CN204496855U - LED (light emitting diode) display screen - Google Patents

LED (light emitting diode) display screen Download PDF

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Publication number
CN204496855U
CN204496855U CN201520032965.9U CN201520032965U CN204496855U CN 204496855 U CN204496855 U CN 204496855U CN 201520032965 U CN201520032965 U CN 201520032965U CN 204496855 U CN204496855 U CN 204496855U
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China
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led
pad region
led chip
led chips
region
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CN201520032965.9U
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Chinese (zh)
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李漫铁
屠孟龙
谢玲
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深圳雷曼光电科技股份有限公司
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Abstract

The utility model discloses an LED (light emitting diode) display screen, which comprises a circuit board and a plurality of groups of three-color LED chips, wherein a plurality of pixel areas are arranged on the circuit board, each group of three-color LED chips is packaged into the corresponding pixel area, at least three bonding pad areas are arranged in each pixel area, and electrodes of the three-color LED chips are respectively and electrically connected with the corresponding three bonding pad areas, so as to singly control at least two LED chips. By adopting the method, the LED display screen has the advantages that the small dot spacing of the LED display screen can be easily realized, the LED chips can be singly controlled, and the accuracy is favorably improved.

Description

一种LED显示屏 An LED display

技术领域 FIELD

[0001] 本实用新型涉及LED显示技术领域,特别是涉及一种LED显示屏。 [0001] The present invention relates to the field of LED display technology, in particular, it relates to an LED display.

背景技术 Background technique

[0002] 随着传统LED显示屏的竞争越来约激烈,小点间距的LED显示屏越来越受厂商重视。 [0002] As the competition in the traditional LED display increasingly fierce about, dot pitch LED display manufacturers more and more attention. 与传统LED显示屏不同的是,所谓小点间距即是指像素点的间距较小。 The conventional LED display is different, which means a smaller dot pitch called small pixel pitch. 小点间距的LED显示屏由于像素点间距较小,从而具有无缝拼接、真实还原色彩、画面更稳定流畅等优点,真正意义上实现了无缝高清大屏。 Dot pitch LED display due to the smaller pixel pitch, which has a seamless, true color, the picture is more stable and smooth, etc., in the true sense of seamless high-definition big screen.

[0003] 现有的小点间距LED显示屏技术中,通常是将LED芯片安装在封装支架上以构成离散式的LED灯珠,然后将LED灯珠安装在印刷电路板上形成发光的像素点。 [0003] The prior art LED display dot pitch, usually an LED chip mounted on a package holder to constitute discrete LED lamp and the LED lamp mounted light emission pixels formed in the printed circuit board . 然而,采用上述技术,在将封装好的LED灯珠通过贴片机贴装到印刷电路板上时,容易造成虚焊时,影响产品质量。 However, using the techniques described above, when the packaged LED lamp mounted to the printed circuit board by a chip mounter, when Weld likely to cause, affecting product quality. 并且,将封装好的LED灯珠安装到印刷电路板上时由于封装支架的存在而难以实现真正的小点间距。 And, due to the presence of the encapsulated stent of the package it is difficult to achieve really small spacing when the LED lamp mounted to a printed circuit board.

实用新型内容 SUMMARY

[0004] 本实用新型主要解决的技术问题是提供一种LED显示屏,能够提高产品质量,且更容易实现LED显示屏的小点间距。 [0004] The present invention is mainly to solve the technical problem of providing an LED display, can improve product quality, and easier to realize a small spacing LED display.

[0005] 为解决上述技术问题,本实用新型采用的一个技术方案是:提供一种LED显示屏,包括电路板和多组三色LED芯片;所述电路板上设置有多个像素区域,每组所述三色LED芯片封装于一个所述像素区域中,其中,每个所述像素区域内设置有至少三个焊盘区,所述三色LED芯片的相应电极分别与所述三个焊盘区电连接,实现至少两个所述LED芯片单独控制。 [0005] To solve the above problems, an aspect of the present invention uses: providing an LED display, including a circuit board and a plurality of sets of three-color LED chip; said circuit board is provided with a plurality of pixel regions, each of the set of three-color LED chip packaging in a region of said pixel, wherein each of said pixel regions is provided with at least three pad region, an electrode in the three-color LED chips, respectively, and the three welding panel is electrically connected to the LED chip to realize at least two separately controlled.

