CN107833960A - A kind of LED support and its manufacture method with overflow ducts and overflow launder - Google Patents
A kind of LED support and its manufacture method with overflow ducts and overflow launder Download PDFInfo
- Publication number
- CN107833960A CN107833960A CN201710993227.4A CN201710993227A CN107833960A CN 107833960 A CN107833960 A CN 107833960A CN 201710993227 A CN201710993227 A CN 201710993227A CN 107833960 A CN107833960 A CN 107833960A
- Authority
- CN
- China
- Prior art keywords
- overflow
- led support
- ducts
- overflow launder
- launder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 15
- 239000006071 cream Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 8
- 230000008595 infiltration Effects 0.000 abstract description 8
- 238000001764 infiltration Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 7
- 238000011982 device technology Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000003677 Sheet moulding compound Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000012260 resinous material Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 210000001165 lymph node Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a kind of LED support and its manufacture method with overflow ducts and overflow launder, including substrate, the substrate front side is used to place LED chip, and the substrate back is provided with pad, overflow ducts are provided with the pad, overflow launder is provided with the overflow ducts.LED support and its manufacture method provided by the invention with overflow ducts and overflow launder, by setting overflow ducts on pad, overflow launder is set on overflow ducts, in welding, unnecessary tin cream is flowed into overflow launder, tin cream amount is ensure that, improves device technology uniformity, flatness, the uniformity of height；And the overflow ducts set up increase bonding pad area, heat-conducting effect is further increased, and the presence of overflow ducts makes infiltration angle exist inside overflow launder, possesses the effect of QFN/DFN structures, while ensure that the pitch requirements of light source high density assembling.
Description
Technical field
The present invention relates to LED encapsulation technologies field, more particularly to a kind of LED branch with overflow ducts and overflow launder
Frame and its manufacture method.
Background technology
At present, the form that the LED product of cutting-type is embedded using pad more（As shown in Figure 1）, but the side that pad is embedded
There is problems with for formula：1st, when being welded, tin cream is in molten condition, when placing LED, is easily subjected to displacement, and
As shown in Fig. 2 when tin cream amount is different, device high and low position can be variant, influences optical effect；2nd, conventional tin cream material is led
Heating rate only has 1/10th of copper material, influences the thermal conductivity of device.3rd, when tin cream is in molten condition, cohesive force is big, is crossing back
Empty problem is easily produced during stream stove welding, influences the electric conductivity and thermal conductivity of device.In IC package, to solve above-mentioned ask
Topic, as shown in 3 and Fig. 4, in the QFN/DFN of integrated circuit device package（Quad or Dual Flat No-leadPackage）
In structure, the infiltration angle of scolding tin may be present, but in LED field, particularly small spacing LED product, light source assembles in high density
When, there is the requirement of spacing between device, and the presence for infiltrating angle will influence the arrangement of device spacing, therefore QFN/DFN has leaching
The structure at profit angle is not particularly suited for small spacing LED product.
Therefore, prior art has yet to be improved and developed.
The content of the invention
It is an object of the invention to provide a kind of LED support and its manufacture method with overflow ducts and overflow launder, purport
Existing device out-of-flatness, the problems such as thermal conductivity is bad when solving existing LED support in scolding tin.
To solve the above problems, technical scheme is as follows：
A kind of LED support with overflow ducts and overflow launder, including substrate, the substrate front side are used to place LED chip, institute
State substrate back and be provided with pad, the outer overflow ducts for being extended down to LED support edge, the overflow ducts are provided with the pad
On be provided with overflow launder.
The described LED support with overflow ducts and overflow launder, wherein, the overflow launder is located at the LED support side
Edge, it is the groove of two sides opening.
The described LED support with overflow ducts and overflow launder, wherein, the overflow launder is located at LED support edge
Length is less than or equal to the length that the overflow ducts are located at LED support edge.
The described LED support with overflow ducts and overflow launder, wherein, the quantity of the overflow ducts is multiple.
The described LED support with overflow ducts and overflow launder, wherein, bowl knot is provided with around the substrate front side
Structure.
The described LED support with overflow ducts and overflow launder, wherein, the second overflow launder is provided with the pad.
A kind of manufacture method of the LED support with overflow ducts and overflow launder, comprises the following steps：
Step 1：Etching, plating copper base, form the LED support basic framework of multiple array arrangements, adjacent LED support basis
Framework is connected by overflow ducts, and overflow launder is etched with the overflow ducts；
Step 2：It is molded, is molded using upper die and lower die, molding lives overflow launder at present for molding, avoids injected plastics material from flowing into；
Step 3：Cut along the overflow launder, form LED support.
The manufacture method of the described LED support with overflow ducts and overflow launder, wherein, in the step 2, injection
When, form bowl structure in copper base front.
