CN204289530U - A kind of small size colorful LED lamp pearl - Google Patents
A kind of small size colorful LED lamp pearl Download PDFInfo
- Publication number
- CN204289530U CN204289530U CN201420759186.4U CN201420759186U CN204289530U CN 204289530 U CN204289530 U CN 204289530U CN 201420759186 U CN201420759186 U CN 201420759186U CN 204289530 U CN204289530 U CN 204289530U
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- Prior art keywords
- copper foil
- die bond
- pad
- resin substrate
- lamp pearl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
The utility model provides a kind of small size colorful LED lamp pearl, this lamp pearl is filled full copper material and forms conduction copper column in the through hole of support, therefore the heat that rack upper surface produces effectively can be conducted by conduction copper column, increases lower surface, left by the connector of LED lamp bead again, effective heat dispersion improving lamp pearl, in addition, owing to being full of copper material in through hole, the integral position of through hole suitably can move inward from bracket edge, even if when die-cut throughhole portions punched fall, copper material in through hole still can retain a part, therefore the requirement for die cutting accuracy reduces, effectively improve the yield of product, in addition, owing to being dispelled the heat by copper post, the connection of LED wafer and pad Copper Foil is simultaneously connected by wire jumper, therefore the Copper Foil area of rack upper surface can significantly reduce, and die bond Copper Foil is roughly in word order, light source concentrates on a line, decrease the rambling reflection of Copper Foil of rack upper surface, therefore illumination effect is better.
Description
Technical field
The invention relates to LED technical field, particularly a kind of small size colorful LED lamp pearl.
Background technology
Along with the development of technology, the pixel of LED display is more and more higher, and pixel is also more and more intensive, and this just requires that the size of LED lamp bead forming pixel must be very little, and this encapsulation technology for LED has also been deducted a percentage higher requirement.In encapsulation technology, the structure of most crucial is exactly support, supporting structure determines encapsulating structure, and the size of the final LED lamp bead of encapsulating structure, the support of traditional SMD LED lamp bead adopts and is being formed by injection moulding on metallic support, and metallic support stretches out metal pins to both sides, significantly, stretch out pin to both sides and can occupy segment space, cause between adjacent LED, there is larger spacing.
To this, class double-layer PCB board technology can be adopted to make LED support and to encapsulate, particularly enclose upper strata Copper Foil in the front of resin substrate with conduction, then bottom surface Copper Foil is fixed in the bottom surface of resin substrate using as pin, and, reach through hole on resin substrate, then Copper Foil is plated at the hole wall of through hole, conducting wire Copper Foil is connected with bottom surface Copper Foil conduction, and then adopt resin that filling through hole is full, the final like this LED lamp bead encapsulated out would not the pin that extends of oriented both sides, thus effectively adds the closeness of display screen.But also there is many difficult points at present in this technology: (1) due to resin substrate heat conductivility poor, as traditional support, the heat that LED crystal sends cannot be derived from top to bottom, and then be passed on the connector of LED lamp bead, (2) in order to solve heat dissipation problem, upper strata Copper Foil needs to increase area as far as possible to increase radiating efficiency, and while increasing Copper Foil area, also to consider the problems such as the conduction distance of upper copper foil piece, in addition because stent size is very little, therefore through hole is caused generally all to need the edge starting to increase at LED, on the other hand, in current technology, LED support is all the multiple densely arranged LED support of machine-shaping on the resin substrate of whole piece, then at each independently LED support of die-cut formation, owing to through hole hole wall only having plated the copper material of thin layer, and through hole is in the edge of support, one deck when die-cut easily due to die cutting accuracy cause not the copper material of hole wall punched fall, cause final lamp pearl cannot normally, therefore, existing support is very high to die-cut required precision, product yield is low.(3) upper strata Copper Foil forms galvanic circle by roundabout distribution, but these galvanic circles can increase the area of upper strata Copper Foil, and large-area upper strata Copper Foil can cause a large amount of luminescence, and light-out effect is poor.
