CN201373272Y - White-light LED light source module adopting COB technology and array interconnection - Google Patents
White-light LED light source module adopting COB technology and array interconnection Download PDFInfo
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- CN201373272Y CN201373272Y CN200920050678U CN200920050678U CN201373272Y CN 201373272 Y CN201373272 Y CN 201373272Y CN 200920050678 U CN200920050678 U CN 200920050678U CN 200920050678 U CN200920050678 U CN 200920050678U CN 201373272 Y CN201373272 Y CN 201373272Y
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Abstract
The utility model relates to a white-light LED light source module adopting COB technology and array interconnection. The white-light LED light source module comprises an open-ended module casing (1), a circuit board (2) arranged inside the module casing (1), an LED chip array (3) arranged on the circuit board (2), packaging adhesive (4) packaging the LED chip array (3) on the circuit board (2), a highly pervious light emitting board (5) covering the opening of the module casing (1), and a fluorescent material layer (6) coated on the highly pervious light emitting board (5) and closer to the surface of the LED chip array (3). The white-light LED light source module has the advantages of uniform and high brightness, good reliability, compact structure, simple manufacturing technique and convenient subsequent design and use.
Description
Technical field
The utility model relates to a kind of light source module, relates in particular to the white light LED light source module of a kind of COB of employing technology and array interconnection.
Background technology
White light LEDs light fixture of the prior art generally is that the led chip that produces blue light is close to phosphor layer and is encapsulated in the confined space with the formation white light LEDs.
The shortcoming of this structure is: produce blue-light LED chip and phosphor layer and form an integral body, therefore both can't be separated from each other, thereby cause some problems, such as owing to directly on blue-light LED chip, be coated with fluorescent material, therefore the uniformity of fluorescent material is difficult to control, and then cause the brightness uniformity of the last white light LEDs finished product that forms poor, and be difficult to after the finished product manufacturing, adjust the colour temperature of finished product white LED lamp tool; Again such as the tube core that directly contacts blue-light LED chip owing to fluorescent material, so the heat that blue-light LED chip sends impels the operating temperature of fluorescent material higher, finally accelerate the aging attenuation process of fluorescent material, in the life-span of having reduced fluorescent material, finally influenced service life of whole white light LEDs light fixture.
In addition, publication number is that the application for a patent for invention of CN101017814A discloses a kind of separating fluorescence film white LED lamp.In this structure, make fluorescent film with materials such as fluorescent material in advance, keep suitable distance to be located at the place ahead of led chip light-emitting area fluorescent film and led chip again, thereby at last fluorescent film and led chip are encapsulated in formation separating fluorescence film white LED lamp in the confined space.Publication number is that the application for a patent for invention of CN101294662A discloses a kind of white light LED lighting device and manufacture method thereof.In this structure and method, cool colour led light source and photic zone are sealed in the space, the printing opacity carrier that scribbles phosphor layer is located on the lamp casing in photic zone the place ahead to form white light LEDs.
Be close to phosphor layer and be encapsulated in a prior art in the confined space with the led chip that produces blue light and compare, the fluorescent material of the disclosed white light LEDs light fixture of CN101017814A and CN101294662A and led chip closely do not attach, and then reduced to a certain extent between the two and to have produced influencing each other of heat, therefore can blend together white light by the fluorescence excitation material, reduce the fluorescent material operating temperature again, prolong the service life of white LED lamp to a certain extent, promoted the overall performance of white LED lamp.
Yet, the shortcoming of the disclosed white light LEDs light fixture of CN101017814A and CN101294662A is: the one, and not enough to exciting uniformity of light to consider, make troubles for the application process of fluorescent material, just be difficult to realize evenly smearing of fluorescent material, therefore the brightness uniformity of prepared white light is relatively poor; The 2nd, the led chip packaging density is difficult to improve, thereby has limited the brightness of light source module unit are and the raising of output light flux; The 3rd, circuit connecting mode adopts traditional connection in series-parallel form, and when number of chips was a lot, light source reliability and life-span all were affected; The 4th, still have the place that can improve on structure and the technology, consider not enough to the follow-up use of product.
Thereby, be necessary to provide a kind of white light LED light source module of improvement, so that overcome the shortcoming and deficiency of prior art.
The utility model content
The purpose of this utility model provides that a kind of brightness is even, brightness is high, good reliability, compact conformation, simple, the follow-up design of manufacture craft white light LED light source module easy to use.
