CN106678580A - Manufacturing method for spiral LED lamp filament inside bulb lamp - Google Patents
Manufacturing method for spiral LED lamp filament inside bulb lamp Download PDFInfo
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- CN106678580A CN106678580A CN201611235343.1A CN201611235343A CN106678580A CN 106678580 A CN106678580 A CN 106678580A CN 201611235343 A CN201611235343 A CN 201611235343A CN 106678580 A CN106678580 A CN 106678580A
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- filament
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- lamp filament
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a manufacturing method for a spiral LED lamp filament inside a bulb lamp. According to the manufacturing method for the spiral LED lamp filament inside the bulb lamp, a substrate circuit is made, and a spiral structure is cut out on a substrate; then, die bond, adhesive dispensing and encapsulation are conducted on the substrate, and then a lamp filament is formed; and the two ends of the lamp filament are clamped through clamps and evenly stretches outwards, so that a conical spiral lamp filament is obtained. The spirally wound lamp filament enables the luminous flux per the unit space volume in a limited space to be increased, the lamp filament can emit light by 360 degrees through front face and back face die bond, the light emitting effect is more stereoscopic after the lamp filament is stretched, and atmosphere lighting effects such as antiquing lighting can be achieved. The bulb made of the lamp filament is good in light emitting evenness, and the manufactured lamp filament is high in light emitting efficiency, high in luminous efficacy, small in light attenuation, high in reliability and good in heat dissipating effect.
Description
Technical field
The present invention relates to a kind of LED illumination technology, more particularly to a kind of spiral LED filament preparation side in bulb lamp
Method.
Background technology
White-light LED illumination is considered as potential, and future soon will substitute solid light source, becomes the illumination skill of main flow
Art.And it is wide in last decade because it has the advantages that small volume, energy-conservation, life-span length, pollution-free, lightweight etc.
General to be applied to solid-state illumination, outdoor information shows, liquid crystal display, back lighting, the field such as Landscape Lighting.In the market
LED filament is all belonging to vertical bar type, and the number of the chip that can be fixed is restricted, and overall wattage is limited to, therefore
In the space of bulb finite volume, the size of luminous flux can not be effectively improved.And, in some specific occasions, I
Need the filament of given shape to reach or build certain atmosphere, such as illumination modelled after an antique, bar, the public place of entertainment such as KTV is described
Coiled filament can cater to this demand.Although LED illumination can effectively solve the low light efficiency of incandescent lamp, lacking more than heat production
Point, but tungsten filament has good plasticity due to it, and bending curl is relatively easy.And the spiral LED filament also relates to solid
The complicated technical process such as crystalline substance, dispensing, the manufacture difficulty in later stage has been lifted.Simultaneously, it is contemplated that the cost of manufacture of coiled filament,
Therefore, how to design and produce that a kind of reliability is higher, the controllable spiral LED filament of cost is that one kind needs LED industry work
The problem that author explores.
The content of the invention
The present invention be directed to problem, it is proposed that a kind of spiral LED filament preparation method in bulb lamp, Neng Gouyou
The filament is made to effect, and the luminous efficiency of the filament of the making is high, and light efficiency is big, and light decay is little, and reliability is higher, good heat dissipation.
The technical scheme is that：A kind of spiral LED filament preparation method in bulb lamp, it is characterised in that
Specifically include following steps：
1）Prepare that there is satisfactory electrical conductivity, thermal conductivity, plastic metal substrate or plastic non-metal base plate first, it is right
In non-metal base plate：Last layer conductive layer is pasted on substrate, or last layer conductive layer is pasted in substrate upper and lower surface, so
Afterwards one layer of white oil of each brush of upper and lower surface is covered；For metal substrate, then first on metallic substrates face pastes a layer insulating, exhausted
Paste one layer of conductive layer above edge layer again, finally on the electrically conductive one layer of ink of each brush is covered under face and substrate；
2）There is the conductive laminated conducting channel for etching filament design helical trajectory in the substrate made；
3）The mode being machined into cuts out the substrate of filamentray structure on substrate, obtains that the flexible base of filamentray structure is presented
Plate；
4）After positive cartridge chip or flip-chip are packaged, then chip is led by insulating cement baking-curing or elargol etc.