Summary of the invention
The object of the invention is to avoid above-mentioned weak point of the prior art and provides a kind of radiating requirements, process requirements and the characteristics of luminescence that can take into full account LED, thus improve the radiating efficiency of LED lamp bead, reduce the accuracy requirement of technique and improve the support of the colorful LED of small size of illumination effect.
The object of the invention is achieved through the following technical solutions:
A kind of small size colorful LED lamp pearl, comprise the encapsulation glue-line in resin substrate and coated described resin substrate front, the front of described resin substrate is provided with N number of die bond Copper Foil for fixed L ED crystal and N+1 the pad Copper Foil for conducting electricity, described N is not less than two, the bottom surface of described resin substrate is fixed with the pin Copper Foil consistent with pad Copper Foil quantity, described die bond Copper Foil is roughly in word order, described pad Copper Foil is distributed in the both sides of described die bond Copper Foil, the conductive through hole of through described resin substrate is offered under each pad Copper Foil, copper material is perfused with to make formation conduction copper column in described conductive through hole, one end of every root copper post is fixed with pad Copper Foil described in a slice, the other end fixes pin Copper Foil described in a slice, every sheet die bond Copper Foil is fixed with a LED wafer, the pin of described wafer is connected to described pad Copper Foil through wire jumper.
Wherein, described LED wafer comprises blue light crystal, green light crystal and ruddiness crystal, described die bond Copper Foil comprises the B die bond Copper Foil for fixing blue light crystal, G die bond Copper Foil for fixing green light crystal and the R die bond Copper Foil for fixing ruddiness crystal, described pad Copper Foil comprises the B pad Copper Foil for connecting a conductive electrode for blue light crystal, for connecting the G pad Copper Foil of a conductive electrode of green light crystal, for the R pad Copper Foil that connects a conductive electrode of ruddiness crystal be connected blue light crystal simultaneously, the public pad Copper Foil of another conductive electrode of green light crystal and ruddiness crystal.
Wherein, two parts that resin substrate is divided into area roughly equal by the line of centres of described die bond Copper Foil, are provided with two pad Copper Foils in each part.
Wherein, described resin substrate is square substrate, and described pad Copper Foil is distributed in four corners of this resin substrate.
Wherein, the bottom surface of described substrate is provided with the insulating lacquer layer in " ten " shape, and lower surface is divided into four pin field by described insulating lacquer layer, is provided with the pin Copper Foil described in a slice in each pin field.
Wherein, between described B die bond Copper Foil and G die bond Copper Foil, be connected with heat conduction Copper Foil, between described B die bond Copper Foil and B pad Copper Foil, be connected with heat conduction Copper Foil.
Wherein, described G die bond Copper Foil is positioned at resin substrate front center, and all sides of described G die bond Copper Foil only arrange a slice heat conduction Copper Foil, and all the other are reserved as exposed area, and Copper Foil is not covered to expose the front of resin substrate in described exposed area.
Wherein, described die bond Copper Foil is square Copper Foil, and the area of each die bond Copper Foil is less than 10% of the area of described resin substrate, is greater than 5% of the area of described resin substrate.
Wherein, described resin substrate is black.
Wherein, being formed by black epoxy/silicones mold pressing of described encapsulation glue-line, the roughness of the upper surface of this packaging silicon rubber is 0.5-1.5 μm.
The beneficial effect of the invention: the invention provides a kind of small size colorful LED lamp pearl, this lamp pearl is filled full copper material and forms conduction copper column in the through hole of support, therefore the heat that rack upper surface produces effectively can be conducted by conduction copper column, increases lower surface, left by the connector of LED lamp bead again, effective heat dispersion improving lamp pearl, in addition, owing to being full of copper material in through hole, the integral position of through hole suitably can move inward from bracket edge, even if when die-cut throughhole portions punched fall, copper material in through hole still can retain a part, therefore the requirement for die cutting accuracy reduces, effectively improve the yield of product, in addition, owing to being dispelled the heat by copper post, the connection of LED wafer and pad Copper Foil is simultaneously connected by wire jumper, therefore the Copper Foil area of rack upper surface can significantly reduce, and die bond Copper Foil is roughly in word order, light source concentrates on a line, decrease the rambling reflection of Copper Foil of rack upper surface, therefore illumination effect is better.
