WO2010074371A1

WO2010074371A1 - Chip-on-board led package and manufacturing method thereof

Info

Publication number: WO2010074371A1
Application number: PCT/KR2009/002382
Authority: WO
Inventors: 김한도; 윤정현; 김천수
Original assignee: 루미마이크로 주식회사
Priority date: 2008-12-26
Filing date: 2009-05-06
Publication date: 2010-07-01
Also published as: KR100989579B1; KR20100076639A

Abstract

The present invention relates to a chip-on-board LED package that comprises: a metallic heatsink plate; a chip mounted on the metallic heatsink plate; phosphors applied on the chip; and a heatsink insulator provided on the metallic heatsink plate, and including a lead electrode therein that is electrically connected to the chip and passes through the heatsink insulator. Therefore, the chip-on-board LED package has improved heatsink performance, thereby realizing a high-luminance LED.

Description

Chip on board LED package and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-on-board type light emitting diode (LED) package and a method of manufacturing the same.

In general, a light emitting diode (hereinafter referred to as 'LED') basically consists of a junction between a p-type and an n-type semiconductor, and when voltage is applied, electrons and holes are combined to provide energy corresponding to the bandgap of the semiconductor. It is a kind of photoelectronic device that emits in form.

Such LEDs include high-brightness light sources for flashlights, back light for liquid crystal displays (LCDs) used in portable electronic products (mobile phones, camcorders, digital cameras, and PDAs), light sources for billboards, light and switch light sources, and indicators. As a light source for traffic lights, the range of use is expanding day by day.

Such LEDs have been developed in the form of Surface Mount Device (SMD) mounted using Surface Mount Technology (SMT) according to the trend of miniaturization and slimming of information and communication devices.

FIG. 1 is a perspective view illustrating a PCB package in which a plurality of PCB substrates are stacked and fabricated by arranging a plurality of LEDs on a PCB substrate. FIG. 2 is a cross-sectional view illustrating one LED manufactured using the PCB package.

Referring to FIG. 1, a PCB package is formed by stacking a PCB 10 and a reflector 20 in a multi-layered structure. In the PCB 10, a plurality of through holes may be formed to form a terminal pattern and flow terminals and currents. And an SMT slot on the side. In the reflector 20, a chip 31 is mounted on the PCB 10 inside the pad part and a bonding process for connecting the wires 33 is performed. By coating and curing the molding material 35 made of epoxy and phosphor on the chip 31 and the wire 33, one LED package is completed.

LED manufacturing technology using a PCB package, there is an advantage that it is easy to form the terminal portion, the implementation of a multi-package, easy to realize the miniaturization and light weight by using a PCB.

However, since the amount of the phosphor used is large, and the reflector 20 is further configured, manufacturing cost is increased, and the reflector 20 is used, so that light efficiency is lowered.

In order to solve this disadvantage, a chip on board (COB) type LED package has been developed, a brief look at such a structure.

FIG. 3 is a cross-sectional configuration diagram showing a conventional COB package, wherein the COB package includes a metal pad 42 formed of a material such as copper on a resin-based insulating layer 41 to form a lead electrode or the like. A chip 43 is mounted on the metal pad 42 positioned at the center portion. Reference numeral 44 denotes a die adhesive for attaching the chip 43 to the metal pad 42.

The chip 43 is electrically connected to the metal pad 42 constituting the lead electrode through a bonding wire 45, and a phosphor 46 and a COB mold 47 are sequentially applied on the chip 43.

The COB package is applied by doping the phosphor 46 on top of the chip 43, then applying the COB mold 47 thereon, and then curing the chip 43 and the bonding wire 45. To protect.

In the conventional COB package configured as described above, a small amount of the phosphor 46 can be used by applying a dispensing process, thereby reducing manufacturing cost, and the reflector 20 disappears as shown in FIG. 1. Color Temperature) It has the advantage of reducing the deviation and increasing the light efficiency.

However, the conventional COB package type LEDs as described above also have a limitation in improving heat dissipation performance because they do not have a heat dissipation structure capable of sufficiently dissipating heat generated from a chip to the outside, thereby realizing high brightness LEDs. There is a problem that is difficult to do.

