CN107706287B - COB light source production method - Google Patents
COB light source production method Download PDFInfo
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- CN107706287B CN107706287B CN201710903465.1A CN201710903465A CN107706287B CN 107706287 B CN107706287 B CN 107706287B CN 201710903465 A CN201710903465 A CN 201710903465A CN 107706287 B CN107706287 B CN 107706287B
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- box dam
- light source
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- cob light
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 238000005119 centrifugation Methods 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 229920000297 Rayon Polymers 0.000 claims description 5
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000010411 cooking Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 238000005336 cracking Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract description 3
- 230000001376 precipitating effect Effects 0.000 abstract description 3
- 230000003760 hair shine Effects 0.000 abstract description 2
- XNMARPWJSQWVGC-UHFFFAOYSA-N 2-[3-[11-[[5-(dimethylamino)naphthalen-1-yl]sulfonylamino]undecanoylamino]propoxy]-4-[(5,5,8,8-tetramethyl-6,7-dihydronaphthalene-2-carbonyl)amino]benzoic acid Chemical compound CC1(C)CCC(C)(C)C=2C1=CC(C(=O)NC=1C=C(C(=CC=1)C(O)=O)OCCCNC(=O)CCCCCCCCCCNS(=O)(=O)C1=C3C=CC=C(C3=CC=C1)N(C)C)=CC=2 XNMARPWJSQWVGC-UHFFFAOYSA-N 0.000 description 11
- 238000013461 design Methods 0.000 description 5
- 230000002269 spontaneous effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000243 photosynthetic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to the technical fields of COB light source, disclose COB light source production method, comprising the following steps: 1) secure the wafer on substrate；2) chip and conductor wire are welded；3) first layer box dam is set on substrate, second layer box dam is set on first layer box dam；4) fluorescent glue is filled, after fluorescent glue tiling, substrate is put into centrifugation apparatus and is rotated；5) postrotational substrate is toasted, forms COB light source.By the way that two layers of box dam is arranged on substrate, fluorescent glue is filled in box dam, so that the total height of box dam increases, and fluorescent glue is avoided to overflow in subsequent depositing technology；Then using the fluorescent powder in centrifugation apparatus precipitating fluorescent glue, so that COB light source shines uniformly, hot spot works well, make the heat dissipation effect of fluorescent glue good simultaneously, the temperature for reducing fluorescent glue surface, avoiding COB light source because use process medium temperature spends height leads to fluorescent glue cracking or generation the case where chip rapid decay.
Description
Technical field
The present invention relates to the technical fields of COB light source, especially COB light source production method.
Background technique
COB light source is that the high photosynthetic efficiency that LED chip is placed directly against on the mirror metal substrate of high reflecting rate integrates area source skill
Art, this technology eliminate bracket concept, electroless plating, without Reflow Soldering, without patch process, therefore process reduces nearly one third, at
Originally one third is also saved.
COB light source can simply be interpreted as high power and integrate area source, can design light source according to product shape structure
Lighting area and outer dimension, it has the advantage that
1, COB light source low manufacture cost, it is easy to use；
2, electrically stablize, circuit design, optical design, heat dissipation design are scientific and reasonable；
3, there is good hot lumen depreciation；
4, mating convenient for the secondary optics of product, improve lighting quality；
5, Gao Xianse, shine uniformly, without hot spot, health environment-friendly.
6, installation is simple, easy to use, reduces Design of Luminaires difficulty, saves lamps and lanterns processing and follow-up maintenance cost.
COB integration packaging is as novel LED packaged type, as LED product is in the application of lighting area, COB light source
It is more and more extensive in following application meeting.However, higher temperature can be generated when the long-time use of COB light source, lead to fluorescence
Glue cracking or chip decaying are serious, reduce the service life of COB light source.
Summary of the invention
COB light source production method provided by the invention, it is intended to solve meeting when COB light source uses for a long time in the prior art
The problem of generating higher temperature, causing fluorescent glue cracking or chip decaying serious, reduce the service life of COB light source.
