CN100524676C - Blanking type encapsulation constitution without external pin and manufacturing method thereof - Google Patents
Blanking type encapsulation constitution without external pin and manufacturing method thereof Download PDFInfo
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- CN100524676C CN100524676C CN 200710003632 CN200710003632A CN100524676C CN 100524676 C CN100524676 C CN 100524676C CN 200710003632 CN200710003632 CN 200710003632 CN 200710003632 A CN200710003632 A CN 200710003632A CN 100524676 C CN100524676 C CN 100524676C
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- 238000005538 encapsulation Methods 0.000 title claims description 93
- 238000000034 method Methods 0.000 claims abstract description 71
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- 239000000853 adhesive Substances 0.000 claims description 49
- 230000001070 adhesive effect Effects 0.000 claims description 49
- 239000011248 coating agent Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 27
- 230000002093 peripheral effect Effects 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 4
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 9
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a blanking-type packaging structure without outer pins and a manufacturing method thereof. The manufacturing method of the blanking-type packaging structure without outer pins comprises the following steps: providing a lead frame with a plurality of carrier units, wherein each carrier unit internally forms a plurality of pins, disposing a plurality of wafers to the lead frame, wherein the wafers are electrically connected to the pins, forming a plurality of glue sealing bodies on the carrier units and combining the pins, performing one step of semi-blanking to form a plurality of half-concave nicks on the pins along the outer periphery of the glue sealing bodies, performing one step of electric plating to form an electric plating layer on the exposed surface of the half-concave nicks of the pins and performing one step of complete plating for cutting off the pins along the half-concave nicks to be divided into individual glue sealing bodies. The invention can resolve the problems that the pins of the blanking-type packaging structure without outer pins are torn off, dropped down with rough edges and the like in the single planking process, and the invention can increase the excellent rate of the process and even increase the plating area of the pins, thereby being quite suitable for utility.
Description
Technical field
The singulation that the present invention relates to a kind of semiconductor packaging is separated (singulation), particularly relating to a kind of pin that can cause blanking type encapsulation constitution without external pin in the processing procedure that solves peels off, drops and problems such as burr, and can promote the processing procedure acceptance rate, more can increase blanking type encapsulation constitution without external pin and manufacture method thereof that pin is electroplated area.
Background technology
In present semiconductor packages manufacturing technology, earlier a plurality of carrier elements are integrated in a base material for carrying out encapsulation procedure, be quite common, and meet business efficiency.After most encapsulation procedure was finished, the side carried out monomer separation, to isolate a plurality of semiconductor packaging structures.For example, using lead frame to produce encapsulation constitution without external pin (leadless IC package) as base material promptly is so, carries out monomer separation at last at processing procedure.With regard to the separation known kind, encapsulation constitution without external pin can further be distinguished and be blanking type (punching type) and sawing formula (sawing type).Wherein, in blanking type encapsulation constitution without external pin, a plurality of adhesive bodies are indivedual formation, just can reach the effect of monomer separation with the method for stamping-out lead frame pin.The sawing formula then is to cover all carrier elements continuously with an adhesive body, must cut off adhesive body and pin simultaneously with the sawing cutter of high speed rotating, and is bigger for the effect of attrition of cutter, and comparatively consuming time.
See also shown in Figure 1, be existing known blanking type encapsulation constitution without external pin the stamping-out list from the time schematic cross-section.Existing known blanking type encapsulation constitution without external pin, be to finish monomer separation with the action that once cuts entirely, lead frame 110 is fixed on the microscope carrier 11 of a blanking equipment, and once cuts off the pin 111 of this lead frame 110 with stamping-out cutter 12, and can not switch to the adhesive body 130 of reservation shape.
Please cooperate and consult shown in Figure 2ly, be the schematic cross-section of existing known blanking type encapsulation constitution without external pin.Have known blanking type encapsulation constitution without external pin 100 now, mainly comprise a position, a chip 120 and an adhesive body 130 of this lead frame 110.This chip 120 is to be arranged at this lead frame 110 and to be electrically connected to those pins 111 by a plurality of bonding wires 121.This adhesive body 130 that mould envelope forms, it is this chip 120 of sealing and in conjunction with those pins 111, but the upper surface of those pins 111 should expose slightly, for stamping-out.The lower surface of those pins 111 also is necessary for and appears shape, can supply surface engagement.Before stamping-out, an electrodeposited coating 140 be formed at those pins 111 earlier expose upper surface and lower surface slightly, to avoid pin 111 rustization and to help welding.Yet as shown in Figure 1, in existing known stamping-out process, stamping-out cutter 12 can cause pin 111 to be peeled off by this adhesive body 130 easily to the die-cut strength of those pins 111, even has the problem that drops to take place.
