CN206505944U - A kind of die bond position flexible LED support, LED component and LED modules - Google Patents
A kind of die bond position flexible LED support, LED component and LED modules Download PDFInfo
- Publication number
- CN206505944U CN206505944U CN201621300217.5U CN201621300217U CN206505944U CN 206505944 U CN206505944 U CN 206505944U CN 201621300217 U CN201621300217 U CN 201621300217U CN 206505944 U CN206505944 U CN 206505944U
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- Prior art keywords
- led
- die bond
- led chip
- chip
- bond pad
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Abstract
A kind of die bond position flexible LED support, LED component and LED modules, including metallic support and the cup cover for wrapping up the metallic support；The metallic support includes the metal pins in embedded cup cover；It is reflector that the part at the top of the metal pins is arranged in the cup cover；The reflector is provided with a hollow cavity, the part that the metal pins are located at the bottom surface of the hollow cavity is pad, the pad is divided into die bond pad and wire bond pads by the river course insulated, the shape of the die bond pad is limited by the river course positioned at its both sides, and the width at the middle part of the die bond pad is less than the width at its two ends.The utility model is shaped as the wide die bond pad in middle narrow two ends by setting one, the larger chip of volume is set flexibly to be fixed in the either end of die bond pad, the position of each LED chip can need adjustment according to production, reduce product batch caused by putting mistake due to LED chip position in production to scrap, also make bonding wire mode more flexible.
Description
Technical field
The utility model is related to a kind of luminescent device, more particularly to a kind of LED support, LED component and LED modules.
Background technology
Referring to Fig. 1, its structural representation for indoor conventional TOP-LED devices in the prior art.The TOP-LED devices
Part includes LED support, is fixed on LED chip 03, bonding wire and packaging plastic 04 on LED support, and the LED support includes metal branch
Frame 02 and the cup cover 01 for wrapping up the metallic support 02, metallic support 02 include the metal pins in embedded cup cover and are exposed at cup cover
The part being arranged in outer metal pin, this glass cover 01 at the top of the metal pins is reflector；The reflector is provided with one
Hollow cavity, the part that the metal pins are located at the hollow cavity bottom surface is pad, and the packaging plastic 04 is filled in cup cover 01
Intracavitary in empty, and wrap up LED chip 03.It is each that the LED chip includes red LED chip, green LED chip and blue-light LED chip
A piece of, red LED chip is the single electrode chip of vertical stratification, and green glow and blue-light LED chip are the bipolar electrode of horizontal structure
Chip.
The pad includes die bond pad 021 and wire bond pads 022, and wherein LED chip is each attached on die bond pad 021,
The bottom of red LED chip is directly anchored on die bond pad 021 by conducting resinl, and another electrode passes through bonding wire and bonding wire
Pad 022 is connected, and green glow and blue-light LED chip are fixed on die bond pad 021 by insulating cement, and two electrodes pass through weldering respectively
Line is connected with two wire bond pads 022.The shape of the die bond pad 021 is limited by the river course for being used to insulate positioned at its both sides
Fixed, wherein the river course of side is straight line, and the river course of opposite side is rectangular-shaped broken line, and the one end for making die bond pad 021 is wide
Bar shaped, the width expansion of the other end, three LED chips are linearly arranged on the die bond pad 021, wherein, red-light LED
Chip is fixed on one end of the expansion.It is in order to preferably fix red LED chip, due to hanging down that one end of the die bond pad, which expands,
The green glow and blue-light LED chip volume of the volume ratio horizontal structure of the red LED chip of straight structure are big, and for fixing feux rouges
The volume of the conducting resinl of LED chip is larger, and conducting resinl easily flows through river course and causes short circuit, thus be accordingly used in fixed red LED chip
Bonding pad area used is bigger than the bonding pad area of green glow and blue-light LED chip, but consequently, it is possible to the die bond position of red LED chip
It is unique to put, it is impossible to adjusted, if occurring LED chip position in production puts mistake, or due to LED support placing direction
Wrong to cause LED chip position to put mistake, then this batch of product rejection, further, since the position of red LED chip is unique, leads
Cause the set-up mode and size, the connected mode of bonding wire of pad by larger limitation, be unfavorable for industrialized production.In addition, simultaneously
The red LED chip of vertical stratification is not limited to, as long as, all easily there is above-mentioned technology in arrangement and asks in large volume LED chip
Topic.