The mode of electric glue baking welding is fixed on substrate, when flip-chip is welded, by between two electrodes point insulating glue it is electric by two
Extremely separate to prevent short circuit；
5）LED die bond operations are carried out on substrate, the spacing between LED chip can be adjusted, die bond face menu face die bond or two-sided
Die bond；
6）Coated with fluorescence rouge and powder and bloom mixed transparent silica gel, or covered by rotating or applying pressure mode with fluorescence membrane
On the substrate covered after die bond is intact, one side or dual coating are realized, through high-temperature baking, solidification, obtain encapsulation intact
Spiral LED filament；
7）After with fixture is clamped the both positive and negative polarity of filament, uniformly stretch out, obtain the filament of required form, and fixture is normal
The fixture of the making filament of rule；
8）The both positive and negative polarity of filament made by giving is powered, the luminous flux of measurement filament, and whether temperature rise is qualified.
The step 2）Filament design helical trajectory is Fei Bulaqi helicals, logarithmic spiral or Archimedian screw two dimension
Helix, and pitch, polar diameter size is adjusted as desired.
The step 6）The surface of substrate is coated in by gluing glutinous coating method with the fluorescence membrane for preparing.
The step 7）Shape after coiled filament stretching is conical log-spiral or cylindrical screw three-dimensional spiral line.
The beneficial effects of the present invention is：The present invention possesses solid for the spiral LED filament preparation method in bulb lamp
Illumination effect, and it is luminous uniform, light decay is less, and reliability is higher.
Description of the drawings
Fig. 1 is present invention process flow chart；
It is spiral of Archimedes outside drawing that Fig. 2 is substrate of the present invention；
It is Fei Bulaqi helical outside drawings that Fig. 3 is substrate of the present invention；
It is logatithmic spiral outside drawing that Fig. 4 is substrate of the present invention；
Fig. 5 is after substrate die bond of the present invention and rhombus positive and negative connector structure chart；
Fig. 6 is after substrate die bond of the present invention and rectangle positive and negative connector structure chart；
Fig. 7 is that one side die bond dispensing filament of the present invention encapsulation finishes rear sectional view；
Fig. 8 finishes rear sectional view for two-sided die bond dispensing filament encapsulation of the invention；
Fig. 9 is the taper circular cone schematic diagram after filament stretching of the present invention；
Figure 10 is the bulb figure with spiral of Archimedes filament of the invention；
Figure 11 is the bulb figure with Fei Bulaqi helical filaments of the invention；
Figure 12 is the bulb figure with logatithmic spiral filament of the invention；
Figure 13 is the bulb figure with two spiral of Archimedes filaments of the invention；
Figure 14 is the bulb figure with two Fei Bulaqi helical filaments of the invention；
Figure 15 is the bulb figure with two logatithmic spiral filaments of the invention.
Specific embodiment
The present invention is for the spiral LED filament preparation method in bulb lamp, and key step as shown in Figure 1 is as follows：
1st, prepare that there is satisfactory electrical conductivity, thermal conductivity, plastic metal substrate or plastic non-metal base plate first,
（Metal substrate such as magnesium substrate, copper base, copper magnesium composite base plate etc., non-metal base plate such as compound conductive plastic substrate, conductive rubber
Substrate, electric silica gel substrate etc.）；For non-metal base plate, last layer conductive layer is pasted on substrate, or in substrate upper and lower two
Face pastes last layer conductive layer（Conductive layer can be layers of copper）, then cover in one layer of white oil of each brush in top and bottom；If substrate is to lead
The metal substrate of electricity（Such as aluminium sheet or copper coin）, then need first a layer insulating to be pasted on aluminium sheet, on the insulating layer face is again
One layer of conductive layer is pasted, finally on the electrically conductive one layer of ink of each brush is covered under face and substrate（If nonmetallic one side, then block
Surface layer is followed successively by white oil, conductive layer, non-metal base plate, white oil；If metal one side, then block surface layer and be followed successively by white oil, lead
Electric layer, insulating barrier, metal substrate, white oil）；
2nd, the conducting channel of filament design track is etched in the substrate conductive layer made, substrate can be one side or two-sided
Conductive layer, two-sided etching is similar to one side etch step,（If nonmetallic two-sided, then truncation surface level is followed successively by white oil, conductive
Layer, non-metal base plate, conductive layer, white oil；If metal double-side, then truncation surface level is followed successively by white oil, conductive layer, insulating barrier,
Metal substrate, insulating barrier, conductive layer, white oil）The helicoidal path of designed conducting channel is unrestricted, logarithmic spiral, A Ji
The spiral ways such as Mead spiral, hyperbolic spiral all can, the making approach of circuit is also unrestricted, can paster or etching etc., such as scheme
Outside drawing shown in 2-4；
3rd, the mode being machined into cuts out the substrate of filamentray structure on substrate, obtains that the flexible base of filamentray structure is presented
Plate, the mode of processing does not limit species（Such as molding modes such as punching press, 3D printings）；
4th, after being packaged positive cartridge chip or flip-chip, then chip is led by insulating cement baking-curing or elargol etc.
