CN106531731A - Stentless LED packaging structure and manufacturing method thereof - Google Patents
Stentless LED packaging structure and manufacturing method thereof Download PDFInfo
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- CN106531731A CN106531731A CN201611114723.XA CN201611114723A CN106531731A CN 106531731 A CN106531731 A CN 106531731A CN 201611114723 A CN201611114723 A CN 201611114723A CN 106531731 A CN106531731 A CN 106531731A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses a stentless LED packaging structure and a manufacturing method thereof, and relates to the manufacturing of an LED light string. The LED light string is formed by serially connecting a plurality of LED chips with each other, the LED chips are flip chips, a positive electrode and a negative electrode are arranged at the bottom of each LED chip, the LED light string comprises one or more than one group of luminous combinations, each group of luminous combinations comprises two rows of LED chips, the first row of LED chips consists of a plurality of LED chips through uniformly-spaced linear arrangement, and the first row of LED chips is covered with a first fluorescent adhesive layer; the second row of LED chips consists of a plurality of LED chips through uniformly-spaced linear arrangement, the first LED chips and the second LED chips are arranged in a staggered manner, and the bottom surfaces of the first LED chips are opposite to the bottom surfaces of the second LED chips; the electrodes of the first LED chips and the second LED chips which are arranged in the staggered manner are adhered to each other to form electrical connection, the polarities of the two electrodes with electrical connection are opposite, and the second row of LED chips is covered with a second fluorescent adhesive layer. The stentless LED packaging structure is simple in structure, simple in manufacturing technology and good in light outgoing effect.
Description
Technical field
The present invention relates to LED encapsulation structure, especially one kind is without bracket LED encapsulating structure and its manufacture method.
Background technology
The luminous needs of LED filament are all-round luminous, and existing LED filament is usually the two sides patch LED chip in substrate, so
Cover fluorescent glue afterwards again outside LED chip, common substrate can be in the light, and the light extraction efficiency of this kind of filament is low.In order to solve base
The problem that plate is in the light, also has and makes filament using transparency carrier, and the LED chip bottom of transparency carrier both sides goes out light and can wear
Transparency carrier is crossed, light efficiency is improved to a certain extent, but this kind of transparency carrier high cost, while easily from two side leakage of transparency carrier
Blue light, causes out light uneven.In order to solve impact of the substrate to filament, there is one kind without support filament in existing market, as in
State's patent, one kind of Publication No. 105140381 is without substrate LED filaments and preparation method and without substrate LED filament lamp, the lamp
Silk include at least a string LED chips that are identical or differing illuminant color, electric lead-out wire, between chip and chip with electricity lead-out wire it
Between electric connection line；On the welding ends of chip, electric connection line and electric lead-out wire, the first luminous bisque of coating, is constituted initially without substrate
LED filaments；The initial another side without substrate LED filament is coated with the second luminous bisque and makes without substrate LED filaments；Without base
Plate LED filament can be adhesive on transparent high thermal conductivity tube outer surface with transparent adhesive tape or luminescent powder, constitute cylindricality without substrate LED
Mercerising source, for manufacturing great power LED filament lamp.This kind of filament removes substrate, improves the light efficiency and uniform in light emission of filament
Problem；But the manufacture process of the filament is more complicated, connected by gold thread between adjacent chips, when filament bends, gold thread is easy
Disconnect, affect the life-span of filament；In addition, filament is only simultaneously provided with LED chip, its light-out effect is poor.
The content of the invention
The technical problem to be solved is to provide one kind without bracket LED encapsulating structure and its manufacture method, structure
Simply, manufacturing process is simple, and light extraction efficiency is high, connects without the need for gold thread, can effectively improve the reliability of electric connection.
