CN202736970U - LED support for surface mounting and LED lamp - Google Patents
LED support for surface mounting and LED lamp Download PDFInfo
- Publication number
- CN202736970U CN202736970U CN 201220264869 CN201220264869U CN202736970U CN 202736970 U CN202736970 U CN 202736970U CN 201220264869 CN201220264869 CN 201220264869 CN 201220264869 U CN201220264869 U CN 201220264869U CN 202736970 U CN202736970 U CN 202736970U
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- substrate
- direction extension
- packaging body
- led support
- spare
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Abstract
The utility model discloses an LED support for surface mounting and an LED lamp. The LED support for surface mounting comprises a metal substrate and an encapsulation body; the metal substrate comprises a first substrate piece and a second substrate piece, wherein the first substrate piece and the second substrate piece respectively comprise a horizontally-extending portion, a vertically-extending portion and a pin which are connected successively; and the encapsulation body completely covers the horizontally-extending portions of the metal substrate and at least partially covers the vertically-extending portions, and the encapsulation body is provide with a bowl-cup structure formed at a surface of an upper side of the horizontally-extending portions, and an encapsulating adhesive is filled inside the bowl-cup structure. Through adopting the above technical schemes, the LED support of the utility model can effectively prevent the metal substrate from being affected by expansion caused by heat and contraction caused by cold so as to avoid displacement, and at the same time, the LED support can effectively prevent moisture from entering the bowl-cup structure, thereby prolonging the service life of the LED support.
Description
Technical field
The utility model relates to a kind of for surface-pasted led support and LED lamp.
Background technology
Along with LED(Light Emitting Diode, light-emitting diode) lighting technology growing, the application of LED in people's daily life is also more and more extensive.LED generally adopts SMD(Surface Mounted Device, surface mount device at present) supporting structure.
Consult Fig. 1, Fig. 1 is the schematic cross-section of prior art led support.The horizontal component of part metals substrate 1000 is embedded in the packaging body 1001, at metal substrate 1000 upsides bowl cup 1002 is arranged, and fills packaging plastic (not indicating) in the bowl cup 1002.Wherein, metal substrate 1000 comprises and connects respectively positive source and negative pole and be embedded in first substrate spare 201 and second substrate spare 202 in the packaging body 1001, led chip 1003 is arranged on the second substrate spare 202, led chip 1,003 one gold threads 1004 connect first substrate spare 201, and another gold thread 1004 connects second substrate spare 202.
Yet, since metal substrate 1000 and packaging body 1001 to contact the path too short, the slit that causes moisture to be easy between metal substrate 1000 and packaging body 1001 enters bowl cup inside, and, long-time when luminous at led chip 1003, be affected by thermal expansion and contraction, may produce displacement between metal substrate 1000 and the packaging body 1001, gold thread 1004 easily disconnects from metal substrate 1000, disconnects thereby form circuit, causes product failure.
The utility model content
The technical problem that the utility model mainly solves provides a kind of for surface-pasted led support and LED lamp, can effectively prevent the metal substrate generation displacement that is affected by thermal expansion and contraction, and it is inner to prevent effectively that moisture from entering the bowl cup, prolongs the useful life of led support.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of for surface-pasted led support, comprising: metal substrate and packaging body; Metal substrate comprises first substrate spare and second substrate spare, and first substrate spare and second substrate spare include horizontal direction extension, vertical direction extension and the pin that connects successively; Wherein, the surface that the horizontal direction extension of the complete covering metal substrate of packaging body and at least part of covering vertical direction extension, packaging body are positioned at horizontal direction extension upside forms the bowl cup, and is filled with packaging plastic in the bowl cup.
Wherein, the vertical direction extension comprises at least one bend unit, and packaging body covers bend unit fully.
Wherein, packaging body covers the vertical direction extension fully.
Wherein, vertical direction extension and pin are U-shaped structure, and packaging body covers the vertical direction extension fully.
Wherein, metal substrate is copper or aluminium alloy base plate.
Wherein, horizontal direction extension or vertical direction extension are provided with projection or groove.
Wherein, packaging body adopts the PPA material, and packaging body, first substrate spare and the injection mo(u)lding of second substrate spare.
Wherein, first substrate spare and second substrate spare are symmetrical structure, and the pin of first substrate spare be used for to connect positive source, and the pin of second substrate spare is used for connecting power cathode.
For solving the problems of the technologies described above, another technical scheme that the utility model adopts is: a kind of LED lamp is provided, comprises such as above-mentioned arbitrary embodiment described for surface-pasted led support.
Wherein, the LED lamp comprises led chip; Led chip is arranged at first substrate spare, and the positive pole of led chip connects first substrate spare, and the negative pole of led chip connects second substrate spare; Perhaps led chip is arranged at second substrate spare, and the positive pole of led chip connects first substrate spare, and the negative pole of led chip connects second substrate spare.
