CN202189783U - Lamp-driver combined cylindrical RGB full-color LED hybrid packaging structure - Google Patents
Lamp-driver combined cylindrical RGB full-color LED hybrid packaging structure Download PDFInfo
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- CN202189783U CN202189783U CN201120080400XU CN201120080400U CN202189783U CN 202189783 U CN202189783 U CN 202189783U CN 201120080400X U CN201120080400X U CN 201120080400XU CN 201120080400 U CN201120080400 U CN 201120080400U CN 202189783 U CN202189783 U CN 202189783U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model discloses a lamp-driver combined cylindrical RGB full-color LED hybrid packaging structure which includes an LED driving chip and LED lamp chips. The LED driving chip and the LED lamp chips are packaged in a cylindrical LED lamp post. Pins of the LED driving chip and/or the LED lamp chips are introduced out downward from the inside of the cylindrical LED lamp post. The lamp-driver combined cylindrical RGB full-color LED hybrid packaging structure can improve the system integrated level, and compared with a conventional product, the package reliability is high, the brightness is high, and the waterproof performance is excellent.
Description
Technical field
The utility model relates to the multicore sheet hybrid package structure of a kind of led chip and drive IC.
Background technology
At present,, remove white light LEDs and be used to illumination, field such as backlight widely, also will be approved by people in the requirements at the higher level field by the white light that RGB mixes along with LED is more and more used widely.With regard to RGB itself, be applied to decoration and realize that as pixel large scale display also more and more is widely used by it.
At present, no matter be used for showing or decorating that LED inevitably needs special-purpose drive IC; And existing drive pattern is that drive IC externally is connected after the individual packages respectively with LED again; Therefore drive IC has accounted for the very big proportion of complete machine cost, and adopts a large amount of drive IC that the weight of LED complete machine is increased greatly, and the installation of complete machine is brought very big inconvenience; And inevitably influence its reliability, also bring complexity for maintenance.
The utility model content
The utility model technical problem to be solved provides the column RGB all-colour LED hybrid package structure that a kind of lamp drives unification, and it can improve level of integrated system, with respect to existing product higher package reliability is arranged, higher brightness, better water resistance.
In order to solve above technical problem, the column RGB all-colour LED hybrid package structure that the utility model provides a kind of lamp to drive unification; Comprise: LED chip for driving and LED wick sheet; It is inner that said LED chip for driving and LED wick sheet are encapsulated in column LED lamppost.
The beneficial effect of the utility model is: can improve level of integrated system, with respect to existing product higher package reliability arranged, higher brightness, better water resistance.
Preferably, draw LED chip for driving and/or LED lamp pin of chip downwards from column LED lamppost inside.
Preferably, said LED wick sheet comprises red LED lamp chip, green LED lamp chip and blue led wick sheet; Said column shape can be circle, ellipse or rectangle.
Preferably, for two-wire transmission chip, it has 6 vertical pins of arranging, and wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the negative pole of RGB three LEDs chips respectively, and the positive pole of three LEDs chips and the vdd terminal of chip for driving all are connected the VDD pin; Input end of clock and data input pin are connected to CIN and DIN pin; Output terminal of clock and data output end are connected to Cout and Dout pin.
Preferably, for single line transmission chip, it has 4 vertical pins of arranging, and wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the negative pole of RGB three LEDs chips respectively, and the positive pole of three LEDs chips and the vdd terminal of chip for driving all are connected the VDD pin; Data input pin is connected the DIN pin; Data output end is connected the Dout pin.
Preferably, for two-wire transmission chip, it has 6 vertical pins of arranging, and wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the positive pole of RGB three LEDs chips respectively, and the ground end of the negative pole of three LEDs chips and chip for driving all is connected the ground pin; Input end of clock and data input pin are connected to CIN and DIN pin; Output terminal of clock and data output end are connected to Cout and Dout pin.
Preferably, for single line transmission chip, it has 4 vertical pins of arranging, and wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the positive pole of RGB three LEDs chips respectively, and the ground end of the negative pole of three LEDs chips and chip for driving all is connected the ground pin; Data input pin is connected the DIN pin; Data output end is connected the Dout pin.
Preferably, the powering mode of built-in driving IC chip is the constant current power supply, and built-in drive IC has temperature sensor and control module, can control the led chip temperature.
Preferably, built-in drive IC has the data cascade function, can realize whole piece series LED lamp is controlled after the data wire series connection with chip for driving, and single line or two-wire cascaded communication mode are adopted in said cascade.
