CN105932138A - Packaging bracket-type semiconductor integrated circuit board - Google Patents
Packaging bracket-type semiconductor integrated circuit board Download PDFInfo
- Publication number
- CN105932138A CN105932138A CN201610478179.0A CN201610478179A CN105932138A CN 105932138 A CN105932138 A CN 105932138A CN 201610478179 A CN201610478179 A CN 201610478179A CN 105932138 A CN105932138 A CN 105932138A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- package support
- pin
- circuit board
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
Abstract
The invention discloses a packaging bracket-type semiconductor integrated circuit board. The packaging bracket-type semiconductor integrated circuit board is characterized by comprising an integrated circuit board body, wherein the integrated circuit board body is provided with a plurality of packaging brackets; separate circuits are arranged in the corresponding packaging brackets; and pins corresponding to the circuits are arranged at the lower parts of the corresponding packaging brackets. The packaging bracket-type semiconductor integrated circuit board has the advantages that a silver-copper alloy is adopted by the brackets, so that heat dissipation is facilitated; a traditional chip circuit point-out mode is changed; each circuit board is partitioned by the brackets and is separately pointed out; glue sealing and operation are accurate; division is convenient; the damage to a chip caused by the division is avoided; the production efficiency is greatly improved; the quality of a product is obviously improved; and the qualified rate of the product is greatly improved.
Description
Technical field
The present invention relates to a kind of semiconductor integrated circuit board, in particular, it relates to a kind of package support type semiconductor integrated circuit board.
Background technology
Existing conventional semiconductors surface-mounted integrated circuit points out multiple chip circuit on a monoblock pc plate, splits extremely difficult and breakage easily occurs and position inaccurate problem, substantially increasing production cost, and extremely inefficient, reduces detection speed.
Summary of the invention
The deficiency existed for prior art, it is an object of the invention to provide a kind of package support type semiconductor integrated circuit board.
For achieving the above object, the technical scheme is that a kind of package support type semiconductor integrated circuit board, including surface-mounted integrated circuit body, described surface-mounted integrated circuit body is provided with several package supports, it is provided with independent circuit in described package support, below described package support, is provided with the pin corresponding with circuit.
The present invention uses package support to separate each circuit so that it is each chip is independent, makes circuit accurate positioning, it is to avoid segmentation and the chip that causes is damaged, be greatly improved production efficiency, and the quality significantly improving product make conforming product rate significantly promote.
Being preferably, pin includes input pin, output pin and heat radiation pin, and described pin is L-shaped.Simple in construction, reasonable in design.
Being preferably, pin includes input pin, output pin and heat radiation pin, and described pin includes that extension and horizontal component, the angle between described extension and horizontal component are acute angle.
It it is the design of acute angle between pin extension of the present invention and horizontal component, packaged chip is made to be difficult in installation process, when when mounted, packaged chip is placed on when carrying out scolding tin on pcb board, often accidentally encountering encapsulation chip makes it fall down, and leverages its work efficiency.
The design of pin acute angle is difficult to the reason fallen down: this is a lever principle, the angle of right angle or acute angle is the fulcrum of lever, the center of gravity of package support is the position of the weight of lever one end, by the weight position that point is the lever other end of external force, when pin is designed as acute angle, now, center of gravity becomes big to the distance of balance pivot, and the mass conservation of weight, outside force to balance pivot in the case of constant, according to lever formula;F1*L1=F2*L2, now needs bigger external force F2 just can move the weight of the other end, and the F2 of needs increases, the another one meaning be exactly package support in the case of pin acute angle than right angle in the case of more be difficult to.
It is preferably, pin horizontal component undulate.