The mode of electric glue baking welding is fixed on substrate.Weld flip-chip when, by between two electrodes point insulating glue it is electric by two
Extremely separate to prevent short circuit.As shown in Figure 5,6,1 is metal or non-metal base plate, and 2 is both positive and negative polarity plumb joint；3 is chip.
5th, LED die bond operations are carried out on the metal or non-metal base plate, the spacing between LED chip can be adjusted, Gu
Crystal face can be optional, and both can with one side die bond can also two-sided die bond, to realize the illumination effect of 180 ° and 360 °.Base plate
The hand of spiral both can in a clockwise direction can also counterclockwise.
6th, the coating of this step indication referred to and both can be coated with fluorescence rouge and powder and bloom mixed transparent silica gel（The ratio of component
Example is unrestricted）, it is also possible to fluorescence membrane by rotate or apply the mode such as pressure be covered in die bond it is intact after substrate
On, one side or dual coating are realized, through high-temperature baking, solidification, obtain encapsulating intact spiral LED filament.Such as Fig. 7,8 institutes
Sectional view after single, double surface die bond glue dispensing and packaging is shown as, 4 is silica gel packaging layer；5 is weld layer.
7th, after is clamped the both positive and negative polarity of filament with fixture, uniformly stretch out, cone-type spiral or cylinder can be obtained
The filament of spiral, and fixture is the fixture of conventional making filament, is not required to repacking.Fig. 9 is the taper after filament stretching of the present invention
Circular cone schematic diagram.
The both positive and negative polarity of filament made by the 8th, giving is powered, the luminous flux of measurement filament, and whether temperature rise is qualified.
Globular bulb way：（a）The two ends of the coiled filament are stretched, by the electrode welding of inner ring in bulb lamppost
Top, outer ring is welded on the conductive wire of bottom.（b）Bulb part include cell-shell, metallic lamp holder, power supply, coiled filament, two
The electrode connecting rod of individual opposite electrode.
If Figure 10-15 is the bulb figure with various filaments of the invention；6 are the bending LED filament after stretching；7 is cell-shell；
8 is first electrode connecting rod；9 is second electrode connecting rod；10 is power supply；11 is lamp holder.
The described method for preparing LED filament, the shape of helix can be Fei Bulaqi helicals, logarithmic spiral or Ah
The big I such as the two-dimensional helical lines such as base Mead spiral, and pitch, polar diameter is adjusted as desired.
The described method for preparing LED filament, the shape after coiled filament stretching can be conical log-spiral or circle
The three-dimensional spiral line such as post spiral.The described method for preparing LED filament, accompanying material can be heat-conducting plastic or heat conduction
Rubber etc. can either protection circuit substrate, and do not affect radiate layer material.
The described method for preparing LED filament, mode for dispensing glue can be using point gum machine or screen printer.The component of glue,
Ratio can show the optical indexes such as finger by free adjusted design, to realize expected colour temperature.
The described method for preparing LED filament, can also be applied with the fluorescence membrane for preparing by modes such as viscous glutinous coatings
Overlay on the surface of substrate.
The method of described preparation LEDbulb lamp, filament stretching height can be 0cm, 8mm-12mm, 18mm-22mm,
This four intervals of 28mm-32mm.
The method of the described bulb lamp for preparing LED filament is that filament two has hole, Kong Kewei circles or square or rhombus
Etc. geometry, the both positive and negative polarity of difference corresponding power.