Preferably, be used for LED display.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is done further explain.
Fig. 1 is the said two-wire LED of a utility model embodiment hybrid package structure front view;
Fig. 2 is the said two-wire LED of the utility model embodiment hybrid package structure 45 degree oblique views;
Fig. 3 is the said single line LED of a utility model embodiment hybrid package structure front view;
Fig. 4 is the said single line LED of the utility model embodiment hybrid package structure 45 degree oblique views;
Fig. 5 is the said double-wire signal control model of a utility model embodiment schematic diagram;
Fig. 6 is the said single-wire signal control model of a utility model embodiment schematic diagram;
Fig. 7 is the said two-wire LED of a utility model embodiment hybrid package connection layout;
Fig. 8 is the said single line LED of a utility model embodiment hybrid package connection layout;
Fig. 9 is the said control circuit cascade of a utility model embodiment sketch map.
Embodiment
The utility model provides a kind of inner structure of LED lamp pearl that three kinds of color led chips of RGB and chip for driving is encapsulated in simultaneously column.It improves level of integrated system, and driving unification LED product with respect to the lamp of paster hybrid package has higher package reliability, higher brightness, better water resistance.
Like Fig. 1, Fig. 2, shown in Figure 7, said LED wick sheet comprises red LED lamp chip 5, green LED lamp chip 3 and blue led wick sheet 4.Its structure that can adopt is to scribble insulating cement on every side at green LED lamp chip 3 and blue led wick sheet 4, scribbles conducting resinl on every side in red LED lamp chip 5 and chip for driving 6.The utility model is encapsulated in column LED lamppost 1 inside with RGB three-color LED chip and chip for driving 6; Adopt the framework 2 of the 6 vertical pins of arranging; Wherein two pin tops have two bigger Ji Dao to be used to load driving IC chip 6 and RGB three color chips, and said chip 6 is perpendicular to the pin one of drawing 0.Three outputs of chip for driving 6 link to each other with the negative pole of RGB three LEDs chips respectively, and the positive pole of three LEDs chips and the vdd terminal of chip for driving all are connected the VDD pin.For two-wire transmission chip, input end of clock and data input pin are connected to CIN and DIN pin.Output terminal of clock and data output end are connected to Cout and Dout pin.Add the VDD pin, the GND pin of chip has CIN, DIN, VDD, GND, COUT, DOUT, 6 pins.Among Fig. 7,7 is that conducting resinl, 8 is that insulating cement, 9 is conducting resinl.
Like Fig. 3, Fig. 4, shown in Figure 8, for single line transmission chip, there is not clock cable, have only data input pin and data output end to be connected to Din and Dout pin.Total VDD, GND, DIN, four pins of DOUT.
As other a kind of distortion, can three outputs of chip for driving 6 be linked to each other with the positive pole of RGB three LEDs chips respectively, the ground end of the negative pole of three LEDs chips and chip for driving all is connected the ground pin.
Like Fig. 5, shown in Figure 6, built-in drive IC makes the powering mode of DBLED or DBRGB become the constant current power supply by constant voltage, and the requirement reduction to operating voltage has wideer operating voltage range.Built-in drive IC has temperature control, can control the led chip temperature, and the look that reduces LED effectively declines, and prolongs led chip useful life.
As shown in Figure 9, built-in drive IC is designed with the data cascade function, can realize after the data wire series connection with DBLED or DBRGB the DBLED or the DBRGB of whole piece series connection are controlled.Every DBLED or DBRGB can be as picture elements, and realizing that image shows no longer needs independent drive IC, and single line or two-wire cascaded communication mode are adopted in cascade.
The utility model is not limited to the execution mode that preceding text are discussed.More than the description of embodiment is intended in order to describe and explain the technical scheme that the utility model relates to.Conspicuous conversion or the alternative protection range that also should be considered to fall into the utility model based on the utility model enlightenment.Above embodiment is used for disclosing the best implementation method of the utility model, so that those of ordinary skill in the art can use numerous embodiments of the utility model and the purpose that multiple alternative reaches the utility model.
Claims (10)
1. a lamp drives the column RGB all-colour LED hybrid package structure of unification; It is characterized in that, comprising: LED chip for driving and LED wick sheet;
It is inner that said LED chip for driving and LED wick sheet are encapsulated in column LED lamppost.
