CN205177836U - High stable high -voltage ceramic COB LED - Google Patents
High stable high -voltage ceramic COB LED Download PDFInfo
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- CN205177836U CN205177836U CN201520951545.0U CN201520951545U CN205177836U CN 205177836 U CN205177836 U CN 205177836U CN 201520951545 U CN201520951545 U CN 201520951545U CN 205177836 U CN205177836 U CN 205177836U
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- led chip
- ceramic substrate
- box dam
- cobled
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Abstract
The utility model discloses a high stable high -voltage ceramic COB LED, including ceramic substrate, last positive bonding pad, negative electrode bonding pad, the solid crystalline region of a plurality of and a plurality of resistance pad of being equipped with of ceramic substrate, every sets up a LED chip in consolidating the crystalline region, and the positive pole of LED chip is connected to positive bonding pad, and the negative pole of LED chip is connected to negative electrode bonding pad, two pins of resistance weld respectively on adjacent two resistance pads, and each LED chip is a parallelly connected resistance all.
Description
Technical field
The utility model relates to LED and manufactures field, specifically a kind of ceramic COBLED with high stable high pressure.
Background technology
LED is called as forth generation light source, there are energy-saving and environmental protection, safety, life-span length, low-power consumption, low-heat, high brightness, waterproof, miniature, shockproof, easy light modulation, light beam are concentrated, the feature such as easy maintenance, can be widely used in the fields such as various instruction, display, decoration, backlight, general lighting.Along with the continuation of industry develops, the leap of technology breaks through, and wideling popularize of application, the light efficiency of LED is also improving constantly, and price constantly drops.The appearance of new composite type tube core, also allows the power of single led pipe (module) improve constantly.By the continuous effort research and development of the same trade, the breakthrough of novel optical design, the exploitation of new lamp kind, the situation that product is single is also expected in further torsion.The improvement of control software design, also makes LED illumination use more convenient.These changes progressively, have all embodied LED light-emitting diode having a extensive future in illumination application.
LED chip encapsulation technology mainly contains two kinds of forms: a kind of COB technology (chipOnboard, chip on board encapsulates), another kind is flip chip technology (FlipChip).Wherein, COB technology, adheres to bare chip conduction or non-conductive adhesive or is mounted on interconnect substrates exactly, then carries out wire bonding and realizes its electrical connection, and cover to guarantee reliability with resin.But existing COB technology also exists polycrystalline series connection appearance lamp pearl and not work the phenomenon that the whole lamp pearl of impact do not work, like this, LED can only do parallel connection or series connection adds parallel connection.
Existing LED connects that to add parallel connection be master, and voltage can not be done height, because if do high-tension product, the chips in product goes wrong and will cause whole product subscription rate, and LED cost is uprised.
Utility model content
Therefore, for above-mentioned problem, the utility model proposes a kind of high stable higfh-tension ceramics COBLED, adopt ceramic COB, realize the use that a lamp does not badly affect its whole lamp, solve current LED and make high-voltage product easily dead lamp, the problems such as subscription rate rate is high.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopts is, a kind of high stable higfh-tension ceramics COBLED, comprise ceramic substrate, ceramic substrate is provided with positive terminal pad, negative terminal pad, several crystal bonding areas and several resistance pads, arrange a LED chip in each crystal bonding area, the positive pole of LED chip is connected to positive terminal pad, and the negative pole of LED chip is connected to negative terminal pad; Two pins of resistance are welded on adjacent two resistance pads respectively, each LED chip resistance all in parallel.
Further, described ceramic substrate is also provided with box dam glue groove, fill box dam glue in box dam glue groove and form box dam Jiao Qu, this box dam Jiao Qu surrounds all crystal bonding areas and arranges; Encapsulation glue is filled in box dam glue district.
Further, described crystal bonding area is arranged in circular array according to the mode that circle is symmetrical, and also namely LED chip is arranged as circular array form.
Further, described box dam Jiao Qu cross section is circular, its be with the center of circle of this crystal bonding area be the center of circle, radius is greater than the radius of crystal bonding area and the circle that formed.
Further, described LED chip is mounted in crystal bonding area by die bond glue.Further, the positive pole of LED chip is connected to positive terminal pad by the gold thread of 99.99% purity, and the negative pole of LED chip is connected to negative terminal pad by the gold thread of 99.99% purity.