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides what a kind of large volume LED chip can flexibly arrange
LED support.
The technical scheme that the utility model is used is：
A kind of flexible LED support in die bond position, including metallic support and the cup cover for wrapping up the metallic support；The metal branch
Frame includes the metal pins in embedded cup cover；It is reflector that the part at the top of the metal pins is arranged in the cup cover；Institute
Reflector is stated provided with a hollow cavity, the part that the metal pins are located at the bottom surface of the hollow cavity is pad, the weldering
Disk is divided into die bond pad and wire bond pads by the river course insulated, and the shape of the die bond pad is by the river positioned at its both sides
Road is limited, and the width at the middle part of the die bond pad is less than the width at its two ends.
LED support of the present utility model, is shaped as the wide die bond pad in middle narrow two ends by setting one, makes volume larger
Chip can flexibly be fixed in the either end of die bond pad, make the fixed position of large volume chip more flexible, each LED core
The position of piece can need adjustment according to production, reduce product batch caused by putting mistake due to LED chip position in production and report
It is useless, also make bonding wire mode more flexible.
Further, positioned at the both sides of the die bond pad river course be shaped as arc-shaped, linear or polyline shaped.
Further, the river course positioned at the both sides of the die bond pad is shaped as arc-shaped, the circle in the both sides river course
Arc bending direction on the contrary, or the both sides river course circular arc bending direction is identical and circular arc curvature radius of the both sides river course not
Together.
The utility model also provides a kind of flexible LED component in die bond position, including LED support, LED chip and packaging plastic
Body；The LED chip is arranged in the LED support；The packing colloid covers the LED chip；The LED support is upper
The LED support stated.
Further, the LED chip is any one in red LED chip, green LED chip or blue-light LED chip
Plant, combine for two or three.
Further, the LED chip includes three LED chips, respectively red LED chip, green LED chip and indigo plant
Light LED chip, the red LED chip is fixed on the either end of the die bond pad.
Further, the LED chip is arranged on the die bond pad with straight line or triangle manner.
Further, the red LED chip is single electrode chip, and the green LED chip and blue-light LED chip are double
Electrode chip.
Above-mentioned preferred scheme, makes thin-film LED, especially red LED chip, can be flexible as large volume chip
Arrangement, when LED chip uses redgreenblue LED chip, the position of each LED chip can need adjustment according to production.
A kind of flexible LED modules in die bond position, including module wiring board, the LED devices on the module wiring board
Part, driving IC and resistance, electric capacity；The LED component is above-mentioned LED component.
Further, the LED chip of each LED component includes three LED chips, respectively red LED chip, green
Light LED chip and blue-light LED chip；Red LED chip, blue light can be constituted between LED chip per two adjacent LEDs device
The triarray of LED chip and green LED chip.
In order to more fully understand and implement, the utility model is described in detail below in conjunction with the accompanying drawings.
Brief description of the drawings
Fig. 1 is the structural representation of TOP-LED devices of the prior art, and Fig. 1 (a) is front view, and Fig. 1 (b) is to overlook
Figure；
Fig. 2 is the structural representation of the LED support of the utility model embodiment one, and Fig. 2 (a) is front view, and Fig. 2 (b) is
Top view；
Fig. 3 is the structural representation of the LED support of the utility model embodiment two；
Fig. 4 is the structural representation of the LED support of the utility model embodiment three；
Fig. 5 is the structural representation of the LED component of the utility model example IV, employs the LED branch in embodiment one
Frame, Fig. 5 (a) is front view, and Fig. 5 (b) is top view, and Fig. 5 (c) and 5 (d) are employed in embodiment two and embodiment three respectively
LED support LED component top view；
Fig. 6 is the structural representation of the LED modules of the utility model embodiment five, and which employs the LED in embodiment two
Support；
Fig. 7 is the structural representation of the LED modules of the utility model embodiment five, and which employs the LED in embodiment three
Support.
