WO2014142396A1

WO2014142396A1 - Led light source structure of high illuminating power equipped with metal circuit for preventing leakage current and improving heat radiation capability

Info

Publication number: WO2014142396A1
Application number: PCT/KR2013/006357
Authority: WO
Inventors: 이동수
Original assignee: (주)라이트스탠다드
Priority date: 2013-03-12
Filing date: 2013-07-16
Publication date: 2014-09-18
Also published as: KR101426240B1

Abstract

The present invention relates to an LED light source structure of high illuminating power equipped with a metal circuit for preventing leakage current and improving the heat radiation capability, including an electrode unit manufactured by pressing a metal of excellent electrical and thermal conductivity, wherein the heat generated from the LED chip is guided through the electrode unit according to the flow of electrons so as to directly discharge the heat prevented from the backflow, improve the heat radiation capability and prevent leakage current, thus achieving a high efficiency.

Description

High luminous intensity LED light source structure with metal circuit to improve heat dissipation performance and prevent leakage current

The present invention relates to an LED light source structure, and in particular, to fabricate an electrode unit by pressing a metal having excellent electrical conductivity and thermal conductivity, and induces heat generated from the LED chip through the produced electrode unit according to the flow of electrons to reverse the flow of heat. The present invention relates to a high-light-power LED light source structure equipped with a metal circuit for improving the heat dissipation performance by preventing direct discharge while improving the heat dissipation characteristics while preventing the leakage current and enabling the high efficiency characteristics.

LED (Light Emitting Diode), widely used as a light source for lighting, has a long life and low power consumption compared to conventional incandescent and fluorescent light sources. Its use area is expanding.

LED generates photons and heat during the movement of electrons due to electromagnetic induction (electricity), and the two form an inverse correlation with each other. However, excessive heat beyond the heat required for proper electron activation reduces photon generation due to electrical energy, and excessive electron activity (increasing the amount of current) decreases the bond strength of the atomic structure, thereby allowing the diode to handle the electron mobility (voltage). This can lead to the destruction of the LED, which can result in a decrease in the efficiency of the LED, thus smoothly cooling the heat generated by the LED, increasing the generation of photons and maintaining the diode's durability.

This problem of heat generation and cooling is an important factor especially when manufacturing a high-brightness LED light source for use as lighting, and the structure that can quickly dissipate heat other than the heat required for the electronic activity generated in the LED when designing the light source Is required.

In addition, as the temperature of the conductor increases, the virtuous cycle in which the heat generation increases due to the increase of the resistance of the free electrons and the active free electrons is continued. Therefore, it is necessary to maximize the cross-sectional area of the wire to solve the heating problem. As a result, there is no solution for this.

In the prior art, a printed circuit board (PCB) is usually used to construct an LED chip connection circuit, in which a copper foil is placed on an insulator material (usually a PCB material) and etched to realize a positive electrode and a negative electrode on the same plane. It is made of a structure that constitutes the conductor by making or drilling a hole.

In this process, the cross-sectional area of the wire becomes thin and the length becomes long, and the resistance of the wire increases. As a result, the primary voltage drop caused by the conducting wire and the secondary voltage drop generated when entering the LED chip surface are generated, and as the heat of the LED chip increases over time, the third voltage drop occurs accordingly.

To solve this problem, a heat transfer body of a medium (mostly a metal conductor) with good heat transfer is attached to the contact surface with the LED chip to induce a first endotherm, and a heat sink is designed to induce a second endotherm to finally radiate heat into the atmosphere. do.

Therefore, in the past, the metal is used as the substrate instead of the PCB board used to design the circuit, but the LED chip is mounted on the metal surface, the insulating layer is formed around the LED chip, and the circuit is formed on the insulating layer to operate the light source. Has been proposed. The reason why the metal is used as the substrate instead of the PCB is because the atoms forming the metal form a crystal lattice, so that the heat is actively conducted through the lattice vibration, and the metal is not bound to atoms. This is because heat is transferred well through many electrons. That is, metals have excellent electrical conductivity, but free electrons carry charges together with heat.

However, even a good heat carrier forms an insulation barrier for preventing short circuit between the LED chip electrodes, which forms a barrier for heat transfer to generate thermal resistance. In particular, the technologies developed to date are simply placing LED chips on metals, and thus, heat transfer paths are not sufficiently secured due to the movement of electrons.