The beneficial effects of the utility model are: the situation that is different from prior art, in the utility model with first substrate spare and second substrate spare horizontal direction extension and at least part of covering vertical direction extension separately of the complete covering metal substrate of packaging body, can prolong the path that contacts of metal substrate and packaging body, reduce moisture entrance scope, so that moisture is not easy to enter into bowl cup inside, so that be difficult between packaging body and the metal substrate because expand with heat and contract with cold the generation displacement, can effectively avoid gold thread and the metal substrate of led chip to disconnect, prolong the useful life of led support.
Description of drawings
Fig. 1 is the schematic cross-section of prior art led support;
Fig. 2 is the schematic cross-section that the utility model is used for surface-pasted led support the first embodiment;
Fig. 3 is the vertical view for surface-pasted led support the first embodiment shown in Figure 2;
Fig. 4 is the schematic cross-section that the utility model is used for surface-pasted led support the second embodiment;
Fig. 5 is the schematic cross-section that the utility model is used for surface-pasted led support the 3rd embodiment.
Embodiment
Below in conjunction with drawings and Examples the utility model is elaborated.
Consult Fig. 2, Fig. 2 is the schematic cross-section that the utility model is used for surface-pasted led support the first embodiment.The utility model led support comprises: metal substrate 1 and packaging body 2.
Metal substrate 1 further comprises first substrate spare 11 and second substrate spare 12, first substrate spare 11 and second substrate spare 12 include horizontal direction extension 100, vertical direction extension 101 and pin 102 separately, wherein, horizontal direction extension 100, vertical direction extension 101 and pin 102 connect and successively by mode moulding such as punching press or castings.
The surface that packaging body 2 is positioned at horizontal direction extension 101 upsides is formed with bowl cup 3, is filled with packaging plastic 4 in the bowl cup 3.
Wherein, the horizontal direction extension 100 of packaging body 2 complete covering metal substrates 1, and packaging body 2 covers vertical direction extension 101 fully, and pin 102 penetrates packaging body 2, and namely pin 102 passes from the bottom surface of packaging body 2.
Consult Fig. 3, Fig. 3 is the vertical view for surface-pasted led support the first embodiment shown in Figure 2, and please in conjunction with Fig. 3.
The zone that first substrate spare 11 is positioned at bowl cup 3 inside comprises first area 110, and the pin 102 of first area 110 by first substrate spare 11 is connected to positive source; The zone that second substrate spare 12 is positioned at bowl cup 3 inside comprises second area 120, the 121 and the 4th zone 122, the 3rd zone, and second area 120, the 121 and the 4th zone 122, the 3rd zone are connected respectively to power cathode by the pin 102 of second substrate spare 12.First area 110, second area 120, the 121 and the 4th zone 122, the 3rd zone isolate mutually by insulating material.When realizing that full color shows, in the bowl cup 3, second area 120, the 3rd zone can arrange respectively red LED chip (not shown), green light LED chip (not shown) and blue-light LED chip (not shown) in the 121 and the 4th zone 122, gold thread one end of each color led chip is connected to its region separately as its negative pole, and the other end all is connected to first area 110 as its positive pole.Certainly, decide on real needs, in bowl cup 3 a LEDs chip can only be set, the color of this led chip can be free, such as being ruddiness or green glow or blue light or white light etc., do not make too many restrictions herein.
The utility model embodiment, the horizontal direction extension 100 of packaging body 2 complete covering metal substrates 1, and packaging body 2 covers vertical direction extension 101 fully, by the contact path of prolongation metal substrate 1 with packaging body 2, help combining closely of metal substrate 1 and packaging body 2, led support is under the impact of expanding with heat and contract with cold, and metal substrate 1 is not easy to produce the displacement of relative led chip (not shown), and the gold thread that led chip is connected on the metal substrate 1 just is not easy to disconnect.The scope of moisture entrance is reduced simultaneously, can prevent effectively that moisture from entering in the bowl cup 3, and then prolong the useful life of led support.
Consult Fig. 4, Fig. 4 is the novel schematic cross-section for surface-pasted led support the second embodiment of this use.The utility model led support comprise with the utility model the first embodiment in the same or analogous metal substrate 21 of 26S Proteasome Structure and Function and packaging body 22.Its difference is:
Separately vertical direction extension 2101 comprises at least one bend unit 300 in the first metalwork 211 that metal substrate 21 comprises, the second metalwork 212, further, packaging body 22 covers in the first metalwork 211, the second metalwork 212 horizontal direction extension 2100 separately fully, and packaging body 22 covers in the first metalwork 211, the second metalwork 212 bend unit 300 of vertical direction extension 2101 separately fully.In addition, cover except the non-encapsulated body 22 of another part of bend unit 300 in the vertical direction extension 2101, pin 2102 also non-encapsulated body 22 covers.
