WO2016049938A1

WO2016049938A1 - Omnidirectional led light source and manufacturing method therefor

Info

Publication number: WO2016049938A1
Application number: PCT/CN2014/088071
Authority: WO
Inventors: 叶逸仁; 郑香奕
Original assignee: 东莞保明亮环保科技有限公司
Priority date: 2014-09-30
Filing date: 2014-09-30
Publication date: 2016-04-07

Abstract

An omnidirectional LED light source and a manufacturing method therefor. The method for manufacturing an omnidirectional LED light source comprises the steps of: placing chips (3), bonding the chips (3), manufacturing a UV curing adhesive lining board (1) mixed with light-guide and heat-conducting filling materials and fluorescent powder, communicating the chips (3) and packaging. The omnidirectional LED light source comprises a lining board layer (1), two leads (5) and a packaging layer (2). At least two LED chips (3) are arranged on the lining board layer (1), the P electrode and the N electrode of each LED chip (3) are exposed out of the lining board layer (1), and the LED chips (3) are electrically connected to each other. One end of each lead is arranged inside the lining board layer (1) and is electrically connected to the LED chip (3), and the other end of the lead extends out of the lining board layer (1). The packaging layer (2) is covered above the lining board layer (1). The LED chips (3) and the leads (5) are arranged between the lining board layer (1) and the packaging layer (2). The lining board layer (1) and the packaging layer (2) are made of a UV curing adhesive mixed with the light-guide and heat-conducting filling materials and the fluorescent powder. The omnidirectional LED light source is simple in structure, convenient to produce and assemble and low in cost, has a wide light-emitting surface, and can be formed into different shapes.

Description

LED full-circumference light source and manufacturing method thereof

Technical field

The invention relates to the field of LED light sources, in particular to an LED full-circumference light source and a manufacturing method thereof.

Background technique

Traditional light bulbs have high power consumption, which is inconsistent with energy conservation requirements, and the problems caused by environmental protection are becoming more and more serious. Therefore, at this stage, light-emitting diodes (LEDs) are developed. The lighting technology replaces traditional light bulbs to achieve energy conservation and environmental protection.

Generally, the LED light source is to place the LED chip on a predetermined placement position of the substrate. Before the chip is placed, the solid crystal glue is placed on the placed position, and baked at a high temperature of 150 ° C - 180 ° C for at least 60 minutes to make the LED chip. Fixed on the substrate; then soldering the wire process, soldering one end of the gold wire to the P and N poles of the chip, and soldering the other end to the substrate; then encapsulating with epoxy or silicone and baking at 150 ° C At least 4 hours; then the metal substrate on which the LED chip is cured is connected to the heat sink by epoxy resin, and the entire circuit board is screwed to a larger heat sink.

The LED light source has the following disadvantages: 1. The production assembly process is cumbersome, the time is long, and the structure of the light source is complicated, which is not conducive to mass production; 2. The substrate is limited by the planar design of the circuit board, and the LED is limited. The shape specification of the luminaire makes the shape and specification of the LED luminaire single, and the space of the illuminating surface is small; 3. The package of the LED chip needs to provide the substrate corresponding to the LED chip, which increases the cost and blocks part of the light source.

Summary of the invention

In order to solve the above problems, the present invention provides an LED full-circumference light source with simple structure, simple production and assembly, low cost, wide luminous surface, and arbitrarily set different shapes, and a manufacturing method thereof, which can effectively solve the existing LED light source. The structure is complicated, the production and assembly process is cumbersome, and the production cost is high.

In order to achieve the above objectives, the technical solution adopted by the present invention is: an LED full-circumference light source, comprising:

a lining layer, the lining layer is provided with at least two LED chips, the P and N poles of the LED chip are exposed outside the lining layer, and the LED chips are electrically connected;

Two leads, one end of the lead is disposed in the lining layer, electrically connected to the LED chip, and the other end of the lead extends outside the lining layer;

An encapsulation layer, the encapsulation layer is over the liner layer, and the LED chip and the lead are disposed between the liner layer and the encapsulation layer; wherein the liner layer and the encapsulation layer are mixed light-conducting and thermally conductive fillers; UV curable glue for phosphors.