The manufacture method of the described LED support with overflow ducts and overflow launder, wherein, in the step 2, use heat
Curable type resinous material is molded.
Beneficial effects of the present invention include：LED support and its system provided by the invention with overflow ducts and overflow launder
Method is made, by setting overflow ducts on pad, overflow launder is set on overflow ducts, in welding, unnecessary tin cream stream
Enter in overflow launder, ensure that tin cream amount, improve device technology uniformity, flatness, the uniformity of height；And the overflow set up
Passage increases bonding pad area, further increases heat-conducting effect, and the presence of overflow ducts makes infiltration angle exist in overflow launder
Portion, possess the effect of QFN/DFN structures, while ensure that the pitch requirements of light source high density assembling.
Brief description of the drawings
Fig. 1 is a kind of common embedded LED support schematic rear view of EMC product pads.
Fig. 2 is that a kind of failure welding causes highly inconsistent LED structure schematic diagram.
Fig. 3 is a kind of structure schematic diagram of QFN encapsulation.
Fig. 4 is a kind of QFN encapsulating structure schematic diagrames with infiltration angle.
Fig. 5 is a kind of LED support side structure schematic diagram with overflow ducts and overflow launder provided by the invention.
Fig. 6 is a kind of LED support structure schematic diagram with overflow ducts and overflow launder provided by the invention.
Fig. 7 is a kind of LED support side sectional view with overflow ducts and overflow launder provided by the invention.
Fig. 8 is a kind of manufacturing flow chart of LED support with overflow ducts and overflow launder provided by the invention.
Description of reference numerals：1st, pad；2nd, substrate；201st, copper base；202nd, thermosetting resin class material；3rd, LED support；
4th, tin cream；5th, pcb board；6th, pcb board pad；7th, angle is infiltrated；8th, overflow ducts；9th, overflow launder.
Embodiment
To make the objects, technical solutions and advantages of the present invention clearer, clear and definite, develop simultaneously embodiment pair referring to the drawings
The present invention is further described.
Referring to Fig. 5-Fig. 7, the invention provides a kind of LED support with overflow ducts and overflow launder, including substrate 2,
Preferably, substrate 2 is molded by copper base 201, is molded heat curing-type resinous material 202 and is made, such as EMC（Epoxy Molding
Compound）、SMC（Sheet Molding Compound）Deng material.The front of substrate 2 is used to place LED chip, the LED
Chip can use formal dress chip structure, vertical chip structure or flip chip structure, and the front surface region of substrate 2 is according to different cores
Chip architecture makees accommodation.The back side of substrate 2 is provided with pad 1, and pad 1 is used to connect external circuit.Preferably, pad 1 is
The body construction of copper base 201.Overflow ducts 8 are provided with pad 1, the setting of overflow ducts 8 increases the surface area of pad 1,
So as to improve heat-conducting effect.Overflow launder 9 is provided with overflow ducts 8.Overflow launder 9 be alternatively referred to as overflow hole, welding groove or
Stock chest, it is groove shapes, in welding, being flowed into for unnecessary tin cream, caused by tin cream is uneven when being welded with solution
The problems such as element height is inconsistent, out-of-flatness.
In actual applications, it is located at the LED support edge referring to Fig. 6 and Fig. 7, overflow launder 9, is the recessed of two sides opening
Groove so that the presence of overflow launder 9 can equally produce infiltration angle 7, and because infiltration angle 7 is located in overflow launder 9, comparison diagram 4 is understood,
The infiltration angle 7 of the present invention can't impact to small spacing LED product.
Preferably, referring to Fig. 6, the length that overflow launder 9 is located at LED support edge is less than or equal to, and overflow ducts 8 are located at
The length at LED support edge, i.e. overflow ducts 8 and the subregion of adjacent LED support reduce as far as possible, avoid making adjacent LED
Into influence.
The shape of overflow ducts 8 can be rectangle, semicircle, half elliptic or other irregular shapes, and overflow launder 9 is opened
Mouth-shaped can be rectangle, circle, ellipse or other irregular shapes.
In actual production, overflow ducts 8 are integrally formed with pad 1, simplify production technology, be can be considered and are being made pad
When 1, increase the surface area of pad 1, it is overflow ducts 8 to have more part.
In actual production, to be further ensured that the uniformity of the flatness of device and height, the quantity of overflow ducts 8 can
Think multiple, for that can also be multiple, the present invention be restricted to this for the quantity of overflow launder 9.
In actual applications, the LED support can be flat support or bowl formula support, it is preferable that the front of substrate 2
Surrounding is provided with bowl structure, further strengthens the mechanical strength of LED support, while ensures that light-emitting area is unique.