In addition, see also shown in Figure 2ly, in blanking type encapsulation constitution without external pin, can have the burr phenomenon at the stamping-out face of those pins 111, and scratch human body or electronic component easily.
This shows, above-mentioned existing blanking type encapsulation constitution without external pin and manufacture method thereof its in method, product structure and use, obviously still have inconvenience and defective, and demand urgently further being improved.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and general manufacture method and product do not have appropriate method and structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new blanking type encapsulation constitution without external pin and manufacture method thereof, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing blanking type encapsulation constitution without external pin and manufacture method thereof exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge thereof, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of new blanking type encapsulation constitution without external pin and manufacture method thereof, can improve general existing blanking type encapsulation constitution without external pin and manufacture method thereof, make it have more practicality.Through constantly research, design, and after studying repeatedly and improving, create the present invention who has practical value finally.
Summary of the invention
Main purpose of the present invention is, overcome the defective of the manufacture method existence of existing blanking type encapsulation constitution without external pin, and provide a kind of manufacture method of new blanking type encapsulation constitution without external pin, technical problem to be solved is to make the pin that can cause blanking type encapsulation constitution without external pin in its processing procedure that can solve existing known one way stamping-out peel off, drop and problem such as burr, and can promote the acceptance rate of processing procedure, more can increase the plating area of pin, thereby be suitable for practicality more.
Another object of the present invention is to, overcome the defective that existing blanking type encapsulation constitution without external pin exists, and provide a kind of novel blanking type encapsulation constitution without external pin, technical problem to be solved is to make it increase the cross section area of electrodeposited coating at pin, to prevent rust improperly, more can solve the problem of pin tangent plane burr, thereby be suitable for practicality more.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.The manufacture method of a kind of blanking type encapsulation constitution without external pin that proposes according to the present invention, it comprises the steps: to provide a lead frame, and it has a plurality of carrier elements, is formed with a plurality of pins in each carrier element; A plurality of chips are set to this lead frame, and make those chips be electrically connected to those pins; Form a plurality of adhesive bodies in those carrier elements, with in conjunction with those pins; Carry out half stamping-out step, form a plurality of half concane gaps in those pins along the outer peripheral edges of those adhesive bodies; Carry out a plating step, form an electrodeposited coating comprises those half concane gaps in those pins exposed surface; And carry out a full stamping-out step, cut off those pins along those half concane gaps, and be separated into other adhesive body.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The manufacture method of aforesaid blanking type encapsulation constitution without external pin wherein is formed with a dam bar (dam bar) between the adjacent carrier unit, those adhesive bodies are to appear those dam bars when forming.
The manufacture method of aforesaid blanking type encapsulation constitution without external pin, wherein said those half concane gaps are the upper surfaces that are formed at those pins.
The manufacture method of aforesaid blanking type encapsulation constitution without external pin, wherein said those half concane gaps are the lower surfaces that are formed at those pins.
The manufacture method of aforesaid blanking type encapsulation constitution without external pin, wherein said those chips are to be electrically connected to those pins by a plurality of bonding wires.
The manufacture method of aforesaid blanking type encapsulation constitution without external pin, the degree of depth of wherein said those half concane gaps are the thickness 1/3rd to 1/2nd of those pins.
The manufacture method of aforesaid blanking type encapsulation constitution without external pin, wherein said plating step are to be electroless plating or metallide.
The manufacture method of aforesaid blanking type encapsulation constitution without external pin, wherein said electrodeposited coating are to be selected from one of them of tin, tin-lead, Sn-Bi.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of blanking type encapsulation constitution without external pin that the present invention proposes, it comprises: a plurality of pins of a lead frame, the outer end of each pin have one first tangent plane and one second tangent plane that forms with the two-part stamping-out; One chip, it is arranged at this lead frame and electrically connects with those pins; One adhesive body, it is formed on this lead frame and with those pins and combines; And an electrodeposited coating, it is formed at those first tangent planes of those pins at least.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid blanking type encapsulation constitution without external pin, wherein said those first tangent planes are to be connected with the lower surface of corresponding pin.
Aforesaid blanking type encapsulation constitution without external pin, wherein said those first tangent planes are to be connected with the upper surface of corresponding pin.
Aforesaid blanking type encapsulation constitution without external pin, wherein said each pin have a upper surface that protrudes in this adhesive body side.
Aforesaid blanking type encapsulation constitution without external pin, wherein said electrodeposited coating also are formed at the outstanding upper surface of those pins.
Aforesaid blanking type encapsulation constitution without external pin, wherein said chip are to be electrically connected to those pins with routing or flip-chip bonded mode.
Aforesaid blanking type encapsulation constitution without external pin, wherein said lead frame are to have a chip bearing, for the setting of this chip.
Aforesaid blanking type encapsulation constitution without external pin, wherein said electrodeposited coating are the lower surfaces that is formed at this chip bearing.
The object of the invention to solve the technical problems also realizes in addition by the following technical solutions.According to a kind of blanking type encapsulation constitution without external pin that the present invention proposes, it is the blanking type encapsulation constitution without external pin by the manufacture method manufacturing of blanking type encapsulation constitution without external pin as claimed in claim 1.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, for achieving the above object, the present invention has disclosed a kind of manufacture method of blanking type encapsulation constitution without external pin.At first, provide a lead frame with a plurality of carrier elements, be formed with a plurality of pins in each carrier element, between the adjacent carrier unit, can be formed with a dam bar (dam bar).Again a plurality of chips are arranged to this lead frame, and make those chips be electrically connected to those pins in a suitable manner.Afterwards, form a plurality of adhesive bodies those carrier elements individually, with in conjunction with those pins but appear those dam bars in correspondence.After sealing, carry out half stamping-out step, form a plurality of half concane gaps in those pins along the outer peripheral edges of those adhesive bodies.Afterwards, carry out a plating step, form an electrodeposited coating comprises those half concane gaps in those pins exposed surface.At last, carry out a full stamping-out step, cut off those pins, and be separated into other adhesive body along those half concane gaps.The present invention has disclosed according to the made blanking type encapsulation constitution without external pin of above-mentioned processing procedure.
In aforesaid manufacture method, those half concane gaps are the upper surfaces that can be formed at those pins.In aforesaid manufacture method, those half concane gaps are the lower surfaces that can be formed at those pins.In aforesaid manufacture method, those chips are can be by a plurality of bonding wires to be electrically connected to those pins.In aforesaid manufacture method, the degree of depth of those half concane gaps is about the thickness 1/3rd to 1/2nd of those pins.In aforesaid manufacture method, above-mentioned plating step is to be electroless plating or metallide.In aforesaid manufacture method, this electrodeposited coating is to can be selected from one of them of tin, tin-lead, Sn-Bi.
By technique scheme, blanking type encapsulation constitution without external pin of the present invention and manufacture method thereof have following advantage at least:
1, the manufacture method of blanking type encapsulation constitution without external pin of the present invention, can solve the pin that can cause blanking type encapsulation constitution without external pin in the processing procedure of existing known one way stamping-out peels off, drops and problem such as burr, and can promote the acceptance rate of processing procedure, more can increase the plating area of pin, thereby be suitable for practicality more.
2, blanking type encapsulation constitution without external pin of the present invention can increase the cross section area of electrodeposited coating at pin, to prevent rust improperly, more can solve the problem of pin tangent plane burr, thereby be suitable for practicality more.
In sum, the invention relates to a kind of blanking type encapsulation constitution without external pin and manufacture method thereof.The manufacture method of this blanking type encapsulation constitution without external pin is a plurality of chips, electric connection to be set on a lead frame and to form a plurality of adhesive bodies basically.Afterwards, before plating step, carry out half stamping-out step earlier, form a plurality of pins of a plurality of half concane gaps in this lead frame along the outer peripheral edges of those adhesive bodies.Again an electrodeposited coating is formed in those half concane gaps.Carry out a full stamping-out step at last, cut off those pins, and those adhesive bodies are separated along those half concane gaps.Can solve in full stamping-out step by half stamping-out step before electroplating and to cause peeling off, dropping and the burr problem of pin, and can increase the plating area of pin.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on manufacture method, product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing blanking type encapsulation constitution without external pin and manufacture method thereof have the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 be existing known blanking type encapsulation constitution without external pin the stamping-out list from the time schematic cross-section.
Fig. 2 is the schematic cross-section of existing known blanking type encapsulation constitution without external pin.
