CN206210831U - A kind of LED support, LED component and LED display - Google Patents
A kind of LED support, LED component and LED display Download PDFInfo
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- CN206210831U CN206210831U CN201621141556.3U CN201621141556U CN206210831U CN 206210831 U CN206210831 U CN 206210831U CN 201621141556 U CN201621141556 U CN 201621141556U CN 206210831 U CN206210831 U CN 206210831U
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- led
- pad
- width
- die bond
- reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Abstract
The utility model is related to a kind of LED support, LED component and LED display, wherein, the reflector bottom inside face of the LED support is provided with for carrying LED chip and realizing at least two pads that LED chip is electrically connected with metal pins；Insulating regions between per adjacent two pad form river course；And the width in each river course is 0.1 μm~0.25 μm.Thus the utility model is reasonably set by river width, meet die bond and bonding wire requirement, reduce the difficulty of die bond and bonding wire, and avoid causing bonding pad area to reduce the die bond that causes and wire-bonding operations window is too small, large chip cannot place phenomenon therein and occur because river course is too wide, at the same it also avoid because river width is too small cause adjacent pad between easily contact caused short circuit and failure；And facilitate Incoming Quality Control, and reduce batch sex differernce, fraction defective is reduced, and meet industrialized production.
Description
Technical field
The utility model is related to LED technology field, more particularly to a kind of pad river width moderate LED support, LED devices
Part and LED display.
Background technology
LED support generally comprises metallic support and wraps up the cup cover of the metallic support.The metal branch is located in the cup cover
The part of top of the trellis is reflector.The metallic support is by the metal pins that are embedded in reflector and exposes to the gold outside reflector
Category pin composition.The reflector bottom inside face is provided with for carrying LED chip and realizing LED chip with the metal pins
At least two pads of electrical connection, and insulating regions between pad are in river course is formed in reflector bottom inside face, then pad it
Between spacing be river width.
Because the size of LED support is limited, then river width has larger to the arrangement of chip and routing technique
Influence, that is, in the bottom inside face of the reflector with certain area, river course thereon is wider, the significant surface of metal pad
Product will be fewer, then the requirement of placement region will be stricter when causing chip to be fixed；Meanwhile, to carrying out electricity using bonding techniques
For the technique of road conducting, position of bonding wire can also be restricted, and operable window is also smaller, is unfavorable for industrialized production.Also,
If river width is too small, deform because LED support is easily influenceed by external force, cause phase in the bottom inside face of reflector
Adjacent pad is mutually approaching or even connected, and so as to cause LED component internal short circuits, final LED component shows as cross luma, from
And cause the fraction defective of LED component to improve.
Also, in the industrial production, may there is very much the river course of different batches supplied materials greatly because batch supplied materials is supplied
Width is inconsistent, and the die bond and routing procedure when being produced to LED component will also result in very big influence, and cause fraction defective liter
It is high.
Therefore, it is necessary to study the scope of river width, a kind of appropriate river course of width is found, to meet industry
Metaplasia is produced.
Utility model content
The purpose of this utility model is to solve the shortcoming and defect of above-mentioned prior art, there is provided a kind of LED support, is led to
Cross and river width is reasonably set, meet die bond and bonding wire requirement, reduce the difficulty of die bond and bonding wire, it is to avoid because of river course
The die bond and wire-bonding operations window for causing bonding pad area to reduce and causing too wide is too small, large chip cannot place phenomenon therein and send out
It is raw, at the same also avoid because river width is too small cause adjacent pad between easily contact caused short circuit and failure；And it is square
Just Incoming Quality Control, reduces batch sex differernce, reduces fraction defective, and meet industrialized production.It is of the present utility model another object is that
A kind of LED component comprising above-mentioned LED support and LED display are provided.
To achieve these goals, the technical solution adopted in the utility model is as follows：
A kind of LED support, including metallic support and the cup cover for wrapping up the metallic support；The metal branch is located in the cup cover
The part of top of the trellis is reflector；The metallic support is by the metal pins that are embedded in reflector and exposes to the gold outside reflector
Category pin composition；The reflector bottom inside face is provided with for carrying LED chip and realizing that LED chip is electrically connected with metal pins
At least two pads for connecing；Insulating regions between per adjacent two pad form river course；The width in each river course is 0.1 μm~0.25
μm。
Preferably, the length range of the LED support be 0.75mm~3.55mm, width range be 0.75mm~
The width in each river course in 3.05mm, and its reflector is 0.1 μm~0.12 μm..
