JP2007150233A - Color-temperature controllable light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a color-temperature controllable light-emitting device capable of changing the color temperature of radiation light. <P>SOLUTION: The color-temperature controllable light-emitting device 1 comprises a blue light-emitting diode 21, a first burying material 110 for burying the blue light-emitting diode 21, an orange light-emitting diode 22, and a second burying material 120 for burying the orange light-emitting diode 22. The first burying material 110 contains a light-transmitting resin 111 and a yellow phosphor 113. The second burying material 120 contains a light-transmitting resin 121 and quartz glass particles 122, and does not contain the yellow phosphor. The quartz glass particles 122 are made of quartz glass containing at least one type of metal element selected from Al, Ti, Fe, Nb, Zr, Mn and Mo as impurities. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a color temperature variable light emitting device. More particularly, the present invention relates to a color temperature variable light emitting device capable of changing the color temperature of emitted light.

2. Description of the Related Art Conventionally, a light-emitting device that includes light-emitting diodes that emit different colors (hereinafter also simply referred to as “LEDs”) and uses different emitted lights in a mixed color is known. As such a light emitting device, the following Patent Document 1 and Patent Document 2 are known.
The following Patent Document 1 is a light emitting device that has a blue LED, a yellow phosphor, and a red LED, and can obtain white light with good color reproducibility. The following Patent Document 2 is a light-emitting diode that has a blue LED, a YAG phosphor, and an orange LED and that can obtain white light that is natural and has a good color mixing state.

JP 2006-80334 A JP 2005-216892 A

  In the light emitting device of Patent Document 1, since a red LED is used as an auxiliary LED, light with improved color rendering properties can be obtained, light with a strong red color whose color temperature is less than 3000K, Although it is possible to obtain a strong blue light having a color temperature of 6000K or higher, it is not possible to obtain light having a color temperature of about 3000 to 4000K that is frequently used as illumination. Further, in Patent Document 1, there is no examination or suggestion of controlling the color temperature.

  On the other hand, the light emitting diode of Patent Document 2 uses an orange LED as an auxiliary LED, and has a structure in which both a blue LED and an orange LED are covered with a YGA phosphor. For this reason, orange light is diffused by the YAG phosphor and is excellent in that white light and orange light are sufficiently mixed. However, since the YAG phosphor does not have translucency, the orange light is attenuated. Therefore, the orange light cannot be fully utilized. Further, in order to obtain a sufficient color mixture state, the luminous intensity of the blue LED must be lowered, and there is a problem that the LED as a whole has a small luminous intensity. Further, in Patent Document 2, there is no examination or suggestion of controlling the color temperature.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a color temperature variable light-emitting device capable of changing the color temperature of emitted light and a light-emitting device including the same.

The present invention is as follows.
(1) A blue light emitting diode, a first embedded material portion for embedding the blue light emitting diode, an orange light emitting diode, and a second embedded material portion for embedding the orange light emitting diode,
The first burying material portion contains a translucent resin and a yellow phosphor,
The second embedded material portion contains a translucent resin and quartz glass particles and does not contain a yellow phosphor,
The quartz glass particle is made of quartz glass containing at least one metal element selected from Al, Ti, Fe, Nb, Zr, Mn, and Mo as an impurity.
(2) The content of the impurities contained in the quartz glass particles is 0.01 to 0.2% by mass in terms of oxide of each metal element when the entire quartz glass particles are 100% by mass. The color temperature variable light-emitting device according to (1) above.
(3) The color temperature variable light-emitting device according to (1) or (2), wherein the first embedded material portion includes the quartz glass particles.
(4) having a container including one surface and a recessed portion recessed from the one surface;
In the recess, the blue light emitting diode and the first embedded material portion are disposed,
The color temperature variable light-emitting device according to any one of (1) to (3), wherein the orange light-emitting diode and the second embedded material portion are disposed on the one surface.
(5) The container is composed of a multilayer wiring board,
An insulating layer, a heat dissipation support film having a thickness of 50 to 500 μm laminated on one surface of the insulating layer, and a conductor layer provided on the other surface of the insulating layer, and penetrates the insulating layer and the conductor layer A bottom substrate provided with a first through-hole,
An insulating intermediate layer having a second through hole that is laminated on a portion of the other surface of the bottom substrate excluding the opening of the first through hole and communicates with the entire surface of the opening of the first through hole;
And an upper substrate having a third through hole which is laminated on a portion of the surface of the insulating intermediate layer excluding the opening of the second through hole and communicates with the entire opening surface of the second through hole, The color temperature variable light-emitting device according to (4) above, comprising:
(6) The container, at least three lead bodies, and a resin mold for sealing the container and a part of each of the lead bodies,
The color temperature variable light-emitting device according to (4), wherein the container is made of an integrally formed metal and has an extended lead portion.

According to the color temperature variable light emitting device of the present invention, the color temperature can be changed. In particular, the color temperature can be freely changed in a wide range of 2000 to 11000K. Furthermore, it can be changed at a constant light intensity regardless of the color temperature, and can be changed at a particularly high light intensity and a wide color temperature.
When the content of impurities contained in the quartz glass particles is 0.01 to 0.2% by mass,
The light-transmitting device and the light-dispersing property can be most efficiently obtained, and the color temperature variable light-emitting device having good color mixing and high luminous intensity can be obtained. In particular, the ineffective light can be efficiently converted into emitted light, and the color temperature variable light emitting device having high efficiency and high luminous intensity can be obtained.
In the case where the first embedded material portion contains quartz glass particles, it is possible to obtain a color temperature variable light-emitting device having particularly high luminous intensity.

  In the case of having a container including one surface and a recessed portion recessed from one surface, the blue LED and the first embedded material portion are disposed in the recessed portion, and the orange LED and the second embedded material portion are disposed on the one surface The color temperature can be changed more reliably. In particular, the color temperature can be freely changed in a wide range of 2000 to 11000K. Furthermore, it can be changed at a constant light intensity regardless of the color temperature, and can be changed at a particularly high light intensity and a wide color temperature.

When the container is made of the multilayer wiring board, circuit design can be freely performed. In particular, since the insulating intermediate layer is provided, not only the bottom substrate but also the insulating intermediate layer can be provided with a circuit, and advanced LED control can be performed. In addition, since the insulating intermediate layer is provided, a substrate having one surface and a recess can be designed easily.
In the case where the container includes at least three lead bodies and a resin mold that seals each of the container and each of the lead bodies, and the container is made of an integrally formed metal and has an extended lead portion. The color temperature can be changed in a widely used form.

Hereinafter, the present invention will be described in detail with reference to FIGS.
The color temperature variable light-emitting device 1 of the present invention includes a blue LED 21, a first embedded material portion 110 in which the blue LED 21 is embedded, an orange LED 22, and a second embedded material portion 120 in which the orange LED 22 is embedded, The first burying material portion 110 contains a translucent resin 111 and a yellow phosphor 113, and the second burying material portion 120 contains a translucent resin 121 and quartz glass particles 122 and is yellow fluorescent. The quartz glass particles 122 are characterized by being made of quartz glass containing at least one metal element selected from Al, Ti, Fe, Nb, Zr, Mn and Mo as impurities.

The “blue LED 21” is an LED that can emit blue light. The configuration of the blue LED is not particularly limited, and a known blue LED can be used. The blue light may be any light that can be visually recognized in blue, and the wavelength thereof is not particularly limited, but is usually an emission wavelength in the range of 460 to 470 nm.
The “first burying material portion 110” is a portion made of a burying material for burying the blue LED 21. The first burying material part 110 contains a translucent resin 111 and a yellow phosphor 113. Of these, the translucent resin 111 is usually a resin that forms a matrix with respect to the yellow phosphor 113.

The “translucent resin 111” is a resin having translucency. The translucency is a translucency for visible light, particularly 60% or more (more preferably 70 to 95%, still more preferably 75 to 95%, particularly preferably 75 to 90%) for light having a wavelength of 300 to 950 nm. ) Is preferable.
The resin constituting this translucent resin 111 is not particularly limited. Examples of the translucent resin include an epoxy resin and a silicon resin. These may use only 1 type and may use 2 or more types together. Although content of translucent resin contained in a 1st embedment material part is not specifically limited, when the whole filler is 100 volume%, it is 10-100 volume% (further 13-100 volume%, and still more 20- 100 volume%, especially 30 to 100 volume%). In addition, although the said translucent resin is normally used, it can replace with translucent resin and can also use liquid glass.