The present invention uses the corrugated design of pin horizontal component, during pin scolding tin, not only burn-on above waveform scolding tin, the most also burn-on in corrugated lower section scolding tin, compare the pin of original level design, its meeting is burn-on scolding tin above horizontal pin, substantially scolding tin is not had in the lower section of horizontal component, say from thermodynamics, a layer of air is had between horizontal component and scolding tin plate, and be to be connected by scolding tin between its horizontal component of wavy shaped configuration and scolding tin plate, according to heat transfer theory, the thermal resistance of air is far longer than the thermal resistance of scolding tin, the design of two kinds of structures, in terms of heat transfer, waveform is much larger than horizontal structure；Saying from scolding tin fixed angle, its scolding tin of waveform is fixing is that upper surface is fixed together with lower surface both sides, and horizontal structure its fixed by upper surface, both say at fixed aspect, and wavy shaped configuration is also much better than horizontal structure.
Being preferably, acute angle is 45 degree.Simple in construction, reasonable in design.
Being preferably, heat radiation pin is drawn directly down through surface-mounted integrated circuit body in the middle of package support.
The present invention uses the design that heat radiation pin directly leads out, its leading foot is compared traditional pin extraction and is compared, its thickness of pin is thin, thermal resistance is big, and directly lead out from centre, its leading foot is cylindrical structural, and sectional area is big, its thermal resistance, much smaller than the thermal resistance of pin structure, substantially increases heat radiation dynamics.
It is preferably, gear blob of viscose it is provided with outside package support upper surface, it is provided with inside described package support upper surface and leads glue passage, described glue passage of leading is arranged vertically downward, extend to bottom package support, described package support bottom surface is provided with a semi-cylindrical concave shaped space, described in lead glue passage and be connected with semi-cylindrical concave shaped space.
The present invention uses gear blob of viscose and the design leading glue passage, when support hose lining amount is filled full, its unnecessary trial of strength will be overflowed outward, now gear blob of viscose can be by trial of strength gear in the little scope enclosed, and unnecessary trial of strength slowly enters in semi-cylindrical concave shaped space as well as leading glue passage, after glue enters in semi-cylindrical concave shaped space, it can form an extra bonding strip between support and pcb board, strengthens the connection of pcb board and support further.
Being preferably, package support material is yellow gold.Simple in construction, reasonable in design.
The present invention has an advantage that support uses yellow gold to be easy to heat radiation, change traditional chips wire waypoint exit pattern, use support to separate each circuit board individually to point out, sealing, operation accurately, makes segmentation convenient, avoid segmentation, and the chip breakage caused, it is greatly improved production efficiency, and the quality significantly improving product makes conforming product rate significantly promote.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the top view of single package supporting structure of the present invention.
Fig. 3 is the A-A1 sectional view of Fig. 2 of the present invention.
Fig. 4 is the B-B1 sectional view of Fig. 2 of the present invention.
Fig. 5 is the transverse sectional view of the embodiment of the present invention two enclosure support structure.
Fig. 6 is the transverse sectional view of the embodiment of the present invention five enclosure support structure.
The top view of Fig. 7 embodiment of the present invention three single package supporting structure.
Fig. 8 is the A-A1 sectional view of Fig. 7 of the present invention.
Fig. 9 is the transverse sectional view of the embodiment of the present invention four enclosure support structure.
In figure: 1, surface-mounted integrated circuit body；2, package support；3, pin；31, input pin；32, output pin；33, heat radiation pin；34, extension；35, horizontal component；4, gear blob of viscose；5, glue passage is led；6, semi-cylindrical concave shaped space.
Detailed description of the invention
Embodiment one
With reference to shown in Fig. 1-4, a kind of package support type semiconductor integrated circuit board of the present embodiment, including surface-mounted integrated circuit body 1, described surface-mounted integrated circuit body 1 is provided with several package supports 2, it is provided with independent circuit in described package support 2, below described package support 2, is provided with the pin 3 corresponding with circuit.
All parts for the present embodiment explains:
1) pin 3 includes input pin 31, output pin 32 and heat radiation pin 33, and described pin 3 is L-shaped.
2) package support 2 material is yellow gold.