Preferably, the length range and width range of the LED support are in 1.75mm~5.05mm, and its reflector
Each river course width be 0.15 μm~0.25 μm..
Preferably, the reflector bottom inside face is provided with a die bond pad and a wiring pad；The die bond pad and
The width in the river course that the insulating regions between the wiring pad are formed is 0.1 μm~0.12 μm or 0.15 μm~0.25 μm.
Preferably, the reflector bottom inside face is provided with a die bond pad, a public wiring pad and an at least electrode
Pad；The die bond pad is arranged between the public wiring pad and the electrode pad, and the die bond pad is distinguished
The width in the river course formed with the insulating regions between public wiring pad and the electrode pad is 0.1 μm~0.12 μm.
Preferably, the reflector bottom inside face is provided with least two groups of chip pad；Every group of chip bonding pad includes one
The river that insulating regions between die bond pad and a wiring pad, and every group of the die bond pad and wiring pad of chip bonding pad are formed
Road width is 0.15 μm~0.25 μm；And the width in the river course formed per the insulating regions between two adjacent groups chip bonding pad is
0.15 μm~0.25 μm.
Preferably, the lateral surface of the reflector is partially provided with light-absorption layer.
To reach the second purpose of the present utility model, the utility model provides a kind of LED component, it include LED support,
At least a LED chip and packing colloid；The LED chip is arranged in the LED support；The packing colloid covering is described
LED chip.Wherein, the LED support is the LED support described in any of the above-described.
Preferably, packing colloid is transparent colloid.
To reach the 3rd purpose of the present utility model, the utility model provides a kind of LED display, and it is by some LED
The evenly distributed formation of device；Each LED component is LED component described above.
Thus, by above-mentioned technical proposal, the utility model has reached following beneficial technique effect：
1) reasonably set by river width, met die bond and bonding wire requirement, reduced the difficulty of die bond and bonding wire
Degree, it is to avoid causing bonding pad area to reduce the die bond that causes and wire-bonding operations window is too small, large chip cannot be put because river course is too wide
Phenomenon therein is put to occur, at the same also avoid because river width is too small cause adjacent pad between easy caused short of contact
Road and failure；And facilitate Incoming Quality Control, and reduce batch sex differernce, fraction defective is reduced, and meet industrialized production；
2) limited respectively by the river width in the reflector bottom inside face of the LED support to different size specification
It is fixed, be conducive to the size of the LED support according to practical application, there is provided more preferable river width, further to meet industry
Metaplasia is produced, and is further reduced batch sex differernce and reduced fraction defective；
3) entered respectively by the river width in the reflector bottom inside face to the LED support with different pad structures
Row is limited, and is conducive to the pad structure further according to practical application LED support, there is provided more preferable river width, with further
Meet industrialized production, and further reduce batch sex differernce and reduce fraction defective；
4) by providing the LED component and LED display of a kind of LED support including after above-mentioned improvement, be conducive into one
Step meets the industrialized production of LED component and LED display, and further reduces the batch difference of LED component and LED display
Different and reduction fraction defective.
Brief description of the drawings
Fig. 1 is the side structure schematic view of LED support in the utility model embodiment 1-1；
Fig. 2 is the overlooking the structure diagram of LED support in the utility model embodiment 1-1；
Fig. 3 is the overlooking the structure diagram of LED support in the utility model embodiment 1-2；
Fig. 4 is the overlooking the structure diagram of LED support in the utility model embodiment 1-3；
Fig. 5 is the overlooking the structure diagram of LED support in the utility model embodiment 1-4；
Fig. 6 is the side structure schematic view of LED component in the utility model embodiment 2-1；
Fig. 7 is the vertical view knot of the LED chip one of which welding manner in LED component in the utility model embodiment 2-1
Structure schematic diagram；
Fig. 8 is the plan structure of the LED chip another kind welding manner in LED component in the utility model embodiment 2-1
The side structure schematic view of schematic diagram；
Fig. 9 is the overlooking the structure diagram of LED component in the utility model embodiment 2-2；
Figure 10 is the overlooking the structure diagram of LED component in the utility model embodiment 2-3；
Figure 11 is the overlooking the structure diagram of LED component in the utility model embodiment 2-4.