Fig. 3 A to 3G is according to first specific embodiment of the present invention, the schematic cross-section of a kind of blanking type encapsulation constitution without external pin in manufacture process.
Fig. 4 is according to first specific embodiment of the present invention, is used in the schematic top plan view of the lead frame of this blanking type encapsulation constitution without external pin.
Fig. 5 is according to first specific embodiment of the present invention, the schematic cross-section of this blanking type encapsulation constitution without external pin.
Fig. 6 is according to first specific embodiment of the present invention, the side schematic view of this blanking type encapsulation constitution without external pin.
Fig. 7 A to 7C is according to second specific embodiment of the present invention, the schematic cross-section of another kind of blanking type encapsulation constitution without external pin in two stamping-out steps of manufacture process.
11: microscope carrier 12: the stamping-out cutter
21: microscope carrier 22: the stamping-out cutter
31: microscope carrier 32: the stamping-out cutter
41: microscope carrier 42: the stamping-out cutter
51: microscope carrier 52: the stamping-out cutter
100: blanking type encapsulation constitution without external pin 110: lead frame
111: pin 120: chip
121: bonding wire 130: adhesive body
140: electrodeposited coating 200: blanking type encapsulation constitution without external pin
210: lead frame 210A: carrier element
211: pin 211A: upper surface
211B: lower surface 211C: half concane gap
211D: the first tangent plane 211E: second tangent plane
212: dam bar 213: the chip bearing
220: chip 221: bonding wire
230: adhesive body 231: outer peripheral edges
240: electrodeposited coating 310: lead frame
311: pin 311A: upper surface
311B: lower surface 311C: half concane gap
312: dam bar 320: chip
321: bonding wire 330: adhesive body
331: outer peripheral edges 340: electrodeposited coating
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to blanking type encapsulation constitution without external pin and its embodiment of manufacture method, method, step, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
In first specific embodiment of the present invention, see also shown in Fig. 3 A to 3G, be according to first specific embodiment of the present invention, the schematic cross-section of a kind of blanking type encapsulation constitution without external pin in manufacture process disclosed a kind of manufacture method of blanking type encapsulation constitution without external pin.Fig. 4 is to use in the schematic top plan view of the lead frame of this blanking type encapsulation constitution without external pin, is the end face schematic diagram of the lead frame that uses in the processing procedure.
At first, see also Fig. 3 A and shown in Figure 4, one lead frame 210 is provided, this lead frame 210 has a plurality of carrier element 210A, form in each carrier element 210A and be provided with a plurality of pins 211, and between adjacent carrier element 210A, form and be provided with a dam bar 212 (dam bar), to connect those pins 211.In the present embodiment, can other formation be provided with at least one chip bearing 213 in each carrier element 210A.Usually this lead frame 210 is to be the all-metal material, and has the thickness of about 0.2 millimeter (mm).But those pins 211 do not have the length that existing known product can form I, J or the outer pin of gull-shaped.Each pin 211 has a upper surface 211A and a lower surface 211B.
See also shown in Fig. 3 B, a plurality of chips 220 are set, can utilize known sticking crystal technique one surface of those chips 220 to be affixed to those chip bearings 213 of this lead frame 210 to this lead frame 210.In addition, in dissimilar lead frames, its pin also can be for the usefulness of sticking crystalline substance.
For making those chips 220 can be electrically connected to those pins 211.See also shown in Fig. 3 C, utilize the routing technology to form a plurality of bonding wires 221, those chips 220 are to be electrically connected to the upper surface 211A of those pins 211 by those bonding wires 221.In addition, also can utilize technology such as interior pin joint and flip-chip bonded to reach the electrical interconnects of chip 220 and lead frame 210.
Afterwards, see also shown in Fig. 3 D, can utilize pressing mold, printing or some glue mode to form those carrier element 210A of a plurality of adhesive bodies 230, with in conjunction with those pins 211 but appear those dam bars 212 in correspondence.In other words, each carrier element 210A all can correspond to an adhesive body 230.In the present embodiment, those adhesive bodies 230 are that those adhesive bodies 230 are to be insulating material usually, comprise curable resin, inorganic filler, curing accelerator and colorant or the like for pressing mold forms.Each adhesive body 230 more seals the most upper surface 211A of those pins 211 except sealing the chip 220 on the corresponding carrier element 210A.But in the present embodiment, a little upper surface 211A of the lower surface of the lower surface 211B of the dam bar 212 of this lead frame 210, pin 211, chip bearing 213 and pin 211 is not covered by those adhesive bodies 230.
