CN204289441U - A kind of support group of small size LED lamp bead and support - Google Patents
A kind of support group of small size LED lamp bead and support Download PDFInfo
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- CN204289441U CN204289441U CN201420798117.4U CN201420798117U CN204289441U CN 204289441 U CN204289441 U CN 204289441U CN 201420798117 U CN201420798117 U CN 201420798117U CN 204289441 U CN204289441 U CN 204289441U
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- copper foil
- support
- led lamp
- small size
- lamp bead
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Abstract
The support group that the utility model provides a kind of small size LED and the support utilizing this support group to cut into, this support group is spliced by multiple support, multiple support shares summit, and offer at shared summit place through hole with plating establish conductive layer, therefore a conductive through hole can be shared by multiple support, thus effectively decreases required number of openings, reduce the density of through hole, the aperture of through hole also can arrange larger, therefore, it is possible to effectively reduce technology difficulty, improves product yield simultaneously.
Description
Technical field
The invention relates to LED technical field, particularly a kind of support group of small size LED lamp bead and support.
Background technology
Along with the development of technology, the pixel of LED display is more and more higher, and pixel is also more and more intensive, and this just requires that the size of LED lamp bead forming pixel must be very little, and this encapsulation technology one for LED has been deducted a percentage higher requirement.In encapsulation technology, the structure of most crucial is exactly support, supporting structure determines size and the encapsulating structure of final LED lamp bead, the support of traditional SMD LED lamp bead adopts and is being formed by injection moulding on metallic support, metallic support stretches out metal pins to both sides, significantly, stretching out pin to both sides can occupy segment space, causes there is larger spacing between adjacent LED.
To this, class double-layer PCB board technology can be adopted to make LED support, particularly enclose upper strata Copper Foil in the front of stent substrate with conduction, then bottom surface Copper Foil is fixed in the bottom surface of resin substrate using as pin, and, reach through hole on resin substrate, then Copper Foil is plated at the hole wall of through hole, conducting wire Copper Foil is connected with bottom surface Copper Foil conduction, and then adopt resin that filling through hole is full, the final like this LED lamp bead encapsulated out would not the pin that extends of oriented both sides, thus effectively adds the closeness of display screen.But, also there is many difficult points in this technology: (1) needs multiple pin due to a LED lamp bead at present, particularly colorful LED lamp bead, it comprises more pin, and each pin needs beginning through hole to be connected to make pin with the upper strata Copper Foil of support in this technology, when a LED lamp bead requires multiple pin, then mean and will offer multiple through hole on support, and it is as above, the size of support is very little, so little size offers multiple through hole simultaneously, and cause pecker density very large, in technique, difficulty is huge.(2), because stent size is very little, when multiple through hole offered by needs, the aperture of through hole also just must suitably reduce, and the through hole of small-bore easily causes copper facing poor effect, causes product electric conductivity not good.
Summary of the invention
The object of the invention is avoid above-mentioned weak point of the prior art and provide one effectively can reduce perforate density, expand conductive through hole aperture, thus effectively reduce technology difficulty, the support group simultaneously improving product yield and the support adopting this support group to make.
The object of the invention is achieved through the following technical solutions:
A kind of support group of small size LED lamp bead is provided, comprise resin substrate, described resin substrate is divided at least two polygonal stent substrates, the adjacent multiple stent substrates of drift angle are by the summit shared, the front of stent substrate is provided with for the die bond Copper Foil of fixed L ED crystal and the pad Copper Foil for conducting electricity, the bottom surface of stent substrate is fixed with the pin Copper Foil consistent with pad Copper Foil quantity, the conductive through hole of through described resin substrate is offered at described summit place, the hole wall plating of described conductive through hole is provided with conductive layer, described conductive layer one end extends to the front of resin substrate, thus connect the pad Copper Foil of the stent substrate contacted with described conductive through hole, the other end extends to the bottom surface of resin substrate, thus connect the pin Copper Foil of the stent substrate contacted with described conductive through hole.
Wherein, described stent substrate is square substrate, and four drift angle places of stent substrate form the described conductive layer being communicated with pad Copper Foil and pin Copper Foil.
Wherein, described die bond Copper Foil comprises the B die bond Copper Foil for fixing blue light crystal, the G die bond Copper Foil for fixing green light crystal and the R die bond Copper Foil for fixing ruddiness crystal, described pad Copper Foil comprises B pad Copper Foil for connecting a conductive electrode for blue light crystal, for connecting the G pad Copper Foil of a conductive electrode of green light crystal, for the R pad Copper Foil that connects a conductive electrode of ruddiness crystal and the public pad Copper Foil of another conductive electrode being connected blue light crystal, green light crystal and ruddiness crystal simultaneously.