1 is a conceptual diagram illustrating a structure of an LED light source structure to which a conventional COM (Chip On Matal) technology is applied. The LED chip is directly mounted on a metal core and a positive electrode and a negative electrode are formed around the LED chip. The structure shows the direct discharge of heat generated from CHIP through CHIP BASE. However, CHIP BASE is also made of insulator, so it could not completely remove the resistance to heat generated from LED CHIP.The metal plate is simply used as heat sink and the insulation layer is formed on the metal plate. This technology differentiates it from the existing technology, but it was difficult to completely remove the thermal resistor. In addition, there was a limitation that the PCB process for constructing the circuit on the metal did not realize a distinctive difference in the existing COB method, process, and cost.

FIG. 2 is a conceptual diagram illustrating a structure of an LED light source structure to which a conventional Chip On Heat-Sink (COH) technology is applied. Patent application No. 10-2011-0013577 "high light power LED light source structure for improving the heat dissipation performance and prevention of voltage drop.

In Patent Application No. 10-2011-0013577, the heat sink is constructed with a positive electrode to realize the effect of fusing the flow of electrons and the heat conduction effect. The resistance can be minimized.

However, in the structure having a vertical multilayer structure in which a very thin insulating layer is formed between the positive electrode unit and the negative electrode unit, minute cracks are generated in the insulating layer when the electrode edge or hole is processed, and lattice vibration and magnetic field are generated. Therefore, there is a possibility that leakage current may occur when high voltage is applied, and when leakage current occurs, efficiency and product reliability may be deteriorated.

The present invention is to apply a more advanced horizontal metal circuit by improving the patent application No. 10-2011-0013577 while solving the problems of the prior art described above, the object of the present invention is to drive the LED light source while minimizing voltage drop The heat dissipation can be efficiently dissipated, but the positive and negative metal electrode circuits can be pressed to prevent leakage current through the horizontally arranged electrode unit. High-power LED light source structure equipped with metal circuit to prevent leakage current and improve heat dissipation performance by connecting heat source and light source and inducing heat according to the flow of electrons To provide.

Another object of the present invention is to prevent the light output due to the heat generated from the LED light source, while maximizing the efficiency of the LED chip, designing a metal heat sink as a circuit to provide a light weight LED lighting can be produced without a separate heat sink It is to provide a high light LED light source structure equipped with a metal circuit to improve the heat dissipation performance and prevent leakage current.

For the above purpose, the present invention is a LED light source structure, which is divided into a first electrode portion and a second electrode portion on the basis of the cut portion formed in the central portion, a portion of the first electrode portion and the second electrode portion on the cut portion At the same time is formed in the groove recessed downwardly, the electrode unit made of an integral structure through a fixing portion for connecting the incision; A case lower plate surrounding the electrode unit to expose a portion of the first electrode portion and the second electrode portion and the fixing portion; A case upper plate which surrounds the electrode unit from above to expose a part of the first electrode part and the second electrode part and the fixing part, and exposes the recess to expose the groove part upward; An LED chip installed in the exposure hole and having both electrodes connected to the first electrode part and the second electrode part inside the exposure hole, respectively; Characterized in that consists of.

The case lower plate further includes a plurality of lower cooling holes for exposing a part of the first electrode part and the second electrode part, including the groove part, and an insulating part inserted into the cutout part to distinguish the first electrode part and the second electrode part. The case upper plate may further include a plurality of upper cooling holes exposing portions of the first electrode part and the second electrode part.

In addition, the groove portion is preferably configured such that the first electrode portion has a larger area than the second electrode portion.

The first electrode part may further include a first electrode connection part which protrudes to one side and a fastening hole is formed, and the second electrode part protrudes to the other side and is formed to be relatively larger than the first electrode connection part. It includes, it is preferable that the protrusion formed on the second electrode connecting portion and both ends protruding upward wrap the upper side of the second electrode connecting portion and includes a fastening inwardly shaped.

The electrode unit may further include a first through hole penetrating the first electrode part or the second electrode part, and the case lower plate may further include a second through hole communicating with the first through hole. It is preferable to further include a third through hole communicating with the first through hole and the second through hole.