In particular, when the LED package is used for a backlight of an LCD, a heat dissipation characteristic and high luminance to maintain a low temperature of the chip, which is a light source, are an important problem. If it is not secured, it is difficult to apply the LCD backlight effectively.

The present invention has been made to solve the above problems, chip-on-board type light emitting diode package to implement a high-brightness LED by improving the heat dissipation performance by mounting the chip directly on top of the metal heat dissipation plate excellent in heat dissipation performance And a method for producing the same.

In addition, the present invention, by insulating the lead electrode and the metal heat dissipation plate connected to the chip at the same time to configure a heat dissipation insulator to enable heat radiation to the top to further improve the heat dissipation performance chip to enable the implementation of a stable and excellent LED package An object of the present invention is to provide an onboard light emitting diode package and a method of manufacturing the same.

In addition, the present invention, by installing an upper metal plate on top of the heat dissipating insulator to enable heat dissipation to the upper and lower parts of the package to ensure a higher heat dissipation performance, the LED has a long life and excellent light emission characteristics It is an object of the present invention to provide a chip-on-board type light emitting diode package and a method of manufacturing the same.

In order to solve the above technical problem, the chip-on-board LED package according to the present invention, the metal heat dissipation plate; A chip mounted on the metal heat dissipation plate; A phosphor coated on the chip; It is provided on the upper portion of the metal heat dissipation plate, it characterized in that it comprises a heat dissipating insulator made to pass through the lead electrode electrically connected to the chip.

It is preferable that an upper heat sink is further provided on the heat dissipating insulator. At this time, the upper heat sink may be made of a metal plate using any one material of Al, Cu, Cu alloy.

In addition, the metal heat dissipation plate is also preferably made of any one of Al, Cu, Cu alloy.

A molding layer is further applied on the phosphor layer, and the molding layer is preferably applied to cover a part of the heat dissipating insulator as well.

The heat dissipating insulator preferably has a structure in which a stage is formed in which the lead electrode is exposed so that a bonding wire connected to the chip can be easily connected.

The heat dissipating insulator is preferably made of polyether ether ketone (PEEK) resin material.

The heat dissipating insulator may have a hole formed therein to have a structure in which the lead electrode is inserted, or may be manufactured by an insert injection method included in the lead electrode.

Next, the method for manufacturing a chip-on-board LED package according to the present invention for solving the above problems, the first step of mounting the chip on the upper portion of the metal heat dissipation plate; A second step of installing a heat dissipating insulator through which a lead electrode passes at a position spaced apart from the chip after the first step; A third step of connecting the chip and the lead electrode with a bonding wire after the second step; A fourth step of forming a phosphor layer by applying a phosphor on the chip after the third step; A fifth step of forming a molding layer on the phosphor layer; And a sixth step of additionally installing an upper heat dissipation plate made of a metal on the heat dissipating insulator.

In the second step, the heat dissipating insulator is formed of a PEEK material, the hole penetrating the center portion is formed by inserting the lead electrode, or the lead electrode can be used that is fixed by the insert injection method.

In the fifth step, the molding layer is preferably covered to cover a part of the heat dissipating insulator, so that the lead electrode is not exposed to the outside.

The chip-on-board light emitting diode package and the method of manufacturing the same according to the present invention have the following effects.

According to the present invention, since the chip is directly mounted on the upper portion of the metal heat dissipation plate having excellent heat dissipation performance, the heat dissipation performance is improved, and the LED can be realized with high brightness.

In addition, since the heat dissipating insulator is installed on the upper portion of the metal heat dissipation plate, the heat dissipation can be insulated from the metal heat dissipation plate and the lead electrode, and the heat can be transferred to the upper side. There is also an effect that can be implemented.

In addition, since the present invention is configured by installing an upper metal plate on top of the heat dissipating insulator, the heat dissipation area can be expanded not only to the lower part of the LED package but also to the upper part, thereby ensuring higher heat dissipation performance and thus lifespan. There is an effect that it is possible to implement LED having a long and excellent light emission characteristics.