To achieve these goals, the utility model provides the white light LED light source module of a kind of COB of employing technology and array interconnection, comprises the module housing (1) with opening, be arranged on the inner circuit board (2) of module housing (1), be arranged on the led chip array (3) on the circuit board (2), led chip array (3) is encapsulated in packaging plastic (4) on the described circuit board (2), the high printing opacity light-emitting plate (5) that the opening of described module housing (1) is hidden, be coated with the lip-deep phosphor layer (6) that is located at close more described led chip (3) on the described high printing opacity light-emitting plate (5).
Advantage of the present utility model is: brightness is even, brightness is high, good reliability, compact conformation, simple, the follow-up design of manufacture craft are easy to use.
Below in conjunction with accompanying drawing, describe the utility model in detail by preferred embodiment.
Description of drawings
Fig. 1 is the sectional structure schematic diagram of the utility model white light LED light source module.
Fig. 2 is the structural representation that the led chip of the utility model white light LED light source module adopts the array interconnection.
Fig. 3 is the circuit theory diagrams that the led chip of the utility model white light LED light source module adopts the array interconnection.
The specific embodiment
With reference now to accompanying drawing, the utility model is described.
As Figure 1-3, the white light LED light source module that provides of the utility model comprises module housing 1, the circuit board 2 that is arranged on module housing 1 inside with opening, is arranged on led chip array 3 on the circuit board 2, led chip array 3 is encapsulated in packaging plastic 4 on the described circuit board 2, high printing opacity light-emitting plate 5 that the opening of described module housing 1 is hidden, is coated with the lip-deep phosphor layer 6 that is located on the described high printing opacity light-emitting plate 5 more near described led chip 3.
Particularly as shown in Figure 1, adopt the COB encapsulation technology that the led chip 3 of array interconnection is encapsulated on the circuit board 2, and, then circuit board 2 is placed in module housing 1 inside at surface coverage one deck chip array packaging plastic 4 of all led chips 3.Adopt the COB technology to make the volume of single luminescent device (just led chip 3) much smaller than not adopting COB technology volume after being encapsulated, therefore can concentrate a large amount of luminescent devices in range of small, thereby cause the white light LEDs module to have the characteristics of brightness height, compact conformation, might produce the approximate light source of power, brightness and apparent size and conventional light source, made things convenient for promoting the use of of semiconductor illuminating light source, save encapsulating material simultaneously, reduced production cost.
High printing opacity light-emitting plate 5 is installed in the dead ahead (opening part of just described module housing 1) of the array that this external chip 3 constitutes, do texturing earlier at the lower surface (near the surface of chip 3) of high printing opacity light-emitting plate 5 and handle, be coated with the even phosphor layer 6 of last layer thickness optimization then.The arrangement mode of led chip 3 has been considered the distribution of its light, and this exciting light is the uniform light of a slice in module housing 1 internal mix when arriving phosphor layer 6, carries out the fluorescence conversion when exciting light is through phosphor layer 6 uniformly and forms photochromic uniform white light.Adopt fluorescent powder coated technology, can carry out the fluorescence conversion, avoided that single led chip is carried out fluorescence and be converted to the photochromic non-uniform phenomenon that white light brings, simplified manufacture craft simultaneously blue light or the purple light that a plurality of led chips send; Because fluorescent material and the chip of coating directly contacting, have also avoided the chip operation temperature to the influence in light-emitting phosphor efficient and life-span, the conversion efficiency and the service life of having improved white light.
Adopt COB (chip on board) technology to encapsulate blue light or purple LED chip array 3 on the described circuit board 2, in the surface coverage of led chip array 3 one deck packaging plastic 4 is arranged, the array interconnection mode is adopted in being electrically connected of its chip array 3; The lower surface of described high printing opacity light-emitting plate 5 scribbles layer of even phosphor layer 6.
In a preferred embodiment, the quantity of the led chip 3 in the described white light LED light source module is 49, and forms the quadrate array of 7*7.Led chip 3 adopts the SiC substrate blue-light LED chip of Cree company.