2. lamp as claimed in claim 1 drives the column RGB all-colour LED hybrid package structure of unification, it is characterized in that, draws LED chip for driving and/or LED lamp pin of chip downwards from column LED lamppost inside.
3. lamp as claimed in claim 1 drives the column RGB all-colour LED hybrid package structure of unification, it is characterized in that, said LED wick sheet comprises red LED lamp chip, green LED lamp chip and blue led wick sheet; Said column shape can be circle, ellipse or rectangle.
4. lamp as claimed in claim 3 drives the column RGB all-colour LED hybrid package structure of unification; It is characterized in that for two-wire transmission chip, it has 6 vertical pins of arranging; Wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the negative pole of RGB three LEDs chips respectively, and the positive pole of three LEDs chips and the vdd terminal of chip for driving all are connected the VDD pin; Input end of clock and data input pin are connected to CIN and DIN pin; Output terminal of clock and data output end are connected to Cout and Dout pin.
5. lamp as claimed in claim 3 drives the column RGB all-colour LED hybrid package structure of unification; It is characterized in that for single line transmission chip, it has 4 vertical pins of arranging; Wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the negative pole of RGB three LEDs chips respectively, and the positive pole of three LEDs chips and the vdd terminal of chip for driving all are connected the VDD pin; Data input pin is connected the DIN pin; Data output end is connected the Dout pin.
6. lamp as claimed in claim 3 drives the column RGB all-colour LED hybrid package structure of unification; It is characterized in that for two-wire transmission chip, it has 6 vertical pins of arranging; Wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the positive pole of RGB three LEDs chips respectively, and the ground end of the negative pole of three LEDs chips and chip for driving all is connected the ground pin; Input end of clock and data input pin are connected to CIN and DIN pin; Output terminal of clock and data output end are connected to Cout and Dout pin.
7. lamp as claimed in claim 3 drives the column RGB all-colour LED hybrid package structure of unification; It is characterized in that for single line transmission chip, it has 4 vertical pins of arranging; Wherein the pin top is used to load driving IC chip and RGB three color chips, and said chip is perpendicular to the pin of drawing; Three outputs of chip for driving link to each other with the positive pole of RGB three LEDs chips respectively, and the ground end of the negative pole of three LEDs chips and chip for driving all is connected the ground pin; Data input pin is connected the DIN pin; Data output end is connected the Dout pin.
8. drive the column RGB all-colour LED hybrid package structure of unification like claim 4 or 5 or 6 or 7 described lamps; It is characterized in that; The powering mode of built-in driving IC chip is the constant current power supply, and built-in drive IC has temperature sensor and control module, can control the led chip temperature.
9. drive the column RGB all-colour LED hybrid package structure of unification like claim 4 or 5 or 6 or 7 described lamps; It is characterized in that; Built-in drive IC has the data cascade function; Can realize whole piece series LED lamp is controlled after the data wire series connection with chip for driving, single line or two-wire cascaded communication mode are adopted in said cascade.
10. a lamp drives the column RGB all-colour LED hybrid package structure of unification; It is characterized in that, be used for LED display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120080400XU CN202189783U (en) | 2011-03-24 | 2011-03-24 | Lamp-driver combined cylindrical RGB full-color LED hybrid packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120080400XU CN202189783U (en) | 2011-03-24 | 2011-03-24 | Lamp-driver combined cylindrical RGB full-color LED hybrid packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202189783U true CN202189783U (en) | 2012-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120080400XU Expired - Lifetime CN202189783U (en) | 2011-03-24 | 2011-03-24 | Lamp-driver combined cylindrical RGB full-color LED hybrid packaging structure |
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| Country | Link |
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| CN (1) | CN202189783U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2497183A (en) * | 2011-11-29 | 2013-06-05 | Ibm | Light emitting diode (LED) with three active regions and intensity control unit |
| CN110415641A (en) * | 2019-08-26 | 2019-11-05 | 深圳市好的照明有限公司 | A kind of two-wire cascade LED drive circuit |
-
2011
- 2011-03-24 CN CN201120080400XU patent/CN202189783U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2497183A (en) * | 2011-11-29 | 2013-06-05 | Ibm | Light emitting diode (LED) with three active regions and intensity control unit |
| CN110415641A (en) * | 2019-08-26 | 2019-11-05 | 深圳市好的照明有限公司 | A kind of two-wire cascade LED drive circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120411 |