  The “yellow phosphor 113” is a phosphor capable of receiving yellow light (wavelength 400 to 550 nm) upon receiving light from the blue LED 21. The type of the yellow phosphor is not particularly limited. For example, a TAG phosphor, a YAG phosphor, a sulfide phosphor, a nitride phosphor, and the like can be used. These may use only 1 type and may use 2 or more types together. Among these, a TAG phosphor is particularly preferable. The TAG phosphor has excellent filling properties compared to other yellow phosphors, and can exhibit particularly excellent effects when using the container 100 described later. That is, for example, when a YAG phosphor is used, if it is mixed with a translucent resin 111 and further mixed with quartz glass particles 113 described later, the viscosity of the embedded material increases and it becomes difficult to embed the blue LED 21. There is a case. However, with the TAG phosphor, even in such a configuration, the viscosity of the embedded material does not increase excessively, and the embedded operation can be performed without any problem.

Although content of this yellow fluorescent substance 113 is not specifically limited, When the 1st embedding material part 110 whole is 100 mass%, it is 10-40 mass% (more preferably 15-35 mass%, More preferably, 20-30 Mass%, particularly preferably 21 to 25 mass%).
Moreover, although the magnitude | size, shape, etc. of the yellow fluorescent substance 113 are not specifically limited, Usually, it is preferable that it is an average particle diameter of 30-200 micrometers (more preferably 40-150 micrometers, especially preferably 45-147 micrometers). Moreover, the shape is usually spherical and / or irregularly shaped particles.

The first burying material portion 110 may contain components other than the translucent resin 111 and the yellow phosphor 113. Examples of other components include quartz glass particles 112 and other phosphors described later.
When these quartz glass particles 112 and / or other phosphors are contained, the translucent resin 111 usually serves as a matrix for the quartz glass particles 112 and other phosphors. Therefore, it is preferable that the quartz glass particles 112 and other phosphors are dispersed and contained in the translucent resin 111, respectively. Moreover, it is preferable that it is more uniformly dispersed.

  The following specific silica glass particles 112 have both an effect of improving translucency and an effect of improving light dispersibility. Therefore, the light emitted from the blue LED 21 can be transmitted while being dispersed. That is, when the yellow phosphor 113 is contained in the first burying material part 110, the light transmittance of the first burying material part 110 is lower than that in the case where it is not contained. However, the passage of light is ensured by containing the quartz glass particles 112, and a decrease in transmittance is suppressed as compared with the case where the quartz glass particles 112 are not contained. Further, since the quartz glass particles 112 have excellent light dispersibility, the same yellow light can be obtained even with a relatively small amount of yellow phosphor. For this reason, high luminous intensity can be obtained while containing the yellow phosphor 113 as a whole. Furthermore, the color mixing property of yellow light and blue light obtained due to the light dispersibility of the quartz glass particles 112 is also improved.

When the quartz glass particles 112 are contained in the first burying material part 110, the content is not particularly limited. However, when the entire first burying material part 110 is 100% by mass, 0.01 to 50% by mass (more Preferably 1 to 45% by mass, more preferably 10 to 45% by mass, still more preferably 20 to 43% by mass, particularly preferably 25 to 42% by mass, more particularly preferably 30 to 40% by mass). preferable.
On the other hand, examples of the other phosphors include, for example, a phosphor having a red fluorescence ability (red phosphor), a phosphor having a blue fluorescence ability (blue phosphor), and a phosphor having a green fluorescence ability (green phosphor). And phosphors having orange fluorescence ability. These may use only 1 type and may use 2 or more types together.

The “orange LED 22” is an LED that can emit orange light. The configuration of the orange LED 22 is not particularly limited, and a known orange LED can be used. The orange light may be any light that can be visually recognized as orange, and the wavelength thereof is not particularly limited, but is usually 550 to 650 nm (preferably 560 to 610 nm, more preferably 570 to 600 nm, still more preferably 575 to 575). The emission wavelength is in the range of 595 nm.
The “second burying material portion 120” is a portion made of a burying material for burying the orange LED 22. The second burying material portion 120 contains a translucent resin 121 and quartz glass particles 122. However, the yellow phosphor is not contained (meaning that it is not intentionally contained, and unavoidable inclusion to the extent that the contained effect cannot be obtained is good).

  As the translucent resin 121 contained in the second embedded material portion 120, the translucent resin 111 in the first embedded material portion 110 can be applied as it is. However, the translucent resin 111 in the first embedded material portion 110 and the translucent resin 121 in the second embedded material portion 120 may be the same or different. The translucent resin 121 is usually a resin that becomes a matrix with respect to the quartz glass particles 122, and the quartz glass particles 122 are dispersed and contained in the translucent resin 121, and are further dispersed uniformly. Preferably it is.

The “quartz glass particles 122 (112)” are particles made of quartz glass containing at least one metal element selected from Al, Ti, Fe, Nb, Zr, Mn, and Mo as impurities. Each said metal element is normally contained as an oxide and / or a double oxide. That is, for example, Al ₂ O ₃ , TiO ₂ , Fe ₂ O ₃ , Nb ₂ O ₅ , ZrO ₂ , MnO _2, MoO _{2 and the} like can be mentioned. The content ratio of impurities is not particularly limited, but usually 0.01 to 0.2 mass% (preferably 0.05 to 0.2 mass%) in terms of oxide of each element when the entire quartz glass particle is 100 mass%. Mass%, more preferably 0.1 to 0.15 mass%) (when a plurality of elements are contained, the total amount in terms of oxide). Within this range, it is possible to most efficiently have translucency and light dispersibility. In addition, the above oxide conversion is performed by converting Al as Al ₂ O ₃ , Ti as TiO ₂ , Fe as Fe ₂ O ₃ , Nb as Nb ₂ O ₅ , Zr as ZrO ₂ , Mn as MnO ₂ , and Mo as MoO _2. is there.

  The size and shape of the quartz glass particles 122 are not particularly limited, but the average particle size (maximum length) is 1 to 30 μm (more preferably 1 to 15 μm, still more preferably 2 to 10 μm, still more preferably 3 to 7 μm). And particularly preferably 4 to 6 μm, particularly preferably 4 to 5 μm. In this range, sufficient light dispersibility can be obtained while ensuring sufficient light transmission. The shape of the quartz glass particles 122 is not particularly limited, but is usually spherical. Even if contained in the light-transmitting resin 120 in a spherical shape, the container 100 described later can be filled with good workability.

Further, the content of the quartz glass particles 122 is not particularly limited, but is 0.01 to 50% by mass (more preferably 1 to 45% by mass, still more preferably) when the second embedded material portion 120 is 100% by mass. 10 to 45% by mass, still more preferably 20 to 43% by mass, particularly preferably 25 to 42% by mass, and particularly preferably 30 to 40% by mass).
Further, the translucency in the quartz glass particles 122 is translucency with respect to visible light, particularly 5% or more (more preferably 10 to 50%, still more preferably 20 to 60) for light having a wavelength of 300 to 950 nm. %) Is preferred.

The quartz glass particles 122 are particularly excellent in the balance between translucency and light dispersibility. In other words, it is superior in transmission on the long wavelength side as compared with a normal glass material (glass other than quartz glass). Therefore, it is difficult to prevent the emission of light on the long wavelength side by the orange LED, and it is easy to exert the effect of mounting the orange LED. Further, the quartz glass particles 122 are superior in light dispersion ability compared to quartz crystals. That is, the quartz crystal is more excellent in translucency than quartz glass, but contains almost no impurities. Since no impurities are contained, when quartz crystal is used, reflection on the particle surface is only used as a light dispersion function. On the other hand, quartz glass particles contain impurities in the above-mentioned range, and thus have excellent light dispersibility while sufficiently ensuring translucency. Therefore, light dispersibility can be exhibited both inside and on the surface of the particle, and excellent color mixing can be exhibited.
Further, the quartz glass particles have a large specific heat capacity, and can keep the temperature of the entire buried material portion (110 and 120) and further the light emitting device 1 as a whole. Therefore, superior heat resistance can be exhibited compared with the case where quartz glass is not contained, and an LED with a larger current specification can be used.