Preferably, it is further stiffening effect, in addition to overflow ducts 8 are set, the second overflow launder is also equipped with pad 1
（Not shown in figure）, it is similar that it acts on overflow launder 9.
Referring to Fig. 8, present invention also offers a kind of manufacture method of the LED support with overflow ducts and overflow launder, bag
Include following steps：
Step 1：Etching, plating copper base, form the LED support basic framework of multiple array arrangements, adjacent LED support basis
Framework is connected by overflow ducts, and overflow launder is etched with the overflow ducts；
Step 2：It is molded, is molded using upper die and lower die, molding lives overflow launder at present for molding, avoids injected plastics material from flowing into；
Step 3：Cut along the overflow launder, form LED support.
Preferably, human lymph node electric conductivity is plated during plating.In actual production, in the step 2, during injection, in copper base
Front forms bowl structure.In actual production, in the step 2, it is molded using thermosetting resin class material.The heat
Curable type resinous material can be EMC（Epoxy Molding Compound）、SMC（Sheet Molding Compound）Deng
Material.
LED support and its manufacture method provided by the invention with overflow ducts and overflow launder, by being set on pad
Overflow ducts are put, overflow launder is set on overflow ducts, in welding, unnecessary tin cream is flowed into overflow launder, ensure that tin cream
Amount, improves device technology uniformity, flatness, the uniformity of height；And the overflow ducts set up increase bonding pad area, enter
One step improves heat-conducting effect, and the presence of overflow ducts makes infiltration angle exist inside overflow launder, possesses IC-components envelope
The effect of QFN/DFN structures in dress, while ensure that the pitch requirements of light source high density assembling.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (9)
1. a kind of LED support with overflow ducts and overflow launder, it is characterised in that including substrate, the substrate front side is used for
LED chip is placed, the substrate back is provided with pad, and the outer overflow for being extended down to LED support edge is provided with the pad and is led to
Road, overflow launder is provided with the overflow ducts.
2. the LED support according to claim 1 with overflow ducts and overflow launder, it is characterised in that the overflow launder
Positioned at the LED support edge, for the groove of two sides opening.
3. the LED support according to claim 2 with overflow ducts and overflow launder, it is characterised in that the overflow launder
Length positioned at LED support edge is less than or equal to the length that the overflow ducts are located at LED support edge.
4. the LED support according to claim 1 with overflow ducts and overflow launder, it is characterised in that the overflow is led to
The quantity in road is multiple.
5. the LED support according to claim 1 with overflow ducts and overflow launder, it is characterised in that the substrate is just
Bowl structure is provided with around face.
6. the LED support according to claim 1 with overflow ducts and overflow launder, it is characterised in that on the pad
It is provided with the second overflow launder.
7. a kind of manufacture method of the LED support with overflow ducts and overflow launder, it is characterised in that comprise the following steps：
Step 1：Etching, plating copper base, form the LED support basic framework of multiple array arrangements, adjacent LED support basis
Framework is connected by overflow ducts, and overflow launder is etched with the overflow ducts；
Step 2：It is molded, is molded using upper die and lower die, molding lives overflow launder at present for molding, avoids injected plastics material from flowing into；
Step 3：Cut along the overflow launder, form LED support.
8. the manufacture method of the LED support according to claim 7 with overflow ducts and overflow launder, it is characterised in that
In the step 2, during injection, bowl structure is formed in copper base front.
9. the manufacture method of the LED support according to claim 7 with overflow ducts and overflow launder, it is characterised in that
In the step 2, it is molded using thermosetting resin class material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710993227.4A CN107833960A (en) | 2017-10-23 | 2017-10-23 | A kind of LED support and its manufacture method with overflow ducts and overflow launder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710993227.4A CN107833960A (en) | 2017-10-23 | 2017-10-23 | A kind of LED support and its manufacture method with overflow ducts and overflow launder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107833960A true CN107833960A (en) | 2018-03-23 |
Family
ID=61648938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710993227.4A Pending CN107833960A (en) | 2017-10-23 | 2017-10-23 | A kind of LED support and its manufacture method with overflow ducts and overflow launder |
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| Country | Link |
|---|---|
| CN (1) | CN107833960A (en) |
Cited By (3)
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| CN109638125A (en) * | 2018-10-26 | 2019-04-16 | 华灿光电(苏州）有限公司 | A kind of flip LED chips and preparation method thereof |
| CN109630913A (en) * | 2018-10-26 | 2019-04-16 | 江门市中阳光电科技有限公司 | The manufacturing method of light emitting device |
| CN109817785A (en) * | 2018-12-25 | 2019-05-28 | 广东晶科电子股份有限公司 | A kind of light emitting diode and preparation method thereof |
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