[0006] 其中,所述焊盘区的数量为六个,所述三色LED芯片固定于其中一个焊盘区中,且所述三色LED芯片中的一个LED芯片的负极与所述一个焊盘区电连接,另两个LED芯片的负极分别与其余五个焊盘区中的两个焊盘区电连接,所述三色LED芯片的正极分别与所述其余五个焊盘区中的剩余三个焊盘区电连接,以实现每个所述LED芯片的单独控制。 [0006] wherein the number pad region is six, the three-color LED chip is fixed to one of the pad region, and the negative electrode of the three-color LED chips of one LED chip of a welding panel electrically connected to the negative electrode and the other two LED chips are electrically connected to the pad region other five two pad areas, the positive three-color LED chips, respectively, and the remaining five in the pad region the remaining three regions are electrically connected to the pad, to be implemented separately controlling each of the LED chip.

[0007] 其中,所述三色LED芯片分别为显示红色、绿色、蓝色的LED芯片;负极与所述一个焊盘区电连接的所述一个LED芯片为显示红色的单极性LED芯片,所述显示红色的单极性LED芯片通过银胶固定在所述一个焊盘区中,以实现其负极与所述一个焊盘区电连接;所述另两个LED芯片分别为显示绿色和蓝色的双极性LED芯片,所述显示绿色和蓝色的双极性LED芯片通过绝缘胶固定在所述一个焊盘区中。 [0007] wherein, the three-color LED chips are red, green, and blue LED chips; a negative electrode of said pad region electrically connected to the LED chip is a red LED chip unipolar, the red LED chip is a unipolar fixed to the silver paste through a pad region in order to achieve the negative electrode is electrically connected to a pad region; the other two green LED chips and blue, respectively bipolar color LED chip, the green and blue LED chips through a bipolar fixed to the insulating adhesive in a pad region.

[0008] 其中,所述显示红色、绿色、蓝色的LED芯片沿第一方向排列固定于所述其中一个焊盘区中。 [0008] wherein the red, green, and blue LED chips are arranged along a first direction is fixed to one of said pad region.

[0009] 其中,所述焊盘区的数量为四个,所述三色LED芯片固定于其中一个焊盘区中,且所述三色LED芯片中的一个LED芯片的负极与所述一个焊盘区电连接,另两个LED芯片的负极分别与其余三个焊盘区中的两个焊盘区电连接,所述三色LED芯片的正极均与所述其余三个焊盘区中的剩余一个焊盘区电连接,其中,分别与所述三色LED芯片的负极电连接的三个焊盘区所连接的负载或参考电压不相同,以实现每个所述LED芯片单独控制。 [0009] wherein the number pad region is four, the three-color LED chip is fixed to one of the pad region, and the negative electrode of the three-color LED chips of one LED chip of a welding panel electrically connected to the negative electrode and the other two LED chips are electrically connected with the remaining two of the three pads in the pad region region, the positive three-color LED chips are in the remaining region with three pads the remaining electrically connected to a pad region, wherein the three load pad region electrically connected to the negative electrode of the three-color LED chips being connected to a reference voltage or not identical, each of said LED chip to achieve individual control.

[0010] 其中,所述像素区域之间的间距为0.8mm〜3.9mm。 [0010] wherein the spacing between said pixel region 0.8mm~3.9mm.

[0011] 其中,所述像素区域为设置在所述电路板上的凹槽,所述凹槽内填充有封装胶以覆盖所述三色LED芯片。 The groove is filled with a plastic package [0011] wherein the pixel region is disposed in a recess on the circuit board, so as to cover the three colors of the LED chip.

[0012] 其中,所述封装胶的外表面与所述凹槽开口所在的平面齐平或凸出于所述凹槽开口所在的平面。 [0012] wherein the plane of said packaging adhesive outer surface of the recess opening is located flush with or protrude from a plane where the groove opening.

[0013] 其中,所述三色LED芯片的相应电极分别通过金属导线或各向异性导电胶与所述三个焊盘区连接。 [0013] wherein the respective electrodes of the three-color LED chips are connected by a metal wire or anisotropic conductive paste of the three pad region.

[0014] 其中,所述像素区域的形状为圆形、椭圆形或方形。 [0014] wherein the shape of the pixel area is circular, oval or square.

[0015] 本实用新型的有益效果是:区别于现有技术的情况,本实用新型的LED显示屏中,通过在电路板上设置用于封装LED芯片的像素区域,从而可以将LED芯片直接封装在电路板上,由此不需要通过额外的封装支架封装LED芯片,从而更容易实现LED显示屏的小点间距,且有利于降低封装支架成本。 [0015] The beneficial effects of the present invention are: to be distinguished from the prior art, the present invention is an LED display, a circuit board is provided by a pixel region of the package of the LED chip, the LED chip can be packaged directly in the circuit board, whereby no additional packaging by packaging an LED chip holder, making it easier to achieve a small spacing LED display, and help to reduce the cost of the package holder. 此外,三色LED芯片的相应电极分别与三个焊盘区电连接,以实现至少两个LED芯片单独控制,即可以单独控制LED芯片的电路,有利于提高精度。 In addition, the respective electrodes of the three-color LED chips are electrically connected with the pad areas three to achieve separate control of the at least two LED chips, which can individually control circuit of the LED chip, help to improve the accuracy.

附图说明 BRIEF DESCRIPTION

[0016] 图1是本实用新型LED显示屏一实施方式的结构示意图; [0016] FIG. 1 is a schematic structural diagram of an embodiment of the present invention, the LED display;

[0017] 图2是图1所示的LED显示屏中,像素区域的放大结构示意图; [0017] FIG. 2 is a LED display shown in FIG. 1, a schematic view of an enlarged structure of the pixel region;

[0018] 图3是本实用新型LED显示屏的另一实施方式中,像素区域的放大结构示意图; [0018] FIG. 3 is another embodiment of the present invention, LED display screen, an enlarged schematic view of the structure of the pixel region;

[0019] 图4是本实用新型LED显示屏的又一实施方式中,像素区域的截面示意图; [0019] FIG. 4 is another embodiment of the present invention, the LED display, a schematic sectional view of a pixel region;

[0020] 图5是本实用新型LED显示屏的又一实施方式中,像素区域的放大结构示意图。 [0020] FIG. 5 is another embodiment of the present invention, LED display screen, an enlarged schematic view of the structure of the pixel region.

具体实施方式 Detailed ways

[0021] 下面将结合附图和实施方式对本实用新型进行详细说明。 [0021] The present invention will now be described in detail in conjunction with the accompanying drawings and embodiments.

[0022] 参阅图1和图2,本实用新型LED显示屏的一实施方式中,LED显示屏包括电路板I和多组三色LED芯片2,三色LED芯片2分别为显示红色的红色LED芯片21、显示绿色的绿色LED芯片22以及显示蓝色的LED芯片23。 [0022] Referring to FIG 1 and FIG 2, one embodiment of the present invention, the LED display, LED display circuit board comprising a plurality of sets of I and tri-color LED chip 2, three-color LED chips 2 are red red LED chip 21, green 22 green LED chip and the blue LED chip 23. 当然,三色LED芯片也可以是红色LED芯片、绿色LED芯片和白色LED芯片,或者是红色LED芯片、黄色LED芯片和白色LED芯片。 Of course, three-color LED chip may be a red LED chip, green LED chip and a white LED chip, or a red LED chip, a yellow LED chip and the white LED chips.

[0023] 电路板I上设置有多个按矩阵n*m排列的像素区域ll,n、m均为16的整数倍。 Is provided on the I [0023] Circuit board ll plurality of pixel regions arranged in a matrix of n * m, n, m are each an integer multiple of 16. 每组三色LED芯片2封装于一个像素区域11中。 Each set of three-color LED chip 2 is encapsulated in a pixel region 11. 其中,每个像素区域11内设置有至少三个焊盘区111、112、113,三色LED芯片2的相应电极分别与三个焊盘区111、112、113电连接,实现至少两个LED芯片2单独控制。 Wherein each pixel region 11 is provided with at least three pad region 112, 113, the respective electrodes of the three-color LED chip 2 are electrically connected to pad area 111, three, to achieve at least two LED control chip 2 alone.