By containing quartz glass particles in the second embedded material portion 120, white light having a high color temperature obtained from the blue LED 21 and the first embedded material portion 110 and orange light obtained from the orange LED 22 are efficiently mixed. be able to. In addition, since the second embedded material portion 120 does not contain a yellow phosphor, it is possible to obtain the light emission of the orange LED 22 with sufficient luminous intensity with respect to high-luminance white light. Therefore, the color temperature variable light-emitting device 1 as a whole can not only change the color temperature but also control the luminous intensity at the same time. That is, conventionally, the light intensity has to be reduced at a low color temperature, whereas light can be emitted at a high light intensity even at a low color temperature.
The second embedded material portion 120 may contain components other than the translucent resin 121, but preferably does not contain non-translucent components such as phosphors. That is, it may be contained as long as the effect of not containing the yellow phosphor in the second embedded material portion 120 is sufficiently exhibited.

  The color temperature variable light-emitting device 1 of the present invention only needs to have the above-described configuration, and the arrangement and the like of each part are not particularly limited. However, the color temperature variable light-emitting device 1 includes a container 100 including one surface 101 and a recess 102 that is recessed from the one surface 101 The blue LED 21 and the first embedded material portion 110 are preferably disposed in the recess 102, and the orange LED 22 and the second embedded material portion 120 are preferably disposed on the one surface 101. Furthermore, it is preferable that a second embedded material portion 120 is further disposed on the first embedded material portion 110. When the second embedded material portion 120 is disposed on the first embedded material portion 110, the color mixing property and the high luminous intensity are further improved.

The “container 100” includes one surface 101 and a recess 102 that is recessed from the one surface 101. Examples of the container 100 include a substrate (see FIGS. 1 to 14), a frame (see FIGS. 15 to 17 and FIG. 20), and the like.
The depth of the recessed part 102 is not specifically limited, For example, it can be 0.2-5 mm (distance from the one surface 101 to the lowest part of the recessed part 102). Moreover, it is preferable that a depth is 0.2-2 mm especially for a wide-angle use. Further, the size of the recess 102 is not particularly limited, and can be appropriately determined depending on the planar shape of the recess 102 or the like. For example, when the planar shape of the recessed part 102 is circular, the diameter can be 2-12 mm (further 5-12 mm, especially 5-8 mm). Even in the case of a shape other than a circular shape, the same dimensions can be obtained by setting a virtual circle.

  Moreover, the shape of the recessed part 102 is not specifically limited. That is, for example, the planar shape may be a circular shape as shown in FIG. 9, FIG. 11, FIG. 12, and FIG. 13, or may be another shape such as a triangle and a quadrangle. Furthermore, as shown in FIG. 10, it may have a substantially star shape or the like having one concave portion for each LED and communicating these radially. Furthermore, the number of the recesses 102 included in the container 100 is not particularly limited, and may be one or may be two or more. However, since it is one recessed part 102 connected like FIG. 10, the filling of the 1st embedding material part 110 can be performed smoothly and it is excellent in workability | operativity. Furthermore, the cross-sectional shape of the recess 102 is not particularly limited, and may be a bowl shape or a substantially flat bottom surface. Among these, the bottom surface preferably has a substantially flat shape.

The size, shape, etc. of the one surface 101 are not particularly limited. Although the frame portion does not have to be provided like the container 100 illustrated in FIG. 20, a frame portion may be provided to cover the orange LED 22 with the second embedded material portion 120. That is, it is possible to provide a further step up from the one surface. For example, the LED mounting substrate (one type of color temperature variable light-emitting device 1) illustrated in FIGS. 1 to 8 and 11 is an insulating intermediate layer 12 and an upper substrate 13 (rising portion 103) described later, and FIGS. 17 is a rising portion 103 in the cup portion (container 100) of the frame illustrated in FIG. Therefore, it is preferable that these containers 100 have a three-stage shape of one surface 101, a concave portion 102 that is recessed from the one surface 101, and a rising portion 103 that rises from the one surface.
Further, for example, the container 100 may have a shape that is recessed from the peripheral part toward the central part as illustrated in FIGS. Further, for example, as illustrated in FIGS. 4 to 6 and the like, the shape may be a concave shape from the central portion toward the peripheral portion.

More specifically, examples of the container 100 include the containers 100 provided in each of the color temperature variable light-emitting devices 1 of (1), (2), and (3) below (for each container 100). , Each color temperature variable light-emitting device 1 will be described).
(1) The container 100 is formed of a multilayer wiring board, and is provided on the other surface of the insulating layer, the heat-radiating support film 4 having a thickness of 50 to 500 μm laminated on one surface of the insulating layer, and the other surface of the insulating layer. A bottom substrate 11 having a conductor layer 5 and provided with a first through hole penetrating the insulating layer and the conductor layer 5, and an opening of the first through hole in the other surface of the bottom substrate 11 And an insulating intermediate layer 12 having a second through hole that is laminated in a portion excluding the first through hole and communicated with the entire opening surface of the first through hole, and the second through hole in the surface of the insulating intermediate layer 12 The color temperature variable light-emitting device 1 (hereinafter simply referred to as “multilayer substrate”) including an upper substrate 13 having a third through-hole that is stacked in a portion excluding the opening of the hole and communicates with the entire opening surface of the second through-hole. Also referred to as “type.” See FIGS.

  Also, (2) at least three lead bodies 601 and a resin mold 602 that seals the housing body 100 and a part of each of the lead bodies 601, the housing body 100 is an integrally formed metal The color temperature variable light-emitting device 1 (hereinafter also simply referred to as “resin mold type”, see FIGS. 15 to 19).

  Further, (3) the housing body 100 and the lead body 702 are housed in the outer shell case 701 having at least one surface opened, and the translucent resin (the light transmitting material of the first embedded material portion 110 is contained in the outer shell case 701). The color temperature variable light-emitting device 1 (hereinafter also simply referred to as “case type”, which can be filled with the second burying material portion 120 itself) (hereinafter also simply referred to as “case type”, see FIG. 20). The structure in the container 100 is as before.

[1] Multi-layer board type color temperature variable light emitting device 1 (see FIGS. 1 to 14)
Hereinafter, the multilayer substrate type color temperature variable light emitting device (1) will be described.
The “bottom substrate 11” is provided with metal layers on both sides having an insulating layer, a heat-radiating support film 4 made of copper foil or the like provided on one surface, and a conductor layer 5 laminated on the other surface. It is a laminate. The insulating layer is not particularly limited, and insulating layers made of various insulating materials can be used. Examples of the insulating material include resin and ceramic.

When the above resin is used, the type of resin is not particularly limited, and examples thereof include insulating resins such as epoxy resins, bismaleimide resins, phenylene resins, phenylene ether resins, and phenol resins. Among these, an epoxy resin is preferable. It is because it is excellent in insulation, handleability and versatility. For the insulating layer using resin, for example, a substrate in which a prepreg obtained by impregnating a base material such as glass cloth with an insulating resin varnish such as an epoxy resin (hereinafter also simply referred to as “glass epoxy substrate”) is used. be able to.
When the ceramic is used, the type of ceramic is not particularly limited, and examples thereof include aluminum nitride, silicon carbide, silicon nitride, and alumina. In addition, the insulating layer manufactured using aluminum nitride has translucency, and the reflection efficiency can be easily improved by plating the surface with, for example, silver or the like.
The thickness of the bottom substrate 11 is not particularly limited, and can be 100 to 4000 μm, particularly 300 to 3000 μm, and further 500 to 2500 μm.

  Further, the bottom substrate 11 includes the “heat dissipation support film 4” for dissipating heat generated from the LEDs (21 and 22 and the like) on one surface of the insulating layer. On the other hand, the conductor layer 5 provided on the other surface of the insulating layer is for forming a wiring pattern having electrodes and the like to be electrically connected to the LED.

  Of these, the method of providing the heat-dissipating support film 4 is not particularly limited, but since a considerable thickness is required for heat dissipation, it is usually provided by a method of laminating metal foils. The material of the heat dissipation support film 4 is not particularly limited, and copper, aluminum, or the like can be used. Of these metals, copper is preferred because of its excellent thermal conductivity. The thickness of the support film 4 for heat dissipation is 50 to 500 μm, and preferably 50 to 300 μm. If the thickness of the heat dissipation support film 4 is 50 to 500 μm, the LED (usually the blue LED 21) bonded to the heat dissipation support film 4 can be supported, and the heat dissipation is sufficiently performed. Furthermore, it can be set as a lightweight LED mounting board.

