CN205081116U - Novel semiconductor lead frame frame - Google Patents
Novel semiconductor lead frame frame Download PDFInfo
- Publication number
- CN205081116U CN205081116U CN201520916194.XU CN201520916194U CN205081116U CN 205081116 U CN205081116 U CN 205081116U CN 201520916194 U CN201520916194 U CN 201520916194U CN 205081116 U CN205081116 U CN 205081116U
- Authority
- CN
- China
- Prior art keywords
- pin
- lead frame
- muscle
- microscope carrier
- chip microscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 210000003205 muscle Anatomy 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a novel semiconductor lead frame frame relates to semiconductor electronic components manufacturing technical field, including chip microscope carrier, well muscle, the lower part of chip microscope carrier is equipped with the pin, well muscle setting is at the root of pin, the pin is equipped with the flexion, the flexion is in well muscle below. The utility model discloses a structure is the below of flexion setting at well muscle, and well muscle is close to the plastic -sealed body more, the finished product planar position of pin in the off -position of muscle is stayed in the back of bending, and on the inclined plane position after bending, the race of pin side is glued and can not fallen down in when the finished product is bent, has guaranteed the cleanness in the mould, has improved production efficiency and has reduced the defective percentage.
Description
Technical field
The utility model relates to semiconductor electronic component manufacturing technology field, is specifically related to a kind of novel semi-conductor lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.At present, semiconductor electronic component is assembled by chip, plastic-sealed body part, spun gold or aluminium wire, lead frame usually, in order to improve automated production efficiency, lead frame is generally arranged by multiple identical copper base unit and forms, and each copper base unit comprises the fin, slide glass, lead and the outer lead that are in turn connected into one, slide glass is for carrying the chip of electronic devices and components, and chip is by being encapsulated on slide glass after the encapsulating of plastic-sealed body part.
In existing lead frame, muscle position is distant from plastic-sealed body, in after plastic packaging, pin side is run glue and sometimes can be gone to middle muscle position and get on, when making finished product bending to rear operation, the part that glue is run in interior pin side will fall down from interior pin side, fall in mould, finished product is caused and weighs wounded, affect outward appearance and product evenness, because planarization is poor, the binding face of product and radiator reduces, the final product that affects installs the radiating effect on a heat sink, if radiating effect is poor, then the life-span of product will shorten.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of novel semi-conductor lead frame, and middle muscle position, above bending, is run the colloid of glue because of pin side and dropped to solve and affect postorder processing.
The technical scheme adopted for realizing the purpose of this utility model is: a kind of novel semi-conductor lead frame, it is characterized in that, comprise chip microscope carrier, middle muscle, the bottom of described chip microscope carrier is provided with pin, described middle muscle is arranged on the root of pin, described pin is provided with bend, and described bend is below middle muscle.
Further, described pin has three, and comes below described chip microscope carrier, and pin upper and lower is divided into interior pin and outer pin two sections by described middle muscle, and the pin end being positioned at two pins of both sides is provided with pin welding stage.
Further, the top of described chip microscope carrier is provided with dovetail groove.
Further, the below of described pin welding stage is provided with lock glue hole.
Further, it is characterized in that, the top of described dovetail groove is provided with fin, and described fin is provided with location hole.
The beneficial effects of the utility model:
The novel semi-conductor lead frame that the utility model provides reaches following beneficial effect:
Middle muscle is more near plastic-sealed body, in during finished product bending, the off-position of muscle stays the position of interior pin plane, instead of on incline position after bending, in after finished product bending, the race glue of pin side can not fall down, ensure that cleaning in mould, improve production efficiency and reduce defect rate, avoiding product simultaneously and weigh problem wounded, ensure that product and radiator are fitted completely, and then improve life of product.
Accompanying drawing explanation
Fig. 1 is the structural representation of the novel semi-conductor lead frame that the utility model provides;
Fig. 2 is the plastic packaging finished product end view of the novel semi-conductor lead frame that the utility model provides.
Embodiment
Also by reference to the accompanying drawings the utility model is described in further detail below by specific embodiment.
