CN203413560U - LED (light-emitting diode) lamp and lamp filament thereof - Google Patents
LED (light-emitting diode) lamp and lamp filament thereof Download PDFInfo
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- CN203413560U CN203413560U CN201320345993.7U CN201320345993U CN203413560U CN 203413560 U CN203413560 U CN 203413560U CN 201320345993 U CN201320345993 U CN 201320345993U CN 203413560 U CN203413560 U CN 203413560U
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- substrate
- led filament
- light
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- chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The embodiment of the utility model discloses an LED (light-emitting diode) lamp and a lamp filament thereof. The LED lamp filament comprises a substrate, a light-emitting unit and a sealing glue layer, wherein the light-emitting unit is fixedly arranged on at least one side face of the substrate; the sealing glue layer is coated to the periphery of the light-emitting unit; the substrate is of a slender strip-shaped structure. The light-emitting unit comprises a plurality of blue light chips and a plurality of red light chips, wherein the blue light chips and the red light chips are regularly arranged on the substrate and are connected in series in sequence. By installing the light-emitting unit, which consists of the combination of the blue light chips and the red light chips, on the substrate, the LED lamp filament disclosed by the embodiment of the utility model is high in color rendering and big in light-emitting angle.
Description
Technical field
The utility model relates to LED lighting technical field, relates in particular to a kind of LED lamp and filament thereof.
Background technology
The filament of traditional lighting light fixture generally can be directly luminous by tungsten filament etc. wire form, this class filament ubiquity short, the defect such as power consumption is large of life-span, and generally only can send sodium yellow, colour rendering is poor.
Along with scientific and technological development, LED lamp replaces traditional lighting gradually.Existing LED lamp is provided with light emitting module, comprises square or circular support, is arranged at the LED chip of support one side, and be coated on the lens on LED chip surface.Existing LED lamp generally arranges fluorescent material and then obtains white light on blue-light LED chip, and the whole colour rendering of LED lamp is lower.Simultaneously, due to existing support, generally adopt the conductive metallic material injection moulding PPA such as copper, aluminium to form, itself does not have light transmission, light path can only realize 180 ° of planar transmission in a side that is provided with LED chip at most, Integral luminous angle is less, even under the secondary optics effect of lens, general lighting angle is also no more than 165 °, and the easy yellow variable color of PPA material, affects the overall quality of LED lamp.In addition, existing LED light emitting module adopts planar point glue packaging technology mostly, and efficiency and yields are low, and production cost is high.
Utility model content
The utility model embodiment technical problem to be solved is, a kind of LED filament is provided, and colour rendering is high.
The further technical problem to be solved of the utility model embodiment is, a kind of LED lamp is provided, and colour rendering is high.
In order to solve the problems of the technologies described above, the utility model embodiment has proposed a kind of LED filament, comprises substrate, is fixed on the luminescence unit at least one side of substrate and the adhesive layer that is coated on luminescence unit periphery; Described substrate setting is elongated list structure; Described luminescence unit comprises that some rules are arranged on described substrate and blue chip in sequential series and red light chips.
Further, at least at interval of two described blue chips, a described red light chips is set.
Further, the length of described substrate is 5.00mm ~ 200.00mm, and width is 0.50 ~ 10.00mm, is highly 0.10mm ~ 5.00mm.
Further, in the both side surface of described substrate, be provided with described luminescence unit.
Further, the cross section outline of described adhesive layer is rounded, and diameter is 1.00mm ~ 10.00mm.
Further, described adhesive layer adopts the transparent colloid material that is mixed with fluorescent material to form.
Further, described substrate setting is transparent.
Further, described adhesive layer adopts mould model technique to form.
Further, described blue chip and red light chips are in sequential series by plain conductor, and the two ends of described substrate are provided with the electrode pin being connected with the two ends of described plain conductor respectively.
Correspondingly, the utility model embodiment also provides a kind of LED lamp, comprises the LED filament described in as above any one.
The beneficial effect of the utility model embodiment is: the main body that forms LED filament by elongated strip substrate is set; The luminescence unit being constituted by blue chip and red light chips by least one side setting in substrate, effectively improves the colour rendering of LED filament; Substrate setting is to transparent, effectively improves rising angle and the light extraction efficiency of LED filament; Adopt mould model technique to form adhesive layer, technique is simple, and production efficiency and yields are high, and production cost is low.
Accompanying drawing explanation
Fig. 1 is the main-vision surface structural representation of the LED filament of the utility model embodiment.
Fig. 2 is the A portion enlarged drawing of Fig. 1 in the utility model embodiment.
Fig. 3 removes the left surface structural representation of adhesive layer in LED filament the first embodiment of the utility model embodiment.
Fig. 4 is the B portion enlarged drawing of Fig. 3 in the utility model embodiment.
Fig. 5 is the luminous schematic diagram of LED filament the first embodiment of the utility model embodiment.
Fig. 6 removes the left surface structural representation of adhesive layer in LED filament the second embodiment of the utility model embodiment.