Further, described ceramic substrate specifically 96% aluminium oxide ceramic substrate.Described LED chip can be blue chip.
Pass through such scheme, the utility model selects 96% aluminium oxide ceramic substrate, then loop line figure is made at this ceramic base plate surface, a resistance in parallel on each LED chip, increase the stability of LED chip, make product not easily dead lamp, improve the efficiency of LED chip simultaneously, prevent LED from occurring the phenomenon do not worked.First, select 96% aluminium oxide ceramic substrate, because ceramic substrate has excellent insulating properties and stability, therefore can do high voltage product, and can Safety Approval be crossed.Secondly, by between every chips and a resistance, make LED there will not be dead lamp phenomenon, solve the deficiency of prior art.Finally, the utility model is through test, and it is high that it has light efficiency, and not easily the good advantage of dead lamp, greatly reduces the use cost of client.The utility model is skillfully constructed, and structure is simple, is easy to industrialization and produces, have good practicality.
Accompanying drawing explanation
1. Fig. 1 is the structural representation of the utility model patent;
2. Fig. 2 is Fig. 1 cut-away view;
3. Fig. 3 is the circuit theory diagrams of the utility model patent.
Embodiment
Now with embodiment, the utility model is further illustrated by reference to the accompanying drawings.
The utility model realizes the ceramic COB area light source LED of a high pressure, high efficiency, high stable, is made up of 96% aluminium oxide ceramic substrate, LED chip and resistance.First make loop line figure on ceramic substrate (such as 96% aluminium oxide ceramic substrate) surface, on each LED chip, a resistance in parallel, increases the stability of LED chip, makes the not dead lamp of product.The utility model breaks through the bottleneck of ceramic COB, solves the problem that a lamp does not badly affect the use of its whole lamp, reduces client's use cost.
Concrete, as a specific embodiment, see Fig. 1 and Fig. 2, the title representated by each label in diagram is as follows: 1: die bond glue, 2:LED chip, 3: gold thread, 4: encapsulation glue, 5: box dam Jiao Qu, 6: resistance pad, 7: ceramic substrate, 8: resistance.
See Fig. 1 and Fig. 2, a kind of high stable higfh-tension ceramics COBLED, comprise ceramic substrate 7, ceramic substrate 7 is provided with positive terminal pad V+, negative terminal pad V-, several crystal bonding areas and several resistance pads 6, arrange a LED chip 2 in each crystal bonding area, LED chip 2 is mounted in crystal bonding area by die bond glue 1.The positive pole of LED chip 2 is connected to positive terminal pad V+ by the gold thread 3 of 99.99% purity, and the negative pole of LED chip 2 is connected to negative terminal pad V-by the gold thread 3 of 99.99% purity.Two pins of resistance 8 are welded on adjacent two resistance pads 6 respectively, each LED chip 2 resistance 8 all in parallel.
Crystal bonding area is arranged in circular array according to the mode that circle is symmetrical, and also namely LED chip 2 is arranged as circular array form.Ceramic substrate 7 is also provided with box dam glue groove, fill box dam glue in box dam glue groove and form box dam glue district 5, this box dam glue district 5 surrounds all crystal bonding areas and arranges; Encapsulation glue is filled in box dam glue district 5.Cross section, box dam glue district 5 is circular, its be with the center of circle of this crystal bonding area be the center of circle, radius is greater than the radius of crystal bonding area and the circle that formed.
In the present embodiment, for reaching a good effect, ceramic substrate 7 specifically 96% aluminium oxide ceramic substrate realizes, and LED chip 2 adopts blue chip to realize, and can certainly be other color chips composition.
Fig. 3 is the circuit theory diagrams of the utility model patent, as seen from the figure, each LED chip resistance all in parallel, like this, it no matter is in parallel or connection in series-parallel combination, single LEDs chip does not work and can not affect other lamp pearls, thus it is bad and affect the use of its whole lamp to avoid a lamp, solves current LED and does high-voltage product easily dead lamp, problem that subscription rate rate is high.
