CN206098388U

CN206098388U - Formal dress chip level white light LED filament light source

Info

Publication number: CN206098388U
Application number: CN201620929745.0U
Authority: CN
Inventors: 郑敏
Original assignee: Xiamen Zhong Xinda Ltd
Current assignee: Xiamen Zhong Xinda Ltd
Priority date: 2016-08-24
Filing date: 2016-08-24
Publication date: 2017-04-12
Anticipated expiration: 2026-08-24

Abstract

The utility model discloses a formal dress chip level white light LED filament light source, it includes transparency carrier, a plurality of epitaxial chip and phosphor powder membrane, be provided with the circuit pad on the transparency carrier, be provided with a plurality of conducting layers on this transparency carrier correspond the big or small circuit pad of epitaxial chip, on a plurality of epitaxial chips cover a plurality of conducting layers of brilliant this transparency carrier in corresponding counterpoint, and all paste on every formal dress chip and cover the pressfitting and have the phosphor powder membrane. The utility model discloses utilize special design's increasing electrode and carry on electrode chemical plating gold to another termination electrode that has the electrode difference in height, let epitaxial chip electrode have great area and same height, increase processing procedure simplification, and direct the subsides cover pressfitting phosphor powder membrane, light can directly be turned white in formation white light chip can solve the phosphor powder sediment problem in the application process of gluing, the utilization ratio of increase filament product.

Description

Formal dress chip-scale white light LEDs filament light sources

Technical field

This utility model is related to the technical field of LED illumination, particularly relates to a kind of formal dress chip-scale white LED lamp mercerising Source.

Background technology

The tinsel that the filament of traditional lighting light fixture typically directly can be lighted by tungsten filament etc. is constituted, this kind of filament generally existing The defects such as short life, power consumption be big, and is typically only capable of sending sodium yellow, color rendering propertiess are poor.Due to LED have energy-conservation, the high life, The features such as specular removal, environmental protection, solid encapsulation, LED illumination market, are gradually replaced traditional lighting and are entered various applications Field.

Therefore, a series of LED filament of light source of similar tungsten filament designs is occurred in that on the market, for being assembled into LED balls bubble After lamp and candle lamp, effect is very good.But existing filament light sources need to carry out die bond, bonding wire, the process of sealing.Weldering therein Line is turned on partially due to gold thread need to be stamped, cause chip go out it is logical block, brightness can be reduced.The sealing of processing procedure after in addition, Need first to carry out the pre- of fluorescent glue to purchase, be coated with dispensing mode that the time is longer, the fluorescent material in glue will be precipitated, and cause Filament colour temperature after packaged changes excessive, and available yield rate is too low.

In view of this, it is many caused by the design people is not for attaining perfect in the design of above-mentioned LED filament light-source structure to lack Lose and inconvenience, and deeply conceive, and actively research improvement has a fling at and develops and design this utility model.

Utility model content

The purpose of this utility model be solve prior art in fluorescent material precipitation cause it is packaged after filament colour temperature become Dynamic excessive, available yield rate is low, and as gold thread is blocked, and the problems such as cause chip brightness to reduce, and provides a kind of formal dress Chip-scale white light LEDs filament light sources.

In order to reach above-mentioned purpose, solution of the present utility model is：

A kind of formal dress chip-scale white light LEDs filament light sources, which includes transparency carrier, multiple epitaxial chips and fluorescent powder membrane, Line pad is provided with the transparency carrier, each epitaxial chip includes substrate, N electron layer, P electronic shell and protective layer；N is electric In the one side of substrate, the N electron layer has high-end and low side to sublayer, and the P electronic shell is high-end located at the N electron layer On, the P electronic shell is provided with P electrode, and the low side of N electron layer is provided with N electrode, the top of the P electrode and the top flat of N electrode Together, the protective layer is coated on the area in the outside of P electrode and N electrode, the P electrode and the N electrode and accounts for the extension respectively The 1/8-1/3 of chip area, is provided with the multiple and extension in the line pad of the transparency carrier correspondence epitaxial chip size The corresponding conductive layer of P electrode and N electrode of chip, the P electrode of each epitaxial chip and N electrode flip leading in transparency carrier In electric layer, the fluorescent powder membrane is pasted on four sides of the substrate another side and the epitaxial chip that are pressed together on each epitaxial chip.

The conductive layer is any one in gold, silver, stannum, nickel and corresponding alloy.

Each epitaxial chip be located at transparency carrier line pad diverse location, epitaxial chip greatly then with adjacent extension The relative position spacing of chip is big, and chip is little then little with the relative position spacing of adjacent epitaxial chip, and spacing ratio is extension core 1 to 5 times of piece size.

The P electrode of each epitaxial chip is symmetrical in diagonal with N electrode or symmetrical in horizontal sides.

The area equation of the P electrode and N electrode of each epitaxial chip.

The area of the P electrode and N electrode of the epitaxial chip is small one and large one.

After said structure, this utility model formal dress chip-scale white light LEDs filament light sources are using electricity well prepared in advance The extremely specially designed formal dress epitaxial chip for increasing electrode, and epitaxial chip another termination electrode for having electrode altitude difference is carried out The gold-plated processing procedure of electric polarization, allows each epitaxial chip to have larger area and sustained height, can so increase processing procedure summary, and increase Large electrode area can make heat conduction more preferably, and can improve production yield, by pre-production good TLC-Fluorescence powder film, directly paste pressure Close on epitaxial chip, form the chip-scale chip that can directly can be emitted white light, the fluorescent powder membrane with good stable color temperature can be solved The certainly sedimentation problem in phosphor gel application process.Meanwhile, this utility model does not need the welding of gold thread, using directly printing Or coating tin cream or elargol are turned on, shorten processing time, lower the fraction defective that the rosin joint open circuit of welding is produced, direct fluorescence Powder film pastes pressing, lowers because the optical characteristics of fluorescent material precipitation change bad, increases the availability of filament product.

Compare with existing LED filament light source, this utility model is different from existing structure function:This utility model is to be not required to Gold thread welding is carried out, each epitaxial chip of the filament light sources is luminous for five faces, and the effective light-emitting area of epitaxial chip is completely covered, and lights Scope is bigger, and fluorescent powder membrane directly pastes and is not required to carry out, with glue, dispensing, lighting uniform, not leakiness blue light, it is to avoid fluorescent material sinks Form sediment.This utility model is different from existing structure structure:Cradle fits are carried out directly, need not follow-up independent cradle fits or picture Current filament support substrate is first cut into the discontinuity that small pieces are fitted on support again.This utility model process is simple, can In case paster, can effectively reduce cost.

Description of the drawings

Side views of the Fig. 1 for this utility model formal dress chip-scale white light LEDs filament light sources.

Front views of the Fig. 2 for this utility model epitaxial chip.

Side views of the Fig. 3 for this utility model epitaxial chip.

Fig. 4 is the side view that this utility model epitaxial chip pastes that fluorescent powder membrane forms white chip.

Fig. 5 is the front view that this utility model epitaxial chip pastes that fluorescent powder membrane forms white chip.

Top views of the Fig. 6 for this utility model transparency carrier uncut state.

Partial top views of the Fig. 7 for this utility model formal dress chip-scale white light LEDs filament light sources uncut state.

Specific embodiment

In order to the technical solution of the utility model is explained further, this utility model is entered below by specific embodiment Row is elaborated.

As shown in Figures 1 to 7, this utility model discloses a kind of formal dress chip-scale white light LEDs filament light sources, and which includes Bright substrate 10, multiple epitaxial chips 20 and fluorescent powder membrane 30, are provided with line pad 11, each extension core on the transparency carrier 10 Piece 20 includes substrate 21, N electron layer 22, P electronic shell 23, and protective layer 24；N electron layer 22 is located in the one side of substrate 21, the N Electronic shell 22 have high-end and low side, the P electronic shell 23 located at the N electron layer 22 it is high-end on, the P electronic shell 23 is provided with P electrode 231, the low side of N electron layer 22 are provided with N electrode 221, and the top of the P electrode 231 is concordant with the top of N electrode 221, The protective layer 24 is coated on the Line Integral in the outside of P electrode 231 and N electrode 221, the P electrode 231 and the N electrode 221 The 1/8-1/3 of 20 area of epitaxial chip is not accounted for, is set in the line pad of correspondence 20 size of epitaxial chip of transparency carrier 10 Be equipped with 221 corresponding conductive layer 40 of multiple P electrodes 231 with the epitaxial chip 20 and N electrode, the conductive layer can be tin cream or Person's elargol, the P electrode 231 and 221 flip of N electrode of each epitaxial chip 20 are on the conductive layer 40 of transparency carrier 10, described Fluorescent powder membrane 30 is pasted on four sides of 21 another side of substrate and the epitaxial chip 20 that are pressed together on each epitaxial chip 20.