To solve one of above-mentioned technical problem, technical scheme it is：It is a kind of without bracket LED encapsulating structure, including
LED string and the fluorescent adhesive layer being covered in outside LED string, the LED string are serially connected by some LED chips and are formed；It is described
LED chip is flip-chip, and the bottom of LED chip is provided with anelectrode and negative electrode, and LED string includes more than one group luminous group
Close, the luminescent composition includes two row's LED chips, and first row LED is made up of the equidistant linear array of some first LED chips,
Second row LED is made up of the equidistant linear array of some second LED chips, and the first LED chip is set with the dislocation of the second LED chip
Put, the first LED chip is relative with the bottom surface of the second LED chip；Form the first LED chip of dislocation and the electricity of the second LED chip
It is extremely bonded to each other to be electrically connected, and the opposite polarity of two electrodes being electrically connected.Two row's LED chips are serially connected
Lamp string is formed, the lamp string can be used as filament use with the encapsulating structure being combined into fluorescent glue；Due to two masks of lamp string
LED chip is provided with, so its light-emitting area can reach 360 °, light-out effect is good；The direct company of laminating of the electrode of adjacent LED chip
Connect, connect without the need for line gold thread, the better reliability of electric connection, the service life of lamp string are longer；Due to adjacent LED chip electrode
It is connected with each other, that is to say, that the luminous site between single led chip bottom and two electrodes is not blocked, the part goes out
Light is utilized effectively, and improves light extraction efficiency.
As improvement, the quantity of the first row LED chip than second row LED chip quantity more than one.
Used as improvement, the electrode of the first LED chip in first row LED chip positioned at two ends is connected with external electrode.
Used as improvement, the spacing between the anelectrode and negative electrode of first LED chip is equal to adjacent first LED chip
Between spacing；Spacing between the anelectrode and negative electrode of second LED chip is equal between adjacent second LED chip
Spacing.
Used as improvement, in bar shape, the LED string is arranged on the centre position of fluorescent adhesive layer to the fluorescent adhesive layer.
Used as improvement, the surface of the fluorescent adhesive layer is coated with transparent compound protective layer.Protective layer can protect fluorescent adhesive layer,
Make lamp string bulk strength more preferable, it is not easy to bend；Protective layer may also operate as the effect of waterproof antioxidative, extend the use of LED
Life-span.
Used as improvement, the transparent compound protective layer is layer of silica gel or nano-material coating.
To solve above-mentioned technical problem, another technical scheme of the invention is：It is a kind of without bracket LED manufacture method, including with
Lower step：
（1）The solid first row LED chip in high temperature membrane, first row LED chip by some first LED chips, equally arrange by straight line
Row, the first LED chip are flip-chip；
（2）Framework is covered on outside first row LED chip, framework surrounds accommodating cavity with high temperature membrane, in containing cavity body fills fluorescence
Glue, forms the first fluorescent adhesive layer after solidification, the electrode of the first LED chip is exposed at outside the first fluorescent adhesive layer；
（3）Releasing high temperature films；
（4）First LED chip is inverted, the electrode of the first LED chip is upward；
（5）First row LED chip opposite side arranges second row LED chip, and second row LED chip is by some second LED chips
Equally linear array, the second LED chip are flip-chip, and the first LED chip is in shift to install with the second LED chip, shape
It is electrically connected into the first LED chip for misplacing is bonded to each other with the electrode of the second LED chip, and two for being electrically connected
The opposite polarity of individual electrode, is made first row LED chip be formed with second row LED chip and is connected；
（6）In second row LED chip the second fluorescent adhesive layer of outer covering, the first fluorescent adhesive layer combines to form glimmering with the second fluorescent adhesive layer
First row LED chip and second row LED chip are simultaneously wrapped up by light glue-line.
As improvement, in fluorescent adhesive layer outer covering layer of transparent protective layer.
Fused by eutectic as between the electrode of improvement, the first LED chip and the second LED chip.
The beneficial effect brought compared with prior art of the present invention is：
（1）LED chip is provided with as two faces of lamp string have, so its light-emitting area can reach 360 °, light-out effect is good；
（2）The electrode of adjacent LED chip is directly fitted and connected, and connects without the need for line gold thread, the better reliability of electric connection, lamp string
Service life it is longer；
（3）As adjacent LED chip electrode is connected with each other, that is to say, that luminous between single led chip bottom and two electrodes
Position is not blocked, and the light that goes out of the part is utilized effectively, and improves light extraction efficiency；
（4）Fused by common eutectic between the electrode of adjacent LED chip, operated simpler；Fluorescent glue is by one
Form, manufacturing cycle are short.