The utility model embodiment, vertical direction extension 2101 comprises at least one bend unit 300, packaging body 22 covers horizontal direction extension 2100 fully, and packaging body 22 covers this bend unit 300 fully, by the contact path of prolongation metal substrate 21 within the zone limited in led support with packaging body 22, help combining closely of metal substrate 21 and packaging body 22, led support is under the impact of expanding with heat and contract with cold, metal substrate 21 is not easy to produce the displacement of relative led chip (not shown), and the gold thread that led chip is connected on the metal substrate 21 just is not easy to disconnect.In addition, and moisture will just might enter by the long distance that side metal substrate 21 makes progress if enter bowl cup 23 inside, can effectively stop moisture to enter bowl cup 23 inside, and then prolong the useful life of led support.
Consult Fig. 5, Fig. 5 is the schematic cross-section that the utility model embodiment is used for surface-pasted led support the 3rd embodiment.The utility model led support comprise with the utility model the first embodiment in the same or analogous metal substrate 31 of 26S Proteasome Structure and Function and packaging body 32.Its difference is:
Vertical direction extension 3101 is U-shaped structure with pin 3102, packaging body 32 covers in the first metalwork 311, the second metalwork 312 horizontal direction extension 3100 separately fully, and packaging body 32 covers vertical direction extension 3101 fully, namely only has pin 3102 to expose outside packaging body 32 this moment.
The utility model embodiment, vertical direction extension 3101 and pin 3102 are arranged to be U-shaped structure, its principle still is by the contact path of prolongation metal substrate 31 with packaging body 32, help combining closely of metal substrate 31 and packaging body 32, led support is in the situation of expanding with heat and contract with cold, metal substrate 31 is not easy to produce the displacement of relative led chip (not shown), and the gold thread that led chip is connected on the metal substrate 31 just is not easy to disconnect.The scope of moisture entrance is reduced simultaneously, can prevent effectively that moisture from entering bowl cup 33 inside, and then prolong the useful life of led support.
In above-described embodiment, metal substrate is copper or aluminium alloy base plate.And extension or vertical direction extension can be provided with one or more projections or groove in the horizontal direction, set up the path that contacts that projection or groove also are equivalent to prolong metal substrate and packaging body, and the associativity of metal substrate and packaging body is improved effect.And packaging body can adopt PPA(Polyphthalamide, poly-O-phthalic acid amide) material, and packaging body, first substrate spare and second substrate spare are by injection mo(u)lding.
It should be noted that first substrate spare and second substrate spare can be designed as symmetrical structure, reduce production costs thereby first substrate spare and second substrate spare adopt the symmetrical structure design can reduce mould.Further, the pin of first substrate spare is used for connecting positive source, the pin of second substrate spare is used for connecting power cathode, certainly, first substrate spare and second substrate spare also can be designed as unsymmetric structure, the pin of first substrate spare also can be used for connecting power cathode, and the pin of second substrate spare can be used for connecting positive source, decides on real needs.
Comprehensive above-described embodiment is described, as can be known:
First substrate spare and second substrate spare horizontal direction extension and at least part of covering vertical direction extension separately in the complete covering metal substrate of packaging body, pin penetrates packaging body simultaneously, can prolong the path that contacts of metal substrate and packaging body, and can reduce moisture entrance scope, so that moisture is not easy to enter into bowl cup inside, thereby the displacement that metal substrate can not cause producing relative led chip because of the pulling force of packaging body generation under the impact of expanding with heat and contract with cold, can effectively avoid gold thread and the metal substrate of led chip (not shown) to disconnect, and then can prolong the life-span of led support.
The utility model also provides a kind of LED lamp, and described LED lamp comprises that above-mentioned each embodiment is described for surface-pasted led support.
In the utility model LED lamp embodiment, the LED lamp comprises led chip;
Led chip is arranged at first substrate spare, and the positive pole of led chip connects first substrate spare, and the negative pole of led chip connects second substrate spare; Perhaps led chip is arranged at second substrate spare, and the positive pole of led chip connects first substrate spare, and the negative pole of led chip connects second substrate spare.
The utility model embodiment, first substrate spare and second substrate spare horizontal direction extension and at least part of covering vertical direction extension separately in the complete covering metal substrate of packaging body, pin penetrates packaging body simultaneously, can prolong the path that contacts of metal substrate and packaging body, reduce moisture entrance scope, so that moisture is not easy to enter into bowl cup inside, so that can be because of the generation displacement of expanding with heat and contract with cold between packaging body and the metal substrate, can effectively avoid gold thread and the metal substrate of led chip to disconnect, prolong the useful life of led support, and then prolong the useful life of LED lamp.
