CN201754416U

CN201754416U - LED illuminant carrier structure capable of improving reflection efficiency

Info

Publication number: CN201754416U
Application number: CN2010202555596U
Authority: CN
Inventors: 戴美惠; 戴瑞丰
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-07-09
Filing date: 2010-07-09
Publication date: 2011-03-02
Anticipated expiration: 2020-07-09

Abstract

The utility model relates to an LED illuminant carrier structure capable of improving reflection efficiency, wherein electrical connection circuits are formed on an LED illuminant carrier, and at least one LED wafer is matched and connected with the electrical connection circuits; a silver reflecting layer is formed on the surface of each of the electrical connection circuits; and a reflecting layer is also formed on the top surface of the LED illuminant carrier at the space position between the electrical connection circuits, so as to fill in a sunk area between the electrical connection circuits, so that the light can not be curved. Therefore, a full reflector surface in the same plane as the whole top surface of the LED illuminant carrier is formed on the whole top surface of the LED illuminant carrier, so that the light given out by the LED wafer(s) can generate the total reflection, therefore, the light reflecting efficiency of the LED wafer(s) can be improved effectively, so as to greatly improve the brightness of an LED and save the energy.

Description

Has the luminous carrier structure of LED that promotes reflection efficiency

Technical field

The utility model relates to the luminous carrier structure of a kind of LED, it mainly is to be formed with electrical interconnection on the luminous carrier of LED, so that more than one at least LED wafer is coupled on the electrical interconnection, surface in electrical interconnection, be formed with an argentum reflecting layer, and the luminous carrier end face of the LED between electrical interconnection and electrical interconnection spacing position, also be formed with the reflector, to mend formed depressed area, the spacing position between electrical interconnection and electrical interconnection flat, make light not produce curved fire, and the whole top that makes the luminous carrier of LED forms the complete reflecting surface of an isoplanar, and the light that the LED wafer can be sent produces the effect of reflection fully, and then effectively promote the light reflection efficiency of LED wafer, and then significantly promote the brightness of LED and save energy person, and, the utility model directly forms the electrical interconnection that connects for the LED wafer in the luminous carrier end face of LED, therefore, between each LED wafer, must not be connected with gold thread in addition, except that the bad efficient that reduces encapsulation, do not influence the illumination effect of LED wafer yet.

Background technology

Existing, roughly be divided into two big classes in the market in the led light source module, the first kind is to use the led light source module of or minority LED wafer 6, as shown in Figure 5, the another kind of high-power LED light source module that then uses with a plurality of LED wafers 8, as shown in Figures 7 and 8, first kind led light source module, it mostly is located at one or minority LED wafer 6 in the bowl cup 51 on the luminous carrier 5 of a LED, and with gold thread 61 positive and negative electrode of LED wafer 6 is connected to positive and negative electrode pin 62, last again with the sealing 52 of tool fluorescent agent with its encapsulation.

The second type LED light sources module, it is that most LED wafers 8 are located in the bowl cup 71 on the luminous carrier 7 of a LED, and with each LED wafer 8 just with gold thread 81, negative pole connects, again in the light-passing board 72 of outermost layer with surface-coated tool fluorescent agent sealing 73, when LED wafer that can be in framework is luminous, make light evenly scatter light-passing board 72, to obtain the stable characteristics of luminescence, with the second type LED light sources module similar design, as shown in Figure 6, be that more than one LED wafer 6 is located in the bowl cup 51 on the luminous carrier 5 of a LED, and with LED wafer 6 just with gold thread 61, negative pole just is being connected to individually, negative pole pin 62, last again with the sealing 52 of tool fluorescent agent with its encapsulation, and most gold threads 61 are arranged in those LED wafer 6 top bridge joints.

Above-mentioned two kinds of led light source modules have following shortcoming:

First kind led light source module, catoptrical poor effect because of luminous carrier 5 end faces of its LED, the light source that LED wafer 6 is produced only relies on the sealing 52 of tool fluorescent agent quite limited as the effect that promotes the light source scattering, and all the positive and negative electrode of LED wafer 6 is connected to positive and negative electrode pin 62 with gold thread 61 in the positive and negative electrode of LED wafer 6 tops, gold thread 61 is positioned at LED wafer 6 tops, also will influence the light source that LED wafer 6 is produced, make the brightness decay of LED.