[0024] 其中,三色LED芯片2为双极性LED芯片。 [0024] wherein three-color LED chip 2 is a bipolar LED chip. 三色LED芯片2的正极均连接焊盘区111,红色LED芯片21的负极连接焊盘区112,蓝色LED芯片22和绿色LED芯片23的负极连接焊盘区113。 Positive three-color LED chip 2 are connected to pad area 111, a red LED chip 21 is connected to the negative pad region 112, the blue LED chip region 113 negative connection pad 22 and the green LED chip 23. 其中,焊盘区113和焊盘区112电连接的负载不相同,例如焊盘区112后端电路上连接有阻值为I欧姆的电阻,焊盘区113后端电路上连接有阻值为3欧姆的电阻,以使得红色LED芯片21所在的电路的电流小于绿色LED芯片22和蓝色LED芯片23所在的电路的电流,从而实现红色LED芯片21和绿色LED芯片22与蓝色LED芯片23的单独控制O Wherein the pad region 113 and a load 112 electrically connected to pad area are not identical, e.g. back-end circuit 112 is connected to pad area resistance of I-ohm resistor 113 is connected to the rear end of the resistance circuit pad region 3 ohm resistor, so that the red LED chip 21 is located is smaller than the current of the current circuit green LED chip 22 and the blue LED chip 23 where a circuit, thereby to achieve red LED chips 21 and the green LED chip 22 and the blue LED chip 23 individual control O

[0025] 其中,三色LED芯片2的各电极(即正负极)分别通过金属导线与相应的焊盘区电连接。 [0025] wherein each of the three-color LED chip 2, the electrodes (i.e., positive and negative) are connected electrically to the corresponding region of the pad through the metal wire. 金属导线可以是金线、铝线或合金线等。 Metal wires may be gold, aluminum alloy wire or the like. 当然,三色LED芯片2的各电极也可以通过各向异性导电胶与相应的焊盘区电连接,以实现无金线封装。 Of course, each of the three colors of the electrodes of the LED chip 2 may be connected through an anisotropic conductive adhesive and electrical pad areas corresponding to gold-free package.

[0026] 此外,本实施方式中,通过将LED芯片直接封装在电路板I上,可以使得像素区域之间的间距做得更小,更容易实现小点间距。 [0026] Further, in the present embodiment, by direct encapsulation of an LED chip on the circuit board I, may be such that the spacing between the pixel region can be made smaller, easier to achieve a small spacing.

[0027] 当然,其他实施方法中,还可以是使焊盘区112和焊盘区113所连接的参考电压不相同,以使得红色LED芯片112的正负极之间的压差与绿色LED芯片22或蓝色LED芯片23的正负极之间的压差不相同,以实现LED芯片的单独控制。 [0027] Of course, in other embodiments the method may also be the pad region 112 and a pad region is connected to a reference voltage 113 is not the same, so that the pressure difference between the green LED chip positive and negative electrodes of the red LED chip 112 pressure differential between the positive and negative electrodes 22 or the blue LED chip 23 is not the same, in order to achieve separate control of the LED chip.

[0028] 参阅图3,本实用新型LED显示屏另一实施方式中,像素区域31内的焊盘区的数量为六个,分别是焊盘区311、312、313、314、315以及316。 [0028] Referring to Figure 3, the LED display of the present invention is a further embodiment, the number pad region of the pixel region 31 in the six, respectively, and the pad region 316 311,312,313,314,315. 其中,三色LED芯片4固定在焊盘区311中。 Wherein the three-color LED chip 4 is fixed in the pad region 311. 三个焊盘区312、313、314设置在焊盘区311的一侧,另两个焊盘区315、316设置在焊盘区311的另一侧。 Three pads 312, 313 disposed at one side region 311 of the pad region, a pad region 315, the other two on the other side of the pad region 311.

[0029] 其中,三色LED芯片4分别为红色LED芯片41、绿色LED芯片42以及蓝色LED芯片43。 [0029] wherein three-color LED chips 4 are a red LED chip 41, the green LED chip 42 and the blue LED chip 43. 红色LED芯片41、绿色LED芯片42以及蓝色LED芯片43沿竖直方向依次排列。 41 red LED chips, green LED chips 42 arranged in order and a blue LED chip 43 is in the vertical direction. 当然,三色LED芯片4还可以是沿水平方向依次排列。 Of course, three-color LED chip 4 may also be sequentially arranged in the horizontal direction.