In sum, the utility model has the following advantages for surface-pasted led support and LED light fixture:
(1) can be effectively with the moisture gear in outside, or make moisture within it section stop to flow;
(2) structure of improvement led support is covered in metal substrate major part or Zone Full in the packaging body, only needs to reserve certain surface area and get final product as pin, reduces the contact area of moisture and metal substrate;
(3) metal substrate is bent in the package interior subregion, led support is run into when expanding with heat and contract with cold, metal substrate does not produce the displacement of relative led chip, and moisture to enter the inner path of the bowl cup of led support tortuous, can stop the infiltration of moisture;
(4) metal substrate is derived from package bottom, can prevent effectively that moisture from entering from the side.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (10)
1. one kind is used for surface-pasted led support, it is characterized in that, comprising:
Metal substrate and packaging body;
Described metal substrate comprises first substrate spare and second substrate spare, and described first substrate spare and second substrate spare include horizontal direction extension, vertical direction extension and the pin that connects successively;
Wherein, the surface that the described vertical direction extension of the horizontal direction extension of the complete covering metal substrate of described packaging body and at least part of covering, described packaging body are positioned at horizontal direction extension upside forms the bowl cup, and is filled with packaging plastic in the described bowl cup.
2. according to claim 1ly it is characterized in that for surface-pasted led support,
Described vertical direction extension comprises at least one bend unit, and described packaging body covers described bend unit fully.
3. according to claim 1ly it is characterized in that for surface-pasted led support,
Described packaging body covers described vertical direction extension fully.
4. according to claim 1ly it is characterized in that for surface-pasted led support,
Described vertical direction extension and pin are U-shaped structure, and described packaging body covers the vertical direction extension fully.
5. according to claim 1ly it is characterized in that for surface-pasted led support,
Described metal substrate is copper or aluminium alloy base plate.
6. according to claim 1ly it is characterized in that for surface-pasted led support,
Described horizontal direction extension or vertical direction extension are provided with projection or groove.
7. according to claim 1ly it is characterized in that for surface-pasted led support,
Described packaging body adopts the PPA material, and described packaging body, first substrate spare and the injection mo(u)lding of second substrate spare.
8. according to claim 1ly it is characterized in that for surface-pasted led support,
Described first substrate spare and second substrate spare are symmetrical structure, and the pin of described first substrate spare be used for to connect positive source, and the pin of described second substrate spare is used for connecting power cathode.
9. a LED lamp is characterized in that, comprises that each is described for surface-pasted led support such as claim 1-8.
10. LED lamp according to claim 9 is characterized in that,
Described LED lamp comprises led chip;
Described led chip is arranged at first substrate spare, and the positive pole of described chip connects first substrate spare, and the negative pole of described chip connects described second substrate spare; Perhaps described led chip is arranged at second substrate spare, and the positive pole of described chip connects first substrate spare, and the negative pole of described chip connects described second substrate spare.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220264869 CN202736970U (en) | 2012-06-06 | 2012-06-06 | LED support for surface mounting and LED lamp |
| PCT/CN2012/083509 WO2013181896A1 (en) | 2012-06-06 | 2012-10-25 | Led bracket for surface mounting, manufacturing method thereof and led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220264869 CN202736970U (en) | 2012-06-06 | 2012-06-06 | LED support for surface mounting and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202736970U true CN202736970U (en) | 2013-02-13 |
Family
ID=47662639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220264869 Expired - Lifetime CN202736970U (en) | 2012-06-06 | 2012-06-06 | LED support for surface mounting and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202736970U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738366A (en) * | 2012-06-06 | 2012-10-17 | 深圳雷曼光电科技股份有限公司 | Light emitting diode (LED) support for surface mounting, manufacturing method and LED lamp |
| CN105932138A (en) * | 2016-06-28 | 2016-09-07 | 深圳市瑞展峰电子科技有限公司 | Packaging bracket-type semiconductor integrated circuit board |
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
-
2012
- 2012-06-06 CN CN 201220264869 patent/CN202736970U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738366A (en) * | 2012-06-06 | 2012-10-17 | 深圳雷曼光电科技股份有限公司 | Light emitting diode (LED) support for surface mounting, manufacturing method and LED lamp |
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10380925B2 (en) | 2013-12-31 | 2019-08-13 | Ultravision Technologies, Llc | Modular display panel |
| US10410552B2 (en) | 2013-12-31 | 2019-09-10 | Ultravision Technologies, Llc | Modular display panel |
| US10540917B2 (en) | 2013-12-31 | 2020-01-21 | Ultravision Technologies, Llc | Modular display panel |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
| CN105932138A (en) * | 2016-06-28 | 2016-09-07 | 深圳市瑞展峰电子科技有限公司 | Packaging bracket-type semiconductor integrated circuit board |
| CN105932138B (en) * | 2016-06-28 | 2019-07-26 | 深圳市瑞展峰电子科技有限公司 | A kind of package support type semiconductor integrated circuit board |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130213 |