CN204441280U

CN204441280U - Crystal covering type LED lamp

Info

Publication number: CN204441280U
Application number: CN201420464641.8U
Authority: CN
Inventors: 刘镇
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-08-15
Filing date: 2014-08-15
Publication date: 2015-07-01
Anticipated expiration: 2024-08-15

Abstract

The utility model discloses a kind of crystal covering type LED lamp, comprise a substrate, many group crystal covering type LED chips and fluorescent material glue-line, described crystal covering type LED chip is installed on the substrate, described fluorescent material glue-line covers on crystal covering type LED chip, substrate is transparent glass plate, be provided with the metallic circuit of printing at substrate surface, crystal covering type LED chip is electrically connected by its electrode and described metallic circuit.The beneficial effects of the utility model are: crystal covering type LED chip and being electrical connected of metallic circuit do not need bonding wire, and the light that crystal covering type LED chip produces can send to fluorescent material glue-line direction and glass plate direction simultaneously, form 360 ° of luminous effects; And the temperature that crystal covering type LED chip produces conducts downwards by glass substrate, enough reduce the temperature of fluorescent material glue-line, delay aging and the deformation of fluorescent material glue-line, after preventing the deformation of fluorescent material glue-line, steam enters in glue to be absorbed by fluorescent material and causes fluorescent material to lose efficacy.

Description

Crystal covering type LED lamp

Technical field

The utility model relates to field of LED illumination, particularly relates to crystal covering type LED lamp.

Background technology

The timbering material of existing common LED filament is metal material etc., the back side not light projector, so will realize all-round luminescence (360 ° of luminescences), needs two-sided glue, sealing, and complex manufacturing, by hot bad.

Utility model content

Technical problem to be solved in the utility model is: comparatively complicated for the technology realizing the all-round luminescence of LED in prior art, provides a kind of crystal covering type LED lamp, can realize all-round luminescence, and structure is simple.

In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of crystal covering type LED lamp, comprise a substrate, many group crystal covering type LED chips and fluorescent material glue-line, described crystal covering type LED chip is installed on the substrate, described fluorescent material glue-line covers on crystal covering type LED chip, substrate is transparent glass plate, is provided with the metallic circuit of printing at substrate surface, and crystal covering type LED chip is electrically connected by its electrode and described metallic circuit.

Further, described substrate to be high boric acid content be 12% ~ 22% glass plate, the electrode material of described crystal covering type LED chip is gold.

Further, described metallic circuit is fine silver circuit.

Further, the electrode of described crystal covering type LED chip is electrically connected by tin cream and described metallic circuit.

Further, described substrate is strip, many groups of described crystal covering type LED chips are evenly arranged along the length direction of substrate and are connected by described metallic circuit, and two ends substrate being positioned at length direction are provided with metal pins, and described metal pins and metallic circuit are electrically connected.

The beneficial effects of the utility model are: adopt transparent glass to make substrate, type metal circuit on a glass, crystal covering type LED chip is installed and is electrical connected with metallic circuit on the glass substrate, do not need bonding wire, the light that crystal covering type LED chip produces can send to fluorescent material glue-line direction and glass plate direction simultaneously, forms 360 ° of luminous effects; And the temperature that crystal covering type LED chip produces conducts downwards by glass substrate, the temperature of fluorescent material glue-line can be reduced like this, delay aging and the deformation of fluorescent material glue-line, after preventing the deformation of fluorescent material glue-line, steam enters in glue to be absorbed by fluorescent material and causes fluorescent material to lose efficacy.

Accompanying drawing explanation

Fig. 1 is the front view of the crystal covering type LED lamp of the utility model embodiment.

Fig. 2 is the lateral sectional view of the crystal covering type LED lamp of the utility model embodiment.

Label declaration:

10, substrate; 11, metallic circuit; 12, metal pins; 20, crystal covering type LED chip; 30, fluorescent material glue-line.

Embodiment

By describing technology contents of the present utility model in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with execution mode.

The design of the utility model most critical is: adopt glass plate as the substrate of crystal covering type LED chip, can play the effect of printing opacity and transferring heat simultaneously.

Refer to Fig. 1 and Fig. 2, a kind of crystal covering type LED lamp, comprise a substrate 10, many group crystal covering type LED chips 20 and fluorescent material glue-line 30, crystal covering type LED chip 20 is installed on the substrate 10, fluorescent material glue-line 30 covers on crystal covering type LED chip 20, substrate 10 is transparent glass plate, is provided with the metallic circuit 11 of printing on substrate 10 surface, and crystal covering type LED chip 20 is electrically connected by its electrode and metallic circuit 11.

From foregoing description, the beneficial effects of the utility model are: adopt transparent glass to make substrate, type metal circuit on a glass, crystal covering type LED chip is installed and is electrical connected with metallic circuit on the glass substrate, do not need bonding wire, the light that crystal covering type LED chip produces can send to fluorescent material glue-line direction and glass plate direction simultaneously, forms 360 ° of luminous effects; And the temperature that crystal covering type LED chip produces conducts downwards by glass substrate, the temperature of fluorescent material glue-line can be reduced like this, delay aging and the deformation of fluorescent material glue-line, after preventing the deformation of fluorescent material glue-line, steam enters in glue to be absorbed by fluorescent material and causes fluorescent material to lose efficacy.

Particularly, the crystal covering type LED chip in the application includes but not limited to that application number is the structure of crystal covering type LED chip disclosed in the patent of 201420082716.6.

Further, substrate 10 to be high boric acid content be 12% ~ 22% glass plate, the electrode material of described crystal covering type LED chip 20 is gold.