Wherein, the LED chip and the lead are electrically connected by vacuum coating or a conductive adhesive layer or a bonding wire.

A method for manufacturing an LED full-circumference light source, comprising the following steps:

A. placing a chip, providing a chip adhesive board and a core-setting machine; the surface of the chip adhesive board is adhered with a partial adhesive tape and fixed on one side of the core-setting machine, and the core-setting machine is provided with a robot; Describe the local adhesive portion of the local adhesive tape on which the LED chip is placed on the surface of the chip adhesive board by a robot;

B. Making a UV-curable adhesive liner of a mixed light-conducting thermally conductive filler and a phosphor, providing a liner mold, the liner mold being made of a light transmissive material, including PP, PE, 矽a glue or glass, the liner mold is provided with a liner groove and a lead groove, the liner mold is fixed and closely attached to the chip adhesive board, and then the lead is placed on the lead groove, wherein the liner The groove corresponds to the LED chip adhered to the chip adhesive board, and the UV-curable rubber mixed with the light-conducting heat-conductive filler and the phosphor is poured into the liner groove by a robot, and the mixed light is guided by the UV curing machine. Light-curing curing of the thermally conductive filler and the phosphor, so that the LED chip is embedded in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor;

C. Connect the chip, use a vacuum coating machine to plate the conductive material on the P and N poles of each adjacent LED chip in step B and the lead, and then solidify the conductive material to electrically connect the LED chip and the lead wire. ;

D. Encapsulation, providing a package mold, the package mold is made of a light transmissive material, the light transmissive material comprises PP, PE, silicone or glass, and the package mold is provided with a package groove, and the package mold is Fixed and stuck in step B In the liner mold, the package groove corresponds to the liner hole, and a robot is used to inject the light-guided heat-conductive filler and the phosphor-curable UV-curable glue into the package tank, and then the UV curing machine is used. The mixed light-guided thermally conductive filler and the UV-cured adhesive of the phosphor are photocured to form a semi-finished product, and the liner mold and the package mold are further separated.

E. Fix the semi-finished product in step D on the mold base, and use the laser cutting machine to cut and separate according to the actual set shape.

Wherein, in step C, the LED chip and the lead wire can also be electrically connected by means of a conductive adhesive or a bonding wire.

Wherein, in step B, the lining mold has at least one lining groove.

Wherein, in step D, the package mold has at least one package slot.

Among them, in steps B and D, the curing time of the UV curing machine is 1-100 seconds.

Wherein, in steps B and D, the light-conducting and thermally conductive filler of the UV-curable adhesive of the light-conducting thermally conductive filler and the phosphor comprises nanometer or micron-sized alumina, magnesia, zinc oxide, cerium oxide, silicon oxide, glass powder. One or more.

The beneficial effects of the invention are:

1. The light source structure is very simple, which is conducive to mass production;

2. Directly using the mixed light-guided thermally conductive filler and the UV-curable adhesive of the phosphor as the lining and encapsulating layer, which has better thermal conductivity and light conductivity, can replace the use of the substrate, and saves cost;

3. It is not limited by the shape structure of the substrate, and can be made into various light source shapes according to the needs of different occasions, thereby increasing the appearance;

4. The LED chip encapsulated in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor can achieve the full-circumference illumination effect without the barrier of the substrate.

DRAWINGS

Figure 1 is a schematic view of the structure of the present invention;

Figure 2 is a schematic view of the package of the present invention;

Figure 3 is a schematic view of the finished product of the present invention;

4 is a schematic view of a finished product according to another embodiment of the present invention;

detailed description

The invention is further illustrated by the specific examples.

Example 1

1-4, which shows a specific structure of a preferred embodiment of the present invention, an LED full-circumference light source, comprising: a lining layer 1, the lining layer 1 is provided with at least two LED chips 3, the P and N poles of the LED chip 3 are exposed outside the lining layer 1, the LED chips 3 are electrically connected; two leads 5, one end of the lead 5 is disposed at the In the lining layer 1, electrically connected to the LED chip 3, the other end of the lead extends to the outside of the lining layer 1; an encapsulation layer 2, the encapsulation layer 2 covers the lining layer 1 The LED chip 3 and the lead 5 are disposed between the lining layer 1 and the encapsulating layer 2; wherein the lining layer 1 and the encapsulating layer 2 are UV curable adhesives for mixing the light-conducting thermally conductive filler and the phosphor.