Based on the preparation method of this filament, the method that also detailed description prepares the bulb lamp of LED filament.Electrode material can be
The material with excellent conductive performance such as copper, brass, or conductive plastics, conductive rubber.The type of cell-shell can be A60,
The different types such as G125, St14, STST.
The method of the described bulb lamp for preparing LED filament is the species of inflation.The species of filling gas can also be
The inert gases such as nitrogen, helium, or the mixed gas of several gas with various.
The method of described preparation LEDbulb lamp is that power supply can be inside lamp holder, or lamp holder outside, or in filament
On.
In this invention, the metal base plate made of copper for being adopted than traditional ceramic substrate good heat dissipation effect, and have
There is good thermal diffusivity, it is flexible.In stretching distance 0mm-32mm, optimal value is in interval 18mm-22mm.After the stretching of two ends three
Dimension coiled filament possesses good space, and energy 3D is omnibearing luminous after positive and negative coating fluorescent material, possesses stereo luminous effect, and
Luminous uniform, light decay is less, and reliability is higher.
In the filament preparation method based on the above, also addition devises one kind and the filament is installed in bulb the present invention
Approach.The filling gas of bulb both can be mixed gas of nitrogen, or helium or rare gas not of the same race etc.
Thermal diffusivity preferably, is difficult the protective gas of oxidation reaction.
The filament of the installation in bulb can be one or two, or a plurality of, and filament connected mode both can connect
Can also in parallel or connection in series-parallel mixing.Filament can be placed sidewards also can sideling place or put into arbitrarily angled.It is different
The combination of filament can also have various designs.
In this experiment, the selection of power supply can be designed freely, and selecting for input voltage can be according to the individual of the chip for accessing
The connected mode of number and circuit is adjusting control.
Claims (4)
1. a kind of spiral LED filament preparation method in bulb lamp, it is characterised in that specifically include following steps：
1）Prepare that there is satisfactory electrical conductivity, thermal conductivity, plastic metal substrate or plastic non-metal base plate first, it is right
In non-metal base plate：Last layer conductive layer is pasted on substrate, or last layer conductive layer is pasted in substrate upper and lower surface, so
Afterwards one layer of white oil of each brush of upper and lower surface is covered；For metal substrate, then first on metallic substrates face pastes a layer insulating, exhausted
Paste one layer of conductive layer above edge layer again, finally on the electrically conductive one layer of ink of each brush is covered under face and substrate；
2）There is the conductive laminated conducting channel for etching filament design helical trajectory in the substrate made；
3）The mode being machined into cuts out the substrate of filamentray structure on substrate, obtains that the flexible base of filamentray structure is presented
Plate；
4）After positive cartridge chip or flip-chip are packaged, then chip is led by insulating cement baking-curing or elargol etc.
The mode of electric glue baking welding is fixed on substrate, when flip-chip is welded, by between two electrodes point insulating glue it is electric by two
Extremely separate to prevent short circuit；
5）LED die bond operations are carried out on substrate, the spacing between LED chip can be adjusted, die bond face menu face die bond or two-sided
Die bond；
6）Coated with fluorescence rouge and powder and bloom mixed transparent silica gel, or covered by rotating or applying pressure mode with fluorescence membrane
On the substrate covered after die bond is intact, one side or dual coating are realized, through high-temperature baking, solidification, obtain encapsulation intact
Spiral LED filament；
7）After with fixture is clamped the both positive and negative polarity of filament, uniformly stretch out, obtain the filament of required form, and fixture is normal
The fixture of the making filament of rule；
8）The both positive and negative polarity of filament made by giving is powered, the luminous flux of measurement filament, and whether temperature rise is qualified.
2. the spiral LED filament preparation method being used in bulb lamp according to claim 1, it is characterised in that the step
2）Filament design helical trajectory is Fei Bulaqi helicals, logarithmic spiral or Archimedian screw two-dimensional helical line, and pitch, pole
Footpath size is adjusted as desired.
3. the spiral LED filament preparation method being used in bulb lamp according to claim 1, it is characterised in that the step
6）The surface of substrate is coated in by gluing glutinous coating method with the fluorescence membrane for preparing.
