CN201853699U - Anti-crack and anti-seepage integrated circuit lead wire framework - Google Patents
Anti-crack and anti-seepage integrated circuit lead wire framework Download PDFInfo
- Publication number
- CN201853699U CN201853699U CN2010205859682U CN201020585968U CN201853699U CN 201853699 U CN201853699 U CN 201853699U CN 2010205859682 U CN2010205859682 U CN 2010205859682U CN 201020585968 U CN201020585968 U CN 201020585968U CN 201853699 U CN201853699 U CN 201853699U
- Authority
- CN
- China
- Prior art keywords
- crack
- integrated circuit
- seepage
- lead wire
- wire framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses an anti-crack and anti-seepage integrated circuit lead wire framework, which overcomes the defect that after the existing product is encapsulated, the combination of plastic sealing materials and a patch region is not firm enough. The anti-crack and anti-seepage integrated circuit lead wire framework comprises a center region patch region and a plurality of lead pins, wherein a root welding region of each lead pin is surrounded around the patch region, and the surface of the root welding region of each lead pin is plated with silver. The utility model is characterized in that a plurality of through holes are arranged in the side frame on the periphery, carving grooves are arranged on the surface of the middle part of ribs, and the through holes are in rectangular shapes. After the product is encapsulated, the plastic sealing materials are filled in inner cavities of the through holes and concave parts of the carving grooves, the combining area of the patch region and the plastic sealing materials is greatly enhanced, and the delamination cracking of the plastic sealing materials and a lead wire framework base body can be effectively prevented, so the anti-crack and anti-seepage performance of the product is greatly improved. The anti-crack and anti-seepage integrated circuit lead wire framework has the characteristics of novel structure and obvious benefits, is simple to manufacture and can be widely applied to integrated circuit product manufacture.
Description
Technical field
The utility model relates to a kind of semiconductor electronic components and parts manufacturing technology field, especially refers to the anti-crack and anti-seepage technology of circuit lead frame matrix and plastic packaging material faying face.
Background technology
Along with the fast development of microelectronics and mechanics of communication, in the miniaturization just day by day of semiconductor integrated circuit components and parts, the slimming situation that numerous areas is used, therefore also miniaturization day by day, the slimming of leadframe parts that matches with it.Therefore, how to improve firmness that plastic packaging material combines with pin, effectively stop plastic packaging material and heave cracking, strengthen the waterproof sealing performance and prevent to be the prerequisite that finally improves integrated circuit (IC) products performance and useful life because of infiltration short circuit or the like.State Intellectual Property Office on January 6th, 2010 Granted publication the patent No. be called the utility model patent technology of " a kind of thin type integrated circuit lead frame " for the ZL200920142440.5 name, it comprises " the rectangular dies island of central area and a plurality of pins around described chip island of being periphery are provided with the dowel reinforcement by connection between the adjacent described pin ... described pin is respectively equipped with multiple tracks groove and groove near the inboard positive and negative surface at described encapsulation region edge; The back side of described chip island is evenly equipped with pit." this product is as the main discrete device of producing integrated circuit; include tens of pins; but because plastic packaging material and Chip Area after the encapsulation are simple plane combined structure; so when this product is applied to high vibration, high temperature difference and wet environment; the delamination splitting phenomenon of plastic packaging material and lead frame happens occasionally, have a strong impact on the useful life and the job stability of integrated circuit.
The utility model content
The technical problems to be solved in the utility model is to overcome existing product encapsulation back plastic packaging material to combine firm inadequately defective and deficiency with the Chip Area, provide a kind of circuit lead frame that can prevent effectively that plastic packaging material and layered lead frame cracking phenomena from taking place to society, to improve the integrated circuit job stability, to increase the service life.
The technical scheme that its technical problem that solves the utility model adopts is: the circuit lead frame of anti-crack and anti-seepage, comprise Chip Area, central area and a plurality of pin, the root welding zone of described pin around described Chip Area, electroplate; Described Chip Area is connected with the base material of lead frame by the rib of being located at four bights, and the surrounding frame table face of described Chip Area is silver-plated, it is characterized in that: be provided with a plurality of through holes in the frame around described.