Fig. 2 has showed the array interconnection structure that led chip 3 is adopted in addition.In the drawings, 2 is circuit board, and 22 is the Copper Foil pad, and 3 is led chip, and 44 is gold thread, and 55 is power cathode, and 66 is positive source.As shown in the figure, chip negative pole 55 is connected with Copper Foil pad 22 on the circuit board 2, and anodal 66 are connected with Copper Foil pad 22 by gold thread 44.When certain chips in the array interconnection structure opens circuit such as the C25 inefficacy, C22, the C23 that connects with the C25 chip, C24, C26, C27, C28 can both operate as normal, the current uniform of this group on series circuit is to the six LEDs chips in parallel with C25, and promptly the electric current of C4, C11, C18, C32, C39, C46 becomes 7/6 times of primary current.Under electric current derate service condition, suppose that the chip rated current is 150mA, and designed circuit working electric current is 120mA, C25 opens circuit when chip, the electric current of C4, C11, C18, C32, C39, C46 increases to 140mA, still in the rated current scope of chip, and therefore still can operate as normal.Moreover, when a chips inefficacy short circuit wherein, be short-circuited as C25, at transcient short circuit time, be far longer than gold thread 44 electric currents that can carry own and be added on the gold thread 44 that is connected with chip C25 gold thread 44 moments fusing, open circuit, the effect of generation opens circuit identical with chip failure herein.
As above analyze as can be known, led array adopts array interconnection mode and electric current derate to use and combines, wherein any LED or minority LED break down, can not causing on every side, LED does not work, reduce traditional series connection and the chip of method that is connected in parallel damages influence to other chip operation states, therefore improved the reliability of white light LEDs module.When chip that led array a connects number is many more, advantage is obvious more.
In order to reduce light absorption, can establish the high material of one deck reflecting rate in the inner surface of described housing 1, the surface plating of circuit board 2.Preferably, described housing 1 is made by Heat Conduction Material, and can carry out the conductive structure design to it, such as can being designed to various planforms, and processes hole slot miscellaneous in the above, is convenient to its Secondary Design and fixed installation.
As improvement, high printing opacity light-emitting plate 5 can be the thin slices such as transparent panel as frosted glass, change light emission angle, also can do the light transmission film of microlens array for the surface.High printing opacity light-emitting plate 5 and phosphor layer have multiple combination, handle or do microlens array such as it being done texturing at the lower surface of high printing opacity light-emitting plate 5, or bonding one deck mixed light film etc. can realize the method for light maximization scattering, and the even fluorescent material of surface applied one deck thereon.
The utility model white light LED light source module compared with prior art has following remarkable advantage and beneficial effect:
1, the utility model adopts the white light LED light source module of COB technology and array interconnection, adopt the COB encapsulation technology, the volume of single luminescent device is much smaller than volume after being encapsulated, can concentrate a large amount of luminescent devices in range of small, characteristics with brightness height, compact conformation might be produced the approximate light source of power, brightness and apparent size and conventional light source, have made things convenient for promoting the use of of semiconductor illuminating light source, save encapsulating material simultaneously, reduced production cost.
2, the utility model adopts the white light LED light source module of COB technology and array interconnection, and the electric connecting mode of its led array adopts the array interconnection.Led array for the majority amount, adopting array interconnection and electric current derate to use combines, can improve the reliability of array greatly, be that each led chip or packaged LED device all are that circuit connects a node in the array, wherein any LED breaks down, can not cause on every side that LED does not work, reduce traditional series connection and the chip of method that is connected in parallel damages influence to other chip operation states, improve the reliability of white light LEDs module.
3, a kind of white light LED light source module that adopts COB technology and array interconnection of the utility model, utilize rationally arranging or doing structure in module housing inside or adopt methods such as light-mixed layer technology of chip array, make blue light or purple light excited light be tending towards even distribution, can realize that the large tracts of land fluorescent material evenly applies, and has simplified technology on the one hand; On the other hand, light intensity be tending towards even distribution, improved bright dipping uniformity, also reduced dazzle simultaneously significantly.
4, a kind of white light LED light source module that adopts COB technology and array interconnection of the utility model, it is simple in structure, moulded flexible, pass through modular technology, a plurality of these white light LED light source modules can be made up according to random shape, also this module can be carried out follow-up design (as the secondary optics design etc.), satisfy the lighting requirement of different field, giving to produce and use provides bigger design space.
Above disclosed only is preferred embodiment of the present utility model, can not limit the interest field of the utility model certainly with this, and therefore the equivalent variations of being done according to the utility model claim still belongs to the scope that the utility model is contained.
Claims (7)
1. white light LED light source module that adopts the interconnection of COB technology and array is characterized in that comprising: have opening module housing, be arranged on module housing inside circuit board, be arranged on led chip array on the circuit board, high printing opacity light-emitting plate that the led chip array package is hidden at the chip packaging plastic on the described circuit board, with the opening of described module housing, be coated with the lip-deep phosphor layer that is located on the high printing opacity light-emitting plate more near described led chip with array format.
