子载板的焊盘粘结的方式，省去了压焊的制造工艺，提升产品性能，简化了生产过程，提高了生产效率。
附图说明
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是传统的IC卡模块的封装方法的流程示意图，其步骤a-c显示了工艺过程；
图2是传统的IC卡模块的正面示意图；
图3是传统的IC卡模块的背面示意图；
图4是传统的IC卡模块的结构透视图；
图5是本实用新型的接触式IC卡模块的结构剖面示意图，其显示了单层导电层的状态；
图6是本实用新型的接触式IC卡模块基板的背面示意图，其显示了单层导电层的状态；
图7是本实用新型的接触式IC卡模块的封装方法的第一种实施例的流程示意图，图7中的步骤a-f显示了单面覆导电层的工艺过程；
图8是本实用新型的接触式IC卡模块的结构剖面示意图，其显示了双层导电层的状态；
图9A是本实用新型接触式IC卡模块电子载板的正面示意图，其显示了双层导电层的状态；
图9B是本实用新型接触式IC卡模块电子载板的背面示意图，其显示了双层导电层的状态；
图9C是本实用新型接触式IC卡模块的布线图；
图10是本实用新型的接触式IC卡模块的封装方法的第二种实施例的流程示意图，图10中的步骤a-f显示了双面覆导电层的工艺过程。
具体实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
实施方式1
参见图5至图7所示，本实用新型实施例提出的接触式IC卡模块，其包括PCB电子载板1和芯片2，所述电子载板1的一面(此处为图5所示的下表面)设有接触式IC卡模块的触点31，另一面(此处为图5所示的上表面)的表面设有多个焊盘32；所述芯片2具有多个导电凸点21，所述导电凸点21通过表面组装技术(SMT)的方式贴装连接在焊盘上。其中，导电凸点21的数量与焊盘21的数量可以相同，也可以不相同，此处，具有八个焊盘32，具有五个导电凸点21。
本实用新型实施例由于采用PCB电子载板1来代替传统的载带式引线框架，即利用PCB电子载板1作为载体入料和出料，从而可提高生产效率，节省原材料成本。
本实施例克服了传统的芯片与载带之间需通过金属线键合而使得键合力较弱的缺点，而是使得芯片2的导电凸点与PCB电子载板1的焊盘32粘结的方式，省去了压焊的制造工艺，从而简化了生产过程，提高了生产效率。
作为本实用新型的一个优选实施方式，所述PCB电子载板1包括绝缘层11，绝缘层11的一面(此处为图5所示的下表面)设有第一导电层12，所述第一导电层12的另一面(即下表面，远离绝缘层11的一面)设有接触式IC卡模块的触点31，绝缘层11上设有多个能使第一导电层12的一面具有外露部分的焊盘孔，所述第一导电层12上经焊盘孔外露部分的一面形成焊盘32。进一步而言，所述第一导电层12的下表面电镀形成第一保护层，所述第一保护层形成接触式IC卡模块的触点31；所述第一导电层12的外露部分的上表面电镀形成第二保护层，所述第二保护层形成焊盘32。其中，绝缘层11的基本材料可为玻璃纤维布，第一导电层12一股为可导电的金属层，例如铜或铝，或铜镀金等。
所述导电凸点21可为锡球凸点21A，所述焊盘上设有助焊剂(例如焊膏6)，所述锡球凸点21A通过焊膏6连接在焊盘32上。在制作时，可通过丝网印刷的工艺将焊膏6印刷在焊盘32上。具体是，参见图7b和图7c所示，在绝缘层11的上表面设置网板7，在网板7上对应焊盘32的位置设有网板孔71，使得焊盘32外露；接着，将焊膏6放置在网板7上，利用刮刀72将焊膏6刮平，焊膏6则会被刮入网板孔71内，可使得焊膏6与网板7的上表面平齐，之后移除网板7，则使得焊膏6准确地设置在焊盘32上。接着，采用表面组装技术(SMT)工艺方式，芯片2以其锡球凸点21A通过焊膏6粘结在焊盘32上，参见图7e所示，进行回流焊接，使锡球凸点21A与焊盘32相连接并形成键合点4。也就是说，芯片2通过回流焊接使锡球凸点21A与焊盘32相连接形成键合点。
本实用新型实施例采用锡球键合的方式，使得模块功耗降低10％，键合力(约100克)是传统金属线键合方式(5克)的20倍，大大提高了产品的性能及合格率。
作为本实用新型的一个优选实施方式，所述芯片2的底部与PCB电子载板1之间填充有胶水51；此处，芯片2的底部与绝缘层11之间填充有胶水51。其中，参见图7f所示，可借助滴胶头5，将胶水51填充在芯片2的底部与绝缘层11之间，此时，芯片2的底部，键合点4均密封在胶水51中，从而对焊点和芯片电路进行很好地保护，操作简单，省去了传统模块需要塑封/包封的过程。
实施方式2
本实用新型的实施方式与实施方式1的主要区别是，PCB电子载板的结构不同。具体是，实施方式1中的PCB电子载板1是绝缘层单面覆导电层的结构，而本实施方式2中的PCB电子载板8是绝缘层双面覆导电层的结构。