The utility model realizes a kind of high pressure, high efficiency, high stable pottery COB area light source LED, as a concrete example, see Fig. 1, the specification of the present embodiment is Ф 76*1.0, V+ in Fig. 1 is positive terminal pad of the present utility model, V-is negative terminal pad of the present utility model, make the processes such as LED of the present utility model as follows: first: make 96% aluminium oxide ceramic substrate, then, the mode symmetrical according to circle arranges crystal bonding area, die bond glue 1 in Fig. 1 is dropped on the corresponding crystal bonding area of ceramic substrate 7, again LED chip 2 is put on die bond glue 1 and dries, then LED chip 2 is fixed on 7 ceramic substrates 7, and LED chip 2 is arranged in circular array according to the mode that circle is symmetrical.Secondly: connect LED chip 2 with the gold thread 3 of 99.99% purity, itself and substrate pads (V+ and V-) are energized, a circle (this circle surrounds the circular array that LED chip is arranged in) is surrounded again with box dam glue district 5, dripped to by the encapsulation glue 4 of mixed fluorescent material in this circle, like this, the encapsulation glue of liquid condition is when ceramic substrate keeps flat, encapsulation glue can not outwards flow out, then will encapsulate drying adhesive, be again welded on 6 resistance pads 6 by 8 resistance, whole product completes.
The utility model selects 96% aluminium oxide ceramic substrate 7 to do loop line, because ceramic substrate 7 has excellent insulating properties and stability, therefore can do high voltage product, and can cross Safety Approval.A resistance in parallel between every chips, make LED there will not be dead lamp phenomenon, this product light efficiency is high, and not dead lamp, greatly reduces the use cost of client.
Although specifically show in conjunction with preferred embodiment and describe the utility model; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.
Claims (7)
1. a high stable higfh-tension ceramics COBLED, it is characterized in that: comprise ceramic substrate, ceramic substrate is provided with positive terminal pad, negative terminal pad, several crystal bonding areas and several resistance pads, one LED chip is set in each crystal bonding area, the positive pole of LED chip is connected to positive terminal pad, and the negative pole of LED chip is connected to negative terminal pad; Two pins of resistance are welded on adjacent two resistance pads respectively, each LED chip resistance all in parallel.
2. high stable higfh-tension ceramics COBLED according to claim 1, is characterized in that: described ceramic substrate is also provided with box dam glue groove, and fill box dam glue in box dam glue groove and form box dam Jiao Qu, this box dam Jiao Qu surrounds all crystal bonding areas and arranges; Encapsulation glue is filled in box dam glue district.
3. high stable higfh-tension ceramics COBLED according to claim 1 and 2, is characterized in that: described crystal bonding area is arranged in circular array according to the mode that circle is symmetrical.
4. high stable higfh-tension ceramics COBLED according to claim 3, is characterized in that: described box dam Jiao Qu cross section for circular, its be with the center of circle of this crystal bonding area be the center of circle, radius is greater than the radius of crystal bonding area and the circle that formed.
5. high stable higfh-tension ceramics COBLED according to claim 1, is characterized in that: described LED chip is mounted in crystal bonding area by die bond glue.
6. high stable higfh-tension ceramics COBLED according to claim 1, it is characterized in that: the positive pole of LED chip is connected to positive terminal pad by the gold thread of 99.99% purity, the negative pole of LED chip is connected to negative terminal pad by the gold thread of 99.99% purity.
7. high stable higfh-tension ceramics COBLED according to claim 1, is characterized in that: described ceramic substrate is 96% aluminium oxide ceramic substrate specifically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520951545.0U CN205177836U (en) | 2015-11-24 | 2015-11-24 | High stable high -voltage ceramic COB LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520951545.0U CN205177836U (en) | 2015-11-24 | 2015-11-24 | High stable high -voltage ceramic COB LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205177836U true CN205177836U (en) | 2016-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520951545.0U Expired - Fee Related CN205177836U (en) | 2015-11-24 | 2015-11-24 | High stable high -voltage ceramic COB LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205177836U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310261A (en) * | 2019-07-31 | 2021-02-02 | 立诚光电股份有限公司 | Ceramic substrate structure and process for optical device |
-
2015
- 2015-11-24 CN CN201520951545.0U patent/CN205177836U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310261A (en) * | 2019-07-31 | 2021-02-02 | 立诚光电股份有限公司 | Ceramic substrate structure and process for optical device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20171124 |