In addition, the present invention, the lead electrode is configured to be exposed from the heat dissipating insulator to facilitate the connection work with the bonding wire, and the molding layer is configured to cover the lead electrode, thereby simplifying the assembly process and It also provides the effect of enabling more stable package implementation while reducing costs.

1 is an exploded perspective view showing a PCB package for manufacturing a conventional LED,

2 is a cross-sectional view of the LED using the PCB package of Figure 1,

3 is a cross-sectional view showing a conventional chip-on-board (COB) type LED package,

Figure 4 is a cross-sectional view showing a chip-on-board (COB) type LED package according to the present invention,

5 is a diagram illustrating a method of manufacturing a chip-on-board (COB) type LED package according to the present invention in order.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

4 is a cross-sectional view showing a chip-on-board (COB) type LED package according to the present invention, illustrating a case where two LEDs are configured together.

As shown therein, the chip-on-board LED package according to the present invention includes a metal heat dissipation plate 50, a chip 55 mounted on the metal heat dissipation plate 50, and a coating on the chip 55. The phosphor 70, the heat dissipating insulator 90 provided on the metal heat dissipation plate 50, and the chip 55 and the bonding wire 60 to pass through the inside of the heat dissipating insulator 90. The lead electrode 65 is connected to and electrically connected to an external circuit at the same time, and an upper heat dissipation plate 95 provided on the heat dissipating insulator 90.

The main components of the chip-on-board LED package of the present invention configured as described above will be described in detail.

First, the metal heat dissipation plate 50 is preferably composed of a metal plate of Al (Aluminum) material having a thickness of approximately 1 mm.

The reason why the metal of Al material is used as the metal heat dissipation plate 50 is to quickly transfer heat generated from the chip 55 to the outside under the condition that the chip 55 is directly mounted on the top to promote heat dissipation. For that.

The metal heat dissipation plate 50 is not necessarily limited to an Al material, and may be configured using Cu, a Cu alloy, a SUS material, or the like having a high heat dissipation performance of a certain level or more.

Next, the chip 55 is configured using a chip 55 made of a semiconductor device that is typically installed to implement the LED. Reference numeral 57 in FIG. 4 denotes a die adhesive for attaching the chip 55 to the metal heat dissipation plate 50.

Next, the phosphor 70 is configured to emit a specific color such as RGB while the light emitted from the chip 55 is transmitted. In recent years, the phosphor 70 absorbs a part of the blue light so as to implement a white LED, yellow, pink or In some cases, the color temperature may be controlled within a wide range using an inorganic fluorescent material or an organic fluorescent material which is a fluorescent material capable of emitting red light.

On the phosphor 70 layer, a molding layer 80 is further applied to protect the chip 55 and the phosphor 70 layer as shown in the drawing. In this case, the molding layer 80 may be manufactured and applied to a silicon material. In particular, the molding layer 80 is preferably coated to be configured to implement a stable package state while covering up to a portion of the upper heat sink (95).

Next, the heat dissipating insulator 90 insulates the lead electrode 65 between the metal heat dissipation plate 50 and the upper heat dissipation plate 95, and heats the heat generated from the metal heat dissipation plate 50. 95) to facilitate delivery.

In order to enable such a function, the heat dissipating insulator 90 is preferably made of PEEK (PolyEtherEtherKetone) resin.

PEEK resin is a kind of engineering plastic and is a commercialized plastic material having high heat resistance. When PEEK resin is mixed with nano ceramic particles, the PEEK resin may have higher thermal conductivity.

The lead electrode 65 passes through the inside of the heat dissipating insulator 90. Two examples of the method of configuring the lead electrode 65 to pass through the heat dissipating insulator 90 will be described.

One is a method of forming a hole inside the heat dissipating insulator 90 and inserting the lead electrode 65 into the hole, and the other is a lead electrode (when forming the heat dissipating insulator 90). 65) is a method of injection molding by insert injection.