See also shown in Fig. 3 E, after those adhesive bodies 230 formed, the side carried out the step of half stamping-out.This lead frame 210 is fixed on the microscope carrier 21 of a blanking equipment.Utilize a plurality of stamping-out cuttves 22 to form a plurality of half concane gap 211C in those pins 211 along the outer peripheral edges 231 of those adhesive bodies 230, it should be noted that, formed this half concane gap 211C after half stamping-out step, its shape does not limit, and can be other geometries such as matrix or U type.In the present embodiment, those half concane gaps 211C is the upper surface 211A that is formed at those pins 211.The degree of depth of those half concane gaps 211C is about the thickness 1/3rd to 1/2nd of those pins 211.Promptly be those pins 211 of non-cutting in half stamping-out step, be beneficial to electroplate.
See also shown in Fig. 3 F, carry out a plating step, it is to form an electrodeposited coating 240 comprises those half concane gaps 211C in those pins 211 exposed surface.Wherein, in the present embodiment, those pins 211 exposed surface that coating 240 forms of can powering is to comprise the above-mentioned dam bar 212 outside those adhesive bodies 230, the lower surface 211B of pin 211, the lower surface of chip bearing 213 and a little upper surface 211A and the half concane gap 211C of pin 211 of being emerging in.In addition, this plating step is to can be other modes such as electroless plating or metallide.And the material of this electrodeposited coating 240 is can be for being selected from one of them of tin, tin-lead, Sn-Bi.
At last, see also shown in Fig. 3 G, carry out a full stamping-out step, the lead frame 210 of process sealing and plating is to be fixed on the microscope carrier 31 of another blanking equipment, and this microscope carrier 31 has die-cut conduit so that the full stamping-out stroke of stamping-out cutter 32 to be provided.And utilize those stamping-out cuttves 32 to cut off those pins 211 along those half concane gaps 211C, and be separated into other adhesive body 230.In the present embodiment, those pins 211 are separated with those dam bars 212 by those adhesive bodies 230 combinations.The present invention does not limit to the kind of blanking equipment, and the blanking equipment that uses in half stamping-out step and full stamping-out step can be identical or inequality.
Seeing also shown in Figure 5ly, is according to first specific embodiment of the present invention, the schematic cross-section of this blanking type encapsulation constitution without external pin.Can obtain a plurality of blanking type encapsulation constitution without external pin 200 by this full stamping-out step, utilize above-mentioned half stamping-out step to be implemented between sealing step and the plating step and before full stamping-out step, when reducing full stamping-out step to pin 211 and adhesive body 230 die-cut stress in conjunction with damaging property of place.So can prevent those pins 211, do not have prior art and cause pin to peel off the problem that drops with pin, and further solved the problem of generation pin burr because of full stamping-out once by producing the crack with adhesive body 230 combination interfaces.
And, see also shown in Figure 6ly, be according to first specific embodiment of the present invention, the side schematic view of this blanking type encapsulation constitution without external pin.Former electrodeposited coating 240 in half concane gap 211C can increase the plating area of pin 211 die-cut lateral margins in the product, and can reduce the rustization of those pins 211 and can increase upper plate the time to the joint capacity of soldered ball or tin cream.
Therefore, in first specific embodiment of the present invention, disclosed the above-mentioned blanking type encapsulation constitution without external pin that two-part stamping-out mode is made that comprises in addition.See also Fig. 5 and shown in Figure 6, this blanking type encapsulation constitution without external pin 200, it mainly comprises a plurality of pins 211, a chip 220, an adhesive body 230 and an electrodeposited coating 240 of a lead frame 210.
This each pin 211, being revealed in the outer outer end of adhesive body is to have one first tangent plane 211D and the one second tangent plane 211E that forms with the two-part stamping-out, wherein this first tangent plane 211D is that the sidewall of the half concane gap 211C that formed by aforementioned half stamping-out step is constituted (shown in Fig. 3 E), and is covered (shown in Fig. 3 F) by this electrodeposited coating 240.This second tangent plane 211E is for exposing end face by the formed pin of aforementioned full stamping-out step.In the present embodiment, the first tangent plane 211D of those pins 211 is connected with the upper surface 211A of corresponding pin 211.In different embodiment, the first tangent plane 211D of those pins 211 also can be connected with the lower surface of corresponding pin 211.