The middle part surface of described rib is provided with cutting.Described through hole is rectangular.
The circuit lead frame of the utility model anti-crack and anti-seepage, plastic packaging material after the encapsulation is filled in a plurality of through hole inner chambers and cutting recess, strengthened the bonded area of Chip Area and plastic packaging material greatly, can effectively prevent the delamination splitting of plastic packaging material and lead frame matrix, the anti-crack and anti-seepage performance of this product is improved greatly, anti-mechanical shock of integrated circuit finished product and heat-resistant anti-fatigue intensity are obviously promoted, and product prolongs useful life.Compare than existing product, have novel structure, make characteristics simple, remarkable benefit, can be widely used in the integrated circuit (IC) products manufacturing.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is the A portion enlarged drawing of Fig. 1.
Embodiment
As depicted in figs. 1 and 2, the circuit lead frame of the utility model anti-crack and anti-seepage, comprise the Chip Area 6 of central area carries chips and a plurality of pins 2 around described Chip Area 6 of being periphery, the root welding zone 3 of described pin 2 around described Chip Area 6, electroplate; Described Chip Area 6 is connected with base material 8 by the rib 7 of being located at four bights, and the middle part surface of described rib 7 is provided with cutting 9; Frame 5 electroplates around the described Chip Area 6 are provided with a plurality of through holes 4 in the frame 5 around described, and described through hole 4 is rectangular.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.As depicted in figs. 1 and 2, according to the requirement of encapsulation factory, the fine copper band that base material 8 general employing thickness are 0.15-0.2mm is raw material, processes the lead frame version part of whole piece in being equipped with the milling train of corresponding mould.When silver-plated, because the root welding zone 3 of described pin 2 around described Chip Area 6, therefore can adopt mould printing forme or immersion to carry out silver-plated operation, silver-plated welding zone shape unanimity, working (machining) efficiency height.During the encapsulation of this product, encapsulate with dotted line shown in Figure 21 scope.After the encapsulation, plastic packaging material is filled in a plurality of through hole 4 inner chambers and cutting 9 recesses, strengthened the bonded area of Chip Area 6 greatly with plastic packaging material, can effectively prevent the delamination splitting of plastic packaging material and lead frame matrix, the anti-crack and anti-seepage performance of this product is improved greatly, anti-mechanical shock of integrated circuit finished product and heat-resistant anti-fatigue intensity are obviously promoted, and product prolongs useful life.
Claims (2)
1. the circuit lead frame of an anti-crack and anti-seepage comprises Chip Area, central area (6) and a plurality of pin (2), the root welding zone (3) of described pin (2) around described Chip Area (6) all around, electroplate; Described Chip Area (6) is connected with the base material (8) of lead frame by the rib of being located at four bights (7), and frame (5) electroplate around described Chip Area (6) is characterized in that: be provided with a plurality of through holes (4) in the frame (5) around described; The middle part surface of described rib (7) is provided with cutting (9).
2. the circuit lead frame of anti-crack and anti-seepage according to claim 1, it is characterized in that: described through hole (4) is rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205859682U CN201853699U (en) | 2010-10-28 | 2010-10-28 | Anti-crack and anti-seepage integrated circuit lead wire framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205859682U CN201853699U (en) | 2010-10-28 | 2010-10-28 | Anti-crack and anti-seepage integrated circuit lead wire framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201853699U true CN201853699U (en) | 2011-06-01 |
Family
ID=44096083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205859682U Expired - Lifetime CN201853699U (en) | 2010-10-28 | 2010-10-28 | Anti-crack and anti-seepage integrated circuit lead wire framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201853699U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485323A (en) * | 2014-12-23 | 2015-04-01 | 日月光封装测试(上海)有限公司 | Lead frame and semiconductor packaging body |
-
2010
- 2010-10-28 CN CN2010205859682U patent/CN201853699U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485323A (en) * | 2014-12-23 | 2015-04-01 | 日月光封装测试(上海)有限公司 | Lead frame and semiconductor packaging body |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110601 |