CN202812829U - LED light-emitting element with 4-Pi light-emitting angle - Google Patents
LED light-emitting element with 4-Pi light-emitting angle Download PDFInfo
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- CN202812829U CN202812829U CN2012201672623U CN201220167262U CN202812829U CN 202812829 U CN202812829 U CN 202812829U CN 2012201672623 U CN2012201672623 U CN 2012201672623U CN 201220167262 U CN201220167262 U CN 201220167262U CN 202812829 U CN202812829 U CN 202812829U
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Abstract
An LED light-emitting element with a 4-Pi light-emitting angle comprises a transparent light-emitting element substrate, at least one strip of LED chips mounted on the surface of the transparent light-emitting element substrate and a first light-emitting powder layer, wherein the LED chips belong to the transparent light-emitting element substrate; the LED chips are mutually connected via a chip electric connecting wire; two ends or one end of the substrate are (is) provided with an electric outgoing wire; the electric outgoing wire is connected with the chip electric connecting wire for connecting the LED chips; and the first light-emitting powder layer is covered on the surface of the transparent light-emitting element substrate and the LED chips. The LED light-emitting element is characterized by further comprising an electric connecting structure located at the two ends or one end of the transparent light-emitting element substrate, and the electric connecting structure is used for fixedly connecting the electric outgoing wire and the transparent light-emitting element substrate. According to the utility model, the LED chips are wrapped by light-emitting powder, the packaged LED chips are provided with a 4Pi light-emitting angle, the distribution of the light color of light-emitting light is uniform, the manufacture process is simple, raw materials are saved, the heat radiation performance of the chips is good, and the LED light-emitting element can be used for manufacturing an LED linear light source, LED illuminating lamps and LED lamps.
Description
Technical field
The utility model relates to a kind of LED light-emitting component, particularly a kind of LED light-emitting component of 4 π bright dippings.
Background technology
The led chip of the large multiplex blue light-emitting of white light LEDs element of prior art adds luminous bisque and consists of.Its encapsulation normally is fixed on led chip on the pedestal with crystal-bonding adhesive, wafer is electrically connected again, and then covers phosphor powder layer on led chip.Yet the LED element of encapsulation is because device substrate is transparent materials in this way, and its luminous shooting angle is 2 π to the maximum.If adopt the device substrate of transparent material, be chip substrate that transparent led chip is fixed on the described transparent element substrate with transparent adhesive tape, then the light shooting angle of LED encapsulating products can reach 4 π, thereby can improve the light outgoing efficient of LED.But prior art adopts and first led chip is fixed on transparent adhesive tape on the transparent element substrate of led chip, then covers luminous bisque around chip and transparent element substrate.The blue light that the led chip of this method is sent out more spills from transparent element substrate side surfaces and reverse side easily, makes the distribution of color of the light that led chip sends inhomogeneous, simultaneously also more complicated of technique; In addition, whole LED is wrapped up, also affects the heat dispersion of LED element by luminous arogel and transparent adhesive tape.
Summary of the invention
The purpose of this utility model is intended to solve above-mentioned the deficiencies in the prior art, and a kind of LED light-emitting component of 4 π bright dippings newly is provided.
The utility model is achieved through the following technical solutions:
The LED light-emitting component of the 4 π bright dippings that the utility model provides, it comprises:
A transparent luminescent device substrate;
At least a string lip-deep led chip of described transparent luminescent device substrate that is installed in, described led chip is the led chip of transparency carrier; Described led chip is electrically connected mutually by the chip electric connection line;
Described transparent luminescent device substrate two ends or an end respectively have an electric lead-out wire, and described electric lead-out wire links to each other with the chip electric connection line that is connected each led chip;
Be covered in described transparent luminescent device substrate surface and with led chip on the first luminous bisque;
It is characterized in that, also comprise: be positioned at the connecting structure for electrical equipment at described transparent luminescent device substrate two ends, described connecting structure for electrical equipment is fixedly connected with electric lead-out wire with the transparent luminescent device substrate.
The LED light-emitting component of 4 π bright dippings of the present utility model also can comprise the second luminous bisque, and the described second luminous bisque is coated on described transparent luminescent device substrate upper surface, and described led chip is installed on the second luminous bisque.
Apply the first transparent dielectric layer on the described first luminous bisque upper surface.
The described second luminous bisque is served as reasons and is mixed with the luminous bisque of same diameter clear glass pearl in the crystal-bonding adhesive that contains luminescent powder.
Described connecting structure for electrical equipment and electric lead-out wire are the conductive metal layer paster that is positioned at the integrative-structure of described transparent luminescent device substrate two ends or an end, and described conductive metal layer paster is electrically connected with described chip electric connection line.