In addition, the heat dissipating insulator 90 may be divided into a plurality of layers and stacked in accordance with the exemplary embodiment. In this case, the lead electrode 65 may be inserted between the plurality of layers.

In addition, the heat dissipating insulator 90 is configured such that at least one end of the lead electrode 65 passing therein is exposed to the outside, which connects the chip 55 and the lead electrode 65 to the bonding wire 60. In this case, the bonding wire 60 is easily connected to the lead electrode 65. To this end, a structure in which the upper portion of the portion adjacent to the phosphor 70 layer in the heat dissipating insulator 90 is deleted, that is, the step S may be formed.

In addition, when the end S as described above is formed on the heat dissipating insulator 90, the molding layer 80 is coated and positioned thereon, thereby maintaining a stable fixed state.

Next, as described above, the lead electrode 65 is connected to the chip 55 through a bonding wire 60, and the other side is electrically connected to an external circuit such as a substrate on which the LED package of the present invention is mounted. It is configured to connect, and may be made of an alloy such as Cu, Ni, Ag, etc., made of a long linear structure is configured to pass through the heat dissipating insulator 90.

Next, the upper heat dissipation plate 95 is installed to receive heat generated while the chip 55 is driven from the heat dissipating insulator 90 through the heat dissipating insulator 90 and to be discharged to the outside. It is preferable to be composed of the same metal material as the metal heat dissipation plate 50, but is not necessarily limited thereto, and a metal material having excellent heat dissipation performance may be selected and applied as necessary.

The upper heat sink 95 may be composed of a plate-like structure made of Al material, such as the metal heat dissipation plate 50, in which the thickness may be configured to be about 0.2mm.

In addition, the upper heat sink 95 can be configured using other metals having good heat dissipation performance, such as Cu and Cu alloys, in addition to the Al material.

Now, a method of manufacturing a chip on board (COB) type LED package according to the present invention configured as described above with reference to FIG. 5 will be described.

5 is a flowchart illustrating a method of manufacturing a chip on board (COB) type LED package according to the present invention.

The method of manufacturing a chip on board (COB) type LED package according to the present invention is as follows.

First, as shown in FIG. 5A, the chip 55 is mounted on the metal heat dissipation plate 50. At this time, the chip 55 is attached to the metal heat dissipation plate 50 by the die adhesive 57 is installed.

Next, as shown in FIG. 5B, a heat dissipating insulator 90 including a lead electrode 65 is installed at a position spaced apart from the chip 55 at an upper portion of the metal heat dissipation plate 50. do.

At this time, it is preferable that the heat dissipating insulator 90 is formed of PEEK resin, and a structure in which the lead electrode 65 is inserted therein or a method manufactured by insert injection method is used. Of course, in the structure in which the lead electrode 65 is inserted, it is also possible to install the heat dissipation insulator 90 on the metal heat dissipation plate 50 and then insert the lead electrode 65 in such a manner.

Next, as shown in FIG. 5C, the bonding wire 60 is connected to the lead electrode 65 exposed from the chip 55 and the heat dissipating insulator 90 to thereby form the chip 55 and the lead electrode 65. Is electrically connected.

Next, as shown in FIG. 5D, the phosphor 70 is coated to cover the chip 55 and the bonding wire 60. In this case, the phosphor 70 is coated by a method such as dotting the upper portion of the metal heat dissipation plate 50 in the inner region of the heat dissipation insulator 90 located around or on both sides of one chip 55.

Next, as shown in FIG. 5E, the molding layer 80 is formed on the phosphor 70 so as to cover a part of the phosphor 70 and the heat dissipating insulator 90.

In this case, the molding layer 80 protects the chip 55, the bonding wire 60, and the phosphor 70, and also covers a part of the heat dissipating insulator 90, so that the heat dissipating insulator 90 heats the metal. In addition to being stably fixed to the upper portion of the plate 50, it also serves to protect the lead electrode 65 from being exposed to the outside.

Next, as shown in FIG. 5E, an upper heat sink 95 made of a metal material is further installed on the heat dissipating insulator 90.