Accompanying drawing explanation
Accompanying drawing is utilized to be described further the invention, but the embodiment in accompanying drawing does not form any restriction to the invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 is the Facad structure schematic diagram of a kind of small size colorful LED lamp pearl of the invention.
Fig. 2 is the bottom surface structure schematic diagram of the support of a kind of colorful LED of small size of the invention.
Fig. 3 is the cross section structure schematic diagram in the A-A ' direction along Fig. 1.
Include in Fig. 1 to Fig. 3:
1---resin substrate, 2---B die bond Copper Foil, 3---G die bond Copper Foil, 4---R die bond Copper Foil, 5---B pad Copper Foil, 6---G pad Copper Foil, 7---R pad Copper Foil, 8---public pad Copper Foil, 9---conduction copper column, 10---pin Copper Foil, 11---insulating lacquer layer, 16---heat conduction Copper Foil.
Embodiment
With the following Examples the invention is further described.
The embodiment of the support of the colorful LED of small size that the invention is a kind of, as shown in Figure 1 to Figure 3, comprise: square resin substrate 1, the front of resin substrate 1 is provided with: three die bond Copper Foils (2 for fixed L ED crystal roughly in word order, 3, 4), the B die bond Copper Foil 2 that upper surface is fixed with blue light crystal 12 respectively, upper surface is fixed with the R die bond Copper Foil 4 that the G die bond Copper Foil 3 of green light crystal 13 and upper surface are fixed with ruddiness crystal 14, G die bond Copper Foil 3 is positioned at resin substrate 1 front center, three die bond Copper Foils (2, 3, 4) resin substrate 1 is divided into left and right two parts by the line of centres, these two parts are roughly symmetrical, be distributed in four of four corners, the resin substrate 1 front pad Copper Foil (5 for conducting electricity, 6, 7, 8), the B pad Copper Foil 5 for connecting the negative conductive electrode for blue light crystal 12 respectively, for connecting the G pad Copper Foil 6 of the negative conductive electrode of green light crystal 13, for the R pad Copper Foil 7 that connects the negative conductive electrode of ruddiness crystal 14 be connected blue light crystal 12 simultaneously, the public pad Copper Foil 8 of the positive conductive pole of green light crystal 13 and ruddiness crystal 14, wherein B pad Copper Foil 5 and G pad Copper Foil 6 are positioned at the left part of die bond Copper Foil, R pad Copper Foil 7 and public pad Copper Foil 8 are positioned at the right part of die bond Copper Foil.The negative conductive electrode of blue light crystal 12 is connected to B pad Copper Foil 5 by wire jumper two, and positive conductive electrode is understood to public pad Copper Foil 8 by wire jumper; The negative conductive electrode of green light crystal 13 is connected to G pad Copper Foil 6 by wire jumper two, and positive conductive electrode is understood to public pad Copper Foil 8 by wire jumper; The negative conductive electrode of ruddiness crystal 14 is connected to R pad Copper Foil 7 (because the negative pole of red wafer is in bottom of wafer, therefore wire jumper is negative line, and Gu Tuzhong does not show) herein by wire jumper two, and positive conductive electrode is understood to public pad Copper Foil 8 by wire jumper.The top of resin substrate 1 encapsulates glue-line with coated described all kinds of Copper Foil and wafer by being become one deck by black silicon rubber moulding swaging, and the roughness of the upper surface of this packaging silicon rubber layer 15 is 0.5-1.5 μm.
The bottom surface of described resin substrate 1 be fixed with four with pad Copper Foil four pin Copper Foils 10 and the insulating lacquer layer 11 in " ten " shape one to one, lower surface is divided into four pin field by described insulating lacquer layer 11, is provided with a slice pin Copper Foil 10 in each pin field.
The conductive through hole of through described resin substrate 1 is offered under each pad Copper Foil, copper material is perfused with to make formation conduction copper column 9 in described conductive through hole, one end of every root copper post is fixed with pad Copper Foil described in a slice, and the other end fixes pin Copper Foil 10 described in a slice.