Seen from the above description, by arranging the glass plate that high boric acid content is 12% ~ 22%, can reach optimum light transmittance and heat resistance, and when glass plate is heated, can produce black body radiation, optimum temperature is 85 DEG C ~ 150 DEG C, and best radiant is 94 DEG C.The silica glass of high boric acid content 12% ~ 22% is contained in after gold electrode on pad to weld the gold-tin alloy layer admixed graphite alkene cryogenic glass powder formed by tin cream according to temperature setting and the crystal covering type LED chip of black body radiation track are counter, thermal radiation can be formed between 85 DEG C ~ 150 DEG C Celsius, best center radiation temperature is 94 DEG C, the invalid heat be compounded to form that crystal covering type LED chip active layer produces can be radiate a part by this bed boundary like this, such maintenance LED junction temperature is in the working temperature of high-effect pulse current injectingt density, make crystal covering type LED chip steady operation under the electric current of 30mA, working junction temperature is not higher than 110 DEG C, within 10000 hours, light decay is lower than 5%, making Pyrex cover the all-round smooth product of brilliant LED can be applied in light fixture reliably.

Further, metallic circuit 11 is fine silver circuit.

Seen from the above description, circuit can be made to have best conductive effect by arranging fine silver circuit.

Further, the electrode of crystal covering type LED chip 20 is electrically connected by tin cream and metallic circuit 11.

Further, substrate 10 is strip, many groups crystal covering type LED chip 20 is evenly arranged along the length direction of substrate 10 and is connected by metallic circuit 11, and two ends substrate 10 being positioned at length direction are provided with metal pins 12, and metal pins 12 and metallic circuit 11 are electrically connected.

Please refer to Fig. 1 and Fig. 2, embodiment of the present utility model is a kind of crystal covering type LED lamp, comprise the substrate 10 of a strip, many groups crystal covering type LED chip 20 and fluorescent material glue-line 30, substrate 10 to be high boric acid content be 13% ~ 21% transparent glass plate, substrate 10 surface printing has the metallic circuit 11 of fine silver, the bearing of trend of metallic circuit 11 is consistent with the length direction of substrate 10, metallic circuit 11 has multiple breakpoint, many groups crystal covering type LED chip 20 is evenly installed along the length direction of substrate 10, often organize crystal covering type LED chip 20 between two breakpoints of metallic circuit 11, its positive and negative electrode to be fixed on two breakpoints by tin cream thus to make to be formed between crystal covering type LED chip to be connected in series, two ends substrate 10 being positioned at length direction are provided with metal pins 12, metal pins 12 is electrically connected with two ends of metallic circuit 11, fluorescent material glue-line 30 covers on crystal covering type LED chip 20.

In sum, do not need bonding wire to connect between the substrate of the crystal covering type LED lamp that the utility model provides and crystal covering type LED chip, the light that crystal covering type LED chip produces can send the luminous effect of formation 360 ° to fluorescent material glue-line direction and glass plate direction simultaneously; And the temperature that crystal covering type LED chip produces conducts downwards by glass substrate, reduce the temperature of fluorescent material glue-line, delay aging and the deformation of fluorescent material glue-line, after preventing the deformation of fluorescent material glue-line, steam enters in glue to be absorbed by fluorescent material and causes fluorescent material to lose efficacy; High boric acid content be 12% ~ 22% glass plate can reach optimum light transmittance and heat resistance; The circuit that fine silver is made has best conductive effect.

The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalents utilizing the utility model specification and accompanying drawing content to do; or be directly or indirectly used in relevant technical field, be all in like manner included in scope of patent protection of the present utility model.

Claims

1. a crystal covering type LED lamp, comprise a substrate, many group crystal covering type LED chips and fluorescent material glue-line, described crystal covering type LED chip is installed on the substrate, described fluorescent material glue-line covers on crystal covering type LED chip, it is characterized in that, substrate is transparent, high boric acid content is the glass plate of 12% ~ 22%, and be provided with the metallic circuit of printing at substrate surface, crystal covering type LED chip is electrically connected by its electrode and described metallic circuit;

Crystal covering type LED chip comprises substrate and is provided with the first conductive-type semiconductor layer with stacking gradually by facing up of substrate, luminescent layer, second conductive-type semiconductor layer, conductive layer, reflector, first electrode hole of etching and multiple the second electrode hole be centered around around the first electrode hole, first electrode hole is through to luminescent layer by reflector and exposes the first conductive-type semiconductor layer, second electrode hole runs through reflector and exposes conductive layer, the hole wall of the first electrode hole is coated with insulating layer coating, the first electrode is provided with in first electrode hole, one end of first electrode is positioned at the front in reflector, the other end and the first conductive-type semiconductor layer in electrical contact, be provided with the second electrode in second electrode hole, it is in electrical contact that one end of the second electrode is positioned at the front in reflector, the other end and conductive layer.

2. crystal covering type LED lamp according to claim 1, is characterized in that, the electrode material of described crystal covering type LED chip is gold.

3. crystal covering type LED lamp according to claim 1, is characterized in that, described metallic circuit is fine silver circuit.

4. crystal covering type LED lamp according to claim 1, is characterized in that, the electrode of described crystal covering type LED chip is electrically connected by tin cream and described metallic circuit.

5. crystal covering type LED lamp according to claim 1, it is characterized in that, described substrate is strip, many groups of described crystal covering type LED chips are evenly arranged along the length direction of substrate and are connected by described metallic circuit, two ends substrate being positioned at length direction are provided with metal pins, and described metal pins and metallic circuit are electrically connected.