Specific embodiment
The utility model provides a kind of LED support, LED component and LED display, in order that those skilled in the art
The technical solution of the utility model is better understood when, further is made to the utility model with preferred embodiment below in conjunction with the accompanying drawings
Detailed description.
A kind of embodiment of LED support
Embodiment 1-1
Refer to Fig. 1, a kind of LED support 1, including metallic support 11 and wrap up the cup cover 12 of the metallic support 11.It is described
The part that the top of metallic support 11 is located in cup cover 12 is reflector 121.The metallic support 11 is by embedded reflector 121
Metal pins 111 and the metal pin 112 that exposes to outside reflector 121 constitute.The bottom inside face of the reflector 121 is provided with
For carrying LED chip and realizing at least two pads 13 that LED chip is electrically connected with metal pins 111.Per adjacent two pad it
Between insulating regions formed river course；The width in each river course is 0.1 μm~0.25 μm.
Fig. 2 is referred to, in the present embodiment, the reflector bottom inside face is provided with a die bond pad 131 and a wiring
Pad 132.The width of the river course a1 that the insulating regions between the die bond pad 131 and the wiring pad 132 are formed is 0.1
μm~0.12 μm or 0.15 μm~0.25 μm.
It is pad structure and the size more preferable river width of acquisition further combined with LED support, as one kind more
Excellent technical scheme, the length range of the LED support is 0.75mm~3.55mm, and width range is 0.75mm~3.05mm,
And the width in each river course in its reflector is 0.1 μm~0.12 μm；Or, the length range and width of the LED support
The width that scope is each river course in 1.75mm~5.05mm, and its reflector is 0.15 μm~0.25 μm.
It is further preferred that the lateral surface of the reflector is partially provided with light-absorption layer.
Embodiment 1-2
LED support in the present embodiment is essentially identical with the structure of the LED support of embodiment 1-1, and it is differed only in：Change
Become the width of the pad structure and corresponding river course in reflector bottom inside face, that is, Fig. 3 is referred to, in the present embodiment 1-2
In, the bottom inside face of the reflector 121 is provided with a die bond pad 133, the electrode pad 135 of a public wiring pad 134 and.
The die bond pad 133 is arranged between the public wiring pad 134 and the electrode pad 135, and the die bond pad
The width of 133 the river course a2 and a3 for being formed with the insulating regions between public wiring pad 134 and the electrode pad 135 respectively
It is 0.1 μm~0.12 μm.
It is pad structure and the size more preferable river width of acquisition further combined with LED support, as one kind more
Excellent technical scheme, the length range of the LED support is 0.75mm~3.55mm, and width range is 0.75mm~3.05mm.
Embodiment 1-3
The structure of the LED support in LED support in the present embodiment and embodiment 1-2 is essentially identical, and it is differed only in：
Change the pad structure in reflector bottom inside face, that is, referring to Fig. 4, the bottom inside face of the reflector 121 is provided with one
Die bond pad 136, the electrode pad 138 and 139 of a public wiring pad 137 and two.The public wiring pad 137 is arranged at instead
The left part of the bottom inside face of cup 121 is penetrated, the die bond pad 136 is arranged in the bottom inside face of the reflector 121
Portion part, and two electrode pad 138 and 139 is arranged at the right part of the bottom inside face of the reflector 121 jointly.Often
The river course all formed by the insulating regions between insulating regions separation, and every two adjacent pads between two adjacent pads
The width of a4, a5 and a6 is 0.1 μm~0.12 μm.
It is pad structure and the size more preferable river width of acquisition further combined with LED support, as one kind more
Excellent technical scheme, the length range of the LED support is 0.75mm~3.55mm, and width range is that 0.75mm~3.05mm is another
Outward, the present embodiment 1-3 also has other variant embodiments, for example, change the quantity of electrode pad, that is, the number of electrode pad
Amount can also be set to 3,4 etc..
Embodiment 1-4
The structure of the LED support in LED support in the present embodiment and embodiment 1-1 is essentially identical, and it is differed only in：
Change the width of the pad structure and corresponding river course in reflector bottom inside face, that is, Fig. 5 is referred to, the reflector
121 bottom inside faces are provided with least two groups of chip pad, and in the present embodiment, the chip bonding pad has 3 group 21,22 and 23.