[0030] 其中,红色LED芯片41为单极性LED芯片,其通过可导电性的银胶固定在焊盘区311中,从而实现其负极与焊盘区311电连接。 [0030] wherein, the red LED chip 41 LED chip is unipolar, which glue in the pad area 311 by means of conductive silver, thereby achieving negative electrode 311 is electrically connected to the pad region. 绿色LED芯片42和蓝色LED芯片43为双极性LED芯片,其通过绝缘胶固定在焊盘区311中,且绿色、蓝色LED芯片42、43的负极分别与焊盘区315、316电连接。 Green LED chip 42 and the blue LED chip 43 is a bipolar LED chip is fixed by insulating adhesive pad region 311, the negative electrode and the green, blue LED chips 42, 43 and the pad regions 315 and 316 are electrically connection. 红色LED芯片41的正极与焊盘区312电连接,绿色LED芯片42的正极与焊盘区313电连接,蓝色LED芯片43的正极与焊盘区314电连接。 The positive electrode and the red LED chip 312 electrically connected to pad area 41, the positive electrode and the pad region 313 is electrically connected to the green LED chip 42, a pad region 314 and positive electrode of the blue LED chip 43 is connected. 当然,其他方式中,红色LED芯片42也可以是双极性LED芯片。 Of course, otherwise, the red LED chip 42 may be a bipolar LED chip.

[0031] 通过六个焊盘区311〜316,分别实现相应LED芯片与驱动电路连接,进而实现LED芯片的驱动。 [0031] By six pad region 311~316, respectively, to achieve respective LED chips are connected with the driving circuit, so as to realize the driving of an LED chip. 此外,本实施方式中,每个LED芯片的正负极各自连接不同的焊盘区,从而可单独控制每个LED芯片的电流,由此实现每个LED芯片的单独控制。 Further, in this embodiment, each LED chip is connected to the respective positive and negative regions of different pads, so that the current of each LED chip can be controlled separately, thereby enabling individual control of each LED chip.

[0032] 其中,本实施方式中,像素区域31之间的间距为0.8mm〜3.9mm,例如可以设置为0.8mm、l.1mm等。 [0032] wherein, in the present embodiment, the spacing between the pixel region 31 0.8mm~3.9mm, for example, can be set to 0.8mm, l.1mm like. 当然,利用本实施方式LED显示屏,通过将LED芯片直接封装在电路板上,还可以使得像素区域31之间的间距更小,例如为0.5mm的小间距。 Of course, the LED display of the present embodiment, by direct encapsulation of an LED chip on the circuit board, may also be such that the spacing between the pixel region 31 is smaller, for example, a small pitch of 0.5mm.

[0033] 其中,在本实用新型LED显示屏的实施方式中,像素区域31可以是在电路板平面上的一个区域,还可以是设置在电路板上的凹槽结构。 [0033] wherein, in an embodiment of the present invention, the LED display 31 may be a region of the pixel region on the circuit board plane, may also be provided in a groove configuration on the circuit board.

[0034] 如图4所示,像素区域31为设置在电路板I上的凹槽。 , The pixel region 31 is disposed in a recess on the circuit board I [0034] FIG 4. 以下为了便于说明,将凹槽的标记描述为31。 For convenience of description, the tag recess 31 as described. 凹槽31的形状可以是圆形、椭圆形、方形或多边形,或者其他任意形状。 The shape of the groove 31 may be circular, oval, square or polygonal or any other shape. 三色LED芯片4固定在凹槽31的底部。 Three-color LED chips 4 fixed to the bottom of the recess 31. 凹槽31内填充有透明的封装胶5,用于覆盖三色LED芯片4,并作为三色LED芯片4的光学透镜。 The groove 31 is filled with a transparent sealant 5 for covering the tri-color LED chips 4, and an optical lens 4 of the three-color LED chips.

[0035] 其中,封装胶5为环氧树脂,可以通过点胶方式将胶水点入凹槽31内以形成封装胶5.当然,还可以通过注塑(molding)工艺形成封装胶5。 [0035] wherein the epoxy resin sealant 5, by way of the glue dispensing point into the groove 31 to form a packaging adhesive 5. Of course, the sealant 5 may also be formed by injection molding (Molding) process.

