CN105280106A - LED display panel - Google Patents
LED display panel Download PDFInfo
- Publication number
- CN105280106A CN105280106A CN201510789585.4A CN201510789585A CN105280106A CN 105280106 A CN105280106 A CN 105280106A CN 201510789585 A CN201510789585 A CN 201510789585A CN 105280106 A CN105280106 A CN 105280106A
- Authority
- CN
- China
- Prior art keywords
- led display
- display board
- substrate
- groove
- driving circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention discloses an LED display panel which comprises a substrate and a shading plate. The shading plate is positioned on the upper portion of the substrate, grooves are formed in the upper surface of the substrate, LED chips are mounted in the grooves, mounting grooves are formed in the lower surface of the substrate, driving IC (integrated circuit) components are mounted in the mounting grooves in an attached manner, and the LED chips are connected with the driving IC components. The LED display panel has the advantage that the packaging efficiency can be improved, and the production cost can be reduced.
Description
Technical field
The present invention relates to light fixture manufacturing technology field, particularly relate to a kind of LED display board.
Background technology
Current LED display board, in manufacturing process, is by chip placement on substrate, and recycling routing technology, be connected with the connecting points on substrate by chip, this packaging efficiency is low, and cost is high.
Summary of the invention
For solving the problem, the invention provides a kind of LED display board, can packaging efficiency be improved, reduce production cost.
A kind of LED display board provided by the invention, comprise: substrate and the shadow shield being positioned at described substrate top, the upper surface of described substrate is provided with groove, in described groove, LED wafer is installed, the lower surface of described substrate is provided with mounting groove, be pasted with IC driving circuit parts in described mounting groove, described LED wafer is connected with described IC driving circuit parts.
Preferably, in above-mentioned LED display board, the dorsal edge of described IC driving circuit parts is provided with the paster solder joint for being mounted by described IC driving circuit parts in described mounting groove.
Preferably, in above-mentioned LED display board, in described mounting groove, be provided with fluid sealant or base material.
Preferably, in above-mentioned LED display board, one end of the close described groove of described LED wafer is provided with the projection with described groove fit, and described projection is connected with described IC driving circuit parts through after described groove.
Preferably, in above-mentioned LED display board, in described groove, be provided with shading glue.
Preferably, in above-mentioned LED display board, be connected by pin between described shadow shield with described substrate.
Preferably, in above-mentioned LED display board, described LED wafer equidistantly distributes on the substrate.
Known by foregoing description, above-mentioned LED display board provided by the invention, because the upper surface of described substrate is provided with groove, be provided with LED wafer in described groove, the lower surface of described substrate is provided with mounting groove, is pasted with IC driving circuit parts in described mounting groove, described LED wafer is connected with described IC driving circuit parts, this just without the need to routing technology, thus can improve packaging efficiency, reduces production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
The front view of the first LED display board that Fig. 1 provides for the embodiment of the present application;
The schematic rear view of the IC driving circuit parts of the second LED display board that Fig. 2 provides for the embodiment of the present application;
The vertical view of the first LED display board that Fig. 3 provides for the embodiment of the present application.
Embodiment
Core concept of the present invention is to provide a kind of LED display board, can improve packaging efficiency, reduces production cost.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The first LED display board that the embodiment of the present application provides as shown in Figure 1, the front view of the first LED display board that Fig. 1 provides for the embodiment of the present application.This LED display board comprises: substrate 1 and the shadow shield 2 being positioned at described substrate 1 top, the upper surface interval of described substrate 1 be provided with groove 3, the quantity of groove 3 can be multiple, in described groove 3, LED wafer 4 is installed, the lower surface of described substrate 1 is provided with mounting groove 5, be pasted with IC driving circuit parts 6 in described mounting groove 5, described LED wafer 4 is connected with described IC driving circuit parts 6.
Known by foregoing description, the above-mentioned LED display board that the embodiment of the present application provides, because the upper surface of described substrate is provided with groove, be provided with LED wafer in described groove, the lower surface of described substrate is provided with mounting groove, is pasted with IC driving circuit parts in described mounting groove, described LED wafer is connected with described IC driving circuit parts, this just without the need to routing technology, thus can improve packaging efficiency, reduces production cost.
The embodiment of the present application additionally provides the second LED display board, in the second LED display board, except there is the technical characteristic identical with the first LED display board above-mentioned, also comprise following technical characteristic: the dorsal edge of described IC driving circuit parts is provided with the paster solder joint for being mounted by described IC driving circuit parts in described mounting groove, specifically as shown in Figure 2, the schematic rear view of the IC driving circuit parts of the second LED display board that Fig. 2 provides for the embodiment of the present application, the back side of these IC driving circuit parts 6 visible is provided with multiple paster solder joint 9, in process of production, utilize this paster solder joint 9 just can easily be mounted in mounting groove by IC driving circuit parts 6, so just significantly improve work efficiency relative to routing technique of the prior art, also reduce further production cost.
The embodiment of the present application additionally provides the third LED display board, in the third LED display board, except there is the technical characteristic identical with the first LED display board above-mentioned, also comprise following technical characteristic: continue with reference to figure 1, be provided with fluid sealant 7 or base material in described mounting groove, this makes it possible to the heat dispersion of intensifier circuit.
Further, above-mentioned the first, on the basis of the second and the third LED display board, can also comprise following technical characteristic: one end of the close described groove of described LED wafer is provided with the projection with described groove fit, described projection is connected with described IC driving circuit parts through after described groove.The length of this projection can be arranged to a higher value, to guarantee to be connected to IC driver part, realizes the connection of LED wafer and IC driver part, thus IC driver part can effectively driving LED wafer be luminous.
Further, in above-mentioned LED display board, with reference to figure 1, shading glue 8 is provided with in described groove, the light so just avoiding LED wafer to launch spills from top, optionally, be connected between described shadow shield with described substrate by pin, this just makes to be connected between shadow shield with substrate more firm.
And, in above-mentioned LED display board, described LED wafer 4 optionally equidistantly distributes on described substrate 1, as shown in Figure 3, the vertical view of the first LED display board that Fig. 3 provides for the embodiment of the present application, multiple described LED wafer 4 in rods arranged in horizontal line on described substrate 1, also can have the rectangular array arrangement of two row or multi-row, and can comprise captions monochrome or full-color display module.
In above-mentioned LED display board, substrate thickness can be reduced to 1.0 millimeters to 1.1 millimeters, and LED wafer height is 0.65 millimeter to 1.6 millimeters, so the height of overall LED display board is 1.65 millimeters to 2.8 millimeters.
Known by foregoing description, the above-mentioned LED display board that the embodiment of the present application provides has less thickness, mechanically easy to use, and be widely used in the encapsulation of microprocessor, and can be applicable to drawing, extraordinary application and electronic chip assembling etc., there is the advantage that structure is simple, easy to assembly.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a LED display board, it is characterized in that, comprise substrate and the shadow shield being positioned at described substrate top, the upper surface of described substrate is provided with groove, in described groove, LED wafer is installed, the lower surface of described substrate is provided with mounting groove, is pasted with IC driving circuit parts in described mounting groove, and described LED wafer is connected with described IC driving circuit parts.
2. LED display board according to claim 1, is characterized in that, the dorsal edge of described IC driving circuit parts is provided with the paster solder joint for being mounted by described IC driving circuit parts in described mounting groove.
3. LED display board according to claim 2, is characterized in that, is provided with fluid sealant or base material in described mounting groove.
4. the LED display board according to any one of claim 1-3, is characterized in that, one end of the close described groove of described LED wafer is provided with the projection with described groove fit, and described projection is connected with described IC driving circuit parts through after described groove.
5. LED display board according to claim 4, is characterized in that, is provided with shading glue in described groove.
6. LED display board according to claim 5, is characterized in that, is connected between described shadow shield with described substrate by pin.