The second type LED light sources module, though in the light-passing board 72 of outermost layer with surface-coated tool fluorescent agent sealing 73, when making LED wafer 8 luminous, make light evenly scatter printing opacity, but it is same, catoptrical poor effect because of luminous carrier 7 end faces of its LED, the light source that LED wafer 8 is produced only relies on the light-passing board 72 of tool fluorescent agent sealing 73 also quite limited as the effect that promotes the light source scattering, and it links because of a plurality of LED wafers 8, between per two LED wafer 8 tops just, negative pole all with gold thread 81 with each LED wafer 8 just, negative pole connects, gold thread 81 is positioned at per two LED wafer 8 tops, also will influence the light source that LED wafer 8 is produced, and makes the brightness decay of LED.

Summary of the invention

The purpose of this utility model is: a kind of luminous carrier structure of LED that promotes reflection efficiency that has is provided, solves the existing in prior technology problem.

For achieving the above object, the technical solution adopted in the utility model is:

A kind of luminous carrier structure of LED with lifting reflection efficiency is characterized in that:

It mainly is to be provided with a reflector on the luminous carrier of LED, the luminous carrier end face of LED in reflector is formed with electrical interconnection, so that at least one LED wafer is coupled on the electrical interconnection, surface at electrical interconnection, be formed with an argentum reflecting layer, and the luminous carrier end face of the LED between electrical interconnection and electrical interconnection spacing position, also be formed with the reflector, to mend formed depressed area, the spacing position between electrical interconnection and electrical interconnection flat, make light not produce curved fire, make the interior whole top of the set reflector of the luminous carrier of LED form the complete reflecting surface of an isoplanar.

Wherein: the argentum reflecting layer of electric connection line road surfaces is a silvering.

Wherein: the reflector at the luminous carrier end face of the LED between electrical interconnection and electrical interconnection spacing position is the coatings of good white of reflectivity or silver color.

Wherein: the set reflector in LED luminous carrier top is to make with white material.

Wherein: the set reflector in LED luminous carrier top is to make with aluminum alloy materials, and its surface is then through bright processed.

Wherein: in the set reflector in LED luminous carrier top, be provided with a fluorescent glue-line, be combined with the printing opacity colloid in this fluorescent glue-line most external.

Wherein: the electrical connection between each LED wafer is to be directly connected in electrical interconnection with gold thread, and gold thread need not crossed between per two LED wafers, does not influence the illumination effect of LED wafer.

Wherein: this reflector surface is coated with an argentum reflecting layer.

Wherein: in the set reflector in LED luminous carrier top, be provided with a fluorescent glue-line, be combined with transparent glass in this fluorescent glue-line most external.

Compared with prior art, adopt the advantage that the utlity model has of technique scheme to be:

The utility model is by means of be formed with electrical interconnection on the luminous carrier of LED, surface in electrical interconnection, be formed with an argentum reflecting layer, and the luminous carrier end face of the LED between electrical interconnection and electrical interconnection spacing position, also be formed with the reflector, to mend formed depressed area, the spacing position between electrical interconnection and electrical interconnection flat, make light not produce curved fire, and the whole top that makes the luminous carrier of LED forms the complete reflecting surface of an isoplanar, and the light that the LED wafer can be sent produces the effect of reflection fully, and then effectively promote the light reflection efficiency of LED wafer, and then significantly promote the brightness of LED.

The utility model forms a complete reflecting surface by means of the whole top in the luminous carrier of LED, can effectively promote the light reflection efficiency of LED wafer, and then significantly promote the brightness of LED, can lower powered led light source module produce and the identical brightness of high-power led light source module, can reach the purpose person who saves the energy.

The utility model relies on to be formed with electrical interconnection on the luminous carrier of LED, in the surface of electrical interconnection, is formed with an argentum reflecting layer, this argentum reflecting layer except that effect with height source reflection, the also purpose that the temperature of LED wafer can be derived.

The utility model is borrowed and be formed with electrical interconnection on the luminous carrier of LED, can respectively each LED wafer be coupled on the electrical interconnection by gold thread, and gold thread need not crossed between per two LED wafers, does not influence the reflecting effect of light source.

Description of drawings

Fig. 1 is a wherein embodiment stereogram of the present utility model;

Fig. 2 is a partial cutaway diagrammatic sketch of the present utility model;

Fig. 3 is the embodiment stereogram after the utility model encapsulation;

Fig. 4 is the embodiment cut-away view after the utility model encapsulation;

Fig. 5 is the encapsulation cut-away view of existing LED;

Fig. 6 is wherein a kind of existing LED is connected to the positive and negative electrode of LED wafer individually the positive and negative electrode pin with gold thread an encapsulation cut-away view;

Fig. 7 is the encapsulation cut-away view of another existing LED;

Fig. 8 is the local cut-away view that amplifies of the encapsulation of another existing LED.

