CN203503705U

CN203503705U - White-light LED packaging structure and white-light lighting device thereof

Info

Publication number: CN203503705U
Application number: CN201320461274.1U
Authority: CN
Inventors: 肖文玉
Original assignee: ZHONGSHAN WANPU ELECTRONIC SCIENCE & TECHNOLOGY Co Ltd
Current assignee: Hong Shengxiang photoelectric lighting Science and Technology Ltd. of Zhongshan city
Priority date: 2013-07-30
Filing date: 2013-07-30
Publication date: 2014-03-26
Anticipated expiration: 2023-07-30

Abstract

The utility model belongs to the technical field of white-light LED structures, and specifically relates to a white-light LED packaging structure. The structure comprises a transparent substrate and lighting wafers. The lighting wafers are fixedly arranged on the transparent substrate, and include a plurality of blue wafers each having six lighting surfaces. All the blue wafers are fixedly arranged on the transparent substrate, and electrically connected with the transparent substrate. Both the upper and lower surfaces of the transparent substrate are provided with a fluorescent glue layer with yellow fluorescent powder. The blue wafer is packaged by the fluorescent glue layer, and blue light emitted by the blue wafer is mixed with yellow light emitted by the fluorescent glue layer, thereby generating white light. The white light is refracted by the fluorescent glue layer and enters the air, increasing the light exit angle, so that the problems of high directivity and small light exit angle of the conventional LED light source are effectively solved. The six lighting surfaces of the LED light wafer are effectively utilized, and the luminous flux and luminous efficiency of the LED light source are greatly improved, the luminous efficiency being increased to 200 lm/W. A lighting device using the white-light LED packaging structure can generate soft light, enabling the user to obtain a comfortable experience in use.

Description

White-light LED package structure and white light illumination device thereof

Technical field

The utility model belongs to white-light LED structure technical field, relates in particular to LED encapsulating structure and white light illumination device thereof.

Background technology

LED is a kind of semiconductor device that can be visible ray by electric energy conversion, it adopts electroluminescence, utilize compound-material to make the photoelectric device of P-N knot, changed the luminous principle luminous with electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, light-emitting diode has advantages of that the life-span is long, light efficiency is high, radiationless and low energy consumption, be widely used in illumination and the light decoration technical field of society, the spectrum of LED almost all concentrates on visible light frequency band, the brightness of LED and the lighting angle of LED have inevitable contacting, and the less brightness of lighting angle of LED is less.

Traditional LED packing forms is as the PLCC structure of SMD encapsulation, and the LED light source of producing, has directive property strong conventionally, rising angle is little, the feature such as illuminance uniformity in unit are is poor when being applied to illuminating product, there will be the effect of brightness irregularities on irradiating object, therefore, in use, cause human eye uncomfortable, how to change traditional LED light source directive property strong, the problem that rising angle is little, becomes the eager problem solving of correlative technology field personnel.

Utility model content

The purpose of this utility model is to provide White-light LED package structure, is intended to solve traditional LED light source directive property strong, the problem that rising angle is little.

For solving the problems of the technologies described above, the utility model provides the technical scheme of White-light LED package structure to be, comprise transparency carrier and luminescent wafer, described luminescent wafer is fixedly arranged on described transparency carrier, described luminescent wafer comprises a plurality of six luminous blue wafers, and described in each, blue wafer is fixedly arranged on described transparency carrier, and with described transparency carrier electric connection, the upper and lower surface of described transparency carrier is equipped with the fluorescent adhesive layer with yellow fluorescent powder, the described blue wafer of described fluorescent adhesive layer encapsulation.

Particularly, described transparency carrier is provided with metallic circuit layer, and described blue wafer is by conductive lead wire and described circuit layer electric connection, and described fluorescent adhesive layer is coated described circuit layer and described conductive lead wire.

Further, described transparency carrier is provided with anode and cathode terminals, and described anode and cathode terminals is by the both positive and negative polarity electric connection of described circuit layer and described blue wafer.

Particularly, described anode and cathode terminals is welded on described transparency carrier, and with the both positive and negative polarity electric connection of described circuit layer.

Further, described luminescent wafer also comprises a plurality of for promoting the red wafer that shows index, described red wafer and described blue wafer tandem or in parallel being located on described transparency carrier, and with described circuit layer electric connection.

Preferably, the described red wafer of described fluorescent adhesive layer encapsulation.

The utility model also provides white light illumination device, comprises above-mentioned White-light LED package structure.

The utility model provides the beneficial effect of White-light LED package structure to be: the substrate that adopts transparent material to make, a plurality of six luminous blue wafers are installed in to the upper surface of transparency carrier, upper and lower surface at transparency carrier is coated with fluorescent adhesive layer, and fluorescent adhesive layer encapsulates blue wafer, the yellow light that the light that blue wafer sends sends with fluorescent adhesive layer evenly mixes, form white light, according to Fresnel law, mixed white light reflects at fluorescent adhesive layer place, change the angle of emergence of light, because the upper and lower surface of transparency carrier is coated with fluorescent adhesive layer, the both sides bright dipping of transparency carrier all increases rising angle, White-light LED package structure effectively utilizes six light-emitting areas of blue wafer, solved the problem that LED light source directive property is strong and rising angle is little, reach the light effect that of all-round optic angle degree, luminous flux and the light extraction efficiency of LED light source have been promoted widely, light emission rate can reach 200lm/W, and the fluorescent adhesive layer that the utility model provides is easy for installation, fluorescent adhesive layer even thickness, blue wafer is even through the light color of fluorescent adhesive layer outgoing, avoid occurring on light irradiating object the problem of brightness disproportionation, the white light illumination device with above-mentioned White-light LED package structure, bright dipping is soft, user in use, obtain more comfortable experience.

Accompanying drawing explanation

The front view of the White-light LED package structure that Fig. 1 provides for the utility model;

The vertical view of the White-light LED package structure that Fig. 2 provides for the utility model.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.

Refer to Fig. 1 and Fig. 2, the White-light LED package structure 1 that the utility model provides, comprise transparency carrier 11 and luminescent wafer, luminescent wafer is fixedly arranged on transparency carrier 11, luminescent wafer comprises a plurality of six luminous blue wafers 12, and each blue wafer 12 is fixedly arranged on transparency carrier 11, and with transparency carrier 11 electric connections, the upper and lower surface of transparency carrier 11 is equipped with the fluorescent adhesive layer 13 with yellow fluorescent powder, the blue wafer 12 of fluorescent adhesive layer 13 encapsulation.Transparency carrier 11 is communicated with external power source, for blue wafer 12 provides luminous power, the upper and lower surface of fluorescent adhesive layer 13 coated transparency carriers 11, and encapsulate blue wafer 12, after the sodium yellow that the blue light that blue wafer 12 sends sends with fluorescent adhesive layer 13 evenly mixes, send white light, and 13 places reflect at fluorescent adhesive layer, according to Fresnel law, by medium refraction, enter airborne light, refraction angle is greater than incidence angle, the beam projecting angle of being penetrated by fluorescent adhesive layer 13 increases, and, select transparency carrier 11, the white light mixing can be from the upper and lower surface outgoing of transparency carrier 11, after beam angle increases, the brightness of known light strengthens, and after fluorescent adhesive layer 13 mixes, light is softer, transparency carrier 11 effectively utilizes six exiting surfaces of luminescent wafer 12, improve traditional LED light source directive property strong, the problem that rising angle is little, promote luminous flux and the light extraction efficiency of LED light source, light extraction efficiency can reach 200lm/W, avoid LED light source to be radiated at the phenomenon that brightness disproportionation appears in body surface, more meet user's request.

Particularly, transparency carrier 11 is provided with metallic circuit layer 10, on transparency carrier 11, utilize and electroplate evaporation process plating formation circuit layer 10, particularly, can be silvery circuit layer or nickel circuit layer processed, circuit layer 10 is as electric conductor, by transparency carrier 11 and blue wafer 12 conductive communication, circuit layer 10 is communicated with external power source, make it normally luminous to blue wafer 12 power supplies, certainly, circuit layer 10 also can select other conducting metals to make, blue wafer 12 is by conductive lead wire 101 and circuit layer 10 electric connections, fluorescent adhesive layer 13 coating circuit layers 10 and conductive lead wire 101.In all parts of assurance transparency carrier 12 upper surface settings are all coated on by fluorescent adhesive layer 13, protective circuit layer 10 and conductive lead wire 101 can not be subject to the impact of external environment condition, and guarantee that the yellow light that light that blue wafer 12 sends sends with fluorescent adhesive layer 13 fully mixes, avoid external interference, realize the uniform effect of bright dipping, conductive lead wire 101 is as electric conductor, by transparency carrier 11 and blue wafer 12 conductive communication, blue wafer 12 is bonded on circuit layer 10, bonding should firmly and not skew, in implementing bonding process, should guarantee that adhesive can not smear to other positions of transparency carrier 11, in order to avoid affect the normal work of LED, certainly, also can adopt and cover brilliant technique, blue wafer 12 is connected with the point of contact on transparency carrier 11, blue wafer 12 is connected with the both positive and negative polarity of circuit layer 10 with the connected mode of serial or parallel connection, circuit layer 10 and external power source electric connection, circuit layer 10 is given blue wafer 12 power supplies, guarantee the normal bright dipping of blue wafer 12,