The invention is realized in this way, comprising the following steps:
1), multiple chips are separately fixed on the reserved place of substrate；
2), the chip is electrically connected with the substrate by conductor wire, is made on the chip and the substrate
Circuit realize conducting；
3), first layer box dam is set on the substrate, the chip and conductor wire are in the first layer box dam
In enclosing region, the substrate for setting the first layer box dam is toasted, is taken after first layer box dam solidification
Out；Second layer box dam is set on the first layer box dam, the substrate for setting the second layer box dam is toasted,
It is taken out after second layer box dam solidification；The first layer box dam and second layer box dam form the whole box dam of monoblock type；
4) fluorescent glue, is filled in the whole box dam area defined, after fluorescent glue tiling, by the base
Plate, which is put into centrifugation apparatus, to be rotated, and the fluorescent powder in the fluorescent glue is made to be deposited to the lower part of the fluorescent glue；
5) substrate after centrifugal rotation, is put into oven cooking cycle, is taken out after the fluorescence adhesive curing, COB is formed
Light source.
Further, in the step 2), the conductor wire is set as straight line bends shape.
Further, in the step 3), the surface of the first layer box dam is arranged in second box dam.
Further, the first layer box dam and the second layer box dam, which enclose by box dam machine, sets.
Further, in the step 4), after the fluorescent glue tiling, the height of the fluorescent glue is more than the first layer
The height at the top of box dam, and the height at the top lower than second layer box dam.
Further, the conductor wire is gold thread or aluminum steel.
Further, the fixed viscose glue is the red glue of conductive elargol or insulation.
Compared with prior art, COB light source production method provided by the invention, by the way that two layers of box dam is arranged on substrate,
Fluorescent glue is filled in box dam, so that the total height of box dam increases, and fluorescent glue is avoided to overflow in subsequent depositing technology；
Then using the fluorescent powder in centrifugation apparatus precipitating fluorescent glue, so that COB light source shines uniformly, hot spot works well, and makes simultaneously
The heat dissipation effect for obtaining fluorescent glue is good, reduces the temperature on fluorescent glue surface, avoids COB light source due to use process medium temperature spends height
The case where leading to fluorescent glue cracking or chip rapid decay generation can generate higher when solving COB light source use for a long time
The problem of temperature causes fluorescent glue cracking or chip decaying serious, reduces the service life of COB light source.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of COB light source production method provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of internal structure of COB light source production method provided in an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Realization of the invention is described in detail below in conjunction with specific embodiment.
The same or similar label correspond to the same or similar components in the attached drawing of the present embodiment；In description of the invention
In, it is to be understood that if there is the orientation or positional relationship of the instructions such as term " on ", "lower", "left", "right" for based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore describe the use of positional relationship in attached drawing
Language only for illustration, should not be understood as the limitation to this patent, for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term is understood as the case may be.
It is preferred embodiment provided by the invention shown in referring to Fig.1~2.
COB light source production method, comprising the following steps:
1) multiple chips 11 are separately fixed on the reserved place of substrate 12 by fixed viscose glue.On clean substrate 12
Suitable glue on point, then be correctly placed on chip 11 on glue with vacuum pencil or tweezers, it, will after all wafers 11 place
The substrate 12 for having sticked chip 11 puts baking and curing in baking oven into, can also be with spontaneous curing；
2) chip 11 and substrate 12 conductor wire 13 is crossed using the bonding equipment of ASM to be electrically connected, make chip 11 and
Circuit on substrate 12 realizes conducting, after the completion of welding, detects to product, underproof product is reprocessed again, qualified
Product is transferred to next process；
3) first layer box dam 14 is set on the substrate 12, and chip 11 and conductor wire 13 are in what first layer box dam 14 was surrounded
It in region, puts the substrate 12 for setting first layer box dam 14 into oven and toasts, taken out after the solidification of first layer box dam 14.