Fig. 7 is the C portion enlarged drawing of Fig. 6 in the utility model embodiment.
Fig. 8 is the luminous schematic diagram of LED filament the second embodiment of the utility model embodiment.
Fig. 9 is the distribution curve flux figure of the LED filament of the utility model embodiment.
The specific embodiment
It should be noted that, in the situation that not conflicting, embodiment and the feature in embodiment in the application can mutually combine, and below in conjunction with the drawings and specific embodiments, the utility model are described in further detail.
As shown in Fig. 1 ~ Fig. 9, the utility model embodiment provides a kind of LED filament, comprises substrate 10, luminescence unit 20 and adhesive layer 30.
Described substrate 10 arranges and is elongated list structure, to form the main body of described LED filament.In the utility model embodiment, described substrate 10 length are 5.00mm ~ 200.00mm, and width is 0.50 ~ 10.00mm, is highly 0.10mm ~ 5.00mm.
As shown in Fig. 2, Fig. 4 and Fig. 7, described luminescence unit 20 is fixed at least one side of described substrate 10, and it comprises blue chip 21 and red light chips 22 that some rules are arranged.Described blue chip 21 and red light chips 22 are in sequential series by plain conductor 40, and the two ends correspondence of described substrate 10 is provided with the electrode pin 50 being connected with the two ends of described plain conductor 40 respectively.
Please refer to Fig. 6 ~ Fig. 8, in the utility model embodiment, for further improving illuminating area and the irradiating angle of described LED filament, in the both side surface of described substrate 10, be provided with described luminescence unit 20.
The described substrate 10 of the utility model embodiment can adopt existing any one baseplate material to make.Please refer to Fig. 5 and Fig. 8, as a kind of embodiment of the best, described substrate 10 arranges and is transparent, so that the light that described luminescence unit 20 sends can see through described substrate 10, from another side, projects, and then effectively increase rising angle and the light extraction efficiency of described LED filament, realize 360 ° luminous.In the utility model embodiment, described substrate 10 preferably adopts the transparent ceramic material with unique optical properties to make, by means of the performances such as heat-resisting quantity, oxidative resistance, electrical insulating property and anti-high pressure of transparent ceramic material self, fully improve the overall quality of described LED filament simultaneously.Certainly, described substrate 10 also can adopt and make as other any applicable materials such as resistant to elevated temperatures perspex materials.
During concrete enforcement, when only when a side of described substrate 10 arranges described luminescence unit 20, adopt one side die bond bonding wire packaging technology, concrete steps are: expand crystalline substance → die bond → baking → bonding wire; When the two-phase of described substrate 10 deviates from side and all described luminescence unit 20 is set, adopt two-sided die bond bonding wire packaging technology, concrete steps are: expand → the second die bond → the second baking → two-sided bonding wire of crystalline substance → first surface die bond → first surface baking.
Described adhesive layer 30 is coated on the periphery of described luminescence unit 20, to form the diaphragm of described luminescence unit 20, and forms the secondary optical lens of described luminescence unit 20 simultaneously, to increase optical reflection, reduces light loss, and improves light efficiency.
In the utility model embodiment, described adhesive layer 30 forms (hereinafter, will " be mixed with the transparent colloid material of fluorescent material " referred to as fluorescent glue) by the transparent colloid material that is mixed with fluorescent material.Because described fluorescent material is excited and can send gold-tinted by described blue chip 21, and the gold-tinted that the blue light that described blue chip 21 sends sends with described fluorescent material coordinates and can form white light, and then can make described LED filament produce the illumination effect close to conventional incandescent filament.Again because being coordinated the colour rendering index of gained white light not high with described fluorescent material by described blue chip 21 merely, thus by being set, described red light chips 22 compensates, to obtain the light of low colour temperature and high-color rendering simultaneously.In implementation process, the magnitude setting of described red light chips 22 is generally far fewer than the magnitude setting of described blue chip 21, described blue chip 21 can specifically arrange according to the required light efficiency obtaining with the allocation ratio of red light chips 22, in the utility model embodiment, at least at interval of two described blue chips 21, be provided with a described red light chips 22.
Please refer to Fig. 1, Fig. 5 and Fig. 8, in the utility model embodiment, described adhesive layer 30 is by described substrate 10 and luminescence unit 20 integral coating in interior, and its cross section outline is rounded, and diameter is 1.00mm ~ 10.00mm.As a kind of embodiment, the cross section outline of described adhesive layer 30 also can arrange and be the arbitrary shape that other meet optical demands.
In the utility model embodiment, described adhesive layer 30 adopts mould model technique to form, and, by moulding press, by means of mould, directly on described substrate 10, by compression molding, generates described adhesive layer 30, specifically comprises the steps:
The substrate 10 of the luminescence unit 20 that is sticked is put into the die cavity of mould;
By upper and lower two secondary mould matched moulds and vacuumize;
The fluorescent glue mixing is injected in mould and solidified.