Described led chip be blue light-emitting chip, send out ultraviolet light chip, glow or the chip of other coloured light, described led chip is two, these two led chips are in series or in parallel with each other; Described led chip is a plurality of, the mutual series, parallel of these a plurality of led chips or connection in series-parallel.
Be doped with the clear glass pearl of same diameter in the described second luminous bisque 2=, to control the thickness of the second luminous bisque.
Luminous bisque is all arranged around the LED light-emitting component of 4 π bright dippings of the present utility model, led chip wherein.Its making step is: apply the second luminous bisque that last layer is mixed into by transparent adhesive tape and luminescent powder at transparent luminescent device substrate upper surface first, after the curing, the led chip of a string at least transparency carrier is fixed on this second luminous bisque with transparent crystal-bonding adhesive, after crystal-bonding adhesive solidifies, with gold thread (chip electric connection line) led chip is electrically connected; Then, be coated with on led chip again and be covered with the luminous bisque of another layer (the first luminous bisque), afterwards, with connecting structure for electrical equipment electric lead-out wire and transparent luminescent device substrate are fixed, this connecting structure for electrical equipment lays respectively at the two ends of described transparent element substrate.
Be enclosed with luminescent powder around each led chip of the LED light-emitting component of 4 π bright dippings of the present utility model, make the led chip 4 π bright dippings after the encapsulation, its photochromic being evenly distributed has been simplified simultaneously manufacturing process, has been saved raw material, has also improved the heat dispersion of led chip.
Described transparent element substrate is made by glass, pottery or plastics.
Described second luminous layer is mixed by transparent adhesive tape and luminescent powder, and described transparent adhesive tape has that high rigidity, low-shrinkage become, the performance such as flatness height after high temperature resistant, the high index of refraction, high light transmission rate, high thermal conductivity, curing.
The figure that the described first luminous bisque 7 and the second luminous bisque are coated with can change on demand.
In the second luminous bisque on the described transparent element substrate also the available transparent crystal-bonding adhesive that is mixed with luminescent powder directly led chip is fixed on the transparent luminescent device substrate of LED element and forms, thereby further simplified packaging technology.For the even thickness of the second luminous bisque between led chip and the transparent luminescent device substrate, good product consistency also can add the clear glass pearl of a small amount of same diameter, to control the thickness of this luminous bisque in the described crystal-bonding adhesive that is mixed with luminescent powder.
The utility model compared with prior art, its advantage is: the luminescent powder parcel is arranged around the led chip, and LED element 4 the photochromic of π emergent light are evenly distributed; Luminescent powder layer thickness and luminescent powder density can freely be controlled, the high conformity of LED product; The heat dissipation characteristics of led chip has been improved without gel coating in the side of the transparent element substrate of LED element and the back side; Simultaneously, go back simplified manufacturing technique, saving raw material, reduction cost.
Description of drawings
Fig. 1 is LED light-emitting component (embodiment) structural representation of 4 π bright dippings of the present utility model.
Fig. 2 is the A-A generalized section of Fig. 1.
Fig. 3 is LED light-emitting component (another embodiment) structural representation of 4 π bright dippings of the present utility model.
Fig. 4 is LED light-emitting component (the 3rd embodiment) structural representation of 4 π bright dippings of the present utility model.
Fig. 5 is LED light-emitting component (the 4th embodiment) structural representation of 4 π bright dippings of the present utility model.
Fig. 6 is LED light-emitting component (the 5th embodiment) structural representation of 4 π bright dippings of the present utility model.
The specific embodiment
Further describe the utility model below in conjunction with drawings and Examples.
Fig. 1 is LED light-emitting component (embodiment) structural representation of 4 π bright dippings of the present utility model; Fig. 2 is the A-A generalized section of Fig. 1; As seen from the figure, the LED light-emitting component of the 4 π bright dippings of the utility model embodiment includes a transparent luminescent device substrate 1, one deck the second luminous bisque 2 is arranged on transparent luminescent device substrate 1 upper surface, at least one serial core plate base is that transparent led chip 3 is fixed on the second luminous bisque 2 with transparent crystal-bonding adhesive 4, mutually be electrically connected by chip electric connection line 5 between each led chip 3,6 is the electric lead-out wire of this chip electric connection line 5, be coated with the first luminous bisque 7 on the led chip 3, this first luminous bisque 7 and the second luminous bisque 2 are wrapped in led chip 3 wherein, connecting structure for electrical equipment 8 is positioned at described transparent luminescent device substrate 1 two ends, and this connecting structure for electrical equipment 8 is fixedly connected with electric lead-out wire 6 with transparent luminescent device substrate 1.