Embodiment
Embodiment one
Referring to Fig. 2, its structural representation for the LED support of the utility model embodiment one, Fig. 2 (a) is front view,
Fig. 2 (b) is top view.A kind of flexible LED support in die bond position includes metallic support 20 and wraps up the cup cover of the metallic support 20
10, metallic support 20 includes setting in the metal pins in embedded cup cover and the metal pin being exposed at outside cup cover, the cup cover 10
Part at the top of the metal pins is reflector；The reflector is provided with a hollow cavity, and the metal pins are located in this
The part of empty inner chamber bottom surface is pad, and insulation river course of the pad on hollow cavity bottom surface is divided into a die bond pad 210
With three wire bond pads 220, the shape of the die bond pad 210 is limited by the river course positioned at its both sides, side of the present utility model
Case is that the width at the middle part of die bond pad 210 is less than the width at its two ends.The river course for being located at the both sides of die bond pad 210 is curved
Bent arc-shaped river course in opposite direction, the area of die bond pad 210 is relatively small, and LED chip can linearly be arranged in solid
In brilliant pad 210.
Embodiment two
Referring to Fig. 3, its structural representation for the LED support of the utility model embodiment two.The present embodiment is with implementing
Example one is essentially identical, only following difference：The river course for being located at the both sides of die bond pad 211 is bending direction identical arc-shaped river
Road, and the radius of curvature of two circular arcs is different, the width at the middle part of die bond pad 211 is less than the width at its two ends.Die bond pad
211 shape is set, and makes the die bond pad of the present embodiment big relative to the area of the die bond pad in embodiment one, accordingly
Ground, arrangement of the LED chip on die bond pad can not point-blank, further, and LED chip can be with triangle side
Formula is arranged on die bond pad.
Embodiment three
Referring to Fig. 4, its structural representation for the LED support of the utility model embodiment three.The present embodiment is with implementing
Example one is essentially identical, only following difference：The river course for being located at the both sides of die bond pad 212 is respectively linear river course and polyline shaped
River course, and linearly river course is tilted relative to two broken lines in polyline shaped river course, is less than the width at the middle part of die bond pad 212
The width at its two ends.The shape of die bond pad 212 is set, and makes the die bond pad of the present embodiment relative to consolidating in embodiment one
The area of brilliant pad is big, and correspondingly, LED chip can be arranged on die bond pad with triangle manner.
Example IV
Referring to Fig. 5, it is the structural representation of the LED component of the utility model example IV, embodiment one is employed
In LED support, Fig. 5 (a) is front view, and Fig. 5 (b) is top view.A kind of flexible LED component in die bond position, including LED branch
Frame, LED chip 30 and packaging plastic 40.The packaging plastic 40 is filled in the hollow cavity of cup cover 10, and wraps up LED chip 30.Its
In, LED chip 30 is each attached on the die bond pad 21, and the LED chip 30 is red LED chip, green LED chip or blue light
In LED chip any one, two or three of combination, preferably LED chip includes three LED chips in the present embodiment, respectively
For the combination of red LED chip, green LED chip and blue-light LED chip, red LED chip is the single electrode core of vertical stratification
Piece, and green glow and blue-light LED chip are the bipolar electrode chip of horizontal structure.
Wherein, the bottom of red LED chip is directly anchored on die bond pad 21 by conducting resinl, and another electrode leads to
Cross bonding wire to be connected with wire bond pads 22, green glow and blue-light LED chip are fixed on die bond pad 21 by insulating cement, two electrodes
Be connected respectively by bonding wire with two wire bond pads 22, in three wire bond pads 22, have one be public pad, its with three
LED chip is connected by bonding wire, and two other is not common pad, and it is connected with green glow or blue-light LED chip by bonding wire respectively
Connect.The red LED chip of vertical stratification is fixed on the either end of die bond pad 21, and green glow and blue-light LED chip are fixed on surplus
Under optional position, correspondingly, using embodiment one LED support when, LED chip can be with arranged in a straight line in LED support
On die bond pad.When in a linear fashion fix when, as shown in Fig. 5 (b), red LED chip be not fixed on green LED chip and
Between blue-light LED chip.I.e. red LED chip is fixed on the either end of die bond pad 21, and green LED chip is fixed on die bond
The middle part of pad 21, blue-light LED chip is fixed on the other end of die bond pad 21.As the present embodiment deformation or
Blue-light LED chip is fixed on the middle part of die bond pad, and green LED chip is fixed on the other end of die bond pad.As a result,
Flexibly, the position of RGB chips can need adjustment according to production, reduce in production due to LED core for the fixed position of red LED chip
Product batch is scrapped caused by mistake is put in piece position, also makes bonding wire mode more flexible.
In the present embodiment, each LED component can also be any of above-described embodiment two or embodiment three die bond
The flexible LED support in position, the arrangement mode of its LED chip is triangle manner.Fig. 5 (c) and 5 (d) specifically are see, it is distinguished
It is the top view for the LED component for employing embodiment two and the LED support in embodiment three.
Embodiment five
The utility model also provides a kind of die bond position flexible LED modules, including module wiring board, installed in the module
LED component, driving IC and resistance, electric capacity on wiring board.In the present embodiment, each LED component is any of the above-described kind of die bond
The flexible LED component in position.
The preparation method of LED modules of the present utility model is to be punched out the sheet metal strips such as copper strips or sheet iron strip, to be formed
The shape of pad, then in its electroplating surface metal or alloy material, makes PPA material injections after plating on sheet metal strip
It forms cup cover, is bent sheet metal strip around cup cover after injection, forms metal pin, completes the making of LED support；
LED chip is fixed on the die bond pad of LED support, then bonding wire is respectively welded in LED chip and wire bond pads, most
After fill packaging plastic, solidify, section, complete LED component making；The LED component made is welded in the circuit board, and will
Drive on the IC another side of associated circuit components welding assist side, complete the making of LED modules.
Referring to Fig. 6, it (only draws BRG rows for the structural representation of the LED modules of the utility model embodiment five in figure
Row and RBG arrange two kinds of arrangement modes), which employs the LED support of embodiment two.Blue LED die is abbreviated as B, green
LED chip is abbreviated as G, and red LED chips are abbreviated as R.LED chip in the LED component includes four kinds of arrangement modes, LED devices
Part can be divided into four kinds, BRG arrangements, RBG arrangements, GRB arrangements and RGB arrangements according to the different arrangement modes of LED chip；The BRG
It is arranged as, top is B, lower left is R, and lower right is G；The RBG is arranged as, and top is R, and lower left is B, and lower right is G；Should
GRB is arranged as, and top is G, and lower left is R, and lower right is B；The RGB is arranged as, and top is R, and lower left is G, and lower right is
B.BRG is arranged and RBG permutation and combination, or the LED component of GRB arrangements and RGB permutation and combination is arranged alternately in the circuit board.Specifically
In the present embodiment, first row LED component arranges for BRG, and secondary series LED component arranges for RBG, and the 3rd row LED component is BRG
Arrangement, such alternate cycles；Or first row LED component arranges for GRB, secondary series LED component arranges for RGB, the 3rd row LED
Device arranges for GRB, such alternate cycles.Consequently, it is possible to which three can be constituted between the LED chip of every two adjacent LEDs device
The B chips of the LED component of R and G chips and the lower left corner in the triarray of color chip, such as Fig. 6 in the LED component in the upper left corner
The triarray of three color chips is formed, it has the technical effect that, formed between different LED components between light mixing effect, i.e. LED component
Different colours light there is certain mixing, light extraction is softer.
The present embodiment can also use the LED component of embodiment three, referring to Fig. 7, it is the LED branch using embodiment three
The structural representation of the LED modules of frame.LED modules and the arrangement mode phase of the LED chip in above-mentioned LED modules in Fig. 7
Together, i.e. BRG arrangements and RBG permutation and combination, or the LED component of GRB arrangements and RGB permutation and combination are arranged alternately in the circuit board.
There is certain mixing in the different colours light formed between different LED components between light mixing effect, i.e. LED component, and light extraction is softer.
In other embodiments, the combination of the shape in river course is not limited to above example, such as linear river course with
Arc-shaped river course, polyline shaped river course and arc-shaped river course, or polyline shaped river course and polyline shaped river course etc., the shape in river course is not yet
It is limited to above-mentioned shape, can is irregular sideline etc..The arrangement mode of LED chip can also flexible combination, its arrangement mode
It is also not necessarily limited to linear fashion and triangle manner.The quantity of LED chip is not limited to three, can be four, five etc., vertically
Fabric chip is also not limited to red LED chips, can be that green or blue LED die are thin-film LED.
LED support of the present utility model, device and module, are welded by setting one to be shaped as the wide die bond in middle narrow two ends
Disk, allows the larger chip of volume to be flexibly fixed in the either end of die bond pad, makes the fixed position of large volume chip
More flexible, the position of each LED chip can need adjustment according to production, put mistake due to LED chip position in reduction production and lead
The product batch of cause is scrapped, and also makes bonding wire mode more flexible；Further, the large volume chip is specifically thin-film LED,
Especially red LED chip, when LED chip uses redgreenblue LED chip, the position of each LED chip can be according to production
Need adjustment.