Every group of chip bonding pad includes a die bond pad 141 and a wiring pad 142, and every group of He of die bond pad 141 of chip bonding pad
The width of the river course a7 that the insulating regions between wiring pad 142 are formed is 0.15 μm~0.25 μm；And per two adjacent groups chip
The width of the river course a8 that the insulating regions between pad are formed is 0.15 μm~0.25 μm.
It is pad structure and the size more preferable river width of acquisition further combined with LED support, as one kind more
Excellent technical scheme, the length range and width range of the LED support are 1.75mm~5.05mm.
A kind of LED component embodiment
Embodiment 2-1
Refer to Fig. 6, a kind of LED component 10, including LED support, a LED chip 101 and packing colloid 102.The LED
Chip 101 is arranged in the LED support；The packing colloid 102 covers the LED chip 101.
Wherein, the LED support be a kind of above-mentioned LED support embodiment in LED support in embodiment 1-1.
Fig. 7 is referred to, the negative pole of the LED chip 101 is fixedly arranged in the reflector bottom of the LED support by conducting resinl
Die bond pad 131 on side, and its positive pole is welded in the wiring pad 132 by bonding wire.Now, the LED chip 101
It is red LED chip.
Or, Fig. 8 is referred to, the bottom of the LED chip 101 is fixed on the reflector of the LED support by insulating cement
Die bond pad 131 in bottom inside face, and its negative pole is welded in the die bond pad 131 by bonding wire, and its positive pole passes through
Bonding wire is welded in the wiring pad 132.Now, the LED chip 101 is the LED chip of non-feux rouges, that is, the LED core
Piece 101 is blue-light LED chip or yellow light LED chip etc..
Preferably, the packing colloid is transparent colloid.
Embodiment 2-2
The structure of the LED component in LED component in the present embodiment and embodiment 2-1 is essentially identical, and its difference is：This
The LED support of the LED component in embodiment 2-2 is the LED support in embodiment 1-2, and the LED component includes a LED
Chip and the second LED chip.
In the present embodiment, the bonding wire knot of LED chip is illustrated so that the public wiring pad 134 is common-anode pad as an example
Structure.Fig. 9 is referred to, first LED chip 102 is red LED chip, and its bottom and its negative pole are fixedly arranged on institute by conducting resinl
Die bond pad 133 is stated, its positive pole is welded in the public wiring pad 134 by bonding wire.
Second LED chip 103 is non-red LED chip (being such as blue light or gold-tinted or purple LED chip), its bottom
Portion is fixedly arranged on the die bond pad 133 by insulating cement, and its top positive pole is welded in the public wiring pad by bonding wire
134, its top negative pole is welded in the electrode pad 135 by bonding wire.
In other variant embodiments, the public wiring pad 134 can be common cathode pad, the specific mode of connection
Principle is identical with above-mentioned principle, therefore repeats no more.
Embodiment 2-3
The structure of the LED component in LED component in the present embodiment and embodiment 2-2 is essentially identical, and its difference is：This
The LED support of the LED component in embodiment 2-3 is the LED support in embodiment 1-3, and the LED component includes a LED
Chip, the second LED chip and the 3rd chip.
In the present embodiment, the bonding wire knot of LED chip is illustrated so that the public wiring pad 137 is common-anode pad as an example
Structure.Figure 10 is referred to, first LED chip 104 is red LED chip, and its bottom and its negative pole are fixedly arranged on by conducting resinl
The die bond pad 136, its positive pole is welded in the public wiring pad 137 by bonding wire.
Second LED chip 105 is non-red LED chip (being such as blue light or gold-tinted or purple LED chip), its bottom
Portion is fixedly arranged on the die bond pad 136 by insulating cement, and its top positive pole is welded in the public wiring pad by bonding wire
137, its top negative pole is welded in the wherein electrode pad 138 in two electrode pads by bonding wire.
3rd LED chip 106 is non-red LED chip (being such as blue light or gold-tinted or purple LED chip), its bottom
Portion is fixedly arranged on the die bond pad 136 by insulating cement, and its top positive pole is welded in the public wiring pad by bonding wire
137, its top negative pole is welded in another electrode pad 139 by bonding wire.