[0036] 其中,封装胶5的外表面与凹槽31开口所在的平面齐平,或者,也可以是凸出于凹槽31开口所在的平面或低于凹槽31开口所在的平面。 [0036] wherein the planar outer surface of the recess 5 of the packaging adhesive 31 is located flush with the opening, or may be convex to the plane of the opening groove 31 is located below the plane or opening recess 31 is located.

[0037] 参阅图5,本实用新型LED芯片的又一实施方式中,像素区域61中的焊盘区的数量为四个,分别为611、612、613以及614。 [0037] Referring to Figure 5, still another embodiment of the present invention the LED chip, the number of pixels in the region of the pad region 61 is four, 611, 612 and 614 respectively. 其中,三色LED芯片7分别固定在焊盘区611中,并呈一字排列。 Wherein the three-color LED chips 7 are fixed in the pad region 611, and has a straight line arrangement. 其中,红色LED芯片71为单极性LED芯片,其通过导电性银胶固定在焊盘区611中,以实现其负极与焊盘区611的电连接。 Wherein the red LED chip 71 LED chip is unipolar, which glue in the pad region 611 via a conductive silver, for electrical connection to the negative electrode 611 of the pad area. 绿色、蓝色LED芯片72、73为双极性LED芯片,通过绝缘胶固定在焊盘区611中,且绿色LED芯片72的负极与焊盘区613电连接,蓝色LED芯片73与焊盘区614电连接。 Green, and blue LED chips 72, 73 is a bipolar LED chip is fixed by insulating adhesive pad region 611, and the green LED chip 72 is electrically connected to a negative electrode pad region 613, the blue LED chip 73 and the pad District 614 is electrically connected. 三个LED芯片71、72、73的正极均与焊盘区612电连接。 Three LED chips 71, the positive electrode are electrically connected to pad area 612.

[0038] LED芯片71〜73通过相应焊盘区611〜614与驱动电路连接,从而在驱动电路的作用下实现LED芯片的驱动。 [0038] LED chip 71~73 611~614 are connected by a respective pad region and the driving circuit, thereby achieving the driving of the LED chip by the driving circuit. 其中,与相应LED芯片的负极连接的焊盘区611、613、614,其所连接负载或参考电压不相同,以使得流过每个LED芯片的电流不相同,由此可实现每个LED芯片的单独控制,提高精度。 Wherein the respective LED chip pad region connected to the negative 611,613,614, the reference voltage or the load connected to it are not the same, so that the current flowing through each LED chip is not the same, whereby each LED chip can be achieved individual control, to improve the accuracy.

[0039] 以上所述仅为本实用新型的实施方式,并非因此限制本实用新型的专利范围,凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本实用新型的专利保护范围内。 [0039] The foregoing is only embodiments of the present invention, not intended to limit the patent scope of the present invention, all utilize the present invention disclosure and drawings taken equivalent structures or equivalent process, or directly or indirectly used in other technical fields shall fall within the scope of the novel utility patent protection.

Claims (10)