The present invention can maximize the cross-sectional area and exposure of the plus and minus electrodes for mounting the LED chip to release the voltage drop and heat generated from the LED chip in the shortest time. Specifically, it maximizes the cross-sectional area of the electrode and reduces the length to minimize the resistance, thereby maximizing the flow of electrons flowing through the electrode unit, and minimizing the voltage drop by allowing the maximum flow of electrons to cope with the surface resistance generated from the LED. Done.

In particular, since both electrodes can be integrally produced through press processing, the same effect as stamping processing can be obtained, but the unit cost can be lowered to 1/10 level compared to stamping processing, which is relatively expensive.

In addition, there is no fear that tolerances may occur when the case is bonded through the integral processing of the electrode unit, and the recess is formed in the mounting portion of the LED chip, so that the phosphor may be uniformly formed at the correct position during coloring.

In addition, as the cross-sectional area of the positive electrode directly contacting the LED chip with a large area increases, thermal equilibrium between the LED chip and the positive electrode is rapidly resolved, thereby solving the problem of a rapid rise in the temperature of the LED active layer. The heat is also conducted in the same way to prevent heat backflow to the LED chip, and the resistance of the LED chip is stabilized, the current is stabilized, thereby driving the constant current can be easily implemented in the converter design.

In addition, since the positive electrode and the negative electrode have a horizontal structure, the leakage current caused by the microcracks, the lattice vibration, and the magnetic field of the insulating part is prevented from occurring, thereby improving efficiency and product reliability.

In addition, in the present invention, unlike the conventional method, which is impossible to energize during the manufacturing process, the defect of the LED chip is visually inspected or the product has to be separated and inspected separately after the final process is completed. Through the second electrode connection part and the conduction test is possible during the manufacturing process, it is easy to check the electrode defects of the LED chip. In particular, after the LED chip is installed, it is possible to modify the color of the phosphor before the silicon is solidified by checking the photo color through the energization test when the protective silicon is processed, including the phosphor.

1 is a conceptual diagram illustrating a structure of an LED light source structure to which a conventional COM (Chip On Matal) technology is applied,

2 is a conceptual diagram illustrating a structure of an LED light source structure to which a conventional Chip On Heat-sink (COH) technology is applied;

3 is a conceptual diagram showing a structure of an LED light source structure to which the improved COH technology is applied according to the present invention;

Figure 4 is a perspective view showing the appearance of the LED light source structure according to a preferred embodiment of the present invention,

5 is an exploded perspective view showing the structure of an LED light source structure according to a preferred embodiment of the present invention;

Figure 6 is a plan view showing the appearance of the LED light source structure according to a preferred embodiment of the present invention,

7 is a bottom view showing the appearance of the LED light source structure according to a preferred embodiment of the present invention,

8 is a perspective view showing a coupling hole and a coupling portion formed in accordance with another embodiment of the present invention.

The present invention is to produce an integrated electrode unit by pressing a metal having excellent electrical conductivity and thermal conductivity, the electrode unit is produced at this time, the electrode does not constitute a separate PCB circuit in the conduction by connecting the conductor after the LED chip mounting The unit itself is designed to be a circuit. Through the design that considers the movement of thermal energy through the movement of electrons to the designed two electrode unit, the heat generated from the LED chip is directly discharged through the two electrode unit to improve heat dissipation characteristics, while separating the electrodes and placing them in a horizontal structure. The heat dissipation area is secured by increasing the cross-sectional area of the electrode, and leakage current is prevented to exhibit high efficiency.

In addition, by forming a recessed groove in the form where the LED chip is mounted so that the protective silicon treatment including the phosphor for coloring is made uniform in the correct position.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of a high-power LED light source structure equipped with a metal circuit for improving the heat dissipation performance of the present invention and prevent leakage current.

3 is a conceptual view showing the structure of the LED light source structure to which the improved COH technology is applied according to the present invention, Figure 4 is a perspective view showing the appearance of the LED light source structure according to a preferred embodiment of the present invention, Figure 5 is a preferred embodiment of the present invention 6 is an exploded perspective view showing the structure of the LED light source structure according to the embodiment, Figure 6 is a plan view showing the appearance of the LED light source structure according to the preferred embodiment of the present invention, the present invention is the electrode unit 110, the case lower plate 130 And the main structure is made of a case upper plate 140 and the LED chip 150.