At this time, the upper heat dissipation plate 95 is preferably installed to be in close contact with the heat dissipating insulator 90 by using an adhesive having a thermal conductivity so that heat transfer can be made smoothly.

Meanwhile, in the above, the method of installing the heat dissipating insulator 90 first and applying the phosphor 70 later is illustrated. On the contrary, the phosphor 70 may be applied first and the heat dissipating insulator 90 may be installed later. In this case, the bonding wire 60 is connected to the chip 55 before the phosphor 70 is coated, and after the phosphor 70 is coated, the other end of the bonding wire 60 is connected to the heat dissipating insulator 90. Proceed to how.

In addition, in the above description, a configuration in which the upper heat sink 95 is installed after the molding layer 80 is first formed, has been described. On the contrary, the upper heat sink 95 may be installed first and the molding layer 80 may be formed later. Do.

The technical idea described in each embodiment of the present invention may be implemented independently, or may be implemented in combination with each other. In addition, the present invention has been described through the embodiments described in the drawings and the detailed description of the invention, which is merely exemplary, and those skilled in the art to which the present invention pertains various modifications and equivalent other embodiments therefrom It is possible. Therefore, the technical protection scope of the present invention will be defined by the appended claims.

Claims

A metal heat dissipation plate;

A chip mounted on the metal heat dissipation plate;

A phosphor coated on the chip;

And a heat dissipation insulator provided on an upper portion of the metal heat dissipation plate and configured to pass a lead electrode electrically connected to the chip therein.
The method according to claim 1,

Chip-on-board LED package, characterized in that the upper heat sink is further provided on the heat insulating insulator.
The method according to claim 2,

The upper heat sink is a chip-on-board LED package, characterized in that made of a metal plate using any one material of Al, Cu, Cu alloy.
The method according to claim 1,

The metal heat dissipation plate is a chip-on-board LED package, characterized in that made of any one material of Al, Cu, Cu alloy.
The method according to claim 1,

Chip-on-board light emitting diode package, characterized in that the molding layer is further applied on the phosphor layer.
The method according to claim 5,

The molding layer is a chip-on-board type light emitting diode package, characterized in that the coating to cover a portion of the heat dissipating insulator together.
The method according to claim 1,

The heat dissipating insulator is a chip-on-board type light emitting diode package, characterized in that formed of a structure in which a step (삭제) is formed so that the lead electrode is exposed so that the bonding wire connected to the chip can be easily connected.
The method according to claim 1,

The heat dissipating insulator is a chip-on-board LED package, characterized in that consisting of PEEK (PolyEtherEeKetone) resin material.
The method according to claim 1,

The heat dissipating insulator is a chip-on-board type light emitting diode package, characterized in that the hole is formed inside the lead electrode is made of a structure that is inserted.
The method according to claim 1,

The heat dissipating insulator is a chip-on-board type light emitting diode package, characterized in that made by insert injection method comprising a lead electrode.
A first step of mounting the chip on top of the metal heat dissipation plate;

A second step of installing a heat dissipating insulator through which a lead electrode passes at a position spaced apart from the chip after the first step;

A third step of connecting the chip and the lead electrode with a bonding wire after the second step;

A fourth step of forming a phosphor layer by applying a phosphor on the chip after the third step;

A fifth step of forming a molding layer on the phosphor layer;

And a sixth step of additionally installing an upper heat sink made of a metal material on top of the heat dissipating insulator.
The method according to claim 11,

In the second step, the heat dissipating insulator is formed of a PEEK material, the chip-on-board type light emitting diode package manufacturing method, characterized in that the hole is formed through the method of inserting the lead electrode.
The method according to claim 11,

In the second step, the heat dissipating insulator is formed of a PEEK material, and the lead-on board-type LED package manufacturing method, characterized in that the lead electrode is fixed by the insert injection method.
The method according to claim 11,

In the fifth step, the molding layer is covered with a part of the heat dissipating insulator, the chip-on-board type light emitting diode package manufacturing method, characterized in that the coating so that the lead electrode is not exposed to the outside.