  The formation method of the conductor layer 5 for forming a wiring pattern etc. is not specifically limited, Any of the method of laminating | stacking metal foil, the plating method, sputtering method, etc. may be sufficient. The material of the conductor layer 5 is not particularly limited, and copper and silver can be used. For the formation of the conductor layer 5, copper is usually used. That is, so-called double-sided copper-clad lamination can also be used. The thickness of the conductor layer used as this wiring pattern etc. can be 10-150 micrometers, for example.

Further, the bottom substrate 11 is provided with a first through hole. The first through hole corresponds to the recess 102. The number of the first through holes is not particularly limited. That is, for example, one first through hole may be provided in one substrate as illustrated in FIG. 12 (chip type), and two or more in one substrate as illustrated in FIG. 13 (array type). A first through hole may be provided. Further, at least as many first through holes as the number of LEDs mounted on the substrate may be provided. Furthermore, the number of the first through holes can be the same as the number of LEDs to be mounted.
The first through hole is provided through the insulating layer and the conductor layer 5 for forming a wiring pattern or the like provided on the other surface of the insulating layer. Further, when the reflective layer 6 is provided, the reflective layer 6 is provided so as to penetrate therethrough.

  The inner wall surface of the first through hole may be in a state where the insulating layer appears, and the conductor layer 5 and / or the reflective layer 6 may be provided. By providing the conductor layer 5 and / or the reflective layer 6, the luminous intensity can be increased. The material of the reflective layer 6 is not particularly limited, and may be a metal such as silver, copper, gold, nickel, nickel-chromium. Among these metals, silver is preferable because it has particularly excellent reflection efficiency. That is, as the reflective layer 6, for example, electroless Ni plating (for example, 5 to 15 μm), electrolytic Au plating (for example, 0.5 to 2 μm), and electrolytic Ag plating (for example, 10 to 25 μm) is applied to the inner surface of the first through hole. Each can be formed in this order. In such multi-layer plating, a liquid containing metal ions (for example, Au ions, Ag ions, etc.) is introduced into the recesses, and a plating layer (for example, an electroless Ni plating layer) previously formed in the recesses is energized. Can be formed.

  Furthermore, the surface of the support film 4 for heat radiation exposed in the first through hole provided in the bottom substrate 11 may not include the reflective layer 6, but the reflective layer 6 (hereinafter simply referred to as “bottom reflective layer”). Can also be provided). When the bottom reflective layer 6 is provided, light (ring emission) or ineffective light emitted from the LED (particularly the blue LED 21) in the lateral direction is emitted in the radiation direction (from the bottom substrate 11 side to the top substrate 13 side). Can radiate efficiently. In particular, when the quartz glass particles 112 are contained in the first burying material portion 110 covering the blue LED 21, as shown in FIG. 22, the light from the blue LED 21 is incident on the quartz glass particles 112 in the vicinity of the blue LED 21. At this time, this light is scattered and can be guided in the radiation direction on the bottom reflective layer 6. Therefore, ring light emission can be suppressed, light can be efficiently emitted outside, and an LED mounting substrate with higher light emission efficiency can be obtained.

  Furthermore, the wall surface constituting the first through hole may be provided substantially perpendicular to the bottom substrate 11 (one surface), but it has a trumpet shape that opens from the bottom substrate 11 toward the top substrate 13 and opens. It can also be a through hole. That is, the inner wall surface of the first through hole may be an inclined surface that is inclined from the bottom substrate 11 to the upper surface side. In the case of the inclined surface, the output light can be radiated in a wider range (wide angle). Further, when the reflective layer 6 is provided on the inclined surface, the luminous intensity can be increased. The angle of the inclined surface can be 80 to 20 °, particularly 70 to 30 ° with respect to the one surface of the bottom substrate 11.

  The blue LED 21 is bonded on the heat dissipation support film 4 inside the first through hole. A method for joining the blue LEDs 21 is not particularly limited, and the blue LED 21 can be joined with an adhesive resin, a silver paste, a solder paste, or the like, and among them, the adhesive resin 7 is preferable. Examples of the adhesive resin 7 include an epoxy resin. Moreover, blue LED21 may be provided with only 1 in a 1st through-hole, and may be provided with multiple. Furthermore, when two or more blue LEDs 21 are provided in the first through-hole, it is preferable to arrange them close to each other in a balanced manner. In particular, when three are provided, they are preferably arranged at positions corresponding to vertices of an equilateral triangle (substantially equilateral triangle).

  The LED (not only the blue LED 21 but also the orange LED 22) includes a die-bonding type LED (having two electrodes on the upper surface of the LED) and a single-bonding type (the base of the LED is one electrode and the other is the other). LED disposed on the upper surface of the LED is known. Any of these LEDs may be used, but it is preferable to use a die bond type LED. In the single bond type LED, the heat dissipation support film 4 (one surface in the case of the orange LED 22) is caused to function as an electrode. Therefore, in order to arrange a plurality of LEDs in one through hole, the surface of the heat-dissipating support film 4 is divided into a number of electrodes corresponding to the number of LEDs mounted to insulate the electrodes from each other. There is a need. On the other hand, in the LED of the die bond system, it is not necessary to use the heat dissipation support film 4 as an electrode, and the entire surface of the heat dissipation support film 4 (the bottom reflection layer when the bottom reflection layer 6 is provided on the heat dissipation support film 4). 6 is excellent in that the entire surface of 6 (excluding the lower surface of the LED) can be used as the reflective layer 6.

The “insulating intermediate layer 12” is a layer laminated on the other surface of the bottom substrate 11. The insulating intermediate layer 12 can include an insulating layer and an insulating adhesive layer 8 provided on both surfaces thereof. The insulating layer can be formed of resin, ceramic, or the like, similar to the insulating layer of the bottom substrate 11 described above.
Furthermore, the method of forming the insulating adhesive layer 8 is not particularly limited, but an insulating adhesive (preferably a thermosetting resin such as an epoxy resin) is applied, or laminated when it is a solid such as a film. The uncured adhesive layer and the bottom substrate 11 and the insulating intermediate layer 12 or the upper substrate 13 and the insulating intermediate layer 12 can be brought into contact with each other and then cured to be bonded together. Further, the insulating adhesive layer 8 may be a layer formed by curing a part of the insulating intermediate layer 12.

  The insulating intermediate layer 12 has a second through hole. The second through holes communicate with the respective opening surfaces of the first through holes provided in the bottom substrate 11 and the third through holes provided in the upper substrate 13 over the entire surface. Although the number is not particularly limited, it is usually the same number as each of the first through holes and the third through holes. The second through hole is provided through the insulating adhesive layer 8 when the insulating layer and the insulating adhesive layer 8 are provided.

The planar shape of the second through hole is not particularly limited, but is preferably similar to or the same as the planar shape of the first through hole. The first through hole and the second through hole preferably have the same axis. Furthermore, the opening size of the second through hole (diameter when circular, maximum size when other shapes) is not particularly limited, and is the same as or larger than the first through hole.
A reflective layer 6 can be provided on the inner wall surface of the second through hole, as required, similarly to the first through hole. Furthermore, it can also be set as an inclined surface like the 1st through-hole. Furthermore, it can be set as an inclined surface and the reflective layer 6 can be provided in this inclined surface.

  The insulating intermediate layer 12 may be provided with a circuit 121 for lighting and controlling the LED (blue LED 21 and / or orange LED 22). In this circuit 121, a resistor, a diode, a connector (connector wiring, etc.), and the like can be arranged. The thickness of the insulating intermediate layer 12 is not particularly limited, and can be set to 100 to 200 μm. Furthermore, the thickness of the insulating adhesive layer 8 is not particularly limited, and can be 20 to 50 μm. By providing this insulating intermediate layer 12, the bottom substrate 11 and the top substrate 13 can be insulated. Therefore, the circuit 5 of the bottom substrate 11, the circuit 121 of the insulating intermediate layer 12, the circuit of the upper substrate 13, and the like can be formed independently (insulated). For example, the circuit is separated into the bottom substrate 11 and the insulating intermediate layer 12 by routing a part of the wiring to the upper surface side of the insulating intermediate layer 12 through the through hole 122 formed in the insulating intermediate layer 12. (See FIG. 11). In particular, when a die-bonding type LED is used, the number of lands 3 to which the bonding wires 9 are connected is increased because the support film 4 for heat dissipation is not used as an electrode. Even in such a case, the circuit can be distributed by providing the insulating intermediate layer 12. When the insulating intermediate layer 12 includes the circuit 121, a so-called single-sided copper laminated layer can be used as the insulating intermediate layer 12.