Certainly, first layer box dam 14 can also be made to solidify using the method for spontaneous curing；The second layer is arranged on first layer box dam 14 to enclose
Dam 15 is put the substrate 12 for setting second layer box dam 15 into oven and is toasted, and takes out after the solidification of second layer box dam 15, also
Second layer box dam 15 can be made to solidify using the method for spontaneous curing, at this time first layer box dam 14 and the formation of second layer box dam 15
The whole box dam of monoblock type.According to actual needs, it can be arranged on second layer box dam 15 and continue that box dam is arranged, be formed so whole
The number of plies of box dam is more so that the height of whole box dam is higher, be arranged box dam purpose be in order to which subsequent sealing is prepared, and
The whole box dam that multilayer is arranged is height in order to increase box dam, and other methods can also be used to increase the height of box dam, such as optimization be enclosed
Dam equipment etc.；
4) fluorescent glue 16 is filled in whole box dam put substrate 12 into centrifugation apparatus after fluorescent glue 16 tiles naturally
Middle carry out rotating centrifugal, makes the fluorescent powder in fluorescent glue 16 be deposited to the lower part of fluorescent glue 16.Due to being provided in step 3)
Two layers of box dam avoids the fluorescent glue 16 being filled in box dam when substrate 12 is centrifuged so that box dam overall height increases
The case where spilling, occurs；
5) substrate 12 after rotating centrifugal is put into oven cooking cycle, takes out after the solidification of fluorescent glue 16, is detected again,
After qualification, COB light source completes.
The COB light source production method of above-mentioned offer fills fluorescence by the way that two layers of box dam is arranged on the substrate 12 in box dam
Glue 16, so that the total height of box dam increases, and fluorescent glue 16 is avoided to overflow in subsequent depositing technology；Then using centrifugation
Fluorescent powder in equipment precipitating fluorescent glue 16 avoids COB light source because in use process so that the heat dissipation effect of fluorescent glue 16 is more preferable
Temperature is excessively high and fluorescent glue 16 is caused to crack or generation the case where chip rapid decay, when solving COB light source and using for a long time
Higher temperature can be generated, causes the cracking of fluorescent glue 16 or chip decaying serious, reduces asking for the service life of COB light source
Topic.
In step 2), conductor wire 13 is set as straight line bends shape.In the prior art, the conductor wire 13 of COB light source is in arc
Shape is easy to be broken in weld when by pressure at right angle, the problem of causing dead lamp, be unfavorable for COB light source assembling and
It uses.In the present embodiment, straight line bends shape is set by conductor wire 13, in this way, the pressure will not be made when front is under pressure
Used in forniciform 13 top of conductor wire, but the side of forniciform conductor wire 13 is acted on, while forniciform conductor wire
13 itself have preferable buffer function, so that conductor wire 13 is not easy to break when being under pressure, solves and are assembling or using
When conductor wire 13 be under pressure the problem of being easily broken off.
In step 3), the surface of first layer box dam 14 is arranged in the second box dam.In this way, the feelings constant in box dam equipment
Under condition, the total height highest of first layer box dam 14 and second layer box dam 15 can be made, so that the fluorescent glue 16 filled in box dam
Thickness increase, increase fluorescent glue 16 buffer function, better protective effect is formed to conductor wire 13；In addition, increasing box dam
Total height can to avoid the fluorescent glue 16 being filled in inside box dam when centrifugation spilling, facilitate the reality of subsequent handling
It applies.
In the present embodiment, first layer box dam 14 and second layer box dam 15 carry out circle by box dam machine and set.By using box dam
Machine, so that the quality of production is stablized, is conducive to industrialize so that the dam body of first layer box dam 14 and second layer box dam 15 is identical everywhere
With standardized production；In addition, the shape of box dam can be set by the parameter that box dam machine is arranged, so that COB light source
It produces more flexible, meets the individual demand of different clients.
In step 4), after fluorescent glue 16 tiles, the height of fluorescent glue 16 is more than the height at the top of first layer box dam 14, and
Lower than the height at the top of second layer box dam 15.That is, the COB light source made by this COB light source production method, glimmering
The thickness of optical cement 16 is bigger than conventional COB light source, so that is buffered by the COB light source that this COB light source production method makes
Effect is more preferable, can preferably protect internal conductor wire 13.Meanwhile the height of fluorescent glue 16 is lower than the height of second layer box dam 15
Degree avoids the case where fluorescent glue 16 overflows box dam generation.