1,5, the luminous carrier of 7-LED description of reference numerals:; The 11-electrical interconnection; 111,121-reflector; 12-spacing position; The 13-reflector; The 14-positive contact; The 15-negative contacts; 2,6,8-LED wafer; 21,61,81-gold thread; 3-fluorescent glue-line; 4-printing opacity colloid; 51,71-bowl cup; 52,73-sealing; 62-positive and negative electrode pin; The 72-light-passing board.

Embodiment

See also Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4, the relevant a kind of tool of the utility model promotes luminous carrier 1 structure of LED of reflection efficiency, it mainly is to be formed with electrical interconnection 11 on the luminous carrier 1 of LED, so that more than one at least LED wafer 2 is coupled on the electrical interconnection 11, surface in electrical interconnection 11, be formed with an argentum reflecting layer 111, and in the luminous carrier of the LED 1 end face spacing position 12 of 11 of electrical interconnection 11 and electrical interconnections, also be formed with reflector 121, to mend the 12 formed depressed areas, spacing position of 11 of electrical interconnection 11 and electrical interconnections flat, make light not produce curved fire, and make the luminous carrier 1 set reflector 13 interior whole top of LED form the complete reflecting surface of an isoplanar, and the light that LED wafer 2 can be sent produces the effect of reflection fully, and then effectively promote the light reflection efficiency of LED wafer 2, and then significantly promote the brightness of LED and save energy person, and, the utility model directly forms the electrical interconnection 11 that connects for LED wafer 2 in luminous carrier 1 end face of LED, therefore, being electrically connected between each LED wafer 2 is that gold thread 21 is directly connected in electrical interconnection 11, just be connected to the outside respectively by electrical interconnection 11 again,

negative contacts

14,15, gold thread 21 need not crossed between per two LED wafers 2, except that the bad efficient that reduces encapsulation, do not influence the illumination effect of LED wafer 2 yet.

And aforementioned argentum reflecting layer 111 in electrical interconnection 11 surfaces is silvering, and in the reflector 121 at the luminous carrier of the LED 1 end face spacing position 12 of 11 of electrical interconnection 11 and electrical interconnections, be the best then with the good white of reflectivity or the coatings of silver color, in addition, in the set reflector 13 in the luminous carrier of LED 1 top, this reflector 13 is to make with white material, to promote the light reflection efficiency, can plate an argentum reflecting layer in reflector 13 surfaces, has the effect that promotes the light reflection efficiency, in addition, this reflector 13 also can be made by aluminum alloy materials, and its surface is then through bright processed.

The utility model is provided with a fluorescent glue-line 3 in reflector 13, be combined with printing opacity colloid 4 or transparent glass in these fluorescent glue-line 3 most external.

In sum, the utility model tool provides brightness that can significantly promote LED and the effect of saving the energy.

More than explanation is just illustrative for the utility model; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within the protection range of the present utility model.

Claims

1. one kind has the luminous carrier structure of LED that promotes reflection efficiency, it is characterized in that:

2. according to the described luminous carrier structure of LED with lifting reflection efficiency of claim 1, it is characterized in that: the argentum reflecting layer of electric connection line road surfaces is a silvering.

3. according to the described luminous carrier structure of LED with lifting reflection efficiency of claim 1, it is characterized in that: the reflector at the luminous carrier end face of the LED between electrical interconnection and electrical interconnection spacing position is the coatings of good white of reflectivity or silver color.

4. according to the described luminous carrier structure of LED with lifting reflection efficiency of claim 1, it is characterized in that: the set reflector in LED luminous carrier top is to make with white material.

5. according to the described luminous carrier structure of LED with lifting reflection efficiency of claim 1, it is characterized in that: the set reflector in LED luminous carrier top is to make with aluminum alloy materials, and its surface is then through bright processed.

6. according to the described luminous carrier structure of LED of claim 1, it is characterized in that: in the set reflector in LED luminous carrier top, be provided with a fluorescent glue-line, be combined with the printing opacity colloid in this fluorescent glue-line most external with lifting reflection efficiency.

7. according to the described luminous carrier structure of LED of claim 1 with lifting reflection efficiency, it is characterized in that: the electrical connection between each LED wafer, be to be directly connected in electrical interconnection with gold thread, gold thread need not crossed between per two LED wafers, does not influence the illumination effect of LED wafer.

8. according to claim 1 or the 4 described luminous carrier structures of LED with lifting reflection efficiency, it is characterized in that: this reflector surface is coated with an argentum reflecting layer.

9. according to the described luminous carrier structure of LED of claim 1, it is characterized in that: in the set reflector in LED luminous carrier top, be provided with a fluorescent glue-line, be combined with transparent glass in this fluorescent glue-line most external with lifting reflection efficiency.