Description of the drawings
Fig. 1 is without bracket LED encapsulating structure longitudinal sectional view.
Fig. 2 is without bracket LED encapsulating structure transverse sectional view.
Fig. 3 is the first LED chip and the second LED chip schematic diagram in succession.
Fig. 4 is fixed on the schematic diagram in high temperature membrane for first row LED.
Fig. 5 is the schematic diagram that the first fluorescent adhesive layer is covered on first row LED.
Fig. 6 second rows LED and the schematic diagram of first row LED para-positions.
Specific embodiment
With reference to Figure of description, the invention will be further described.
As shown in figure 1, one kind is without bracket LED encapsulating structure, the LED encapsulation structure is strip, can be used as filament use.
Include LED string and the fluorescent adhesive layer 3 being covered in outside LED string without bracket LED encapsulating structure.Draw at the two ends of fluorescent adhesive layer 3
Go out connection electrode 4, connection electrode 4 is connected to the input and outfan of LED string, and the connection electrode 4 at two ends is accessed
Power supply can drive LED string to light, and its profile and using method are identical with common filament.The present invention improves LED string
Structure, so as to improve whole LED filament light extraction efficiency, brightness and Simplified flowsheet.
As shown in Figure 1, 2, the LED string is serially connected by some LED chips and is formed, and the LED chip is upside-down mounting core
Piece, the bottom of LED chip are provided with anelectrode and negative electrode.The LED string includes more than one group luminescent composition, described luminous group
Conjunction includes two rows LED chip setting up and down, and first row LED 1 is made up of 11 equidistant linear array of some first LED chips,
First LED chip 11 is positive to place, and the electrode 111 of its bottom is down；The second row LED 2 is by some second LED chips 21
Equidistantly linear array is constituted, and the second LED chip 21 is in upside down, and the electrode 211 of its bottom is upward；First LED chip 11
Shift to install with the second LED chip 21, the first LED chip 11 is relative with the bottom surface of the second LED chip 21, make an adjacent LED
Chip 11 is just aligned with the electrode of the second LED chip 21；Form first LED chip 11 and the second LED chip 21 of dislocation
Electrode is bonded to each other to be electrically connected, and the opposite polarity of two electrodes being electrically connected, thus can be by first
Row's 1 chips of LED are got up with 2 chip-in series of second row LED.The quantity of 1 chips of first row LED is than 2 cores of second row LED
The quantity of piece is more one, so first LED chip 11 at a first row two ends electrode outwardly is vacant, the two electrodes
Opposite polarity；Connect the connection electrode of forward direction on the vacant anelectrode of the first LED chip 11, it is empty in the first LED chip 11
Connect the connection electrode of negative sense on remaining negative electrode.Spacing between the anelectrode and negative electrode of first LED chip 11 etc.
Spacing between adjacent first LED chip 11；Spacing between the anelectrode and negative electrode of second LED chip 21 is equal to
Spacing between adjacent second LED chip 21；After the electrode connection of 11 the second LED chip of figure 21 of the first LED chip, a LED
The light-emitting zone 212 in the middle of light-emitting zone 112 and the second LED chip bottom in the middle of chip bottom will not be stopped, be passed through
Spacing between same row's adjacent LED chip goes out light.
As shown in Fig. 2 the fluorescent adhesive layer 3 is in bar shape, the end face of fluorescent adhesive layer 3 can be circular, square, five sides
Shape, hexagon etc.；The LED string is arranged on the centre position of fluorescent adhesive layer, makes LED string going out to all the winds just equal
Even.The surface of the fluorescent adhesive layer 3 is coated with transparent compound protective layer 5, and clear layer will not be in the light, and protective layer can protect fluorescence
Glue-line, makes lamp string bulk strength more preferable, it is not easy to bend, and protective layer may also operate as the effect of waterproof antioxidative, extend LED's
Service life.The transparent compound protective layer 5 is layer of silica gel or nano-material coating.