4. the spiral LED filament preparation method being used in bulb lamp according to claim 1, it is characterised in that the step
7）Shape after coiled filament stretching is conical log-spiral or cylindrical screw three-dimensional spiral line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611235343.1A CN106678580A (en) | 2016-12-28 | 2016-12-28 | Manufacturing method for spiral LED lamp filament inside bulb lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611235343.1A CN106678580A (en) | 2016-12-28 | 2016-12-28 | Manufacturing method for spiral LED lamp filament inside bulb lamp |
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| Publication Number | Publication Date |
|---|---|
| CN106678580A true CN106678580A (en) | 2017-05-17 |
Family
ID=58873066
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611235343.1A Pending CN106678580A (en) | 2016-12-28 | 2016-12-28 | Manufacturing method for spiral LED lamp filament inside bulb lamp |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108198805A (en) * | 2017-12-06 | 2018-06-22 | 浙江亿米光电科技有限公司 | A kind of high-capacity LED coiled-coil filament |
| CN108799863A (en) * | 2018-06-23 | 2018-11-13 | 杭州思隽思科技有限公司 | A kind of filamentray structure and the light bulb with the filamentray structure |
| CN108826041A (en) * | 2018-06-23 | 2018-11-16 | 杭州思隽思科技有限公司 | A kind of manufacturing method of filamentray structure |
| CN109538972A (en) * | 2018-12-06 | 2019-03-29 | 上海应用技术大学 | A kind of LED intention bulb lamp |
| CN109869648A (en) * | 2019-02-26 | 2019-06-11 | 上海应用技术大学 | One kind exempting from stem LED filament lamp and preparation method thereof |
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| CN203656627U (en) * | 2013-12-02 | 2014-06-18 | 张晓峰 | Lamp bulb with one spiral LED lamp filament |
| CN103972377A (en) * | 2014-05-08 | 2014-08-06 | 南京华鼎电子有限公司 | Method for packaging omni-directional lighting LED lamp filament by means of flip bonding |
| CN104157638A (en) * | 2014-08-27 | 2014-11-19 | 江苏华英光宝科技股份有限公司 | 360-degree light emitting free-surrounding LED lamp filament with front-mounted chips inverted and manufacturing method thereof |
| CN105240703A (en) * | 2015-10-28 | 2016-01-13 | 汤雄 | Manufacturing technology for bent LED filament and bulb with bent LED filament |
| CN105570700A (en) * | 2015-12-31 | 2016-05-11 | 苏州瀚墨材料技术有限公司 | Lighting device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203656627U (en) * | 2013-12-02 | 2014-06-18 | 张晓峰 | Lamp bulb with one spiral LED lamp filament |
| CN103972377A (en) * | 2014-05-08 | 2014-08-06 | 南京华鼎电子有限公司 | Method for packaging omni-directional lighting LED lamp filament by means of flip bonding |
| CN104157638A (en) * | 2014-08-27 | 2014-11-19 | 江苏华英光宝科技股份有限公司 | 360-degree light emitting free-surrounding LED lamp filament with front-mounted chips inverted and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108198805A (en) * | 2017-12-06 | 2018-06-22 | 浙江亿米光电科技有限公司 | A kind of high-capacity LED coiled-coil filament |
| CN108799863A (en) * | 2018-06-23 | 2018-11-13 | 杭州思隽思科技有限公司 | A kind of filamentray structure and the light bulb with the filamentray structure |
| CN108826041A (en) * | 2018-06-23 | 2018-11-16 | 杭州思隽思科技有限公司 | A kind of manufacturing method of filamentray structure |
| EP3812647A4 (en) * | 2018-06-23 | 2022-03-16 | Tiehan Ge | Filament structure and bulb having the filament structure |
| CN109538972A (en) * | 2018-12-06 | 2019-03-29 | 上海应用技术大学 | A kind of LED intention bulb lamp |
| CN109869648A (en) * | 2019-02-26 | 2019-06-11 | 上海应用技术大学 | One kind exempting from stem LED filament lamp and preparation method thereof |
| CN109869648B (en) * | 2019-02-26 | 2021-05-18 | 上海应用技术大学 | Core-stem-free LED filament lamp and preparation method thereof |
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