In the present embodiment, conductor wire 13 is gold thread or aluminum steel.According to the purposes of COB light source, leading for respective material is selected
Electric wire 13, wherein gold thread and aluminum steel are that other kinds of conductor wire 13 also may be selected according to actual needs in preference.
In the present embodiment, fixed viscose glue is the red glue of conductive elargol or insulation.Chip 11 according to used in COB light source
Property, use elargol or red glue as fixed viscose glue, wherein elargol is conductive, and red glue is insulation.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (7)
1.COB light source production method, which comprises the following steps:
1), multiple chips are separately fixed on the reserved place of substrate；
2), the chip is electrically connected with the substrate by conductor wire, makes the electricity on the chip and the substrate
Realize conducting in road；
3), first layer box dam is set on the substrate, the chip and conductor wire are in the encirclement of the first layer box dam
In region, the substrate for setting the first layer box dam is toasted, is taken out after first layer box dam solidification；?
Second layer box dam is set on the first layer box dam, the substrate for setting the second layer box dam is toasted, to institute
It is taken out after stating the solidification of second layer box dam；The first layer box dam and second layer box dam form the whole box dam of monoblock type；
4) fluorescent glue, is filled in the whole box dam area defined, after fluorescent glue tiling, the substrate is put
Into being rotated in centrifugation apparatus, the fluorescent powder in the fluorescent glue is made to be deposited to the lower part of the fluorescent glue；
5) substrate after centrifugal rotation, is put into oven cooking cycle, is taken out after the fluorescence adhesive curing, COB light source is formed.
2. COB light source production method as described in claim 1, which is characterized in that in the step 2), the conductor wire setting
For straight line bends shape.
3. COB light source production method as described in claim 1, which is characterized in that in the step 3), the second layer box dam
The surface of the first layer box dam is set.
4. COB light source production method as described in claim 1, which is characterized in that the first layer box dam and the second layer
Box dam carries out circle by box dam machine and sets.
5. COB light source production method as described in claim 1, which is characterized in that in the step 4), the fluorescent glue tiling
Afterwards, the height of the fluorescent glue is more than the height at the top of the first layer box dam, and is lower than the height at the top of second layer box dam
Degree.
6. COB light source production method as described in claim 1, which is characterized in that the conductor wire is gold thread or aluminum steel.
7. COB light source production method as described in claim 1, which is characterized in that fixed viscose glue is conductive elargol or insulation
Red glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710903465.1A CN107706287B (en) | 2017-09-29 | 2017-09-29 | COB light source production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710903465.1A CN107706287B (en) | 2017-09-29 | 2017-09-29 | COB light source production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107706287A CN107706287A (en) | 2018-02-16 |
| CN107706287B true CN107706287B (en) | 2019-05-14 |
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| CN201710903465.1A Active CN107706287B (en) | 2017-09-29 | 2017-09-29 | COB light source production method |
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| CN118136748A (en) * | 2024-05-06 | 2024-06-04 | 珠海市宏科光电子有限公司 | COB light source with uniform light emission and preparation process thereof |
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| KR101008459B1 (en) * | 2010-08-31 | 2011-01-14 | 진영범 | Mothod for fabricating a smart card |
| CN202153536U (en) * | 2011-07-20 | 2012-02-29 | 福建泰德视讯数码科技有限公司 | High power LED packaging structure |
| CN102569562A (en) * | 2012-01-20 | 2012-07-11 | 江苏索尔光电科技有限公司 | LED (Light-Emitting Diode) packaging method |
| JP2013171626A (en) * | 2012-02-17 | 2013-09-02 | Sharp Corp | Light source board and light source module |
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Effective date of registration: 20180817 Address after: 518107 12 buildings of Shek Guan Industrial Park, Gongming village, Guangming New District, Shenzhen, Guangdong Applicant after: Crescent Optoelectronics (Shenzhen) Limited by Share Ltd Address before: 343100 Fenghuang Park, Ji'an hi tech Zone, Ji'an, Ji'an, Jiangxi Applicant before: Jiangxi crescent photoelectric Co., Ltd. |
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