  The “upper substrate 13” is a layer laminated on the insulating intermediate layer 12. The upper substrate 13 has an insulating layer. Moreover, the conductor layer 5 can be provided in the both surfaces or single side | surface. As the insulating layer, an insulating material similar to the insulating layer in the bottom substrate 13 can be used. The thickness of the upper substrate 13 is not particularly limited, and can be 100 to 4000 μm, particularly 300 to 3000 μm, and further 500 to 2500 μm.

When the upper substrate 13 is filled with the second embedded material portion 120, the second embedded material portion 120 (the filler constituting the uncured second embedded material portion) is held so as not to flow out to other portions. , And can have a function as a holding frame (the insulating intermediate layer 12 can also have a similar function).
When the upper substrate 13 includes the conductor layer 5, a circuit for lighting and controlling the LED can be provided. In this circuit, a resistor, a diode, a connector (connector wiring, etc.), and the like can be arranged. The method for forming the conductor layer 5 on the upper substrate 13 is not particularly limited, and any of a method of laminating a metal foil, a plating method, a sputtering method, and the like may be used. The material of the conductor layer 5 is not particularly limited, and copper or the like can be used, and copper is usually used. That is, so-called double-sided copper-clad lamination can also be used. The thickness of this conductor layer can be set to 10 to 150 μm, for example.

The upper substrate 13 has a third through hole. The third through hole communicates with the first through hole provided in the bottom substrate 13 and the second through hole provided in the insulating intermediate layer 12. The third through hole is provided through the insulating layer of the upper substrate 13. When the conductive layer 5 is provided in the insulating layer, the third through hole is provided through the insulating layer and the conductive layer 5. The planar shape of the third through hole is not limited, but is preferably similar to the planar shape of each of the first through hole and the second through hole, and further, the first through hole, the second through hole, and the third through hole. More preferably, the shafts have the same axis. Further, the opening size of the third through hole (diameter when circular, maximum size when other shapes) is not particularly limited, and is the same as or larger than the first through hole. Further, it is the same as or larger than the second through hole.
A reflective layer 6 can be provided on the inner wall surface of the third through hole, if necessary, similarly to the first through hole. Furthermore, it can also be set as an inclined surface like the 1st through-hole. Furthermore, it can be set as an inclined surface and the reflective layer 6 can be provided in this inclined surface.

  Further, the upper substrate 13 is a translucent upper substrate having translucency when the conductor layer 5 and the reflective layer 6 are not provided on the inner wall surface. That is, for example, when a glass epoxy substrate that does not include the conductor layer 5 and the reflective layer 6 is used on the inner wall surface, the transparent substrate is provided. Furthermore, when a substrate made of a polycarbonate resin (polycarbonate, etc.), a polyolefin sulfide resin (polyethylene sulfide, etc.), an olefin resin (polyethylene, polypropylene, etc.) is used instead of the glass epoxy substrate, it is further excellent. It can have translucency.

When the upper substrate 13 is translucent, the color temperature variable light-emitting device 1 having a wide viewing angle can be obtained as compared with a non-translucent (including a reflective layer). That is, the color temperature variable light-emitting device 1 including the reflective layer 6 on the inner wall surface of the third through hole can emit light from the LED more directionally. For example, the viewing angle can be less than 90 degrees (particularly 70 to 80 degrees).
On the other hand, in the color temperature variable light emitting device 1 that does not include the reflective layer 6 or the like on the inner wall surface of the third through hole, the light emitted from the LED tends to be emitted in a wider angle. For example, the viewing angle can be 90 degrees or more (particularly 100 to 120 degrees, and further 110 to 115 degrees). Such an LED mounting substrate can be used particularly for wide-angle illumination in a room, a car, a ship, an airplane, and the like. Furthermore, it can be used as internal lighting of a translucent signboard or the like.

  The translucency in the upper substrate 13 refers to translucency for visible light, particularly 70% or more (more preferably 70 to 95%, still more preferably 75 to 95%, particularly about light having a wavelength of 400 to 800 nm. The light transmittance is preferably 80 to 90%. Examples of such a material include various optical resins. That is, for example, acrylic resin, polycarbonate resin, polyphenylene sulfide resin, polyester resin, cycloolefin resin, alicyclic polyolefin resin, and cyclic polyolefin resin can be used. These may use only 1 type and may use 2 or more types together. In addition, when providing a filter function for improving color rendering properties, the transmittance at a predetermined wavelength (or wavelength region) may be specifically reduced.

  Furthermore, the upper substrate 13 disperses the light from the LED by dispersing and containing metal particles and ceramic particles (such as crystalline quartz particles), regardless of whether or not the above-described translucency is present, and thereby the color temperature. The luminous intensity of the variable light emitting device 1 can also be improved. When these light-dispersing particles are contained, the upper substrate 13 is preferably translucent rather than non-translucent.

  The first through hole, the second through hole, and the third through hole may be stacked so that all the step surfaces thereof communicate with each other. Each central axis may be shifted or coincident with each other, but it is preferable that the axes are the same. Further, as described above, the size of each through hole is not particularly limited, but as illustrated in FIG. 1, the second through hole is larger than the first through hole, and the third through hole is larger than the second through hole. It can be a large correlation. Further, as illustrated in FIG. 2, the second through hole is larger than the first through hole, and the second through hole and the third through hole have the same size. Further, although not shown, the first through hole and the second through hole have the same size, and the third through hole can have a larger correlation than the second through hole (in this case, the orange LED 22 is insulated). Disposed on the conductive intermediate layer 12).

  The color temperature variable light-emitting device 1 of the present invention can include a lens 200 as shown in FIGS. By providing the lens 200, the luminous intensity can be improved as compared with the case where the lens 200 is not provided (ineffective light can be collected). In addition, the color temperature variable light-emitting device 1 having a wider or narrower viewing angle (directivity) can be obtained depending on the lens shape as compared with the case where it is not provided.

  As the lens 200, in the multilayer substrate type color temperature variable light emitting device 1, for example, a lens that is provided on the upper substrate 13 and covers at least the opening surface of the third through hole, and is separate from the multilayer substrate portion. 200 (see FIG. 7). Moreover, the lens 200 integral with the 2nd embedding material part 120 by which the upper surface of the said 2nd embedding material part 120 was shape | molded by the lens shape can be provided. Among these, it is preferable to use a separate lens 200. This is because the lens shape can be freely selected with high accuracy. Furthermore, a lens 200 and a hood 202 which are provided on the upper substrate 13 and which cover at least the opening surface of the third through hole and separate from the multilayer substrate portion can be provided. A main surface of a substrate including the hood 202 and further mounting the color temperature variable light-emitting device 1 by providing the hood 202 with a light reflecting ability and / or a diffusing ability (for example, the reflecting layer 6 as shown in FIG. 8). Thus, light can be emitted in a direction substantially perpendicular to (see FIG. 8).

Further, for example, when the upper substrate 13 is translucent as described above and the wide-angle lens is provided on the upper substrate 13 so as to cover the opening surface of the third through hole, the viewing angle is particularly wide (for example, The color temperature variable light-emitting device 1 can be obtained (viewing angle is 90 degrees or more, particularly 100 to 120 degrees, and further 110 to 115 degrees) (see FIG. 7). On the other hand, by providing the lens 200 with a narrower angle, the color temperature variable light-emitting device 1 having excellent directivity with a narrow viewing angle (for example, a viewing angle of less than 90 degrees, particularly 70 to 80 degrees) can be obtained.
The shape of the lens 200 used for the color temperature variable light emitting device 1 is not particularly limited, and may be a convex lens shape or a concave lens shape. Further, the inner shape of the lens 200 is not particularly limited, and may be a flat surface, a concave surface, or a convex surface.