Fig. 1 shows the novel semi-conductor lead frame that the utility model provides, comprise chip microscope carrier 7, middle muscle 10, the bottom of chip microscope carrier 7 is provided with pin 13, middle muscle 10 is arranged on the root of pin 13, namely in, the position of muscle 10 on pin 13 is near chip microscope carrier 7, pin 13 is provided with bend 11, and described bend 11 is below middle muscle 10.In the present embodiment, pin 13 3 altogether, the below being arranged on chip microscope carrier 7 side by side, wherein, a middle pin is directly connected with chip microscope carrier, and two pins of both sides are not directly connected with chip microscope carrier 7 near one end of chip microscope carrier 7, but are provided with pin welding stage 12 in this one end.The position of middle muscle 10 is comparatively near chip microscope carrier 7, middle muscle 10 and vertical being connected of pin 13, pin is divided into interior pin 3 and outer pin 2 by middle muscle 10 up and down, the pin welding stage 12 just mentioned namely is positioned on pin 3, be provided with in the position that interior pin 3 is connected with pin welding stage 12 and lock glue hole 8, the effect in lock glue hole 8 strengthens the stability of pin welding stage 12 in plastic-sealed body 9, and when avoiding outer pin 2 bending, pin welding stage 12 is drawn displacement.The lower end of pin 2 is provided with end muscle 1 outside, makes whole lead frame have overall rigidity.
Above chip microscope carrier 7, be provided with dovetail groove 6, make plastic-sealed body 9 more stable, firm with the combination of chip microscope carrier 7, thus further increase electronic devices and components reliability and extend useful life; Above dovetail groove 6, be also provided with fin 4, fin 4 adopts the metal material that the heat conductivity identical with chip microscope carrier 7 is good, as copper; Fin 4 is provided with location hole 5, facilitates the control of precision in the course of processing.
Fig. 2 shows the end view after lead frame bending, can be clear that, bend 11 is in the below of middle muscle 10, and namely, muscle 10 is positioned at straightway, instead of is just in time positioned on bend 11; The reason done like this is: in during finished product bending, the off-position of muscle 10 stays the position of interior pin 3 plane, instead of on incline position after bending, when Bending Processing, even if there is residual plastic cement interior pin 3 side, also can not because of the vibrations of bending fall down fall in mould, thus avoid the quality problems such as plastic packaging finished product weighs wounded.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (5)
1. a novel semi-conductor lead frame, is characterized in that, comprises chip microscope carrier, middle muscle, and the bottom of described chip microscope carrier is provided with pin, and described middle muscle is arranged on the root of pin, and described pin is provided with bend, and described bend is below middle muscle.
2. novel semi-conductor lead frame according to claim 1, it is characterized in that, described pin has three, and come below described chip microscope carrier, pin upper and lower is divided into interior pin and outer pin two sections by described middle muscle, and the pin end being positioned at two pins of both sides is provided with pin welding stage.
3. novel semi-conductor lead frame according to claim 1, is characterized in that, the top of described chip microscope carrier is provided with dovetail groove.
4. novel semi-conductor lead frame according to claim 2, is characterized in that, the below of described pin welding stage is provided with lock glue hole.
5., according to the arbitrary described novel semi-conductor lead frame of claim 1-4, it is characterized in that, the top of described dovetail groove is provided with fin, and described fin is provided with location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520916194.XU CN205081116U (en) | 2015-11-17 | 2015-11-17 | Novel semiconductor lead frame frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520916194.XU CN205081116U (en) | 2015-11-17 | 2015-11-17 | Novel semiconductor lead frame frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205081116U true CN205081116U (en) | 2016-03-09 |
Family
ID=55433500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520916194.XU Expired - Fee Related CN205081116U (en) | 2015-11-17 | 2015-11-17 | Novel semiconductor lead frame frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205081116U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394188A (en) * | 2021-05-14 | 2021-09-14 | 南通华达微电子集团股份有限公司 | Lead frame with special-shaped lock hole |
-
2015
- 2015-11-17 CN CN201520916194.XU patent/CN205081116U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394188A (en) * | 2021-05-14 | 2021-09-14 | 南通华达微电子集团股份有限公司 | Lead frame with special-shaped lock hole |
| CN113394188B (en) * | 2021-05-14 | 2022-04-22 | 南通华达微电子集团股份有限公司 | Lead frame with special-shaped lock hole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160309 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |