CN104157638B - 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament and preparation method thereof - Google Patents
360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament and preparation method thereof Download PDFInfo
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- CN104157638B CN104157638B CN201410426391.3A CN201410426391A CN104157638B CN 104157638 B CN104157638 B CN 104157638B CN 201410426391 A CN201410426391 A CN 201410426391A CN 104157638 B CN104157638 B CN 104157638B
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Abstract
The invention discloses a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament, including platelet substrate, one layer of flexible insulating layer is covered in described platelet substrate, being prepared on described insulating barrier has connection line, the end positions of described connection line are formed with electrode, position is formed with multiple pads to described connection line between the electrodes, one packed LED chip is installed between each pair pad, described packed LED chip is the full angle light extracting LED chip of transparent enclosure, it is correspondingly arranged below packed LED chip described in each for by the light extraction position of beam projecting.The beneficial effects of the invention are as follows the LED filament structure there is provided a kind of brand new, and realize high efficiency mass production, low production cost.
Description
Technical field
The present invention relates to LED technology field.
Background technology
LED filament of the prior art, also referred to as LED rod or LED post, need solid on substrate in process of production
Brilliant bonding wire, positive and negative electrode is separately installed with the two ends of the substrate, and the production process of whole die bond bonding wire is complex, it is difficult to big
Scale high efficiency production, the connected mode for passing through gold thread between each LED chip in addition easily produces loose contact phenomenon or weldering
The phenomenon for not connecing gold thread occurs, and causes the failure of LED chip.
The content of the invention
In order to overcome the shortcomings of that prior art is present, it is an object of the invention to provide a kind of brand new and it is easy to high
360 degree of the formal dress flip-chip of efficiency mass production is luminous can arbitrarily around LED filament and preparation method thereof.
To achieve the above objectives, the invention provides a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily around LED
Silk, including platelet substrate, cover one layer of flexible insulating layer in described platelet substrate, being prepared on described insulating barrier has connecting line
Road, the end positions of described connection line are formed with electrode, and position is formed with multiple to described connection line between the electrodes
Pad, installs a packed LED chip between each pair pad, described packed LED chip is the full angle light extracting LED of transparent enclosure
Chip, is correspondingly arranged for by the light extraction position of beam projecting below the packed LED chip described in each.
Further improvement of the present invention is, the described flexible insulating transparent state of layer, in described platelet substrate with
The corresponding position of each packed LED chip sets hollow out position.
Further improvement of the present invention is that the lower section of the packed LED chip described in each offers a light hole, institute
The packed LED chip stated just facing to described light hole light extraction.
Further improvement of the present invention is that the second insulating barrier is also covered with below described platelet substrate.
Further improvement of the present invention is, described flexible insulating layer, the second insulating barrier are integrally coated on described thin
On the surface of piece substrate.
Further improvement of the present invention is that the intensity of the second described insulating barrier is strong more than described flexible insulating layer
Degree.
According to another aspect of the present invention, there is provided a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament
Preparation method, comprise the following steps：
S1：Whole piece platelet substrate is provided；
S2：Flexible insulating layer is prepared in described platelet substrate；
S3：Connection line is made on described flexible insulating layer, electricity is made in the end positions of described connection line
Pole, prepares multiple pads on the connection line between described electrode, light hole is set between the pad described in each pair；
S4：Packed LED chip is installed between the pad described in each pair, described packed LED chip just facing to institute
The light hole light extraction stated；
S5：It is divided into multiple filament monomers.
According to another aspect of the present invention, there is provided a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament
Preparation method, comprise the following steps：
S1：Whole piece platelet substrate is provided, multiple light holes are set in platelet substrate；
S2：Flexible insulating layer is prepared in described platelet substrate；
S3：Connection line is made on described flexible insulating layer, electricity is made in the end positions of described connection line
Pole, prepares multiple pads and causes there is a light hole between each pair pad on the connection line between described electrode；
S4：Packed LED chip is installed between the pad described in each pair, described packed LED chip just facing to institute
The light hole light extraction stated；
S5：It is divided into multiple filament monomers.
Further improvement of the present invention is that described platelet substrate includes tinsel, potsherd, sapphire glass
Piece.
Further improvement of the present invention is, in described step S2, is additionally included in described platelet substrate lower section and prepares
The step of second insulating barrier.
The beneficial effects of the invention are as follows product structure is optimized, high efficiency mass production is realized, production cost is relatively low.
Brief description of the drawings
Accompanying drawing 1 is the sectional view according to LED filament of the invention；
Accompanying drawing 2 is the schematic front view according to LED filament of the invention；
Accompanying drawing 3 to accompanying drawing 5 describes preparation in accordance with the present invention.
Specific embodiment
Presently preferred embodiments of the present invention is described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that apparent clearly being defined so as to be made to protection scope of the present invention.
Referring to shown in accompanying drawing 1 and accompanying drawing 2, be according to formal dress flip-chip of the invention 360 degree light and can arbitrarily surround
The structural representation of the embodiment of LED filament LED support, including platelet substrate 1, cover one layer of flexible insulating in platelet substrate 1
Layer 2, the lower section of platelet substrate 1 is also covered with the second insulating barrier 8, and flexible insulating the 2, second insulating barrier 8 of layer is integrally coated on thin slice
On the surface of substrate 1, and the intensity of the second insulating barrier 8 is more than the intensity of flexible insulating layer 2 to play main support effect,
A kind of structure of sandwich is formed between flexible insulating the 2, second insulating barrier 8 of layer and platelet substrate 1, platelet substrate 1 can be used
Tinsel, potsherd, sapphire glass piece, when using tinsel, preferably Copper Foil or aluminum foil material are primarily served excellent
Radiating effect and bent effect, the soft or hard journey of filament bar can be adjusted by changing the material thickness of platelet substrate 1
Degree flexible insulating the 2, second insulating barrier 8 of layer is made up of the exotic material of 800 degrees Celsius of tolerance highest.
Being prepared on insulating barrier 2 has connection line 3, and connection line 3 can be prepared from by the mode of mask etch, for example, be applied
Photoresist, the technique of light shield etching of the method in semiconductor technology, what is be prepared from using addition or subtractive processes is electric with printing
The similar structure in road.The end positions of connection line 3 are formed with electrode 4, for being connected with power supply or being connected with each other, connecting line
Position is formed with multiple pads 5 between the electrodes 4 on road 3, and a packed LED chip 6, packed LED chip are installed between each pair pad 5
6 is the full angle light extracting LED chip of transparent enclosure, and the lower section of each packed LED chip 6 offers a light hole 7, formal dress
LED chip 6 just facing to the light extraction of light hole 7.It is pointed out that the packed LED chip 6 employed in the present invention, formal dress
The welding pin of LED chip 6 is located towards the position of the one side of light hole 7, can so allow positive cartridge chip with flip-chip
Ease of use, reduce production cost；The size of the welding pin of packed LED chip 6 can be prepared into it is more conventional bigger,
And can be more some larger than another with one.
Referring to shown in accompanying drawing 3 to accompanying drawing 5, being given herein, a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily to surround LED
The preparation method of silk, comprises the following steps：
S1：The platelet substrate 1 of whole piece is provided；
S2：Flexible insulating layer 2 is prepared in platelet substrate 1, the second insulating barrier 8 is prepared below platelet substrate 1；
S3：Go out as shown in Figure 3, connection line 3 is made on flexible insulating layer 2, in the two ends position of connection line 3
Making electrode 4 is put, multiple pads 5 are prepared on connection line 3 between the electrodes 4；And go out as shown in Figure 4, every
To setting light hole 7 between pad 5；
S4：Packed LED chip 6 is installed between each pair pad 5, by the way that 1000 degree of welderings of high temperature can be tolerated on pad
Tin cream using die bond weldering by the way of realize, packed LED chip 6 just facing to the light extraction of light hole 7；
S5：The finished product of the full wafer in accompanying drawing 5 is divided into multiple filament monomers as shown in Figure 2.
It is pointed out that in another embodiment of the present invention, flexible insulating the 2, second insulating barrier 8 of layer is by ceramic thin
The transparent materials such as membrane coat are made, and the corresponding position of the lower section of each packed LED chip 6 is provided with platelet substrate 1
The position of hollow out, thus can also realize the outgoing of light without setting perforate to insulating barrier.
In order to realize above structure, its preparation adjusts as follows：
S1：Whole piece platelet substrate 1 is provided, multiple light holes 7 are set in platelet substrate 1；
S2：Flexible insulating layer 2 is prepared in platelet substrate 1；
S3：Connection line 3 is made on flexible insulating layer 2, electrode 4 is made in the end positions of connection line 3, in electrode
Multiple pads 5 are prepared on connection line 3 between 4 and causes that there is a light hole 7 between each pair pad 5；
S4：Between each pair pad 5 install packed LED chip 6, packed LED chip 6 just facing to the light extraction of light hole 7；
S5：It is divided into multiple filament monomers.
Embodiment of above technology design and feature only to illustrate the invention, technique is familiar with its object is to allow
People understands present disclosure and is carried out, and it is not intended to limit the scope of the present invention, all according to spirit of the invention
The equivalent change or modification that essence is done is encompassed by protection scope of the present invention.
Claims (7)
1. a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament, it is characterised in that：Including platelet substrate（1）,
Described platelet substrate（1）One layer of flexible insulating layer of upper covering（2）, described insulating barrier（2）Upper preparation has connection line（3）,
Described connection line（3）End positions be formed with electrode（4）, described connection line（3）In electrode（4）Between position shape
Into there is multiple pads（5）, each pair pad（5）Between a packed LED chip is installed（6）, described packed LED chip（6）For saturating
The full angle light extracting LED chip of bright encapsulation, the packed LED chip described in each（6）Lower section be correspondingly arranged for light to be gone out
The light extraction position penetrated, described platelet substrate（1）Lower section be also covered with the second insulating barrier（8）, described flexible insulating layer
（2）, the second insulating barrier（8）Integrally it is coated on described platelet substrate（1）Surface on, the second described insulating barrier（8）It is strong
Degree is more than described flexible insulating layer（2）Intensity.