Described led chip 3 is the chip of transparency carrier, and led chip 3 is the led chip of the led chip of blue light-emitting, the led chip of sending out ultraviolet light, the led chip that glows or other coloured light;
When led chip was two, two led chips can be in series or in parallel with each other.When led chip is a plurality of, mutually series, parallel or the connection in series-parallel of these a plurality of led chips.
The light emission rate of the LED light-emitting component of 4 π bright dippings of the present utility model is high, and all through the second luminous bisque 2 and the first luminous bisque 7, the photochromic of emergent light is evenly distributed the led chip issued light; Thickness and the luminescent powder density of the second luminous bisque 2 and the first luminous bisque 7 can freely be controlled, the high conformity of the LED light-emitting component product of this 4 π bright dipping; Because transparent element substrate 1 side and the back side do not have gel coating, can improve the heat dissipation characteristics of the LED light-emitting component of this 4 π bright dipping; Simultaneously, but also simplified manufacturing technique, save raw material, reduce cost.
Described transparent luminescent device substrate 1 is made by the glass that contains luminescent powder, pottery or plastics.
The luminescent powder of the described second luminous bisque 2 is mixed by transparent adhesive tape and luminescent powder, and described transparent adhesive tape is the transparent adhesive tape of high rigidity, high temperature resistant, high index of refraction, high light transmission rate, high thermal conductivity.The thickness of the described second luminous bisque 2 and luminescent powder density determine by the optical parameter of output light, control colour temperature, colour rendering index and luminous intensity that its thickness and luminescent powder density can change output light.
The luminescent powder of the described first luminous bisque 7 is identical with the luminescent powder of the second luminous bisque 2, but its density in luminous bisque can be identical or not identical, it is identical with the one side of the second luminous bisque 2 with luminescent powder density, the colour temperature that makes its emergent light, colour rendering index and luminous intensity to control its thickness, thereby obtains 4 π bright dippings, the photochromic LED element that is evenly distributed of outgoing.
Fig. 3 is another example structure schematic diagram of the utility model; Led chip 3 among this embodiment is used by the die bond glue-line that is mixed with luminescent powder directly to be fixed on (the die bond glue-line that in fact contains luminescent powder consists of the second luminous bisque 2) on the transparent luminescent device substrate 1, thus further simplified manufacturing technique; In order to control die bond glue-line 9 consistency of thickness, can in this luminescent powder, be mixed with the clear glass pearl 10 of same diameter, control the density of diameter and the luminescent powder of this bead 10, can obtain satisfactory optical parameter; This embodiment also comprises the light transmission medium layer 91 that is coated on the first luminous bisque 7 simultaneously.
Fig. 4 is the 3rd example structure schematic diagram of the utility model; Led chip 3 among this embodiment directly is fixed on the transparent luminescent device substrate 1 that is mixed with luminescent powder with crystal-bonding adhesive 4, thus further simplified manufacturing technique; In order to control product parameters and uniformity, when making is mixed with the substrate of luminescent powder, can regulate the ratio of luminescent powder, thus the optical parameter of control product.
Fig. 5 is the 4th example structure schematic diagram of the utility model; The luminous bisque 7 of ground floor on the led chip 3 among this embodiment applies after can adopting first box dam glue 11 to surround certain shape again.Can control optical parameter and the uniformity of product according to the shape (just) of box dam glue 11; Box dam glue 11 can surround various different graphics, to increase product diversity.
Fig. 6 is the 5th example structure schematic diagram of the utility model, among this embodiment, connecting structure for electrical equipment 8 and electric lead-out wire 6 are the conductive metal layer paster that is positioned at the integrative-structure of transparent luminescent device substrate both ends or one end, and this conductive metal layer paster is electrically connected with described chip electric connection line 5.
Each embodiment that the claimed scope of the utility model is not limited to introduce herein, all belongs to the scope that patent of the present invention contains at all various forms of conversion of doing based on the present patent application claim and description and replacement.
Claims (6)
1. the LED light-emitting component of a π bright dipping, it comprises:
A transparent luminescent device substrate;
At least a string lip-deep led chip of described transparent luminescent device substrate that is installed in, described led chip is the led chip of transparency carrier; Described led chip is electrically connected mutually by the chip electric connection line;
Described transparent luminescent device substrate two ends or an end respectively have an electric lead-out wire, and described electric lead-out wire links to each other with the chip electric connection line that is connected each led chip;
Be covered in the first luminous bisque on described transparent luminescent device substrate surface and the led chip;
It is characterized in that, also comprise: be positioned at the connecting structure for electrical equipment of described transparent luminescent device substrate two ends or an end, described connecting structure for electrical equipment is fixedly connected with electric lead-out wire with the transparent luminescent device substrate.