In addition, the present embodiment 2-3 also has other variant embodiments, for example, according to above-mentioned middle electrode pad and LED chip
Between quantitative relation, correspondingly change electrode pad number and LED chip number.
In other variant embodiments, the public wiring pad 137 can be common cathode pad, the specific mode of connection
Principle is identical with above-mentioned principle, therefore repeats no more.
Embodiment 2-4
The structure of the LED component in LED component in the present embodiment and embodiment 2-1 is essentially identical, and its difference is：This
The LED support of the LED component in embodiment 2-4 is the LED support in embodiment 1-4, and the LED component includes a LED
Chip, the second LED chip and the 3rd chip.
Refer to Figure 11, first LED chip 107, the second LED chip 108 and the 3rd LED chip 109 respectively with institute
The 3 groups of chip bonding pads 21,22 and 23 stated in LED support are corresponded.
The bottom of first LED chip 107 and its negative pole are fixed in corresponding chip bonding pad 21 by conducting resinl
Die bond pad 211, and its positive pole is welded in the wiring pad 212 in corresponding chip bonding pad 21 by bonding wire.
Welded by the die bond that insulating cement is fixed in corresponding chip bonding pad 22 bottom of second LED chip 108
Disk 221, its top negative pole is welded in the die bond pad 221 in corresponding chip bonding pad 22 by bonding wire, and its top is just
Pole is welded in the wiring pad 222 in corresponding chip bonding pad 22 by bonding wire.
Welded by the die bond that insulating cement is fixed in corresponding chip bonding pad 23 bottom of 3rd LED chip 109
Disk 231, its top negative pole is welded in the die bond pad 231 in corresponding chip bonding pad 23 by bonding wire, and its top is just
Pole is welded in the wiring pad 232 in corresponding chip bonding pad 23 by bonding wire.
In addition, the present embodiment 2-4 also has other variant embodiments, for example, according to above-mentioned chips pad and LED chip
Between quantitative relation, correspondingly change chip bonding pad group number and LED chip number.
A kind of LED display embodiment
A kind of LED display, it is formed by some LED components are evenly distributed.In the present embodiment, each LED component is
LED component in a kind of above-mentioned LED component embodiment described in embodiment 2-1~embodiment any one of 2-4, therefore no longer go to live in the household of one's in-laws on getting married herein
State.
Further to improve the contrast of LED display, it is preferable that the centre-to-centre spacing of the LED component of arbitrary neighborhood two is P2.5.
Relative to prior art, LED support, LED component and LED display that the utility model is provided, its advantage
It is：
1) reasonably set by river width, met die bond and bonding wire requirement, reduced the difficulty of die bond and bonding wire
Degree, it is to avoid causing bonding pad area to reduce the die bond that causes and wire-bonding operations window is too small, large chip cannot be put because river course is too wide
Phenomenon therein is put to occur, at the same also avoid because river width is too small cause adjacent pad between easy caused short of contact
Road and failure；And facilitate Incoming Quality Control, and reduce batch sex differernce, fraction defective is reduced, and meet industrialized production；
2) limited respectively by the river width in the reflector bottom inside face of the LED support to different size specification
It is fixed, be conducive to the size of the LED support according to practical application, there is provided more preferable river width, further to meet industry
Metaplasia is produced, and is further reduced batch sex differernce and reduced fraction defective；
3) entered respectively by the river width in the reflector bottom inside face to the LED support with different pad structures
Row is limited, and is conducive to the pad structure further according to practical application LED support, there is provided more preferable river width, with further
Meet industrialized production, and further reduce batch sex differernce and reduce fraction defective；
4) by providing the LED component and LED display of a kind of LED support including after above-mentioned improvement, be conducive into one
Step meets the industrialized production of LED component and LED display, and further reduces the batch difference of LED component and LED display
Different and reduction fraction defective.
The utility model is not limited to above-mentioned implementation method, if do not taken off to various changes of the present utility model or deformation
From spirit and scope of the present utility model, if these are changed and deformation belongs to claim of the present utility model and equivalent technologies
Within the scope of, then the utility model is also intended to comprising these changes and deforms.
Claims (10)
1. a kind of LED support, including metallic support and the cup cover for wrapping up the metallic support；The metallic support is located in the cup cover
The part at top is reflector；The metallic support is by the metal pins that are embedded in reflector and exposes to the metal outside reflector
Pin is constituted；The reflector bottom inside face is provided with for carrying LED chip and realizing that LED chip is electrically connected with metal pins
At least two pads；Insulating regions between per adjacent two pad form river course；It is characterized in that：The width in each river course is
0.1 μm~0.25 μm.
2. LED support according to claim 1, it is characterised in that：The length range of the LED support be 0.75mm~
3.55mm, width range is that the width in each river course in 0.75mm~3.05mm, and its reflector is 0.1 μm~0.12 μm.
3. LED support according to claim 1, it is characterised in that：The length range and width range of the LED support are equal
It is 1.75mm~5.05mm, and the width in each river course in its reflector is 0.15 μm~0.25 μm.
4. LED support according to claim 1, it is characterised in that：The reflector bottom inside face is provided with die bond weldering
Disk and a wiring pad；The width in the river course that the insulating regions between the die bond pad and the wiring pad are formed is 0.1 μ
M~0.12 μm or 0.15 μm~0.25 μm.
5. LED support according to claim 1, it is characterised in that：The reflector bottom inside face is provided with die bond weldering
Disk, a public wiring pad and an at least electrode pad；The die bond pad is arranged at the public wiring pad and the electricity
Between the pad of pole, and the die bond pad respectively between public wiring pad and the electrode pad insulating regions formed
The width in river course is 0.1 μm~0.12 μm.
6. LED support according to claim 1, it is characterised in that：The reflector bottom inside face is provided with least two groups
Chip bonding pad；Every group of chip bonding pad includes a die bond pad and a wiring pad, and every group of die bond pad of chip bonding pad and
The river width that insulating regions between wiring pad are formed is 0.15 μm~0.25 μm；And per between two adjacent groups chip bonding pad
Insulating regions formed river course width be 0.15 μm~0.25 μm.
7. LED support according to claim 1, it is characterised in that：The lateral surface of the reflector is partially provided with extinction
Layer.
8. a kind of LED component, including LED support, at least a LED chip and packing colloid；The LED chip is arranged at described
In LED support；The packing colloid covers the LED chip；It is characterized in that：The LED support is claim 1~7 times
LED support described in one.
9. LED component according to claim 8, it is characterised in that：Packing colloid is transparent colloid.
10. a kind of LED display, is formed by some LED components are evenly distributed, it is characterised in that：Each LED component will for right
Seek the LED component described in 8.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621141556.3U CN206210831U (en) | 2016-10-20 | 2016-10-20 | A kind of LED support, LED component and LED display |
| KR1020170121881A KR20180032206A (en) | 2016-09-21 | 2017-09-21 | LED support, LED elements and LED screen |
| US15/711,057 US10290783B2 (en) | 2016-09-21 | 2017-09-21 | LED bracket, LED device and LED display screen |
| JP2017005239U JP3214714U (en) | 2016-09-21 | 2017-11-16 | LED bracket, LED device and LED display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621141556.3U CN206210831U (en) | 2016-10-20 | 2016-10-20 | A kind of LED support, LED component and LED display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206210831U true CN206210831U (en) | 2017-05-31 |
Family
ID=58757073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621141556.3U Active CN206210831U (en) | 2016-09-21 | 2016-10-20 | A kind of LED support, LED component and LED display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206210831U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162150A (en) * | 2018-11-07 | 2020-05-15 | 惠州市聚飞光电有限公司 | LED (light-emitting diode) luminous piece and manufacturing method thereof |
| CN116056321A (en) * | 2022-08-05 | 2023-05-02 | 荣耀终端有限公司 | Circuit board, circuit board assembly and electronic equipment |
-
2016
- 2016-10-20 CN CN201621141556.3U patent/CN206210831U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162150A (en) * | 2018-11-07 | 2020-05-15 | 惠州市聚飞光电有限公司 | LED (light-emitting diode) luminous piece and manufacturing method thereof |
| CN116056321A (en) * | 2022-08-05 | 2023-05-02 | 荣耀终端有限公司 | Circuit board, circuit board assembly and electronic equipment |
| CN116056321B (en) * | 2022-08-05 | 2023-10-20 | 荣耀终端有限公司 | Circuit board, circuit board assembly and electronic equipment |
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