Embodiment two
With reference to shown in Fig. 1, Fig. 2, Fig. 5, a kind of package support type semiconductor integrated circuit board, including surface-mounted integrated circuit body 1, described surface-mounted integrated circuit body 1 is provided with several package supports 2, it is provided with independent circuit in described package support 2, below described package support 2, is provided with the pin 3 corresponding with circuit.
All parts for the present embodiment explains:
1) pin 3 includes input pin 31, output pin 32 and heat radiation pin 33, and described pin 3 includes that extension 34 and horizontal component 35, the angle between described extension 34 and horizontal component 35 are acute angle.
2) acute angle is 45 degree.
3) package support 2 material is yellow gold.
Embodiment three
With reference to shown in Fig. 1, Fig. 7, Fig. 8, a kind of package support type semiconductor integrated circuit board, including surface-mounted integrated circuit body 1, described surface-mounted integrated circuit body 1 is provided with several package supports 2, it is provided with independent circuit in described package support 2, below described package support 2, is provided with the pin 3 corresponding with circuit.
All parts for the present embodiment explains:
1) pin 3 includes input pin 31, output pin 32 and heat radiation pin 33, and described pin 3 is L-shaped.
2) heat radiation pin 33 is drawn directly down through surface-mounted integrated circuit body 1 in the middle of package support 2.
3) package support 2 material is yellow gold.
Embodiment four
With reference to shown in Fig. 1, Fig. 2, Fig. 9, a kind of package support type semiconductor integrated circuit board, including surface-mounted integrated circuit body 1, described surface-mounted integrated circuit body 1 is provided with several package supports 2, it is provided with independent circuit in described package support 2, below described package support 2, is provided with the pin 3 corresponding with circuit.
All parts for the present embodiment explains:
1) pin 3 includes input pin 31, output pin 32 and heat radiation pin 33, and described pin 3 includes that extension 34 and horizontal component 35, the angle between described extension 34 and horizontal component 35 are acute angle.
2) acute angle is 45 degree.
3) pin level 35 part undulate.
4) gear blob of viscose 4 it is provided with outside package support 2 upper surface, it is provided with inside described package support 2 upper surface and leads glue passage 5, described glue passage 5 of leading is arranged vertically downward, extend to bottom package support 2, described package support 2 bottom surface is provided with a semi-cylindrical concave shaped space 6, described in lead glue passage 5 and be connected with semi-cylindrical concave shaped space 6.
5) package support 2 material is yellow gold.
Embodiment five
With reference to shown in Fig. 1, Fig. 2, Fig. 6, a kind of package support type semiconductor integrated circuit board, including surface-mounted integrated circuit body 1, described surface-mounted integrated circuit body 1 is provided with several package supports 2, it is provided with independent circuit in described package support 2, below described package support 2, is provided with the pin 3 corresponding with circuit.
All parts for the present embodiment explains:
1) pin 3 includes input pin 31, output pin 32 and heat radiation pin 33, and described pin 3 includes that extension 34 and horizontal component 35, the angle between described extension 34 and horizontal component 35 are acute angle.
2) acute angle is 45 degree.
3) pin level 35 part undulate.
4) package support 2 material is yellow gold.
Above example uses package support to separate each circuit so that it is each chip is independent, makes circuit accurate positioning, it is to avoid segmentation and the chip that causes is damaged, be greatly improved production efficiency, and the quality significantly improving product make conforming product rate significantly promote.
The above is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-described embodiment, and all technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that, for those skilled in the art, some improvements and modifications without departing from the principles of the present invention, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (8)
1. a package support type semiconductor integrated circuit board, it is characterized in that: include surface-mounted integrated circuit body, described surface-mounted integrated circuit body is provided with several package supports, is provided with independent circuit in described package support, is provided with the pin corresponding with circuit below described package support.
A kind of package support type semiconductor integrated circuit board the most according to claim 1, it is characterised in that: described pin includes input pin, output pin and heat radiation pin, and described pin is L-shaped.