2. the white light LED light source module of employing COB technology according to claim 1 and array interconnection, it is characterized in that: have on the described circuit board Copper Foil pad, with positive source and power cathode that described Copper Foil pad is connected, the led chip array is connected between described positive source and the power cathode electrically.
3. the white light LED light source module of employing COB technology according to claim 1 and array interconnection is characterized in that: adopt the COB technology, the volume of single luminescent device can be concentrated a large amount of luminescent devices in range of small much smaller than volume after being encapsulated.
4. the white light LED light source module of employing COB technology according to claim 1 and array interconnection is characterized in that: adopt array chip syndeton, each led chip or packaged LED device all are that circuit connects a node in the array.
5. the white light LED light source module of employing COB technology according to claim 1 and array interconnection, it is characterized in that: the inner surface of described housing, the surface of described circuit board are coated with the high material layer of reflecting rate.
6. the white light LED light source module of employing according to claim 1 COB technology and array interconnection, it is characterized in that: described housing is made by Heat Conduction Material, and is processed with above the housing and is used for heat radiation and hard-wired hole slot.
7. the white light LED light source module of employing COB technology according to claim 1 and array interconnection is characterized in that: described high printing opacity light-emitting plate is focussing glass, the transparent panel that changes the light emission angle, the transparent panel that Surface Machining has microlens array etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920050678U CN201373272Y (en) | 2009-01-22 | 2009-01-22 | White-light LED light source module adopting COB technology and array interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920050678U CN201373272Y (en) | 2009-01-22 | 2009-01-22 | White-light LED light source module adopting COB technology and array interconnection |
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| Publication Number | Publication Date |
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| CN201373272Y true CN201373272Y (en) | 2009-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200920050678U Expired - Lifetime CN201373272Y (en) | 2009-01-22 | 2009-01-22 | White-light LED light source module adopting COB technology and array interconnection |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130111A (en) * | 2010-12-24 | 2011-07-20 | 郑伟 | Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device |
| CN102261569A (en) * | 2010-05-24 | 2011-11-30 | 艾迪光电（杭州）有限公司 | Light-emitting diode (LED) lamp |
| CN102290504A (en) * | 2011-09-07 | 2011-12-21 | 惠州市西顿工业发展有限公司 | Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method |
| CN103219449A (en) * | 2013-04-18 | 2013-07-24 | 东莞帝光电子科技实业有限公司 | Light-emitting diode (LED) packaging structure and LED packaging method |
| CN103335235A (en) * | 2013-07-11 | 2013-10-02 | 湖州赫澜电子科技有限公司 | LED lamp structure |
| CN104347610A (en) * | 2013-07-23 | 2015-02-11 | 深圳市瑞丰光电子股份有限公司 | Embedded LED device, manufacture method thereof, and luminescence device |
-
2009
- 2009-01-22 CN CN200920050678U patent/CN201373272Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102261569A (en) * | 2010-05-24 | 2011-11-30 | 艾迪光电（杭州）有限公司 | Light-emitting diode (LED) lamp |
| CN102130111A (en) * | 2010-12-24 | 2011-07-20 | 郑伟 | Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device |
| CN102290504A (en) * | 2011-09-07 | 2011-12-21 | 惠州市西顿工业发展有限公司 | Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method |
| CN102290504B (en) * | 2011-09-07 | 2014-04-16 | 惠州市西顿工业发展有限公司 | Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method |
| CN103219449A (en) * | 2013-04-18 | 2013-07-24 | 东莞帝光电子科技实业有限公司 | Light-emitting diode (LED) packaging structure and LED packaging method |
| CN103219449B (en) * | 2013-04-18 | 2016-12-28 | 东莞帝光电子科技实业有限公司 | LED encapsulation structure and LED encapsulation method |
| CN103335235A (en) * | 2013-07-11 | 2013-10-02 | 湖州赫澜电子科技有限公司 | LED lamp structure |
| CN104347610A (en) * | 2013-07-23 | 2015-02-11 | 深圳市瑞丰光电子股份有限公司 | Embedded LED device, manufacture method thereof, and luminescence device |
| CN104347610B (en) * | 2013-07-23 | 2017-06-20 | 深圳市瑞丰光电子股份有限公司 | Embedded LED device and preparation method thereof and luminaire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20091230 Effective date of abandoning: 20090122 |