参见图8至图10所示，本实施例的PCB电子载板8包括绝缘层81，绝缘层81的一面(此处为下表面)设有第一导电层82，绝缘层81的另一面(此处为上表面)设有第二导电层83，所述第一导电层82的下表面设有接触式IC卡模块的触点31，所述第二导电层83的上表面形成焊盘32，所述绝缘层81上设有使第一、二导电层82、83相连的导电通道84。
进一步地，所述第一导电层81的下表面电镀形成第一保护层，所述第一保护层形成接触式IC卡模块的触点31；所述第二导电层的上表面电镀形成第二保护层，所述第二保护层形成焊盘32。
其中，所述第一、二导电层81、82可分别为铜层或铝层，所述第一、二保护层31、32可分别为镀金或镀银层。
作为本实用新型的一个优选实施方式，上述第二导电层83的上表面在焊盘32外的区域设置有阻焊层，用于防止锡外流。需要说明的是，所述阻焊层仅仅在双面覆导电层的PCB电子载板8中才出现。
本实施方式的其他结构、工作原理和有益效果与实施方式1的相同，在此不再赘述。
以上所述仅为本实用新型的几个实施例，本领域的技术人员依据申请文件公开的可以对本实用新型实施例进行各种改动或变型而不脱离本实用新型的精神和范围。

Claims (9)

1.一种接触式IC卡模块，其特征在于，所述IC卡模块包括PCB电子载板和芯片，所述电子载板的一面设有接触式IC卡模块触点，另一面表面设有多个焊盘；所述芯片具有多个导电凸点，通过表面组装方式将所述芯片的导电凸点贴装在电子载板的焊盘上。
2.根据权利要求1所述的接触式IC卡模块，其特征在于，所述PCB电子载板包括绝缘层，绝缘层的一面设有第一导电层，绝缘层的另一面设有第二导电层，所述第一导电层的一面设有接触式IC卡模块的触点，所述第二导电层的另一面设有多个焊盘，所述绝缘层上设有使第一、二导电层相连的导电通道。
3.根据权利要求2所述的接触式IC卡模块，其特征在于，所述第一导电层的一面电镀形成第一保护层，所述第一保护层形成接触式IC卡模块的触点；所述第二导电层的另一面电镀形成第二保护层，所述第二保护层形成焊盘。
4.根据权利要求1所述的接触式IC卡模块，其特征在于，所述PCB电子载板包括绝缘层，绝缘层的一面设有第一导电层，所述第一导电层的另一面设有接触式IC卡模块的触点，绝缘层上设有能使第一导电层的一面具有外露部分的焊盘孔，所述第一导电层经焊盘孔外露部分的一面形成焊盘。
5.根据权利要求4所述的接触式IC卡模块，其特征在于，所述第一导电层的一面电镀形成第一保护层，所述第一保护层形成接触式IC卡模块的触点；所述第一导电层的外露部分的另一面电镀形成第二保护层，所述第二保护层形成焊盘。
6.根据权利要求1所述的接触式IC卡模块，其特征在于，所述导电凸点为锡球凸点，所述焊盘上设有助焊剂，通过上述表面组装方式将所述芯片导电的凸点借助助焊剂贴装在电子载板的焊盘上，通过回流焊接进行连接。
7.根据权利要求1所述的接触式IC卡模块，其特征在于，所述芯片的底部与PCB电子载板之间填充有胶水。
8.根据权利要求3或5所述的接触式IC卡模块，其特征在于，所述第一导电层为铜层或铝层，所述第一、二保护层分别为镀金或镀银层。
9.根据权利要求2所述的接触式IC卡模块，其特征在于，所述第二导电层的一面在所述焊盘外的区域设有阻焊层。 
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* Cited by examiner, † Cited by third party
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CN102543769A (zh) * 2011-12-27 2012-07-04 广州市明森机电设备有限公司 一种双界面卡的生产方法及其设备
CN104167380A (zh) * 2014-05-30 2014-11-26 上海芯哲微电子科技有限公司 一种smt贴片封装结构的smt贴片封装方法
CN104602461A (zh) * 2014-12-15 2015-05-06 苏州海博智能系统有限公司 一种ic卡载带焊接加工方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102543769A (zh) * 2011-12-27 2012-07-04 广州市明森机电设备有限公司 一种双界面卡的生产方法及其设备
CN102543769B (zh) * 2011-12-27 2014-10-22 广州市明森机电设备有限公司 一种双界面卡的生产方法及其设备
CN104934726A (zh) * 2014-03-18 2015-09-23 苏州海博智能系统有限公司 载带连接器
CN104934726B (zh) * 2014-03-18 2021-08-06 苏州海博智能系统有限公司 载带连接器
CN104167380A (zh) * 2014-05-30 2014-11-26 上海芯哲微电子科技有限公司 一种smt贴片封装结构的smt贴片封装方法
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