The electrode unit 110 is made of a material having excellent electrical and thermal conductivity as a whole, and the first electrode portion 111 serving as a positive electrode by conducting current according to the positive electrode, and the negative current by conducting the current according to the negative electrode. A second electrode 113 serving as an electrode is provided.

At this time, a cutout 115, which is a minute gap formed along a central portion of the electrode unit 110, is formed, and the first electrode 111 and the second electrode 113 are based on the cutout 115. The first electrode part 111 and the second electrode part 113 are connected through a fixing part 116 connecting a part of the cutout 115 to form an integrated structure through press working. Unit 110 is manufactured.

The fixing part 116 is configured to have the first electrode part 111 and the second electrode part 113 have an integrated structure in manufacturing the electrode unit 110 through press working. It is made as thin as possible to connect and secure the 111 and the second electrode 113, the first electrode portion (by cutting the fixing portion 116 in the final step of manufacturing the LED light source structure ( 111 and the second electrode 113 are electrically separated.

In order to manufacture an electrode unit having such a structure, a stamping method requiring a high cost has been conventionally used, but in the present invention, the first electrode part 111 and the second through the fixing part 116 are used. It is possible to manufacture by pressing method that requires relatively inexpensive unit price through the integrated structure in which the electrode unit 113 is connected, and the gap that may occur when the first electrode unit and the second electrode unit are separated and manufactured as in the prior art. It can prevent the problem of non-uniformity of tolerance.

In addition, on the cutout 115 of the electrode unit 110, a recess 117 is formed in which a part of the first electrode 111 and the second electrode 113 are simultaneously recessed downward. The recess 117 is a portion in which the LED chip 150 is installed, and a part of the first electrode 111 and the second electrode 113 are elliptical at the center of the cutout 115. It is formed by pressing in the form of concave downward.

The groove portion 117 is installed with the same number as the number of LED chips 150 to be installed in the electrode unit 110, in the accompanying drawings shows that five groove portions 117 are formed in the embodiment It can be appropriately added or subtracted according to the user's selection.

The LED chip 150 is located in the groove portion, one electrode of both electrodes is connected to the first electrode portion 111 and the other electrode to the second electrode portion 113, respectively, the first electrode portion ( As the current is conducted between the 111 and the second electrode 113, light is emitted.

In addition, after the LED chip 150 is installed, phosphors for coloring or silicon for protection are filled inside the recesses.

In this case, the phosphor for coloring or silicon for protection is injected into the recess 117 in the form of a liquid and undergoes a process of hardening. When the recess 117 is not formed, the electrode unit 110 and the There is a possibility that the interface according to the difference in physical properties between the case top plate 140 is formed so that the liquid phosphor or silicon penetrates along the interface, or the amount of the phosphor or silicon that is solidified is uneven, but through the recess 117 There is an advantage that the phosphor or silicon in the liquid can be uniformly formed in the correct position.

Previously, as shown in FIG. 2, the first electrode part and the second electrode part have a multi-layered structure arranged in the vertical direction, and a very thin insulating layer has to be formed between the first electrode part and the second electrode part. However, in manufacturing and processing, when a micro crack occurs in the insulation portion or when a voltage above the allowable voltage is applied, the insulation layer between the first electrode portion and the second electrode portion due to the influence of lattice vibration and magnetic field. A leakage current occurred in the circuit, resulting in a decrease in efficiency.

Accordingly, in the present invention, as shown in FIG. 3, the first electrode 111 and the second electrode 113 are horizontally disposed on the same plane so that the first electrode 111 and the second electrode 113 are horizontal. While preventing the occurrence of leakage current between each other, by maximizing the heat dissipation area of the first electrode portion 111 and the second electrode portion 113 can be represented to minimize the loss.

Since the heat generation of the first electrode 111 corresponding to the positive electrode is higher than the second electrode 113 corresponding to the negative electrode due to the flow of current during operation of the LED chip 150, thermal equilibrium and heat dissipation In terms of performance, it is preferable to configure the area of the first electrode portion 111 to be larger than the area of the second electrode portion 113.

In addition, as shown in FIG. 5, the first electrode part 111 and the second electrode part 113 are not parallel to each other in a zigzag form, and the first electrode part 111 and the second electrode part 113 are parallel to each other. In this case, since the position of the LED chip 150 may be inclined toward the second electrode part, the LED chip 150 may be configured in a zigzag form as shown in FIG. 5. It can be centered.

7 is a bottom view showing the external appearance of the LED light source structure according to the preferred embodiment of the present invention, wherein the case lower plate 130 is made of a synthetic resin of an insulating material as a part serving as a case surrounding the electrode unit from the lower side; have.

In addition, an upper layer of the case lower plate 130 is inserted into the cutout 115 between the first electrode part 110 and the second electrode unit 120 to electrically separate the first electrode part and the second electrode part. An insulating portion 131 is formed to block the leakage current.

The case upper plate 140 is a part serving as a case surrounding the electrode unit from the upper side and is made of a synthetic resin of an insulating material. At this time, a plurality of exposure holes 141 for the installation of the LED chip 150 is formed on the upper side of the case upper plate 140, the exposure hole 141 is formed at the position where the groove portion is formed, the exposure hole ( A portion of the first electrode portion 112 and the second electrode portion 122 are exposed together through 141.

In this case, the case lower plate 130 further includes a plurality of lower cooling holes 131 exposing a part of the first electrode part 111 and the second electrode part 113 downward, and the case upper plate 140. ) May further include a plurality of upper cooling holes 142 exposing portions of the first electrode part 111 and the second electrode part 113 upward.

Naturally, as the number and area of the lower cooling holes 131 and the upper cooling holes 142 are wider, the heat dissipation performance is improved.

In the conventional product, there is a limit that the heat generated from the LED chip is discharged only downward through the first electrode portion located below, but in the present invention, the first electrode portion 111 and the second electrode portion 113 are disposed upward and downward. At the same time, the heat dissipation performance is further improved.

In addition, the case upper plate 140 and the case lower plate 130 are installed such that the fixing unit 116 is exposed to the outside, and cuts out the fixing unit 116 exposed at the end of the manufacturing process to the first electrode unit 111. ) And the second electrode 113 are separated to perform the functions of the positive electrode and the negative electrode, respectively.

The LED chip 150 is installed in the exposure hole 141, and both electrodes of the LED chip 150 are respectively exposed to the first electrode part 112 and the second electrode part (exposed through the exposure hole 141). 122, the LED chip 150 emits light as power is applied to the first electrode 111 and the second electrode 113. Although the present invention shows that five LED chips 150 are installed in a preferred embodiment, it is natural that the quantity can be changed without difficulty according to the user's selection.

In this case, a first through hole 118 penetrating through the first electrode part 111 or the second electrode part 113 is formed in the electrode unit 110, and the first through hole ( And a second through hole 132 communicating with the first through hole 132, and the third upper through hole 143 communicating with the first through hole 118 and the second through hole 132. By forming, it is preferable to form a plurality of heat dissipation holes penetrating the electrode unit 110, the case lower plate 130 and the case upper plate 140 at the same time.

As described above, heat generated from the LED chip 150 and the electrode unit 110 through the heat dissipation hole penetrating the electrode unit 110, the case lower plate 130, and the case upper plate 140 at the same time is more smoothly convection. Can be configured to be discharged.

For example, assuming that the LED chip 150 is disposed to face downward, heat directly emitted from the LED chip 150 and heat generated from the electrode unit 110 and discharged through the upper cooling hole 142 are discharged. When moving upwards by convection, it can smoothly move upwards through the heat radiating holes to further increase the heat radiating effect.

In addition, a portion of the first electrode 111 and the second electrode 113 is exposed through the exposure hole 141, so that the first electrode 111 is connected to the second electrode 113. It is preferable to be configured to exhibit a large exposure area in comparison. This is a reflection of the fact that the positive electrode receives more heat than the negative electrode in accordance with the current flow and the electron moving direction as mentioned above, and the first electrode part 111 corresponding to the LED chip 150 and the positive electrode. This is to maximize heat dissipation effect by making contact surface with) wider.