Wherein, the bottom surface of each stent substrate is provided with the insulating lacquer layer in " ten " shape, and lower surface is divided into four pin field by described insulating lacquer layer, is provided with the pin Copper Foil described in a slice in each pin field.
Wherein, two parts that stent substrate is divided into area roughly equal by the line of centres of described die bond Copper Foil, the gross area of the pad Copper Foil in each part is roughly equal.
Wherein, protection resin is also filled with in described conductive through hole.
Wherein, resin substrate is black.
Wherein, described conductive layer is conductive copper layer.
Also provide a kind of support of small size LED lamp bead, this support to be cut along the edge of stent substrate by any one support group above-mentioned and is formed.
The beneficial effect of the invention: the support group that the invention provides a kind of small size LED and the support utilizing this support group to cut into, this support group is spliced by multiple support, multiple support shares summit, and offer at shared summit place through hole with plating establish conductive layer, therefore a conductive through hole can be shared by multiple support, thus effectively decrease required number of openings, reduce the density of through hole, the aperture of through hole also can arrange larger, therefore, it is possible to effectively reduce technology difficulty, improve product yield simultaneously.
Accompanying drawing explanation
Accompanying drawing is utilized to be described further the invention, but the embodiment in accompanying drawing does not form any restriction to the invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 is the Facad structure schematic diagram of the support group of a kind of small size LED lamp bead of the invention.
Fig. 2 is the Facad structure schematic diagram of single support in the support group of a kind of small size of the invention LED lamp bead.
Fig. 3 is the bottom surface structure schematic diagram of single support in the support group of a kind of small size of the invention LED lamp bead.
Fig. 4 is the cross section structure schematic diagram in the A-A ' direction along Fig. 2.
Include in Fig. 1 to Fig. 4:
1---resin substrate, 2---stent substrate, 21---B die bond Copper Foil, 22---G die bond Copper Foil, 23---R die bond Copper Foil, 24---B pad Copper Foil, 25---G pad Copper Foil, 26---R pad Copper Foil, 27---public pad Copper Foil, 28---pin Copper Foil, 29---insulating lacquer layer, 3---heat conduction through hole, 4---conductive layer, 5---protection resin.
Embodiment
With the following Examples the invention is further described.
The embodiment of the support group of the small size LED that the invention is a kind of, as shown in Figure 1 to Figure 3, comprise: upper surface is the square resin substrate 1 of black, the stent substrate 2(of resin substrate 1 point of multiple quadrangle for convenience of explanation, four are only shown) in figure, the stent substrate 2 of the quadrangle making four drift angles adjacent shares a summit, the front of each stent substrate 2 is provided with three die bond Copper Foils for fixed L ED crystal roughly in word order, the B die bond Copper Foil 21 of fixing blue light crystal respectively, G die bond Copper Foil 22 for fixing green light crystal and the R die bond Copper Foil 23 for fixing ruddiness crystal, G die bond Copper Foil 22 is positioned at stent substrate 2 front center, stent substrate 2 is divided into left and right two parts by the line of centres of three die bond Copper Foils, these two parts are roughly symmetrical, each part is distributed with two pad Copper Foils (adding up to four pad Copper Foils), the area of the pad Copper Foil that left and right two parts are distributed is roughly equal, these four pad Copper Foils are the B pad Copper Foil 24 for connecting a conductive electrode for blue light crystal respectively, for connecting the G pad Copper Foil 25 of a conductive electrode of green light crystal, for the R pad Copper Foil 26 that connects a conductive electrode of ruddiness crystal be connected blue light crystal simultaneously, the public pad Copper Foil 27 of another conductive electrode of green light crystal and ruddiness crystal, wherein B pad Copper Foil 24 and G pad Copper Foil 25 are positioned at the left part of die bond Copper Foil, R pad Copper Foil 26 and public pad Copper Foil 27 are positioned at the right part of die bond Copper Foil.The bottom surface of described stent substrate 2 is fixed with and pad Copper Foil four pin Copper Foils 28 and the insulating lacquer layer 29 in " ten " shape one to one, lower surface is divided into four pin field by described insulating lacquer layer 29, is provided with a slice pin Copper Foil 28 in each pin field.
The conductive through hole 3 of through described resin substrate 1 is offered at the summit place that aforementioned multiple stent substrate 2 shares; as shown in Figure 4; the hole wall copper facing of described conductive through hole 3 is to form conductive layer 4; protection resin 5 is filled with in conductive through hole 3; described conductive layer 4 one end extends to the front of resin substrate 1; thus connect the pad Copper Foil of the stent substrate 2 contacted with described conductive through hole 3; the other end extends to the bottom surface of resin substrate 1, thus connects the pin Copper Foil 28 of the stent substrate 2 contacted with described conductive through hole 3.