Each epitaxial chip 20 is located at the diverse location of the line pad 11 of transparency carrier 10, epitaxial chip 20 it is big then with The relative position spacing of adjacent epitaxial chip 20 is big, the little relative position spacing then with adjacent epitaxial chip 20 of epitaxial chip 20 It is little, 1 to 5 times for 20 size of epitaxial chip of spacing ratio.

The P electrode 231 of each epitaxial chip 20 is symmetrical in diagonal with N electrode 221 or symmetrical in horizontal sides.

The area of the P electrode 231 and N electrode 221 of each epitaxial chip 20 can be equal, be alternatively small one and large one.

This utility model formal dress chip-scale white light LEDs filament light sources are using the specially designed increasing of electrode well prepared in advance The formal dress epitaxial chip 20 of electrode, and epitaxial chip 20 another termination electrode for having electrode altitude difference is carried out the gold-plated system of electric polarization Journey, allows each epitaxial chip 20 to have larger area and sustained height, can so increase processing procedure summary, and increase electrode area Heat conduction can be made more preferably, and production yield can be improved, by pre-production good TLC-Fluorescence powder film 30, directly be pasted and be pressed together on extension On chip, the chip-scale chip that can directly can be emitted white light, the fluorescent powder membrane with good stable color temperature, it is possible to resolve fluorescent material are formed Sedimentation problem in glue application process.Meanwhile, this utility model does not need the welding of gold thread, using directly printing or be coated with stannum Cream or elargol are turned on, and shorten processing time, lower the fraction defective that the rosin joint open circuit of welding is produced, and direct fluorescent powder membrane is pasted Pressing, lowers because the optical characteristics of fluorescent material precipitation change bad, increases the availability of filament product.

Above-described embodiment and schema non-limiting product form of the present utility model and style, any art Appropriate change or modification that those of ordinary skill is done to which, all should be regarded as without departing from patent category of the present utility model.

Claims

1. a kind of formal dress chip-scale white light LEDs filament light sources, it is characterised in that include：Transparency carrier, multiple epitaxial chips and glimmering Light powder film, is provided with line pad on the transparency carrier, each epitaxial chip includes substrate, N electron layer, P electronic shell and protection Layer；In the one side of substrate, the N electron layer has high-end and low side to N electron layer, and the P electronic shell is located at the N electron layer On high-end, the P electronic shell is provided with P electrode, and the low side of N electron layer is provided with N electrode, the top of the P electrode and the top of N electrode Hold level with both hands together, the protective layer is coated on the area in the outside of P electrode and N electrode, the P electrode and the N electrode and accounts for this respectively The 1/8-1/3 of epitaxial chip area, in the line pad of the transparency carrier correspondence epitaxial chip size is provided with multiple and is somebody's turn to do The corresponding conductive layer of P electrode and N electrode of epitaxial chip, the P electrode and N electrode flip of each epitaxial chip is in transparency carrier Conductive layer on, the fluorescent powder membrane pastes four sides of the substrate another side and the epitaxial chip that are pressed together on each epitaxial chip On.

2. formal dress chip-scale white light LEDs filament light sources as claimed in claim 1, it is characterised in that：The conductive layer for gold, Any one in silver, stannum, nickel and corresponding alloy.

3. formal dress chip-scale white light LEDs filament light sources as claimed in claim 1, it is characterised in that：Each epitaxial chip position In the diverse location of the line pad of transparency carrier, epitaxial chip is then big with the relative position spacing of adjacent epitaxial chip greatly, core Piece is little then little with the relative position spacing of adjacent epitaxial chip, 1 to 5 times for epitaxial chip size of spacing ratio.

4. formal dress chip-scale white light LEDs filament light sources as claimed in claim 1, it is characterised in that：The P of each epitaxial chip Electrode is symmetrical in diagonal with N electrode or symmetrical in horizontal sides.

5. formal dress chip-scale white light LEDs filament light sources as claimed in claim 1, it is characterised in that：The P of each epitaxial chip The area equation of electrode and N electrode.

6. formal dress chip-scale white light LEDs filament light sources as claimed in claim 1, it is characterised in that：The P of the epitaxial chip is electric The area of pole and N electrode is small one and large one.