Compared with prior art, this support of this technology is opened and is filled full copper material in through-holes, therefore the heat that rack upper surface produces effectively can conduct to the pin Copper Foil of support lower surface by copper material, left by the connector of LED lamp bead again, effective heat dispersion improving lamp pearl, in addition, owing to being full of copper material in through hole, the integral position of through hole suitably can move inward from bracket edge, even if when die-cut throughhole portions punched fall, copper material in through hole still can retain a part, therefore the requirement for die cutting accuracy reduces, effectively improve the yield of product, in addition, owing to being dispelled the heat by copper post, the connection of LED wafer and pad Copper Foil is simultaneously connected by wire jumper, therefore the Copper Foil area of rack upper surface can significantly reduce, and die bond Copper Foil is roughly in word order, light source concentrates on a line, also optimize the Copper Foil arrangement in resin substrate 1 front simultaneously, decrease the rambling reflection of Copper Foil of rack upper surface, the black encapsulation glue-line of mating die swaging one-tenth simultaneously, reduce reflection ray, black silicon glue-line upper strata is enough smooth, avoid light emission direction deviation, its roughness controls at 0.5-1.5 μm simultaneously, guarantee its diffuse effect, therefore Integral luminous better effects if.
In addition, heat conduction Copper Foil 16 is connected with between B die bond Copper Foil 2 and G die bond Copper Foil 3, heat conduction Copper Foil 16 is connected with between described B die bond Copper Foil 2 and B pad Copper Foil 5, heat conduction Copper Foil 16 is connected with between R die bond Copper Foil 4 and R pad Copper Foil 7, owing to there is no conduction copper column 9 below die bond Copper Foil, therefore need to conduct its heat to pad Copper Foil by conduction copper post, derived by conduction copper column 9 again, wherein, G die bond Copper Foil 3 is owing to being located at the center of resin substrate 1, being connected inconvenience with the pad Copper Foil being in corner, therefore carrying out indirect heat conducting by being connected to B die bond copper Copper Foil.But, G die bond Copper Foil 3 is except the heat conduction Copper Foil 16 between B die bond Copper Foil 2, heat conduction Copper Foil 16 is not connected with other Copper Foils, but form exposed area to expose the front of resin substrate 1, this is the center owing to being in resin substrate 1 at G die bond Copper Foil 3, the space of its week side is all LED lamp bead center, reflection must be reduced as far as possible herein, therefore the setting of Copper Foil will be reduced herein, only connect a slice heat conduction Copper Foil 16 to meet basic need, and, heat conduction Copper Foil 16 to be preferably fixed between G die bond Copper Foil 3 and B die bond Copper Foil 2 but not between G die bond Copper Foil 3 and R die bond Copper Foil 4, after tested, the reflection reducing ruddiness is more favourable to improving light-out effect.
Further, all die bond Copper Foils are all square Copper Foils, and the area of described die bond Copper Foil is less than 10% of the area of described resin substrate 1, are greater than 5% of the area of described resin substrate 1, and the upper surface of resin substrate 1 is black, the surface reflection of support could be reduced so as much as possible.
Finally should be noted that; above embodiment is only in order to illustrate the technical scheme of the invention; but not the restriction to the invention protection range; although done to explain to the invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical scheme of the invention or equivalent replacement, and not depart from essence and the scope of the invention technical scheme.
Claims (10)
1. a small size colorful LED lamp pearl, comprise the encapsulation glue-line in resin substrate and coated described resin substrate front, it is characterized in that: the front of described resin substrate is provided with N number of die bond Copper Foil for fixed L ED crystal and N+1 the pad Copper Foil for conducting electricity, described N is not less than two, the bottom surface of described resin substrate is fixed with the pin Copper Foil consistent with pad Copper Foil quantity, described die bond Copper Foil is roughly in word order, described pad Copper Foil is distributed in the both sides of described die bond Copper Foil, the conductive through hole of through described resin substrate is offered under each pad Copper Foil, copper material is perfused with to make formation conduction copper column in described conductive through hole, one end of every root copper post is fixed with pad Copper Foil described in a slice, the other end fixes pin Copper Foil described in a slice, every sheet die bond Copper Foil is fixed with a LED wafer, the pin of described wafer is connected to described pad Copper Foil through wire jumper.