This chip 220 is the chip bearings 213 that are arranged at this lead frame 210, and in routing technology or the flip-chip bonded mode that forms a plurality of bonding wires 221 this chip 220 and those pins 211 is electrically connected.
This adhesive body 230 is to be formed on this lead frame 210 and with those pins 211 to combine.Preferably, those pins 211 also can have a upper surface 211A and a lower surface 211B who protrudes in these adhesive body 230 sides slightly.
This electrodeposited coating 240 is those the first tangent planes 211D that are formed at those pins 211 at least, more can be formed on the upper surface 211A of those pins 211 that protrude in these adhesive body 230 sides slightly and the lower surface of pin lower surface 211B and this chip bearing 213.
Seeing also shown in Fig. 7 A to 7C, is according to second specific embodiment of the present invention, the schematic cross-section of another kind of blanking type encapsulation constitution without external pin in two stamping-out steps of manufacture process.In second specific embodiment of the present invention, disclosed the manufacture method of another kind of blanking type encapsulation constitution without external pin.Encapsulation step before half stamping-out step provides, glues brilliant and sealing or the like as lead frame, and it is roughly identical with first specific embodiment, so repeat no more.
Afterwards, carry out half stamping-out step.See also shown in Fig. 7 A, before half stamping-out step, a plurality of chips 320 have been arranged at a lead frame 310, and are electrically connected to a plurality of pins 311 of this lead frame 310 with a plurality of bonding wires 321.One adhesive body 330 is the corresponding carrier elements that are formed at this lead frame 310, with in conjunction with those pins 311 but appear a plurality of dam bars 312 of this lead frame 310.In half stamping-out step, this lead frame 310 is the microscope carriers 41 that can oppositely be fixed in a blanking equipment, and utilizes a plurality of stamping-out cuttves 42 to form a plurality of half concane gap 311C in those pins 311 along the outer peripheral edges 331 of those adhesive bodies 330.In the present embodiment, this lead frame 310 is oppositely to be arranged at this microscope carrier 41, and those half concane gaps 311C is the lower surface 311B that is formed at those pins 311.
See also shown in Fig. 7 B, after half stamping-out, carry out a plating step, it is to form an electrodeposited coating 340 to comprise the exposed surface of those half concane gaps 311C, i.e. part upper surface 311A, the lower surface 311B of those pins 311 and those half concane gaps 311C in those pins 311.
See also shown in Fig. 7 C, carry out a full stamping-out step, this lead frame 310 can change the microscope carrier 51 that forward is positioned over a blanking equipment into, and utilizes a plurality of stamping-out cuttves 52 to cut off those pins 311 along those half concane gaps 311C, and is separated into other adhesive body 330.Therefore, no matter half concane gap of the present invention is formed in the upper surface or the lower surface of pin, all can solve the pin that causes blanking type encapsulation constitution without external pin in the processing procedure of existing known one way stamping-out peels off, drops and problem such as burr, use promoting the processing procedure acceptance rate, more can increase the plating area of pin.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (17)
1, a kind of manufacture method of blanking type encapsulation constitution without external pin is characterized in that it may further comprise the steps:
One lead frame is provided, and it has a plurality of carrier elements, is formed with a plurality of pins in each carrier element;
A plurality of chips are set to this lead frame, and make those chips be electrically connected to those pins;
Form a plurality of adhesive bodies in those carrier elements, with in conjunction with those pins;
Carry out half stamping-out step, form a plurality of half concane gaps in those pins along the outer peripheral edges of those adhesive bodies;
Carry out a plating step, form an electrodeposited coating comprises those half concane gaps in those pins exposed surface; And
Carry out a full stamping-out step, cut off those pins, and be separated into other adhesive body along those half concane gaps.
2, the manufacture method of blanking type encapsulation constitution without external pin according to claim 1 is characterized in that being formed with a dam bar between the adjacent carrier unit, those adhesive bodies are to appear those dam bars when forming.
3, the manufacture method of blanking type encapsulation constitution without external pin according to claim 1 is characterized in that wherein said those half concane gaps are the upper surfaces that are formed at those pins.
4, the manufacture method of blanking type encapsulation constitution without external pin according to claim 1 is characterized in that wherein said those half concane gaps are the lower surfaces that are formed at those pins.
5, the manufacture method of blanking type encapsulation constitution without external pin according to claim 1 is characterized in that wherein said those chips are to be electrically connected to those pins by a plurality of bonding wires.