2. 360 degree of formal dress flip-chip according to claim 1 is luminous can arbitrarily around LED filament, it is characterised in that：Institute
The flexible insulating layer stated（2）Transparent state, described platelet substrate（1）Upper and each packed LED chip（6）Corresponding position
Install hollow out position.
3. 360 degree of formal dress flip-chip according to claim 1 is luminous can arbitrarily around LED filament, it is characterised in that：Often
Individual described packed LED chip（6）Lower section offer a light hole（7）, described packed LED chip（6）Just face
To described light hole（7）Light extraction.
4. a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily around the preparation method of LED filament, it is characterised in that：Including such as
Lower step：
S1：Whole piece platelet substrate is provided（1）；
S2：In described platelet substrate（1）On prepare flexible insulating layer（2）；
S3：In described flexible insulating layer（2）Upper making connection line（3）, in described connection line（3）End positions system
Make electrode（4）, in described electrode（4）Between connection line（3）It is upper to prepare multiple pads（5）, in the pad described in each pair
（5）Between light hole is set（7）；
S4：In the pad described in each pair（5）Between encapsulate packed LED chip（6）, described packed LED chip（6）Just face
To described light hole（7）Light extraction；
S5：It is divided into multiple filament monomers.
5. a kind of 360 degree of formal dress flip-chip is luminous can arbitrarily around the preparation method of LED filament, it is characterised in that：Including such as
Lower step：
S1：Whole piece platelet substrate is provided（1）, in platelet substrate（1）It is upper that multiple light holes are set（7）；
S2：In described platelet substrate（1）On prepare flexible insulating layer（2）；
S3：In described flexible insulating layer（2）Upper making connection line（3）, in described connection line（3）End positions system
Make electrode（4）, in described electrode（4）Between connection line（3）It is upper to prepare multiple pads（5）So that each pair pad（5）It
Between have a light hole（7）；
S4：In the pad described in each pair（5）Between packed LED chip is installed（6）, described packed LED chip（6）Just face
To described light hole（7）Light extraction；
S5：It is divided into multiple filament monomers.
6. 360 degree of the formal dress flip-chip according to claim 4 or 5 it is luminous can arbitrarily around the preparation method of LED filament,
It is characterized in that：Described platelet substrate（1）Including tinsel, potsherd, sapphire glass piece.
7. 360 degree of the formal dress flip-chip according to claim 4 or 5 it is luminous can arbitrarily around the preparation method of LED filament,
It is characterized in that：In described step S2, described platelet substrate is additionally included in（1）Lower section prepares the second insulating barrier（8）Step
Suddenly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410426391.3A CN104157638B (en) | 2014-08-27 | 2014-08-27 | 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament and preparation method thereof |
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| CN201410426391.3A CN104157638B (en) | 2014-08-27 | 2014-08-27 | 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament and preparation method thereof |
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| CN104157638A CN104157638A (en) | 2014-11-19 |
| CN104157638B true CN104157638B (en) | 2017-06-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098032B (en) * | 2015-07-17 | 2018-10-16 | 开发晶照明（厦门）有限公司 | LED filament and LED bulb with the LED filament |
| CN105336832B (en) * | 2015-09-29 | 2017-09-22 | 旭宇光电（深圳）股份有限公司 | A kind of LED filament |
| CN106783819A (en) * | 2016-12-23 | 2017-05-31 | 常州市武进区半导体照明应用技术研究院 | A kind of flexible filament and preparation method thereof |
| CN106678580A (en) * | 2016-12-28 | 2017-05-17 | 上海应用技术大学 | Manufacturing method for spiral LED lamp filament inside bulb lamp |
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| CN204088316U (en) * | 2014-08-27 | 2015-01-07 | 江苏华英光宝科技股份有限公司 | The 360 degree of luminescences of formal dress flip-chip can arbitrarily around LED silk |
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| DE19643911A1 (en) * | 1996-10-30 | 1998-05-07 | Sick Ag | Opto-electronic integrated circuit arrangement |
| CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
| CN202259395U (en) * | 2011-09-07 | 2012-05-30 | 王元成 | LED (light-emitting diode) light source |
| CN203231142U (en) * | 2013-05-06 | 2013-10-09 | 苏州欧普照明有限公司 | Lamp band |
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| CN204088316U (en) * | 2014-08-27 | 2015-01-07 | 江苏华英光宝科技股份有限公司 | The 360 degree of luminescences of formal dress flip-chip can arbitrarily around LED silk |
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Effective date of registration: 20171220 Address after: Suzhou City, Jiangsu Province, Yushan Town, Kunshan City, 215316 Yu Yang Road No. 433, room 2 Patentee after: Jiangsu wisdom Photoelectric Technology Co., Ltd. Address before: 215300, No. 239 South hope road, Yushan Town, Kunshan City, Jiangsu, Suzhou Patentee before: Jiangsu Huaying Guangbao Technology Co., Ltd. |
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