In addition, the first electrode part 111 further includes a first electrode connection part 112 protruding to one side, and the second electrode part 113 protrudes to the other side, but the first electrode connection part 112 is formed. It is preferable to further include a relatively larger second electrode connecting portion 114, so that the power supply from the outside is smoothly performed.

At this time, one end and the other end of the case lower plate 130 and the case upper plate 140, respectively, so that the first electrode connecting portion 112 and the second electrode connecting portion 114 is sufficiently exposed to easily power from the outside To be supplied.

8 is a perspective view illustrating a coupling hole and a coupling portion formed according to another embodiment of the present invention. The coupling hole 119 is formed in the first electrode connection portion 112 and the second electrode connection portion 114 is formed in the second electrode connection portion 114. The protrusion 121 and the both ends protruding upwards surround the upper side of the second electrode connection part 114 and have a fastening part 120 having a curled shape inward.

The fastening part 120 formed at the second electrode connection part 114 is configured to insert and surround the first electrode connection part of another LED light source structure as a configuration for connecting a plurality of LED light source structures in series. The protrusion 121 formed on the second electrode connection 114 is inserted into the fastening hole 119 formed in the first electrode connection 112 of the other LED light source structure to be inserted.

In addition, the fastening part 120 formed on the second electrode connection part 114 presses the first electrode connection part 112 inserted downward through a shape wound inwardly so that the protrusion 121 is fastened from the fastening hole 119. This will prevent you from falling out easily.

This facilitates the connection between the plurality of LED light source structures, and prevents the second electrode connecting portion 114 and the first electrode connecting portion 112 from being unintentionally coupled by an impact or the like.

The present invention is not limited to the above-described embodiments, and various modifications and variations are made by those skilled in the art to which the present invention pertains without departing from the spirit of the present invention and the equivalent scope of the claims to be described below. Of course this can be done.

Claims

In the LED light source structure,

The groove is divided into a first electrode part and a second electrode part on the basis of an incision formed in the central part, and a recessed part is formed on the incision part of which the first electrode part and the second electrode part are simultaneously recessed downwards, and the incision part is formed. An electrode unit having a unitary structure through a fixing part for connecting;

A case lower plate surrounding the electrode unit to expose a portion of the first electrode portion and the second electrode portion and the fixing portion;

A case upper plate which surrounds the electrode unit from above to expose a part of the first electrode part and the second electrode part and the fixing part, and exposes the recess to expose the groove part upward;

An LED chip installed in the exposure hole and having both electrodes connected to the first electrode part and the second electrode part inside the exposure hole, respectively; A high-power LED light source structure equipped with a metal circuit for improving the heat dissipation performance and preventing leakage current, characterized in that consisting of.
The case lower plate further includes a plurality of lower cooling holes for exposing a part of the first electrode part and the second electrode part, including the groove part, and an insulating part inserted into the cutout part to distinguish the first electrode part and the second electrode part. ,

The case upper plate may further include a plurality of upper cooling holes exposing portions of the first electrode part and the second electrode part. The high light power LED having a metal circuit for improving heat dissipation performance and preventing leakage current may be provided. Light structure.
The method of claim 1,

The recessed portion is a high light power LED light source structure equipped with a metal circuit for improving the heat dissipation performance and preventing leakage current, characterized in that the first electrode portion is configured to have a larger area than the second electrode portion.
The method of claim 1,

The first electrode portion further protrudes to one side, and further includes a first electrode connection portion formed with a fastening hole,

The second electrode portion further protrudes to the other side and further comprises a second electrode connecting portion formed relatively larger than the first electrode connecting portion,

Metals for improving heat dissipation performance and preventing leakage current, which are formed on the second electrode connection portion and include protrusions and protrusions protruding upwards to surround the upper side of the second electrode connection portion, and include a fastening portion formed inwardly. High power LED light source structure with circuit.
The method of claim 1,

The electrode unit further includes a first through hole penetrating the first electrode portion or the second electrode portion,

The case lower plate further includes a second through hole in communication with the first through hole,

The case upper plate further comprises a third through hole communicating with the first through hole and the second through hole, a high-light power LED light source structure equipped with a metal circuit for improving heat dissipation performance and preventing leakage current.