Adopt described mould model technique to form described adhesive layer 30, make the packaging technology of described LED filament more succinct, precision is higher, and the air-tightness of the described adhesive layer 30 after can effective guarantee moulding, greatly improves plastic packaging efficiency and yields, reduces production costs.
When carrying out described mould model technique, for preventing that the fluorescent material in described fluorescent glue from producing precipitation, the uniformity and the concentration degree that guarantee plastic packaging finished product, can form the fluorescent glue that viscosity is large by modulation, makes described fluorescent material can not produce precipitation within certain service time; Or, also can on described moulding press, arrange and can drive described fluorescent glue to continue the anti-settler rotating, keep described fluorescent glue in continuously active state, and then avoid the precipitation of fluorescent material in described fluorescent glue.
Based on this, the utility model embodiment also provides a kind of LED lamp simultaneously, comprises LED filament as above, and covers at the glass shell of described LED filament outside.Described LED luminaire body can arrange and be bulb lamp, candle lamp etc.By described LED filament is set in described glass shell, 360 ° of realizing described LED lamp are luminous, and effectively improve the color quality of described LED lamp.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that not departing from principle of the present utility model and spirit and can carry out multiple variation, modification, replacement and modification to these embodiment, scope of the present utility model is limited by claims and equivalency range thereof.
Claims (10)
1. a LED filament, is characterized in that, comprises substrate, is fixed on the luminescence unit at least one side of substrate and the adhesive layer that is coated on luminescence unit periphery; Described substrate setting is elongated list structure; Described luminescence unit comprises that some rules are arranged on described substrate and blue chip in sequential series and red light chips.
2. LED filament as claimed in claim 1, is characterized in that, at least at interval of two described blue chips, a described red light chips is set.
3. LED filament as claimed in claim 1, is characterized in that, the length of described substrate is 5.00mm ~ 200.00mm, and width is 0.50 ~ 10.00mm, is highly 0.10mm ~ 5.00mm.
4. LED filament as claimed in claim 1, is characterized in that, is provided with described luminescence unit in the both side surface of described substrate.
5. the LED filament as described in claim 1 or 4, is characterized in that, the cross section outline of described adhesive layer is rounded, and diameter is 1.00mm ~ 10.00mm.
6. LED filament as claimed in claim 1, is characterized in that, described adhesive layer adopts the transparent colloid material that is mixed with fluorescent material to form.
7. LED filament as claimed in claim 1, is characterized in that, described substrate setting is transparent.
8. LED filament as claimed in claim 1, is characterized in that, described adhesive layer adopts mould model technique to form.
9. LED filament as claimed in claim 1 or 2, is characterized in that, described blue chip and red light chips are in sequential series by plain conductor, and the two ends of described substrate are provided with the electrode pin being connected with the two ends of described plain conductor respectively.
10. a LED lamp, is characterized in that, comprises LED filament as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320345993.7U CN203413560U (en) | 2013-06-17 | 2013-06-17 | LED (light-emitting diode) lamp and lamp filament thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320345993.7U CN203413560U (en) | 2013-06-17 | 2013-06-17 | LED (light-emitting diode) lamp and lamp filament thereof |
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| Publication Number | Publication Date |
|---|---|
| CN203413560U true CN203413560U (en) | 2014-01-29 |
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| CN201320345993.7U Expired - Lifetime CN203413560U (en) | 2013-06-17 | 2013-06-17 | LED (light-emitting diode) lamp and lamp filament thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103322525A (en) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | LED (light-emitting diode) lamp and filament thereof |
| CN103791286A (en) * | 2014-02-21 | 2014-05-14 | 李文雄 | Linear LED light source, linear LED lamp and manufacturing method for linear LED light source |
| CN103953863A (en) * | 2014-04-23 | 2014-07-30 | 广东聚科照明股份有限公司 | 360-degree full peripheral light lamp bar |
| WO2015144030A1 (en) * | 2014-03-24 | 2015-10-01 | 东莞市雷明灯照明科技有限公司 | Led lamp wick and manufacturing method for led filament monomer thereof |
| WO2020000709A1 (en) * | 2018-06-25 | 2020-01-02 | 深圳市瑞丰光电子股份有限公司 | Led filament having multiple bound surfaces |
-
2013
- 2013-06-17 CN CN201320345993.7U patent/CN203413560U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103322525A (en) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | LED (light-emitting diode) lamp and filament thereof |
| CN103791286A (en) * | 2014-02-21 | 2014-05-14 | 李文雄 | Linear LED light source, linear LED lamp and manufacturing method for linear LED light source |
| WO2015144030A1 (en) * | 2014-03-24 | 2015-10-01 | 东莞市雷明灯照明科技有限公司 | Led lamp wick and manufacturing method for led filament monomer thereof |
| CN103953863A (en) * | 2014-04-23 | 2014-07-30 | 广东聚科照明股份有限公司 | 360-degree full peripheral light lamp bar |
| WO2020000709A1 (en) * | 2018-06-25 | 2020-01-02 | 深圳市瑞丰光电子股份有限公司 | Led filament having multiple bound surfaces |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140129 |
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| CX01 | Expiry of patent term |