Manufacture method without bracket LED encapsulating structure of the invention, comprises the following steps：
（1）As shown in figure 4, consolidating 1 chips of first row LED in high temperature membrane, 1 chips of first row LED are by some first LED chips
11 equally linear array, the first LED chip 11 is flip-chip, and the electrode paste of the first LED chip 11 is in high temperature membrane 7；
（2）As shown in figure 5, framework is covered on outside 1 chips of first row LED, framework 8 surrounds accommodating cavity with high temperature membrane 7, is holding
Put, after solidification, form the first fluorescent adhesive layer 31, the luminous component of the first LED chip 11 is covered by fluorescent glue
Lid, the electrode of the first LED chip 11 are exposed at outside the first fluorescent adhesive layer 31；
（3）Releasing high temperature films 7；
（4）First LED chip 11 is inverted, the electrode of the first LED chip 11 is upward；
（5）As shown in fig. 6,1 chip opposite sides of first row LED arrange 2 chip of second row LED, 2 chips of second row LED by
The equally linear array of some second LED chips 21, the second LED chip 21 is flip-chip, the first LED chip 11 and second
LED chip 21 forms the electrode formation bonded to each other of first LED chip 11 and the second LED chip 21 of dislocation in shifting to install
It is electrically connected with, and the opposite polarity of two electrodes being electrically connected, make 1 chips of first row LED and 2 cores of second row LED
Piece forms series connection；Fused by eutectic between the electrode of the first LED chip 11 and the second LED chip 21, eutectic fusion definition：
At relatively low temperature there is the fusion of eutectic thing in eutectic solder, and the technique is the die bond technique of common LED chip, using
There is equipment to be capable of achieving, it is simple to operate；
（6）In 2 the second fluorescent adhesive layers of chip outer covering of second row LED, the second fluorescent adhesive layer can be by model and perfusion solidification
Molding；First fluorescent adhesive layer 31 and the second fluorescent adhesive layer combine to form fluorescent adhesive layer and by 1 chips of first row LED and second row
2 chips of LED are wrapped up；
（7）In fluorescent adhesive layer outer covering layer of transparent protective layer；The protective clear layer can be by the surface of fluorescent adhesive layer
Brush silica gel is formed, or deposits one layer of nano paint layer on fluorescent adhesive layer surface；The formation process of nano paint layer：Parylene powder
By after distilling, being cracked into monomer xylol steam, in fluorescent adhesive layer surface formation of deposits.Silica gel as protective clear layer,
Intensity can be increased；Nano paint layer plays waterproof and anti-oxidation effect as protective clear layer.
Two row's LED chips are serially connected to form lamp string, and the lamp string is can be used as with the encapsulating structure being combined into fluorescent glue
Filament is used；LED chip is provided with as two faces of lamp string have, so its light-emitting area can reach 360 °；Adjacent LED chip
Electrode be directly fitted and connected, without the need for line gold thread connect, the better reliability of electric connection, the service life of lamp string are longer；By
It is connected with each other in adjacent LED chip electrode, that is to say, that the luminous site between single led chip bottom and two electrodes is that do not have
Block, the light that goes out of the part is utilized effectively, improve light extraction efficiency.
Claims (10)
1. one kind is without bracket LED encapsulating structure, including LED string and the fluorescent adhesive layer being covered in outside LED string, the LED
String is serially connected by some LED chips and is formed；It is characterized in that：The LED chip is flip-chip, and the bottom of LED chip sets
There are anelectrode and a negative electrode, LED string includes more than one group luminescent composition, the luminescent composition includes two row's LED chips, first
Row LED is made up of the equidistant linear array of some first LED chips, and second row LED is by the equidistant straight line of some second LED chips
Rearrange, the first LED chip is shifted to install with the second LED chip, the first LED chip is relative with the bottom surface of the second LED chip；
First LED chip of formation dislocation is bonded to each other with the electrode of the second LED chip to be electrically connected, and be electrically connected
The opposite polarity of two electrodes.
2. one kind according to claim 1 is without bracket LED encapsulating structure, it is characterised in that：The first row LED chip
Quantity than second row LED chip quantity more than one.
3. one kind according to claim 2 is without bracket LED encapsulating structure, it is characterised in that：It is located in first row LED chip
The electrode of first LED chip at two ends is connected with external electrode.
