CN103700753A - 360-degree luminous flexible LED (Light-emitting Diode) light bar - Google Patents
360-degree luminous flexible LED (Light-emitting Diode) light bar Download PDFInfo
- Publication number
- CN103700753A CN103700753A CN201310683712.3A CN201310683712A CN103700753A CN 103700753 A CN103700753 A CN 103700753A CN 201310683712 A CN201310683712 A CN 201310683712A CN 103700753 A CN103700753 A CN 103700753A
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- China
- Prior art keywords
- led
- flexible
- luminous
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims abstract description 29
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
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- 238000005452 bending Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 2
- 238000004020 luminiscence type Methods 0.000 abstract 1
- 239000000565 sealant Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310683712.3A CN103700753A (en) | 2013-12-13 | 2013-12-13 | 360-degree luminous flexible LED (Light-emitting Diode) light bar |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310683712.3A CN103700753A (en) | 2013-12-13 | 2013-12-13 | 360-degree luminous flexible LED (Light-emitting Diode) light bar |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103700753A true CN103700753A (en) | 2014-04-02 |
Family
ID=50362221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310683712.3A Pending CN103700753A (en) | 2013-12-13 | 2013-12-13 | 360-degree luminous flexible LED (Light-emitting Diode) light bar |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103700753A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015184618A1 (en) * | 2014-06-05 | 2015-12-10 | 上海富迪照明电器有限公司 | Embedded white-light led package structure based on solid state fluorescent material and manufacturing method thereof |
CN105226167A (en) * | 2015-11-02 | 2016-01-06 | 杭州电子科技大学 | A kind of flexible LED filament of full angle luminescence and manufacture method thereof |
CN105338741A (en) * | 2015-09-29 | 2016-02-17 | 慈溪锐恩电子科技有限公司 | Preparation method for flexible LED lamp strip |
CN105927883A (en) * | 2016-07-06 | 2016-09-07 | 中山市美耐特光电有限公司 | Paster type LED flexible light strip |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5469342A (en) * | 1994-01-25 | 1995-11-21 | Chien; Tseng L. | Light-strip apparatus |
CN101358697A (en) * | 2008-08-27 | 2009-02-04 | 鹤山丽得电子实业有限公司 | Flexible neon bar with whole body illuminating |
CN202791560U (en) * | 2012-09-03 | 2013-03-13 | 武汉东湖开发区电子工程有限公司 | LED flexible lamp bar |
CN202949623U (en) * | 2012-11-14 | 2013-05-22 | 合肥银月照明科技工程有限公司 | Light-emitting diode (LED) circuit board structure with two faces emitting light |
CN203760509U (en) * | 2013-12-13 | 2014-08-06 | 张晓峰 | Flexible LED lighting bar illuminating at 360 DEG |
-
2013
- 2013-12-13 CN CN201310683712.3A patent/CN103700753A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5469342A (en) * | 1994-01-25 | 1995-11-21 | Chien; Tseng L. | Light-strip apparatus |
CN101358697A (en) * | 2008-08-27 | 2009-02-04 | 鹤山丽得电子实业有限公司 | Flexible neon bar with whole body illuminating |
CN202791560U (en) * | 2012-09-03 | 2013-03-13 | 武汉东湖开发区电子工程有限公司 | LED flexible lamp bar |
CN202949623U (en) * | 2012-11-14 | 2013-05-22 | 合肥银月照明科技工程有限公司 | Light-emitting diode (LED) circuit board structure with two faces emitting light |
CN203760509U (en) * | 2013-12-13 | 2014-08-06 | 张晓峰 | Flexible LED lighting bar illuminating at 360 DEG |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015184618A1 (en) * | 2014-06-05 | 2015-12-10 | 上海富迪照明电器有限公司 | Embedded white-light led package structure based on solid state fluorescent material and manufacturing method thereof |
CN105338741A (en) * | 2015-09-29 | 2016-02-17 | 慈溪锐恩电子科技有限公司 | Preparation method for flexible LED lamp strip |
CN105338741B (en) * | 2015-09-29 | 2017-12-01 | 慈溪锐恩电子科技有限公司 | A kind of preparation method of flexible LED rope light |
CN105226167A (en) * | 2015-11-02 | 2016-01-06 | 杭州电子科技大学 | A kind of flexible LED filament of full angle luminescence and manufacture method thereof |
CN105226167B (en) * | 2015-11-02 | 2017-06-27 | 杭州电子科技大学 | A kind of luminous flexible LED filament of full angle and its manufacture method |
CN105927883A (en) * | 2016-07-06 | 2016-09-07 | 中山市美耐特光电有限公司 | Paster type LED flexible light strip |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: YANG RUILONG GE TIEHAN Effective date: 20150403 Owner name: ZHEJIANG RUIDISHENG OPTOELECTRONICS CO., LTD. Free format text: FORMER OWNER: ZHANG XIAOFENG Effective date: 20150403 |
|
CB03 | Change of inventor or designer information |
Inventor after: Ge Tiehan Inventor before: Zhang Xiaofeng |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: ZHANG XIAOFENG TO: GE TIEHAN Free format text: CORRECT: ADDRESS; FROM: 315400 NINGBO, ZHEJIANG PROVINCE TO: 310015 HANGZHOU, ZHEJIANG PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20150403 Address after: Hangzhou City, Zhejiang province Gongshu District 310015 Cambridge Street No. 10, building 3, Kang Road, 1 building 139-152 room 2 building 239-252 room Applicant after: Zhejiang LEDison Optoelectronics Co., Ltd. Applicant after: Yang Ruilong Applicant after: Ge Tiehan Address before: 315400 Swan Bay, Yuyao pear Road, Zhejiang, 33-207 Applicant before: Zhang Xiaofeng |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140402 |