Particularly, transparency carrier 11 is provided with cathode metal terminal 14 and negative pole metal terminal 15, and cathode metal terminal 14, negative pole metal terminal 15 be the both positive and negative polarity electric connection with blue wafer 12 by circuit layer 10.Cathode metal terminal 14 and negative pole metal terminal 15 are communicated with external power source, and circuit layer 10 sends electric current to blue wafer 12, make it normally luminous, guarantee that LED light source bright dipping is normal

Cathode metal terminal 14 is welded on transparency carrier 11 by soldering tin technique with negative pole metal terminal 15, and with the both positive and negative polarity electric connection of circuit layer 10.Adopt soldering tin technique that cathode metal terminal 14 and negative pole metal terminal 15 are welded on circuit layer 10, and with circuit layer 10 conductings, known according to metallic character, there is good electrical conductance, the both positive and negative polarity of circuit layer 10 respectively with cathode metal terminal 14, negative pole metal terminal 15 electric connections, realize continued power and give blue wafer 12.

Luminescent wafer also comprises that a plurality of red wafer 16 is located on transparency carrier 11 with blue wafer 12 serial or parallel connections for promoting the red wafer 16 that shows index, and with circuit layer 10 electric connections.The light that the red wafer 16 of setting up, blue wafer 12 and fluorescent adhesive layer 13 send bright dipping after mixing is softer, improves white light LEDs and on irradiating object, there will be the problem that high light is dazzling.

Preferably, the red wafer 16 of fluorescent adhesive layer 13 encapsulation.The red wafer 16 of fluorescent adhesive layer 13 protection can not be subject to the impact of external environment condition, and guarantees that the yellow light that light that red wafer 16 sends sends with fluorescent adhesive layer 13 fully mixes, and avoids external interference, realizes the uniform effect of bright dipping,

Preferably, transparency carrier 11 is glass substrate or sapphire substrate, transparency carrier 11 is as the supporting body of luminescent wafer 12, transparency carrier 11 selects the material with high transmission rate to make, after light and the yellow light mix in fluorescent adhesive layer 13 that blue wafer 12 sends, form white light, high transmission rate is convenient to the outgoing of light, the material of selecting should be conducive to the bright dipping of luminescent wafer 12, luminescent wafer 12 is installed and at the surface etch line construction of transparency carrier 12, select glass or sapphire as transparency carrier 11, bright dipping better effects if, and can effectively utilize six exiting surfaces of luminescent wafer 12, reach the light effect that of all-round optic angle degree, promote widely luminous flux and the light extraction efficiency of LED light source, light emission rate can reach 200lm/W.

The utility model also provides white light illumination device, comprises White-light LED package structure 1, and bright dipping is soft, and user in use, avoids being radiated at the effect that occurs brightness irregularities on object, promotes for experiencing.

The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.

Claims

1. White-light LED package structure, comprise transparency carrier and luminescent wafer, described luminescent wafer is fixedly arranged on described transparency carrier, it is characterized in that: described luminescent wafer comprises a plurality of six luminous blue wafers, described in each, blue wafer is fixedly arranged on described transparency carrier, and with described transparency carrier electric connection, the upper and lower surface of described transparency carrier is equipped with the fluorescent adhesive layer with yellow fluorescent powder, the described blue wafer of described fluorescent adhesive layer encapsulation.

2. White-light LED package structure as claimed in claim 1, it is characterized in that: described transparency carrier is provided with metallic circuit layer, described blue wafer is by conductive lead wire and described circuit layer electric connection, and described fluorescent adhesive layer is coated described circuit layer and described conductive lead wire.

3. White-light LED package structure as claimed in claim 2, is characterized in that: described transparency carrier is provided with anode and cathode terminals, and described anode and cathode terminals is by the both positive and negative polarity electric connection of described circuit layer and described blue wafer.

4. White-light LED package structure as claimed in claim 3, is characterized in that: described anode and cathode terminals is welded on described transparency carrier, and with the both positive and negative polarity electric connection of described circuit layer.

5. the White-light LED package structure as described in any one in claim 2 to 4, it is characterized in that: described luminescent wafer also comprises a plurality of for promoting the red wafer that shows index, described red wafer and described blue wafer tandem or in parallel being located on described transparency carrier, and with described circuit layer electric connection.

6. White-light LED package structure as claimed in claim 5, is characterized in that: the described red wafer of described fluorescent adhesive layer encapsulation.

7. white light illumination device, is characterized in that: comprise the White-light LED package structure as described in any one in claim 1 to 6.