7. LED display board according to claim 4, is characterized in that, described LED wafer equidistantly distributes on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510789585.4A CN105280106A (en) | 2015-11-17 | 2015-11-17 | LED display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510789585.4A CN105280106A (en) | 2015-11-17 | 2015-11-17 | LED display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105280106A true CN105280106A (en) | 2016-01-27 |
Family
ID=55149016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510789585.4A Pending CN105280106A (en) | 2015-11-17 | 2015-11-17 | LED display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105280106A (en) |
Citations (13)
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|---|---|---|---|---|
| JPH11231806A (en) * | 1998-02-12 | 1999-08-27 | Kokusai Electric Co Ltd | Lighting check device for led panel |
| JP2002141492A (en) * | 2000-10-31 | 2002-05-17 | Canon Inc | Light-emitting diode display panel and manufacturing method thereof |
| CN201944785U (en) * | 2010-07-20 | 2011-08-24 | 王定锋 | LED lamp circuit board formed by connecting two platy lines in parallel |
| CN202422610U (en) * | 2011-11-28 | 2012-09-05 | 深圳市奥拓电子股份有限公司 | LED (light emitting diode) modules and silica gel masks thereof |
| CN103021288A (en) * | 2012-12-12 | 2013-04-03 | 长春希达电子技术有限公司 | Packaging integrating three-in-one LED (Light Emitting Diode) display unit |
| CN103311422A (en) * | 2012-03-12 | 2013-09-18 | 隆达电子股份有限公司 | Light emitting diode element |
| CN103366647A (en) * | 2013-07-09 | 2013-10-23 | 严敏 | LED display unit module |
| CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
| CN203444723U (en) * | 2013-09-27 | 2014-02-19 | 湖南明和光电设备有限公司 | LED (Light Emitting Diode) electronic display screen module with light source and drive which are separated |
| CN103646620A (en) * | 2013-12-25 | 2014-03-19 | 深圳市洲明科技股份有限公司 | LED (light-emitting diode) display module and manufacturing method thereof |
| CN104217659A (en) * | 2014-09-29 | 2014-12-17 | 广东威创视讯科技股份有限公司 | Novel LED (light emitting diode) display screen |
| CN104684130A (en) * | 2013-11-26 | 2015-06-03 | 四川新力光源股份有限公司 | Card-type LED driver and transportation vehicle with same |
| CN205211327U (en) * | 2015-11-17 | 2016-05-04 | 东莞嘉鑫创光电有限公司 | Light -emitting diode (LED) display board |
-
2015
- 2015-11-17 CN CN201510789585.4A patent/CN105280106A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11231806A (en) * | 1998-02-12 | 1999-08-27 | Kokusai Electric Co Ltd | Lighting check device for led panel |
| JP2002141492A (en) * | 2000-10-31 | 2002-05-17 | Canon Inc | Light-emitting diode display panel and manufacturing method thereof |
| CN201944785U (en) * | 2010-07-20 | 2011-08-24 | 王定锋 | LED lamp circuit board formed by connecting two platy lines in parallel |
| CN202422610U (en) * | 2011-11-28 | 2012-09-05 | 深圳市奥拓电子股份有限公司 | LED (light emitting diode) modules and silica gel masks thereof |
| CN103311422A (en) * | 2012-03-12 | 2013-09-18 | 隆达电子股份有限公司 | Light emitting diode element |
| CN103021288A (en) * | 2012-12-12 | 2013-04-03 | 长春希达电子技术有限公司 | Packaging integrating three-in-one LED (Light Emitting Diode) display unit |
| CN103366647A (en) * | 2013-07-09 | 2013-10-23 | 严敏 | LED display unit module |
| CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
| CN203444723U (en) * | 2013-09-27 | 2014-02-19 | 湖南明和光电设备有限公司 | LED (Light Emitting Diode) electronic display screen module with light source and drive which are separated |
| CN104684130A (en) * | 2013-11-26 | 2015-06-03 | 四川新力光源股份有限公司 | Card-type LED driver and transportation vehicle with same |
| CN103646620A (en) * | 2013-12-25 | 2014-03-19 | 深圳市洲明科技股份有限公司 | LED (light-emitting diode) display module and manufacturing method thereof |
| CN104217659A (en) * | 2014-09-29 | 2014-12-17 | 广东威创视讯科技股份有限公司 | Novel LED (light emitting diode) display screen |
| CN205211327U (en) * | 2015-11-17 | 2016-05-04 | 东莞嘉鑫创光电有限公司 | Light -emitting diode (LED) display board |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160127 |