A kind of package support type semiconductor integrated circuit board the most according to claim 1, it is characterized in that: described pin includes input pin, output pin and heat radiation pin, described pin includes that extension and horizontal component, the angle between described extension and horizontal component are acute angle.
A kind of package support type semiconductor integrated circuit board the most according to claim 3, it is characterised in that: described pin horizontal component undulate.
A kind of package support type semiconductor integrated circuit board the most according to claim 3, it is characterised in that: described acute angle is 45 degree.
6. according to a kind of package support type semiconductor integrated circuit board described in any one in claim 2-4, it is characterised in that: described heat radiation pin is drawn directly down through surface-mounted integrated circuit body in the middle of package support.
7. according to a kind of package support type semiconductor integrated circuit board described in any one in claim 1-5, it is characterized in that: outside described package support upper surface, be provided with gear blob of viscose, it is provided with inside described package support upper surface and leads glue passage, described glue passage of leading is arranged vertically downward, extend to bottom package support, described package support bottom surface is provided with a semi-cylindrical concave shaped space, described in lead glue passage and be connected with semi-cylindrical concave shaped space.
A kind of package support type semiconductor integrated circuit board the most according to claim 7, it is characterised in that: described package support material is yellow gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610478179.0A CN105932138B (en) | 2016-06-28 | 2016-06-28 | A kind of package support type semiconductor integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610478179.0A CN105932138B (en) | 2016-06-28 | 2016-06-28 | A kind of package support type semiconductor integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105932138A true CN105932138A (en) | 2016-09-07 |
| CN105932138B CN105932138B (en) | 2019-07-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610478179.0A Active CN105932138B (en) | 2016-06-28 | 2016-06-28 | A kind of package support type semiconductor integrated circuit board |
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| Country | Link |
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| CN (1) | CN105932138B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177286A (en) * | 1992-12-03 | 1994-06-24 | Mitsubishi Electric Corp | Contact pin of ic socket |
| CN102194806A (en) * | 2010-03-18 | 2011-09-21 | 万国半导体股份有限公司 | Stacked dual chip package and method of fabrication |
| CN202484693U (en) * | 2012-03-22 | 2012-10-10 | 浙江英特来光电科技有限公司 | Light-emitting diode (LED) lamp of three-channel common pole type lens structure |
| CN202633379U (en) * | 2012-05-09 | 2012-12-26 | 佛山市国星光电股份有限公司 | Novel TOP LED support and LED product |
| CN202736970U (en) * | 2012-06-06 | 2013-02-13 | 深圳雷曼光电科技股份有限公司 | LED support for surface mounting and LED lamp |
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN204067431U (en) * | 2014-09-05 | 2014-12-31 | 佛山市国星光电股份有限公司 | A kind of Novel LED support and LED component |
-
2016
- 2016-06-28 CN CN201610478179.0A patent/CN105932138B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177286A (en) * | 1992-12-03 | 1994-06-24 | Mitsubishi Electric Corp | Contact pin of ic socket |
| CN102194806A (en) * | 2010-03-18 | 2011-09-21 | 万国半导体股份有限公司 | Stacked dual chip package and method of fabrication |
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN202484693U (en) * | 2012-03-22 | 2012-10-10 | 浙江英特来光电科技有限公司 | Light-emitting diode (LED) lamp of three-channel common pole type lens structure |
| CN202633379U (en) * | 2012-05-09 | 2012-12-26 | 佛山市国星光电股份有限公司 | Novel TOP LED support and LED product |
| CN202736970U (en) * | 2012-06-06 | 2013-02-13 | 深圳雷曼光电科技股份有限公司 | LED support for surface mounting and LED lamp |
| CN204067431U (en) * | 2014-09-05 | 2014-12-31 | 佛山市国星光电股份有限公司 | A kind of Novel LED support and LED component |
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| Publication number | Publication date |
|---|---|
| CN105932138B (en) | 2019-07-26 |
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