  In addition, when the separate lens 200 is provided, it may be press-fitted into the third through hole by providing the rib portion 201 as shown in FIG. May be arranged by bonding, or may be arranged by other methods. Of these, the rib portion 201 is preferably used. Compared with the case where an adhesive is used, the number of interfaces where the refractive index changes can be reduced, and the color temperature variable light-emitting device 1 with higher luminous intensity can be obtained. Moreover, the material which comprises the lens 200 is not limited, A resin lens may be sufficient and a glass lens may be sufficient.

  Further, when the lens 200 is provided, the lens 200 is colored, and when the upper substrate 13 is translucent, the upper substrate 13 is colored (at least one of them), so that the lens 200 and the upper substrate 13 have a filter function. Can be given. This coloring may be performed by mixing a coloring agent in the material constituting the lens 200 and / or the upper substrate 13, or may be performed by staining the surface of the lens 200 and / or the upper substrate 13. For example, the color rendering can be improved by coloring in pink.

  Many of the red colorants (dyes, etc.) and red phosphors are deteriorated in performance due to heating, and are particularly severely deteriorated in a situation where a temperature of 80 ° C. or even 100 ° C. or higher is applied. However, the multilayer substrate type variable color temperature light-emitting device 1 is excellent in heat dissipation, and the red colorant and the red phosphor are not easily deteriorated and can hold red for a long period of time. In addition, this effect is particularly achieved by the fact that quartz glass particles 122 (112 in the first embedded material portion) are contained in the second embedded material portion 120 (and may be included in the first embedded material portion 110). It is effective.

As a red filter layer, the layer in which translucent resin: red fluorescent substance: quartz glass particle was contained by 35-55 mass%: 40-55 mass%: 5-15 mass% in the mass ratio is mentioned, for example. . This red filter layer may be formed by pouring a mixed resin containing a red phosphor or the like into a light-transmitting resin (uncured product) having fluidity, followed by curing. Furthermore, a sheet-like material in a state of being previously formed into a thin film (thickness of about 0.15 to 0.8 mm) may be laminated and formed. As the red phosphor, rare earth borate phosphor {(Y, Gd) BO ₃ : Eu etc.], yttrium oxide phosphor (Y ₂ O ₂ S: Eu, Y ₂ O ₃ : Eu etc.), etc. Is mentioned. These may use only 1 type and may use 2 or more types together.
The pink color is usually a color in which white light: red light is mixed at 20 to 80%: 80 to 20% (preferably 30 to 70%: 70 to 30%). This mixing ratio corresponds to the ratio of the light emission time, and is usually controlled by the duty ratio.

The multilayer substrate type variable color temperature light emitting device 1 includes a bottom substrate 11, an insulating intermediate layer 12, and an upper substrate 13. Each of the bottom substrate 11, the insulating intermediate layer 12, and the upper substrate 13 may be a single layer or multiple layers.
Furthermore, between the bottom substrate 11 and the upper substrate 13, in addition to the insulating intermediate layer 12, one or more insulating layers (usually six or less layers) may be further provided. In this case, an insulating adhesive layer similar to the insulating adhesive layer 8 included in the insulating intermediate layer 12 can be interposed between the insulating layers. Further, when another insulating layer is further provided in this way, a circuit for turning on and controlling the LED can be provided in this insulating layer, similarly to the insulating intermediate layer 12 and the like.

  The multilayer substrate type variable color temperature light emitting device 1 includes a substrate (a bottom substrate 11, an insulating intermediate layer 12, an upper substrate 13 and various circuits), a blue LED 21, a first embedded material portion 110, an orange LED 22, and a second embedded. In addition to the material part 120 and the lens 200, other parts can be provided. An example of the other part is a connector 500 shown in FIGS. Among these, the connector 500 illustrated in FIG. 13 includes a connector 500 for connecting the color temperature variable light emitting devices 1 to each other, a connector 500 for connecting the color temperature variable light emitting device 1 and various external circuits, and the like. When the connector 500 capable of connecting the color temperature variable light emitting devices 1 is provided, the color temperature variable light emitting device 1 can be extended (added) as necessary.

  This multilayer substrate type color temperature variable light emitting device 1 is usually mounted on a mother board 300 or the like. For example, as shown in FIG. 14, a part of the heat dissipation support film 4 can be used as a terminal electrode, and can be used by being connected to a motherboard-side circuit 301 included in the motherboard 300. For connection, a conductive bonding material 302 (that is, solder, brazing material, etc.) can be used. Furthermore, in the connection by the conductive bonding material 302, it is preferable to connect with a fillet as shown in FIG. As a result, a reliable electrical connection with the conductor layer 5 disposed on the side surface of the bottom substrate 11 is obtained, and an excellent bonding strength is obtained. Therefore, the reliability in the mother board provided with the LED mounting substrate can be improved.

[2] Resin-mold type color temperature variable light-emitting device 1 (see FIGS. 15 to 19)
Hereinafter, the resin mold type color temperature variable light emitting device 1 of the above (2) will be described.
That is, it comprises at least three lead bodies 601 and a resin mold 602 that seals each of the housing body 100 and the lead body 601, and the housing body 100 is made of an integrally molded metal, In addition, the color temperature variable light-emitting device 1 includes the extended lead 104 (see FIGS. 15 to 19).

The “lead body 601” is made of a conductive material and is a lead for controlling the LED housed in the housing body 100. In general, a part (inner lead part) of the lead body 601 is disposed in the resin mold 602 and the remaining part (outer lead part) protrudes to the outside.
The number of the lead bodies 601 is not particularly limited, but may include at least three, may include four, may include five, or may include six. Usually, it is 10 (10) or less.

The connection with each LED when three lead bodies are provided is, for example, two lead bodies 601 connected to the blue LED 21 and one lead body 601 connected to the orange LED 22, as illustrated in FIG. Can be provided. The other bonding wire 9 for controlling the orange LED 22 can be connected to the container 100 or the lead portion 104 extending from the container 100.
Furthermore, as illustrated in FIG. 16, two lead bodies 601 connected to the blue LED 21 and one lead body 601 connected to the orange LED 22 can be provided. The other bonding wire 9 for controlling the orange LED 22 can be connected to the container 100 or the lead portion 104 extending from the container 100.
Further, the shape of each lead body 601 is not particularly limited, and may be a substantially linear shape as illustrated in FIGS. 15 and 16. Moreover, the bending shape bent as illustrated in FIG. 17 may be sufficient. Furthermore, the curved shape may be sufficient. When the lead body 601 having the bent shape and the curved shape is provided, as illustrated in FIG. 17, the resin mold type color temperature variable light-emitting device 1 is mounted in a direction substantially perpendicular to the main surface of the substrate. Can emit light.

  The “accommodating body 100” is made of an integrally formed metal and has a lead portion 104 extended. The container 100 may include only one resin mold type color temperature variable light-emitting device, or may include two or more. The shape of the container 100 is as described above. Furthermore, the kind of metal which comprises the container 100 is not specifically limited. That is, for example, Cu, Ni, Al, Au, Ag, and the like can be used. Moreover, these metal plating layers and the like can also be provided.

  The lead part 104 included in the container 100 is made of a conductive material, like the lead body 601. At least a part of the lead portion 104 protrudes outside the resin mold 602 and functions as an outer lead portion. In addition, the lead portion 104 can be made of a material and / or shape that is more excellent in heat dissipation than the lead body 601. That is, it can be formed from a material superior in thermal conductivity, or the thickness of the lead portion 104 can be increased. As a result, the heat generated by the LEDs in the container 100 can be expelled from the resin mold 602 via the lead portion 104. The lead portion 104 may include only one lead body or two or more lead portions 104.

  For example, as illustrated in FIG. 19, the resin mold type color temperature variable light emitting device 1 includes a large-area container 100 at the center, and three lead bodies 601 and leads at four corners of the resin mold 602. The unit 104 may be arranged. By arranging in this way, a wide area (plan view area) of the container 100 can be secured. Moreover, heat dissipation can be improved by enlarging the container 100. In addition, the circular dotted line in FIG. 19 has shown these boundary lines when the resin mold 602 has the lens-shaped part 603 and the base part 604 (refer FIG. 18).

The “resin mold 602” is a portion that seals a part of each of the container 100 and the lead body 601. The resin mold 602 is made of a translucent resin and is usually molded. However, the light-transmitting resin constituting the resin mold 602 may contain various components for improving heat dissipation and electrical characteristics. Moreover, it may be colored.
Further, the shape of the resin mold 602 is not particularly limited. That is, for example, as illustrated in FIGS. Further, the lens shape portion may not be provided.
The kind of translucent resin which comprises this resin mold 602 is not specifically limited, The said translucent resin can be applied as it is. However, the translucent resin constituting the resin mold 602 and the translucent resin constituting each of the first embedded material portion 110 and the second embedded material portion 120 may be the same or different. Good.

[3] Case type color temperature variable light emitting device 1 (see FIG. 20)
Hereinafter, the case type color temperature variable light emitting device 1 of the above (3) will be described.
That is, the color temperature variable light-emitting device 1 in which the housing body 100 and the lead body 702 are housed in the outer shell case 701 having at least one surface opened, and the outer shell case 701 is filled with a translucent resin ( (See FIG. 20).

  The “outer shell case 701” is a case for housing the housing body 100 and the lead body 702. The outer shell case 701 may be made of any material. That is, for example, resin, metal, ceramics, glass and the like can be mentioned. The kind of resin that constitutes the outer shell case 701 is not particularly limited, and for example, the translucent resin can be applied as it is. However, the resin constituting the outer shell case 701 and the translucent resin constituting each of the first embedded material portion 110 and the second embedded material portion 120 may be the same or different. In the case where the outer shell case 701 is made of a light-transmitting material, the reflective layer 6 can be provided on the inner wall surface of the inner surface of the outer shell case 701 that does not require light emission from the LED. Thereby, the light can be concentrated in a necessary light emitting direction, and the luminous intensity can be improved. As the reflective layer 6, the reflective layer 6 in the multilayer substrate type color temperature variable light emitting device 1 can be applied as it is. Therefore, as illustrated in FIG. 20, for example, light can be emitted in a direction substantially perpendicular to the main surface of the substrate on which the case type color temperature variable light emitting device 1 is mounted.

  The “container 100” may be made of any material, but can be formed of an integrally formed metal as illustrated in FIG. The type of this metal is not particularly limited. That is, for example, Cu, Ni, Al, Au, Ag, and the like can be used. Moreover, these metal plating layers and the like can also be provided. In addition, a part of the container 100 is disposed in the outer shell case 701 and the other portion (heat radiating portion 703) projects out of the outer shell case 701, so that heat dissipation can be improved. The multilayer substrate type light emitting device 1 having a variable color temperature can have the same function as the support film 4 for heat dissipation. The container 100 may include only one case-type color temperature variable light-emitting device, or may include two or more. The shape of the container 100 is as described above.

  As the “lead body 701”, the lead body 601 in the resin mold type color temperature variable light-emitting device 1 can be applied as it is. The shape of the lead body 701 is not particularly limited. For example, as illustrated in FIG. 20, a bent plate-like lead body 701 can be used. A part of the lead body 701 protrudes into the outer shell case 701 (inner lead portion), and the other portion protrudes outside the outer shell case 701 (outer lead portion).

According to the color temperature variable light emitting device 1 of the present invention, the color temperature can be changed in the range of 2000 to 11000K (particularly 2000 to 4000K and 4800 to 11000K, and further 3000 to 4000K and 4800 to 8000K). That is, it is possible to change the color temperature including a color temperature of 3100 to 3300K (especially 3150 to 350K) which is called warm white. Furthermore, it is possible to change the color temperature including a color temperature range excellent in color rendering of 5100 to 5300K (especially 5150 to 5250K) which is so-called white. In addition, the color temperature can be changed including a color temperature range of 7700 to 7900K (particularly 7750 to 7850K), which is referred to as a so-called daylight color.
Furthermore, according to the color temperature variable light-emitting device 1 of the present invention, regardless of the color temperature, the luminous intensity is 0.05 to 100 Cd (particularly 1 to 100 Cd for the multilayer substrate type, 0.05 to 5 Cd for the resin mold type, Furthermore, it can be varied in the range of 1 to 80 Cd) for the multilayer substrate type. That is, the desired color temperature and the desired luminous intensity can be combined and controlled.

  The circuit configuration (and its peripheral circuit configuration) in the color temperature variable light-emitting device of the present invention is not particularly limited. For example, it can be configured as shown in FIG. For example, when the circuit shown in FIG. 21 is the multilayer substrate type color temperature variable light emitting device, the entire circuit can be mounted on the color temperature variable light emitting device. Further, only a part may be mounted on the color temperature variable light-emitting device of the present invention.

  This circuit can include reference signal transmission circuit units 401a and 401b. The reference signal transmission circuit units 401a and 401b are circuits that form signals serving as a reference for the blinking cycle of the LEDs (21 and 22). Specifically, various oscillators (crystal oscillators), operational amplifiers, and the like can be applied to this circuit. Although the reference signal transmission circuit unit includes only one and may control both the blue LED 21 and the orange LED 22 with a kind of reference signal, by providing two types of reference signal transmission circuit units according to each type, It can be controlled with a separate reference signal. In this case, the color temperature can be changed more accurately and freely. Moreover, since the individual waveform design can be performed, the other LED can emit light while the other LED is not emitting light.

  This circuit can include duty control circuit units 402a and 402b connected to reference signal transmission circuit units 401a and 401b. Even if there is only one reference signal transmission circuit unit, the duty control circuit units 402a and 402b may be provided individually (for example, two types) for each LED type (blue LED 21 and orange LED 22). preferable. The duty control circuit units 402a and 402b are circuits that control the duty ratio based on the reference signal formed by the reference signal transmission circuit units 401a and 401b.

  This circuit can include a duty setting circuit unit 403 connected to the duty control circuit units 402a and 402b. The duty setting circuit unit 403 is a circuit for setting a desired duty ratio. Usually, as the luminous intensity of the blue LED 21 is increased, the color temperature can be continuously increased by decreasing the luminous intensity of the orange LED 22. On the other hand, as the luminous intensity of the orange LED 22 is increased, the color temperature can be decreased continuously by decreasing the luminous intensity of the blue LED 21. Therefore, a crossfader circuit or the like can be used when controlling with a fixed duty ratio.

  This circuit can include a light amount setting circuit 404 connected to the duty setting circuit 403. The light quantity setting unit 404 is a circuit that controls the luminous intensity of the entire light to be obtained. By providing the light quantity setting unit 404, for example, light emission with a low color temperature and high overall light intensity, light emission with a high color temperature and low overall light intensity, light emission with a low color temperature and low overall light intensity, color Light emission having a high temperature and a high overall luminous intensity can be freely and continuously obtained.

  This circuit can include a drive circuit portion 405 connected to the duty control circuit portions 402a and 402b. The drive circuit unit 405 is a driver for driving the LEDs (21 and 22) using signals obtained from the duty control circuit units 402a and 402b. As shown in FIG. 21, the drive circuit unit 405 may include one for each series of LEDs, or may include one for driving all the LEDs in an integrated manner. Various transistors can be used as the drive circuit portion 405, and CMOS is particularly preferable.

This circuit can include a current control circuit unit 406. The current control circuit unit 406 is a circuit that controls the amount of current flowing through the LEDs (21 and 22). Specific examples include a resistance circuit and a resistance element. The current control circuit unit 406 may include one for each series of LEDs as shown in FIG. 21, or may include one for controlling all the LEDs in an integrated manner.
This circuit can include a protection circuit portion 407. The protection circuit unit 407 is a circuit that protects against overvoltage. This circuit can also be used normally connected to a power supply 408.

Hereinafter, the present invention will be described specifically by way of examples.
Example 1
(1) Bottom substrate 11
A plurality of first through holes were formed at equal intervals by drilling on a single-sided copper clad laminate having a thickness of about 1.7 mm made of a glass epoxy core (insulating layer) and 50 μm copper foil laminated on one side. . The first through hole was formed in a cylindrical shape having a diameter of 4 mm. Next, the copper foil was patterned to form a wiring pattern. Thereafter, an epoxy prepreg having a thickness of 40 μm was laminated (excluding the opening of the first through hole) on one surface where the wiring pattern was not formed. Next, a patterned copper foil having a thickness of 105 μm to be the heat radiating support film 4 was joined through this prepreg, and the bottom substrate 11 was obtained.

(2) Insulating intermediate layer 12
A single-sided copper-clad laminate with a thickness of about 1.7 mm, made of a glass epoxy core (insulating layer) and laminated with 50 μm copper foil on one side, is drilled into a position corresponding to the first through hole and has a diameter of 8 mm. A cylindrical second through hole was formed. Furthermore, the land where a bonding wire is connected to the copper foil was patterned. Furthermore, an insulating prepreg 12 was obtained by laminating an epoxy prepreg having a thickness of 40 μm on one surface excluding the second through hole on one surface where the copper foil was not laminated.

(3) Upper substrate 13
A cylindrical third through hole having a diameter of 12 mm was formed in a substrate corresponding to the second through hole by drilling on a substrate having a thickness of about 1.6 mm consisting only of a glass epoxy core (insulating layer). Further, an epoxy prepreg having a thickness of 40 μm was laminated on the portion excluding the third through hole, whereby the upper substrate 13 was obtained.

(4) Lamination of Bottom Substrate 11, Insulating Intermediate Layer 12, and Upper Substrate 13 Each layer obtained in the above (1) to (3) is concentric with the first through hole, the second through hole, and the third through hole. Then, each was laminated by thermocompression bonding via a prepreg to obtain a multilayer substrate. The “one surface 101” in the multilayer substrate corresponds to the upper surface of the bottom substrate 11, and the “concave portion 102” recessed from the one surface 101 corresponds to the first through hole.

(5) Formation of reflective layer 6 A nickel plating layer was formed by electroless plating in the first through hole and the second through hole of the multilayer substrate. Next, a plating solution was filled in the concave portion in which the nickel plating layer was formed, a gold plating layer was laminated by electrolytic plating, and a silver plating layer was further formed in the same manner to obtain a reflective layer 6.

(6) Mounting of LEDs 21 and 22 In the central portion in the radial direction inside the first through-hole, one 2W-specific blue LED was bonded to the reflective layer 6 on the heat dissipation support film 4 with an epoxy resin. Next, the blue LED 21 and the land 3 formed on the insulating intermediate layer 12 were connected by a bonding wire 9 made of a gold wire as shown in FIG.
Thereafter, the first embedded material portion 110 was formed by filling and curing the first embedded material containing the silicon resin 111, the quartz glass particles 112, and the TAG phosphor 113 in the first through hole. The mass ratio of the silicon resin 111, the quartz glass particles 112, and the TAG phosphor 113 is 50:25:25.

Further, three orange LEDs were bonded to the reflective layer 6 on the insulating intermediate layer 12 by an epoxy resin so as to be arranged in a substantially equilateral triangle. Next, the orange LEDs 22 were connected in series as shown in FIG. 13 and further connected to the lands 3 formed on the insulating intermediate layer 12 by bonding wires 9 made of gold wires.
Then, the 2nd embedding material part containing the silicon resin 121 and the quartz glass particle | grain 122 was filled and hardened in the 2nd through-hole and the 3rd through-hole, and the 2nd embedding material part 120 was formed. The mass ratio between the silicon resin 121 and the quartz glass particles 122 is 80:20.
In this way, a multilayer substrate type color temperature variable light emitting device 1 shown in FIG. 1 was obtained.

(7) Change in Color Temperature The circuit shown in FIG. 21 and the color temperature variable light-emitting device shown in FIG. 1 were connected, connected to a 12 V power source, and operated. As a result, the luminous intensity could be continuously varied between 2 and 20 Cd. Furthermore, the color temperature could be freely changed between 3000 to 4000K and 4800 to 8000K within the above-mentioned luminous intensity range.

  In addition, in this invention, it can restrict to what is shown to said specific Example, It can be set as the Example variously changed within the range of this invention according to the objective and the use.

It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (multilayer board | substrate type). It is a typical top view which shows an example of the shape of the recessed part and arrangement | positioning of each LED in this color temperature variable light-emitting device. It is a typical top view which shows an example of the shape of the recessed part and arrangement | positioning of each LED in this color temperature variable light-emitting device. It is a typical see-through | perspective perspective view which shows an example of the shape of the recessed part in this color temperature variable light-emitting device, and arrangement | positioning of each LED. It is a typical top view of an example of this color temperature variable light-emitting device. It is a typical top view of an example of this color temperature variable light-emitting device. It is a schematic diagram which shows the cross section of an example of the state which mounted this color temperature variable light emitting device on the motherboard. It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (resin mold type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (resin mold type). It is a schematic diagram which shows the cross section of an example of this color temperature variable light-emitting device (resin mold type). It is a perspective view which shows typically an example of this color temperature variable light-emitting device (resin mold type). It is a top view which shows typically an example of the shape of the container and lead body of this color temperature variable light-emitting device (resin mold type). It is a typical transmission perspective view which shows an example of this color temperature variable light-emitting device (case type). It is a schematic diagram which shows an example of the circuit which controls this color temperature variable light-emitting device. It is a schematic diagram explaining the effect by a quartz glass particle.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1; Color temperature variable light-emitting device, 11; Bottom board | substrate, 12; Insulating intermediate | middle layer, 121; Insulating intermediate | middle layer circuit, 122; Through-hole, 13; Top board | substrate, 21: Blue light emitting diode, 22; 3; Electrode (land), 4; Support film for heat dissipation (copper foil), 5; Conductor layer (copper foil layer, bottom substrate circuit), 6; Reflective layer (silver plating layer), 7; Bonding layer, 8; Bonding layer, 9; bonding wire, 100; container, 101; one surface (one surface of the container), 102; recess (recess of the container), 103; rising portion, 104; lead portion, 110; Part, 111; translucent resin, 112; quartz glass particle, 113; yellow phosphor, 120; second embedded material part, 121; translucent resin, 122; quartz glass particle, 200; lens, 201; 300; Motherboard , 301; Motherboard side circuit, 302; Conductive bonding material, 401a and 401b; Reference signal transmission circuit unit, 402a and 402b; Duty control circuit unit, 403; Duty setting circuit unit, 404; Light amount setting circuit unit, 405; Circuit part, 406; Current control circuit part, 407; Protection circuit part, 408; Power supply, 500; Connector, 601; Lead body, 602; Resin mold, 603; Lens shape part, 604; Base part, 701; 702; Lead body 703;

Claims (6)

A blue light emitting diode, a first embedded material portion for embedding the blue light emitting diode, an orange light emitting diode, and a second embedded material portion for embedding the orange light emitting diode,
The first burying material portion contains a translucent resin and a yellow phosphor,
The second embedded material portion contains a translucent resin and quartz glass particles and does not contain a yellow phosphor,
The quartz glass particle is made of quartz glass containing at least one metal element selected from Al, Ti, Fe, Nb, Zr, Mn, and Mo as an impurity.   The content of the impurities contained in the quartz glass particles is 0.01 to 0.2% by mass in terms of oxide of each metal element when the entire quartz glass particle is 100% by mass. 2. The color temperature variable light emitting device according to 1.   The color temperature variable light-emitting device according to claim 1, wherein the first embedded material portion contains the quartz glass particles. A container having a surface and a recess recessed from the surface;
In the recess, the blue light emitting diode and the first embedded material portion are disposed,
The color temperature variable light-emitting device according to any one of claims 1 to 3, wherein the orange light-emitting diode and the second embedded material portion are disposed on the one surface. The container is composed of a multilayer wiring board,
An insulating layer, a heat dissipation support film having a thickness of 50 to 500 μm laminated on one surface of the insulating layer, and a conductor layer provided on the other surface of the insulating layer, and penetrates the insulating layer and the conductor layer A bottom substrate provided with a first through-hole,
An insulating intermediate layer having a second through hole that is laminated on a portion of the other surface of the bottom substrate excluding the opening of the first through hole and communicates with the entire surface of the opening of the first through hole;
And an upper substrate having a third through hole which is laminated on a portion of the surface of the insulating intermediate layer excluding the opening of the second through hole and communicates with the entire opening surface of the second through hole, The color temperature variable light-emitting device according to claim 4. The container, at least three lead bodies, and a resin mold for sealing the container and a part of each of the lead bodies,
The color temperature variable light-emitting device according to claim 4, wherein the container is made of an integrally formed metal and has a lead portion extended.

Images