2. a kind of small size colorful LED lamp pearl as claimed in claim 1, it is characterized in that: described LED wafer comprises blue light crystal, green light crystal and ruddiness crystal, described die bond Copper Foil comprises the B die bond Copper Foil for fixing blue light crystal, G die bond Copper Foil for fixing green light crystal and the R die bond Copper Foil for fixing ruddiness crystal, described pad Copper Foil comprises the B pad Copper Foil for connecting a conductive electrode for blue light crystal, for connecting the G pad Copper Foil of a conductive electrode of green light crystal, for the R pad Copper Foil that connects a conductive electrode of ruddiness crystal be connected blue light crystal simultaneously, the public pad Copper Foil of another conductive electrode of green light crystal and ruddiness crystal.
3. a kind of small size colorful LED lamp pearl as claimed in claim 2, is characterized in that: two parts that resin substrate is divided into area roughly equal by the line of centres of described die bond Copper Foil, is provided with two pad Copper Foils in each part.
4. a kind of small size colorful LED lamp pearl as claimed in claim 2, is characterized in that: described resin substrate is square substrate, and described pad Copper Foil is distributed in four corners of this resin substrate.
5. a kind of small size colorful LED lamp pearl as claimed in claim 2, it is characterized in that: the bottom surface of described substrate is provided with the insulating lacquer layer in " ten " shape, lower surface is divided into four pin field by described insulating lacquer layer, is provided with the pin Copper Foil described in a slice in each pin field.
6. a kind of small size colorful LED lamp pearl as claimed in claim 2, is characterized in that: be connected with heat conduction Copper Foil between described B die bond Copper Foil and G die bond Copper Foil, is connected with heat conduction Copper Foil between described B die bond Copper Foil and B pad Copper Foil.
7. a kind of small size colorful LED lamp pearl as claimed in claim 2, it is characterized in that: described G die bond Copper Foil is positioned at resin substrate front center, the all sides of described G die bond Copper Foil only arrange a slice heat conduction Copper Foil, all the other are reserved as exposed area, and Copper Foil is not covered to expose the front of resin substrate in described exposed area.
8. a kind of small size colorful LED lamp pearl as claimed in claim 2, it is characterized in that: described die bond Copper Foil is square Copper Foil, the area of each die bond Copper Foil is less than 10% of the area of described resin substrate, is greater than 5% of the area of described resin substrate.
9. a kind of small size colorful LED lamp pearl as claimed in claim 1, is characterized in that: described resin substrate is black.
10. a kind of small size colorful LED lamp pearl as claimed in claim 1, it is characterized in that: being formed by black epoxy/silicones mold pressing of described encapsulation glue-line, the roughness of the upper surface of this packaging silicon rubber is 0.5-1.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420759186.4U CN204289530U (en) | 2014-12-05 | 2014-12-05 | A kind of small size colorful LED lamp pearl |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420759186.4U CN204289530U (en) | 2014-12-05 | 2014-12-05 | A kind of small size colorful LED lamp pearl |
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| Publication Number | Publication Date |
|---|---|
| CN204289530U true CN204289530U (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420759186.4U Active CN204289530U (en) | 2014-12-05 | 2014-12-05 | A kind of small size colorful LED lamp pearl |
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| Country | Link |
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| CN (1) | CN204289530U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107240636A (en) * | 2017-07-21 | 2017-10-10 | 湖南粤港模科实业有限公司 | A kind of ultra-thin radiator series of buckle-type and chip integrative packaging light-source structure |
-
2014
- 2014-12-05 CN CN201420759186.4U patent/CN204289530U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107240636A (en) * | 2017-07-21 | 2017-10-10 | 湖南粤港模科实业有限公司 | A kind of ultra-thin radiator series of buckle-type and chip integrative packaging light-source structure |
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