2. by the LED light-emitting component of 4 π bright dippings claimed in claim 1, it is characterized in that also comprise the second luminous bisque, the described second luminous bisque is coated on described transparent luminescent device substrate upper surface, described led chip is installed on the second luminous bisque.
3. by the LED light-emitting component of 4 π bright dippings claimed in claim 1, it is characterized in that, apply the first transparent dielectric layer on the described first luminous bisque upper surface.
4. press the LED element of 4 π bright dippings claimed in claim 1, it is characterized in that, described connecting structure for electrical equipment and electric lead-out wire are the conductive metal layer paster that is positioned at the integrative-structure of described transparent luminescent device substrate two ends or an end, and described conductive metal layer paster is electrically connected with described chip electric connection line.
5. press the LED light-emitting component of 4 π bright dippings claimed in claim 1, it is characterized in that, described led chip be blue light-emitting chip, send out ultraviolet light chip, glow or the chip of other coloured light, described led chip is two, these two led chips are in series or in parallel with each other.
6. press the LED light-emitting component of 4 π bright dippings claimed in claim 1, it is characterized in that, described led chip be blue light-emitting chip, send out ultraviolet light chip, glow or the chip of other coloured light, described led chip is a plurality of, the mutual series, parallel of these a plurality of led chips or connection in series-parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201672623U CN202812829U (en) | 2012-04-19 | 2012-04-19 | LED light-emitting element with 4-Pi light-emitting angle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201672623U CN202812829U (en) | 2012-04-19 | 2012-04-19 | LED light-emitting element with 4-Pi light-emitting angle |
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| Publication Number | Publication Date |
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| CN202812829U true CN202812829U (en) | 2013-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012201672623U Expired - Lifetime CN202812829U (en) | 2012-04-19 | 2012-04-19 | LED light-emitting element with 4-Pi light-emitting angle |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292173A (en) * | 2013-04-28 | 2013-09-11 | 杭州杭科光电股份有限公司 | 4 Pi luminous LED light source module |
| CN103343891A (en) * | 2013-06-08 | 2013-10-09 | 杭州杭科光电股份有限公司 | LED light source module capable of emitting light in 4pi mode |
| CN103727438A (en) * | 2014-01-14 | 2014-04-16 | 四川品龙光电科技有限公司 | LED lamp and manufacturing method |
| CN105789195A (en) * | 2016-04-25 | 2016-07-20 | 李正豪 | 360-degree light emitting LED device and 360-degree light emitting LED light source |
| US20160307879A1 (en) * | 2015-04-20 | 2016-10-20 | Everlight Electronics Co., Ltd. | Light Emitting Module |
-
2012
- 2012-04-19 CN CN2012201672623U patent/CN202812829U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292173A (en) * | 2013-04-28 | 2013-09-11 | 杭州杭科光电股份有限公司 | 4 Pi luminous LED light source module |
| CN103343891A (en) * | 2013-06-08 | 2013-10-09 | 杭州杭科光电股份有限公司 | LED light source module capable of emitting light in 4pi mode |
| CN103727438A (en) * | 2014-01-14 | 2014-04-16 | 四川品龙光电科技有限公司 | LED lamp and manufacturing method |
| US20160307879A1 (en) * | 2015-04-20 | 2016-10-20 | Everlight Electronics Co., Ltd. | Light Emitting Module |
| CN105789195A (en) * | 2016-04-25 | 2016-07-20 | 李正豪 | 360-degree light emitting LED device and 360-degree light emitting LED light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Xiamen Yankon Energetic Lighting Co., Ltd. Assignor: Zhejiang LEDison Optoelectronics Co., Ltd. Contract record no.: 2015330000247 Denomination of utility model: LED light-emitting element with 4-Pi light-emitting angle Granted publication date: 20130320 License type: Common License Record date: 20151027 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Music Company Limited Assignor: Zhejiang LEDison Optoelectronics Co., Ltd. Contract record no.: 2016990000215 Denomination of utility model: LED light-emitting element with 4-Pi light-emitting angle Granted publication date: 20130320 License type: Common License Record date: 20160531 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: ANHUI HANGKE PHOTOELECTRIC Co.,Ltd. Assignor: ZHEJIANG LEDISON OPTOELECTRONICS Co.,Ltd. Contract record no.: X2020330000015 Denomination of utility model: LED light-emitting element with 4-Pi light-emitting angle Granted publication date: 20130320 License type: Common License Record date: 20200401 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130320 |
|
| CX01 | Expiry of patent term |