The utility model is not limited to above-mentioned embodiment, if do not taken off to various changes or deformation of the present utility model
From spirit and scope of the present utility model, if these are changed and deformation belongs to claim of the present utility model and equivalent technologies
Within the scope of, then the utility model is also intended to comprising these changes and deformed.
Claims (10)
1. a kind of flexible LED support in die bond position, it is characterised in that：Include the cup cover of metallic support and the parcel metallic support；
The metallic support includes the metal pins in embedded cup cover；The part being arranged in the cup cover at the top of the metal pins is
Reflector；The reflector is provided with a hollow cavity, and it is weldering that the metal pins, which are located at the part of the bottom surface of the hollow cavity,
Disk, the pad is divided into die bond pad and wire bond pads by the river course insulated, the shape of the die bond pad by positioned at its two
The river course of side is limited, and the width at the middle part of the die bond pad is less than the width at its two ends.
2. the flexible LED support in die bond position according to claim 1, it is characterised in that：Positioned at the two of the die bond pad
The river course of side be shaped as arc-shaped, linear or polyline shaped.
3. the flexible LED support in die bond position according to claim 1, it is characterised in that：Positioned at the two of the die bond pad
The river course of side is shaped as arc-shaped, the circular arc bending direction in the both sides river course on the contrary, or the both sides river course circular arc it is curved
Qu Fangxiang is identical and circular arc curvature radius of the both sides river course is different.
4. a kind of flexible LED component in die bond position, including LED support, LED chip and packing colloid；The LED chip is arranged at
In the LED support；The packing colloid covers the LED chip；It is characterized in that：The LED support be claim 1~
LED support described in 3 any one.
5. the flexible LED component in die bond position according to claim 4, it is characterised in that：The LED chip is red-light LED
In chip, green LED chip or blue-light LED chip any one, two or three combination.
6. the flexible LED component in die bond position according to claim 4, it is characterised in that：The LED chip includes three
LED chip, respectively red LED chip, green LED chip and blue-light LED chip, the red LED chip are fixed on described
The either end of die bond pad.
7. the flexible LED component in die bond position according to claim 6, it is characterised in that：The LED chip is with straight line or three
Angular mode is arranged on the die bond pad.
8. the flexible LED component in die bond position according to claim 6, it is characterised in that：The red LED chip is single electricity
Pole piece piece, the green LED chip and blue-light LED chip are bipolar electrode chip.
9. a kind of flexible LED modules in die bond position, including module wiring board, the LED component on the module wiring board,
Drive IC and resistance, electric capacity；It is characterized in that：The LED component is the LED component any one of claim 4~8.
10. the flexible LED modules in die bond position according to claim 9, it is characterised in that：The LED of each LED component
Chip includes three LED chips, respectively red LED chip, green LED chip and blue-light LED chip；Per two adjacent LEDs
The triarray of red LED chip, blue-light LED chip and green LED chip can be constituted between the LED chip of device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621300217.5U CN206505944U (en) | 2016-11-30 | 2016-11-30 | A kind of die bond position flexible LED support, LED component and LED modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621300217.5U CN206505944U (en) | 2016-11-30 | 2016-11-30 | A kind of die bond position flexible LED support, LED component and LED modules |
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|---|---|
| CN206505944U true CN206505944U (en) | 2017-09-19 |
Family
ID=59843132
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| CN201621300217.5U Active CN206505944U (en) | 2016-11-30 | 2016-11-30 | A kind of die bond position flexible LED support, LED component and LED modules |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108695305A (en) * | 2018-05-17 | 2018-10-23 | 山西高科华兴电子科技有限公司 | Four crystalline substance LED show lamp bead structure |
| CN110854254A (en) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | Intensive LED packaging mode |
| TWI732621B (en) * | 2019-08-27 | 2021-07-01 | 明陽半導體股份有限公司 | Light-emitting diode device with driving mechanism |
-
2016
- 2016-11-30 CN CN201621300217.5U patent/CN206505944U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108695305A (en) * | 2018-05-17 | 2018-10-23 | 山西高科华兴电子科技有限公司 | Four crystalline substance LED show lamp bead structure |
| TWI732621B (en) * | 2019-08-27 | 2021-07-01 | 明陽半導體股份有限公司 | Light-emitting diode device with driving mechanism |
| CN110854254A (en) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | Intensive LED packaging mode |
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