Specifically, the LED chip 3 and the lead 5 are electrically connected by vacuum coating or a conductive adhesive layer or a bonding wire.

The lining layer 1 and the encapsulating layer 2 can be formed into various shapes as shown in FIG. 3, and the shape of the finished product is square. As shown in FIG. 4, the shape of the finished product is elliptical.

Example 2

The specific manufacturing process of the present invention is as follows:

E. Fix the semi-finished product in step D on the mold base, and use the laser cutting machine to cut and separate according to the actual set shape, which is a finished product, and the shape thereof may be a circle, a star shape, an elliptical shape or a heart shape and various other shapes. .

Wherein, in step B, the lining die has at least one lining groove, and the lining groove can be formed into various shapes such as a circle, a star shape, an elliptical shape or a heart shape and various other shapes.

Wherein, in the step D, the package mold has at least one package groove, and the package hole can be formed into various shapes such as a circle, a star shape, an elliptical shape or a heart shape, and other various shapes.

Wherein, in step C, the conductive material comprises aluminum, copper, gold, silver, tin, AZO, ATO or ITO.

In the present invention, the light-guided thermally conductive filler UV-curing adhesive of the mixed light-conducting thermally conductive filler and the phosphor comprises a component per unit mass: 5-60% of the modified acrylic oligomer; 10-70% of the acrylic monomer; photoinitiator 2-5%; auxiliaries 0-1%; light-guided thermally conductive filler 5-30%.

As a preferred embodiment, the mixed light-guided thermally conductive filler UV-curable adhesive specifically uses a unit mass percentage of the following components: modified acrylic oligomer 10%; acrylic monomer 60%; photoinitiator 3%; 1% of the agent; light-guided thermal conductive filler 26%.

Specifically, the modified acrylic oligomer includes: an epoxy acrylate oligomer, a tertiary amine co-initiator oligomer, a pure acrylate oligomer, a silicone acrylate oligomer, and a fat. One or more of a group of urethane acrylate oligomers, aromatic urethane acrylate oligomers, polyester acrylate oligomers, and amine modified polyester acrylate oligomers.

The acrylic monomer includes one or more of a monofunctional monomer, a difunctional monomer, a trifunctional monomer, and a polyfunctional monomer.

The photoinitiator includes: 2-isopropylthioxanthone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, 2-benzyl -2-dimethylamino-1-(4-morpholinylphenyl)butanone, 2-trimethylbenzoyl-diphenylphosphine oxide, 4- Trimethylbenzoyl-diphenylphosphine oxide, 6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1- One or more of phenylacetone, 4-benzoyl-4'-methyldiphenyl sulfide, and 1-hydroxycyclohexyl phenyl ketone.

The auxiliary agent includes one or more of a silane coupling agent, a titanate coupling agent, a wetting agent, an antifoaming agent, a thickener, an antioxidant, an anti-yellowing agent, and an anti-settling agent. .

The light-conducting thermally conductive filler comprises one or more of aluminum oxide, magnesium oxide, zinc oxide, cerium oxide, silicon oxide, and glass powder of nanometer or micrometer order.

The mixed light-guided thermally conductive filler and the UV-curable adhesive of the phosphor have better thermal conductivity and can effectively replace the fixing and heat dissipation of the substrate.

The method for preparing the light-guided thermally conductive filler and the UV-curable adhesive of the phosphor:

Take 10% of the modified acrylic acid oligomer, 60% of the acrylic monomer, 3% of the photoinitiator, 1% of the auxiliary agent, and 26% of the light-conductive and thermally conductive filler to the mixer to stir the various components and stir. The time is 5-30 minutes; after the mixing is completed, the material is transferred to a three-roll mill, and the material is fully ground and dispersed, and the grinding time is 5-30 minutes, and the finished product can be obtained.

When the invention is used, only the lead wire needs to be inserted into the power source to emit light. Since the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor is used instead of the lining plate, the LED chip emits light without being hindered by the substrate, so Achieve full-circumference effect.

The beneficial effects of the invention are:

4. The LED chip encapsulated in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor can achieve the full-circumference illumination effect without the barrier of the conventional substrate.

The above embodiments are merely illustrative of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Improvements are intended to fall within the scope of protection defined by the claims of the invention.

Claims

An LED full-circumference light source, comprising:

a lining layer, the lining layer is provided with at least two LED chips, the P and N poles of the LED chip are exposed outside the lining layer, and the LED chips are electrically connected;

Two leads, one end of the lead is disposed in the lining layer, electrically connected to the LED chip, and the other end of the lead extends outside the lining layer;

An encapsulation layer, the encapsulation layer is over the liner layer, and the LED chip and the lead are disposed between the liner layer and the encapsulation layer; wherein the liner layer and the encapsulation layer are mixed light-conducting and thermally conductive fillers; UV curable glue for phosphors.
The LED full-circumference light source according to claim 1, wherein the LED chip and the lead are electrically connected by vacuum plating or a conductive adhesive layer or a bonding wire.
A method for manufacturing an LED full-circumference light source, comprising the steps of:

A. placing a chip, providing a chip adhesive board and a core-setting machine; the surface of the chip adhesive board is adhered with a partial adhesive tape and fixed on one side of the core-setting machine, and the core-setting machine is provided with a robot; Describe the local adhesive portion of the local adhesive tape on which the LED chip is placed on the surface of the chip adhesive board by a robot;

B. Making a UV-curable adhesive liner of a mixed light-conducting thermally conductive filler and a phosphor, providing a liner mold, the liner mold being made of a light transmissive material, including PP, PE, 矽a glue or glass, the liner mold is provided with a liner groove and a lead groove, the liner mold is fixed and closely attached to the chip adhesive board, and then the lead is placed on the lead groove, wherein the liner The groove corresponds to the LED chip adhered to the chip adhesive board, and the UV-curable rubber mixed with the light-conducting heat-conductive filler and the phosphor is poured into the liner groove by a robot, and the mixed light is guided by the UV curing machine. Light-curing curing of the thermally conductive filler and the phosphor, so that the LED chip is embedded in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor;

C. Connect the chip, use a vacuum coating machine to plate the conductive material on the P and N poles of each adjacent LED chip in step B and the lead to electrically connect the LED chip and the lead; or use a printing machine to make the conductive offset On the P and N poles of each adjacent LED chip in step B and on the lead, the conductive material is cured to electrically connect the LED chip and the lead; or the wire is soldered in step B using a wire bonding machine. On the P and N poles of each adjacent LED chip and on the lead, electrically connecting the LED chip and the lead;

D. Encapsulation, providing a package mold, the package mold is made of a light transmissive material, the light transmissive material comprises PP, PE, silicone or glass, and the package mold is provided with a package groove, and the package mold is Fixed and stuck in step B In the liner mold, the package groove corresponds to the liner hole, and a robot is used to inject the light-guided heat-conductive filler and the phosphor-curable UV-curable glue into the package tank, and then the UV curing machine is used. The mixed light-guided thermally conductive filler and the UV-cured adhesive of the phosphor are photocured to form a semi-finished product, and the liner mold and the package mold are further separated.

E. Fix the semi-finished product in step D on the mold base, and use the laser cutting machine to cut and separate according to the actual set shape.
A method of fabricating an LED full-circumference light source according to claim 3, wherein in the step B, the liner mold has at least one liner groove.
The method for fabricating an LED full-circumference light source according to claim 3, wherein in the step D, the package mold has at least one package groove.
A method of fabricating an LED full-circumference light source according to claim 3, wherein in steps B and D, the curing time of the UV curing machine is 1-100 seconds.
The method for fabricating an LED full-circumference light source according to claim 3, wherein in the step C, the conductive material comprises aluminum, copper, gold, silver, tin, AZO, ATO or ITO.
The method for fabricating an LED full-circumference light source according to claim 3, wherein in the steps B and D, the light-conducting and thermally conductive filler of the UV-curable adhesive which mixes the light-conducting thermally conductive filler and the phosphor comprises nanometer or micrometer. One or more of alumina, magnesia, zinc oxide, cerium oxide, silicon oxide, and glass frit.