1.一种LED显示屏,其特征在于,包括电路板和多组三色LED芯片; 所述电路板上设置有多个像素区域,每组所述三色LED芯片封装于一个所述像素区域中,其中,每个所述像素区域内设置有至少三个焊盘区,所述三色LED芯片的相应电极分别与所述三个焊盘区电连接,实现至少两个所述LED芯片单独控制。 An LED display, characterized by comprising a circuit board and a plurality of sets of three-color LED chip; said circuit board is provided with a plurality of pixel regions, each of the three colors of LED chip packages to a region of the pixel in which there is provided in each of said pixel region at least three pad region, an electrode in the three-color LED chips are electrically connected with the three pads regions, implementing at least two of the individual LED chips control.
2.根据权利要求1所述的LED显示屏,其特征在于, 所述焊盘区的数量为六个,所述三色LED芯片固定于其中一个焊盘区中,且所述三色LED芯片中的一个LED芯片的负极与所述一个焊盘区电连接,另两个LED芯片的负极分别与其余五个焊盘区中的两个焊盘区电连接,所述三色LED芯片的正极分别与所述其余五个焊盘区中的剩余三个焊盘区电连接,以实现每个所述LED芯片的单独控制。 The LED display according to claim 1, wherein the number pad region is six, the three-color LED chip is fixed to one of the pad region, and the three-color LED chips a negative electrode of the LED chip in a pad region electrically connected to the negative electrode of the other two LED chips are electrically connected with two pad areas remaining five pad region, the positive three-color LED chips the remaining three pads are connected to the other five regions electrically pad region to achieve separate control of each of the LED chip.
3.根据权利要求2所述的LED显示屏,其特征在于, 所述三色LED芯片分别为显示红色、绿色、蓝色的LED芯片; 负极与所述一个焊盘区电连接的所述一个LED芯片为显示红色的单极性LED芯片,所述显示红色的单极性LED芯片通过银胶固定在所述一个焊盘区中,以实现其负极与所述一个焊盘区电连接; 所述另两个LED芯片分别为显示绿色和蓝色的双极性LED芯片,所述显示绿色和蓝色的双极性LED芯片通过绝缘胶固定在所述一个焊盘区中。 3. The LED display according to claim 2, wherein said three-color LED chips are red, green, and blue LED chips; a cathode connected to a pad region electrically to the one LED chips of red LED chip unipolar, unipolar the red LED chip is fixed to the silver paste through a pad region in order to achieve the negative electrode is electrically connected to a pad region; the the other of said two green LED chips are bipolar and blue LED chip, the green and blue LED chips through a bipolar fixed to the insulating adhesive in a pad region.
4.根据权利要求3所述的LED显示屏,其特征在于, 所述显示红色、绿色、蓝色的LED芯片沿第一方向排列固定于所述其中一个焊盘区中。 LED display according to claim 3, wherein the red, green, and blue LED chips are arranged along a first direction is fixed to one of said pad region.
5.根据权利要求1所述的LED显示屏,其特征在于, 所述焊盘区的数量为四个,所述三色LED芯片固定于其中一个焊盘区中,且所述三色LED芯片中的一个LED芯片的负极与所述一个焊盘区电连接,另两个LED芯片的负极分别与其余三个焊盘区中的两个焊盘区电连接,所述三色LED芯片的正极均与所述其余三个焊盘区中的剩余一个焊盘区电连接,其中,分别与所述三色LED芯片的负极电连接的三个焊盘区所连接的负载或参考电压不相同,以实现每个所述LED芯片单独控制。 LED display according to claim 1, wherein the number pad region is four, the three-color LED chip is fixed to one of the pad region, and the three-color LED chips a negative electrode of the LED chip in a pad region electrically connected to the negative electrode of the other two LED chips are electrically connected with two pad areas remaining three pad region, the positive three-color LED chips is electrically connected to a pad region of the remaining three pads remaining region, wherein the three load or reference voltage pad region electrically connected to the negative electrode of the three-color LED chip is connected is not the same, each of said LED chip to achieve a separately controlled.
6.根据权利要求1所述的LED显示屏,其特征在于, 所述像素区域之间的间距为0.8mm〜3.9mm。 6. The LED display according to claim 1, characterized in that the spacing between the pixel region 0.8mm~3.9mm.
7.根据权利要求1所述的LED显示屏,其特征在于, 所述像素区域为设置在所述电路板上的凹槽,所述凹槽内填充有封装胶以覆盖所述三色LED芯片。 LED display according to claim 1, wherein the pixel region is disposed in a recess on the circuit board, the inner groove is filled with a plastic package to cover the three-color LED chips .
8.根据权利要求7所述的LED显示屏,其特征在于, 所述封装胶的外表面与所述凹槽开口所在的平面齐平或凸出于所述凹槽开口所在的平面。 8. The LED display according to claim 7, wherein the plane of the packaging adhesive outer surface of the recess opening is located flush with or protrude from a plane where the groove opening.
9.根据权利要求1所述的LED显示屏,其特征在于, 所述三色LED芯片的相应电极分别通过金属导线或各向异性导电胶与所述三个焊盘区连接。 LED display according to claim 1, wherein an electrode in the three-color LED chips are connected by a metal wire or anisotropic conductive paste of the three pad region.
10.根据权利要求1所述的LED显示屏,其特征在于, 所述像素区域的形状为圆形、椭圆形或方形。 10. The LED display according to claim 1, wherein the shape of the pixel area is circular, oval or square.
CN201520032965.9U 2015-01-16 2015-01-16 LED (light emitting diode) display screen CN204496855U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels

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