6, the manufacture method of blanking type encapsulation constitution without external pin according to claim 1 is characterized in that the thickness 1/3rd to 1/2nd of the degree of depth of wherein said those half concane gaps for those pins.
7, the manufacture method of blanking type encapsulation constitution without external pin according to claim 1 is characterized in that wherein said plating step is to be electroless plating or metallide.
8, the manufacture method of blanking type encapsulation constitution without external pin according to claim 1 is characterized in that wherein said electrodeposited coating is to be selected from one of them of tin, tin-lead, Sn-Bi.
9, a kind of blanking type encapsulation constitution without external pin is characterized in that it comprises:
A plurality of pins of one lead frame, the outer end of each pin have one first tangent plane and one second tangent plane that forms with the two-part stamping-out;
One chip, it is arranged at this lead frame and electrically connects with those pins;
One adhesive body, it is formed on this lead frame and with those pins and combines; And
One electrodeposited coating, it is formed at those first tangent planes of those pins at least.
10, blanking type encapsulation constitution without external pin according to claim 9 is characterized in that wherein said those first tangent planes are to be connected with the lower surface of corresponding pin.
11, blanking type encapsulation constitution without external pin according to claim 9 is characterized in that wherein said those first tangent planes are to be connected with the upper surface of corresponding pin.
12, blanking type encapsulation constitution without external pin according to claim 9 is characterized in that wherein said each pin has a upper surface that protrudes in this adhesive body side.
13, blanking type encapsulation constitution without external pin according to claim 12 is characterized in that wherein said electrodeposited coating also is formed at the outstanding upper surface of those pins.
14, blanking type encapsulation constitution without external pin according to claim 9 is characterized in that wherein said chip is to be electrically connected to those pins with routing or flip-chip bonded mode.
15, blanking type encapsulation constitution without external pin according to claim 9 is characterized in that wherein said lead frame has a chip bearing, for the setting of this chip.
16, blanking type encapsulation constitution without external pin according to claim 15 is characterized in that wherein said electrodeposited coating is the lower surface that is formed at this chip bearing.
17, a kind of blanking type encapsulation constitution without external pin is characterized in that it is the blanking type encapsulation constitution without external pin by the manufacture method manufacturing of blanking type encapsulation constitution without external pin as claimed in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710003632 CN100524676C (en) | 2007-01-18 | 2007-01-18 | Blanking type encapsulation constitution without external pin and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710003632 CN100524676C (en) | 2007-01-18 | 2007-01-18 | Blanking type encapsulation constitution without external pin and manufacturing method thereof |
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| CN101226890A CN101226890A (en) | 2008-07-23 |
| CN100524676C true CN100524676C (en) | 2009-08-05 |
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| CN 200710003632 Expired - Fee Related CN100524676C (en) | 2007-01-18 | 2007-01-18 | Blanking type encapsulation constitution without external pin and manufacturing method thereof |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7993981B2 (en) * | 2009-06-11 | 2011-08-09 | Lsi Corporation | Electronic device package and method of manufacture |
| CN102593271A (en) * | 2011-01-14 | 2012-07-18 | 九介企业股份有限公司 | Luminous diode sealing structure and forming method for groove type sealing lead frame thereof |
| CN103177974B (en) * | 2011-12-23 | 2014-10-29 | 丽智电子(昆山)有限公司 | Process for manufacturing discrete electronic component of copper sheet electrode |
| CN102496608A (en) * | 2011-12-23 | 2012-06-13 | 日月光半导体制造股份有限公司 | Semiconductor packaging possessing clamp part and manufacturing method thereof |
| CN103337490A (en) * | 2013-06-13 | 2013-10-02 | 友达光电股份有限公司 | Chip on film tape and chip on film structure |
| CN103441116A (en) * | 2013-09-11 | 2013-12-11 | 杰群电子科技（东莞）有限公司 | Semiconductor package piece and manufacturing method thereof |
| CN104505346A (en) * | 2014-11-03 | 2015-04-08 | 南通富士通微电子股份有限公司 | Semiconductor packaging technology |
| CN104576407B (en) * | 2014-12-30 | 2018-08-03 | 杰群电子科技（东莞）有限公司 | A kind of tin plating encapsulating method and structure in lead frame pin end face |
| CN114420648A (en) * | 2021-11-30 | 2022-04-29 | 广州金升阳科技有限公司 | Pin structure of module power supply and module power supply |
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