CN203746850U - High-efficiency LED module group device capable of omnibearing light emission - Google Patents

Abstract

The utility model provides an omnidirectional high-efficiency LED module device. It includes a sapphire substrate, on which an LED chip is arranged, the upper and lower layers of the LED chip are coated with a DLC transparent heat-conducting film, the side of the chip to be fixed is coated with a DLC transparent heat-conducting film, and the lower layer of the LED chip is coated with a DLC transparent heat-conducting film. There are prefabricated circuits or prefabricated metal electrodes as connecting leads to external power sources. The utility model adopts sapphire as the multi-chip module substrate, which can realize all-round light emission; the DLC transparent heat-conducting film is plated on the sapphire substrate, which can greatly improve the heat dissipation performance of the LED module.

Description

A high-efficiency LED module device that emits light in all directions

(1) Technical field

The utility model belongs to the technical field of LED packaging, and in particular relates to a high-efficiency LED module device capable of emitting light in all directions.

(2) Background technology

LED has the advantages of high light efficiency, low energy consumption, long life, green environmental protection, etc., and is the most ideal substitute for traditional light sources. However, at present, there are still many problems in LED lamps in terms of luminous efficiency, heat dissipation, and weight of lamps. Among them, the biggest bottleneck hindering the improvement of LED performance is heat dissipation. In the traditional packaging method of LED structured light source, the low-power LED multi-chip packaging structure, because the heat generation is not large, the PCB substrate can be used as the bracket. For high-power LEDs, in order to meet their heat dissipation requirements, MCPCB substrates, ceramic substrates or DCB substrates are often used. Among them, the better heat dissipation performance is the MCPCB package, that is, the insulating layer and the circuit layer are sequentially fabricated on the metal substrate with good thermal conductivity, and then the chip or lamp bead is connected to it. The heat generated by the chip needs to pass through the insulating layer to be conducted to the thermally conductive metal substrate. However, the insulating layer is generally made of polymer materials, and its thermal conductivity is only 0.2~0.5W/mK, which seriously affects the overall heat conduction effect, causing the heat generated by the chip to not be dissipated in time. Especially for high-power chips or chip modules, the heat dissipation performance is far from meeting the requirements.

In addition, due to the opacity of the traditional packaging substrate, the light emitted by the light source cannot be emitted from the back, and must be reflected and absorbed multiple times before it can be emitted from the front, resulting in low external quantum efficiency, which in turn reduces the light output efficiency of the LED module and even the entire lamp. Low, and the light angle is small.

Diamond-like carbon film (DLC) is an amorphous carbon film with SP2 and SP3 hybridized carbon atom space network structure, which has excellent properties such as high optical transparency, thermal conductivity, insulation, chemical corrosion resistance and wear resistance. , which exceeds the thermal conductivity of 400W/m.K. There have been studies on replacing the insulating layer of polymer material between the traditional metal circuit and the metal substrate with DLC film, which can effectively improve the thermal conductivity of the insulating layer. However, this structure also has a series of problems such as the small angle of light output and the generation of more heat caused by the opacity of the traditional packaging substrate.

(3) Contents of the invention

The purpose of the utility model is to overcome the deficiencies of the prior art, and to provide a high-reliability, omni-directional and high-efficiency LED module device by utilizing the advantages of sapphire's excellent light transmission and thermal expansion coefficient matching with DLC films.

The purpose of this utility model is achieved in this way: it includes a sapphire substrate, an LED chip is arranged on the sapphire substrate, the upper and lower layers of the LED chip are coated with a DLC transparent heat-conducting film, and the side of the chip to be fixed is coated with a DLC transparent heat-conducting film. Film, the lower DLC transparent heat-conducting film of the LED chip is made with a prefabricated circuit or a prefabricated metal electrode as a lead wire connected to an external power supply.

The utility model also has some technical characteristics:

1. The sapphire substrate is a double-sided sapphire polishing sheet, and the polishing sheet is rectangular, square or circular;

2. The LED chips are at least one group of chips with the same light color or different light colors, and the chips are connected to each other through wires or prefabricated circuits;

3. The LED chip is fixed on the DLC transparent heat-conducting film in the form of front-mount or flip-chip;

4. The LED chip is fixed on the DLC transparent heat-conducting film with die-bonding glue or eutectic welding;

5. The outside of the DLC transparent heat-conducting film is coated with fluorescent glue or evenly sprayed phosphor.

The utility model discloses an LED module device structure, in particular to a high-efficiency LED module device which uses sapphire as a substrate and uses a DLC film to improve the heat dissipation performance of the device, has high reliability, and emits light in all directions. In the utility model, a polished sapphire sheet is used as a chip packaging substrate, and a DLC transparent heat-conducting film is coated on the side of the sapphire substrate to be fixed with the chip. Make a prefabricated circuit on the DLC transparent heat-conducting film, or only make prefabricated metal electrodes on the DLC transparent heat-conducting film at both ends of the substrate, as a lead for connecting to an external power supply. At least one group of chips is fixed on the DLC transparent heat-conducting film, and the chips and the chip electrodes at both ends and the prefabricated metal electrodes are connected to each other through wires or prefabricated circuits. On the side of the sapphire substrate where the chip is fixed, a layer of DLC transparent heat-conducting film is coated to form a sandwich structure, thus forming a bare LED light-emitting module. If the light emitted by the chip needs to be converted into light and color, the entire structure is coated with fluorescent glue or uniformly sprayed with a layer of phosphor powder. The utility model adopts sapphire as the multi-chip module substrate, which can realize all-round light emission; the DLC transparent heat-conducting film is coated on the sapphire substrate, which can greatly improve the heat dissipation performance of the LED module, and the heat dissipation performance of the double-layer DLC film structure is better than Single-layer film structure; the thermal expansion coefficient of DLC transparent heat-conducting film is close to that of sapphire, and the packaging is safer and more reliable; this structure is beneficial to reduce total reflection of light, improve light extraction efficiency, and reduce heat generation at the same time.

The beneficial effects of the utility model are as follows: 1) Using the sapphire surface processing chip as the multi-chip module substrate, the light emitted by the active layer can pass through the substrate, so that the LED chip module can emit light in all directions; 2) the diamond-like film (DLC ) has excellent thermal conductivity and insulation performance, and the DLC transparent thermal conductive film is coated on the sapphire, the heat generated by the chip can be directly conducted to the DLC film, and then quickly exported through the metal electrodes at both ends. It can greatly improve the heat dissipation performance of the LED module, effectively reduce the chip PN junction temperature, and avoid chip damage due to overheating; 3) The LED chip is surrounded by DLC transparent heat-conducting film, and the upper DLC transparent heat-conducting film acts as heat conduction and protects the chip 4) The thermal expansion coefficient of DLC transparent heat-conducting film is close to that of sapphire, which improves the reliability of packaging; 5) The refractive index of DLC film is between semiconductor materials and sapphire. It is beneficial to reduce the possibility of total reflection of light emitted by the chip, improve light extraction efficiency, and reduce heat generation at the same time.

(4) Description of drawings

Fig. 1 is the structural representation of the utility model;

Figure 2 is a cross-sectional view.

(5) Specific implementation methods

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

Referring to Figures 1-2, the omni-directional and high-efficiency LED module device in this embodiment is in the shape of a strip. Figure 1 is a schematic structural view of the LED device in the length direction, and Figure 2 is a cross-sectional view in the width direction. The device is composed of a sapphire substrate 1, a DLC transparent heat-conducting film 2, a prefabricated metal electrode 3, a chip 4, a wire 5 and a fluorescent glue 6. In the embodiment, the sapphire substrate 1 is a strip-shaped polished sapphire sheet with a wafer length of 10-100 mm, a width of 0.1-10 mm, and a thickness of 0.2-2 mm. After the surface is processed, the surface roughness is Ra0.1-400nm. A layer of DLC transparent heat-conducting film 2 is plated on one side of the sapphire substrate by PECVD method, and upper metal electrodes 3 are made on the DLC transparent heat-conducting film at both ends of the sapphire substrate, which are used as leads for connecting with an external power supply. Stick a group of chips 4 on the DLC transparent heat-conducting film with die-bonding glue. The chips are connected to each other by wires 5 , and the electrodes at both ends of the chipset are connected to the prefabricated metal electrodes 3 by wires. A layer of DLC transparent heat-conducting film is coated on the sapphire substrate with the chip bonded, and finally a layer of fluorescent glue 6 is coated on the outside of the entire LED module device except for the reserved metal electrodes. High-efficiency LED module devices.

In the device structure of the LED module, the light emitted by the chip can be emitted in all directions, and the DLC transparent heat-conducting film has high thermal conductivity, so the heat generated by the chip can be quickly conducted to the metal electrode through the DLC transparent heat-conducting film, and then exported to the outside. In addition, the refractive index of DLC transparent heat-conducting film is 18-2.2, which is between semiconductor materials and sapphire, which can reduce the total reflection of light, increase the light output rate, and reduce heat generation. A high-efficiency LED module device that emits light in all directions can be obtained through the above structure.

This utility model only introduces a kind of LED module device, and this introduction is only applicable to the understanding of the principle of this utility model. Therefore, for those of ordinary skill in the art, without departing from the essential features of the present utility model, it is possible to carry out deformation and change to the embodiment, and all these deformation and changes should belong to the claims of the present utility model protected range.

Claims (6)

1. A high-efficiency LED module device that emits light in all directions, is characterized in that it includes a sapphire substrate, an LED chip is arranged on the sapphire substrate, and the upper and lower layers of the LED chip are coated with a DLC transparent heat-conducting film. The side is coated with a DLC transparent heat-conducting film, and the lower DLC transparent heat-conducting film of the LED chip is made with a prefabricated circuit or a prefabricated metal electrode as a lead wire connected to an external power supply. 2. A high-efficiency LED module device with omnidirectional light emission according to claim 1, characterized in that said sapphire substrate is a double-sided sapphire polished sheet, and the polished sheet is rectangular, square or circular. 3. A high-efficiency LED module device with omnidirectional light output according to claim 2, characterized in that said LED chips are at least one group of chips with the same light color or different light colors, and the chips are connected by wires or prefabricated circuits achieve interconnection. 4. A high-efficiency LED module device with omnidirectional light emission according to claim 3, characterized in that the LED chips are fixed on the DLC transparent heat-conducting film in the form of front-mount or flip-chip. 5. A high-efficiency LED module device with omnidirectional light output according to claim 4, characterized in that said LED chip is fixed on the DLC transparent heat-conducting film by die-bonding glue or eutectic soldering. 6. A high-efficiency LED module device with omnidirectional light emission according to claim 5, characterized in that the outside of the DLC transparent heat-conducting film is coated with fluorescent glue or uniformly sprayed phosphor.