Compared with prior art, the support group that the invention provides a kind of small size LED and the support utilizing this support group to cut into, this support group is spliced by multiple support, multiple support shares summit, and offer at shared summit place through hole with plating establish conductive layer 4, therefore a conductive through hole 3 can be shared by multiple support, thus effectively decrease required number of openings, reduce the density of through hole, the aperture of through hole also can arrange larger, therefore, it is possible to effectively reduce technology difficulty, improve product yield simultaneously.
In support group, each stent substrate 2 can form final LED support after perforation, copper facing, now only needs to cut along the edge of stent substrate 2 in this support group to obtain single support.
Finally should be noted that; above embodiment is only in order to illustrate the technical scheme of the invention; but not the restriction to the invention protection range; although done to explain to the invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical scheme of the invention or equivalent replacement, and not depart from essence and the scope of the invention technical scheme.
Claims (9)
1. the support group of a small size LED lamp bead, it is characterized in that: comprise resin substrate, described resin substrate is divided at least two polygonal stent substrates, the adjacent multiple stent substrates of drift angle are by the summit shared, the front of stent substrate is provided with for the die bond Copper Foil of fixed L ED crystal and the pad Copper Foil for conducting electricity, the bottom surface of stent substrate is fixed with the pin Copper Foil consistent with pad Copper Foil quantity, the conductive through hole of through described resin substrate is offered at described summit place, the hole wall plating of described conductive through hole is provided with conductive layer, described conductive layer one end extends to the front of resin substrate, thus connect the pad Copper Foil of the stent substrate contacted with described conductive through hole, the other end extends to the bottom surface of resin substrate, thus connect the pin Copper Foil of the stent substrate contacted with described conductive through hole.
2. the support group of a kind of small size LED lamp bead as claimed in claim 1, is characterized in that: described stent substrate is square substrate, and four drift angle places of stent substrate form the described conductive layer being communicated with pad Copper Foil and pin Copper Foil.
3. the support group of a kind of small size LED lamp bead as claimed in claim 2, it is characterized in that: described die bond Copper Foil comprises the B die bond Copper Foil for fixing blue light crystal, G die bond Copper Foil for fixing green light crystal and the R die bond Copper Foil for fixing ruddiness crystal, described pad Copper Foil comprises the B pad Copper Foil for connecting a conductive electrode for blue light crystal, for connecting the G pad Copper Foil of a conductive electrode of green light crystal, for the R pad Copper Foil that connects a conductive electrode of ruddiness crystal be connected blue light crystal simultaneously, the public pad Copper Foil of another conductive electrode of green light crystal and ruddiness crystal.
4. the support group of a kind of small size LED lamp bead as claimed in claim 2, it is characterized in that: the bottom surface of each stent substrate is provided with the insulating lacquer layer in " ten " shape, lower surface is divided into four pin field by described insulating lacquer layer, is provided with the pin Copper Foil described in a slice in each pin field.
5. the support group of a kind of small size LED lamp bead as claimed in claim 1, is characterized in that: two parts that stent substrate is divided into area roughly equal by the line of centres of described die bond Copper Foil, and the gross area of the pad Copper Foil in each part is roughly equal.
6. the support group of a kind of small size LED lamp bead as claimed in claim 1, is characterized in that: be also filled with protection resin in described conductive through hole.
7. the support group of a kind of small size LED lamp bead as claimed in claim 1, is characterized in that: resin substrate is black.
8. the support group of a kind of small size LED lamp bead as claimed in claim 1, is characterized in that: described conductive layer is conductive copper layer.
9. a support for small size LED lamp bead, is characterized in that: this support to be cut along the edge of stent substrate by the support group of any one in claim 1-8 and formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420798117.4U CN204289441U (en) | 2014-12-17 | 2014-12-17 | A kind of support group of small size LED lamp bead and support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420798117.4U CN204289441U (en) | 2014-12-17 | 2014-12-17 | A kind of support group of small size LED lamp bead and support |
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| Publication Number | Publication Date |
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| CN204289441U true CN204289441U (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420798117.4U Active CN204289441U (en) | 2014-12-17 | 2014-12-17 | A kind of support group of small size LED lamp bead and support |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409620A (en) * | 2014-12-17 | 2015-03-11 | 木林森股份有限公司 | Small-sized LED lamp bead set and lamp beads |
| CN104409451A (en) * | 2014-12-17 | 2015-03-11 | 木林森股份有限公司 | Bracket set of small-sized LED lamp beads and brackets |
-
2014
- 2014-12-17 CN CN201420798117.4U patent/CN204289441U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409620A (en) * | 2014-12-17 | 2015-03-11 | 木林森股份有限公司 | Small-sized LED lamp bead set and lamp beads |
| CN104409451A (en) * | 2014-12-17 | 2015-03-11 | 木林森股份有限公司 | Bracket set of small-sized LED lamp beads and brackets |
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