4. one kind according to claim 1 is without bracket LED encapsulating structure, it is characterised in that：First LED chip is just
Spacing between electrode and negative electrode is equal to the spacing between adjacent first LED chip；The anelectrode of second LED chip with
Spacing between negative electrode is equal to the spacing between adjacent second LED chip.
5. one kind according to claim 1 is without bracket LED encapsulating structure, it is characterised in that：The fluorescent adhesive layer is in cylinder
Shape, the LED string are arranged on the centre position of fluorescent adhesive layer.
6. one kind according to claim 1 is without bracket LED encapsulating structure, it is characterised in that：The surface of the fluorescent adhesive layer
It is coated with transparent compound protective layer.
7. one kind according to claim 6 is without bracket LED encapsulating structure, it is characterised in that：The transparent compound protective layer is
Layer of silica gel or nano-material coating.
8. one kind is without bracket LED manufacture method, it is characterised in that：Comprise the following steps：
（1）The solid first row LED chip in high temperature membrane, first row LED chip by some first LED chips, equally arrange by straight line
Row, the first LED chip are flip-chip；
（2）Framework is covered on outside first row LED chip, framework surrounds accommodating cavity with high temperature membrane, in containing cavity body fills fluorescence
Glue, forms the first fluorescent adhesive layer after solidification, the electrode of the first LED chip is exposed at outside the first fluorescent adhesive layer；
（3）Releasing high temperature films；
（4）First LED chip is inverted, the electrode of the first LED chip is upward；
（5）First row LED chip opposite side arranges second row LED chip, and second row LED chip is by some second LED chips
Equally linear array, the second LED chip are flip-chip, and the first LED chip is in shift to install with the second LED chip, shape
It is electrically connected into the first LED chip for misplacing is bonded to each other with the electrode of the second LED chip, and two for being electrically connected
The opposite polarity of individual electrode, is made first row LED chip be formed with second row LED chip and is connected；
（6）In second row LED chip the second fluorescent adhesive layer of outer covering, the first fluorescent adhesive layer combines to form glimmering with the second fluorescent adhesive layer
First row LED chip and second row LED chip are simultaneously wrapped up by light glue-line.
9. one kind according to claim 8 is without bracket LED manufacture method, it is characterised in that：In fluorescent adhesive layer outer covering one
Layer protective clear layer.
10. one kind according to claim 8 is without bracket LED manufacture method, it is characterised in that：First LED chip and second
Fused by eutectic between the electrode of LED chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611114723.XA CN106531731A (en) | 2016-12-07 | 2016-12-07 | Stentless LED packaging structure and manufacturing method thereof |
| PCT/CN2017/114531 WO2018103614A1 (en) | 2016-12-07 | 2017-12-05 | Non-bracket led encapsulation structure and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611114723.XA CN106531731A (en) | 2016-12-07 | 2016-12-07 | Stentless LED packaging structure and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106531731A true CN106531731A (en) | 2017-03-22 |
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|---|---|---|---|
| CN201611114723.XA Pending CN106531731A (en) | 2016-12-07 | 2016-12-07 | Stentless LED packaging structure and manufacturing method thereof |
Country Status (2)
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| CN (1) | CN106531731A (en) |
| WO (1) | WO2018103614A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018103614A1 (en) * | 2016-12-07 | 2018-06-14 | 鸿利智汇集团股份有限公司 | Non-bracket led encapsulation structure and manufacturing method therefor |
| CN108417568A (en) * | 2018-03-05 | 2018-08-17 | 孙爱芬 | A kind of LED illumination area source |
| CN109869647A (en) * | 2019-03-05 | 2019-06-11 | 东莞中之光电股份有限公司 | A kind of LED lamp bead of double-side |
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| CN113453679A (en) | 2018-12-20 | 2021-09-28 | C4医药公司 | Targeted protein degradation |
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| CN109869647A (en) * | 2019-03-05 | 2019-06-11 | 东莞中之光电股份有限公司 | A kind of LED lamp bead of double-side |
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|---|---|
| WO2018103614A1 (en) | 2018-06-14 |
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