CN204189780U - A kind of super-high density discrete is slim without pin package body - Google Patents
A kind of super-high density discrete is slim without pin package body Download PDFInfo
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- CN204189780U CN204189780U CN201420628714.2U CN201420628714U CN204189780U CN 204189780 U CN204189780 U CN 204189780U CN 201420628714 U CN201420628714 U CN 201420628714U CN 204189780 U CN204189780 U CN 204189780U
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- lead frame
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 230000001788 irregular Effects 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 description 16
- 239000011521 glass Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of super-high density discrete slim without pin package body, technical purpose is to provide one can effectively improve product quality and reliability, and the discrete holding high-power die is slim without pin package body.Include lead frame, framework Ji Dao is provided with in described lead frame, described framework Ji Dao is provided with one deck elargol, described elargol is provided with chip, and chip is connected with bonding line, and the outer of bonding line connecting frame Ji Dao draws frame part, the below of framework Ji Dao is provided with flat pin, the periphery of framework Ji Dao is provided with plastic-sealed body, and the side metal cross section of described framework Ji Dao exposes to outside plastic-sealed body, between the unit of lead frame and the cell edges of lead frame be provided with irregular hole.The utility model improves productivity ratio, reduces packaging cost, is significantly strengthened by the q&r of product, is applicable to apply in chip package.
Description
Technical field
This patent relates to integrated antenna package technical field, specifically relates to a kind of super-high density discrete slim without pin package body.
Background technology
The history that integrated antenna package (IC encapsulation) has been passed by more than 40 year.Integrated antenna package not only directly affects the electricity of integrated circuit and device, heat, light and mechanical performance, and plays vital effect to the development of integrated circuit technique.For integrated circuit technique, no matter be its characteristic size, the number of transistors that chip area and chip comprise, or its development track and IC encapsulation, Developing mainstream is all that chip-scale gets over large area reduction, encapsulation volume is more and more less, function is more and more stronger, signal constantly strengthens, lower thickness, lead spacing constantly reduces, lead-in wire also gets more and more, and from both sides pin to surrounding pin, arrive bottom surface pin again, packaging cost is more and more lower, Performance And Reliability is more and more higher, unit package volume, IC density on area is more and more higher, live width is more and more thinner, and by single-chip package to multi-chip package future development.
Discrete is slim is exactly under this its development without pin package body, and that arises at the historic moment is novel without pin series products.Discrete is slim is the one of surface mounting technology without pin package body.It is one side encapsulation, only has one side to have plastic-sealed body.It can directly be installed on circuit board without the need to punching on circuit boards.Relative to surface mount formats such as SOP/QFP/BGA, discrete is slim is a kind of encapsulation technology closer to chip dimension without pin package body, and package dimension is less.The Tong Ji island that it exposes can be used for distribute heat, and its heat transfer effect will be better than VIA(Vertical Interconnect Access far away) mode.
At present conventional discrete slim without pin package body owing to being subject to the restriction of production specifications, lead frame area is not fully utilized, unit arrangement is few, and most of lead frame in the process of plastic packaging and cutting technique easily affected by force cause distortion, and then make the manufacturing process of product more difficult, bring adverse effect to product quality and production efficiency.Because the slim volume without pin package body of discrete is little, the faying face between capsulation material and framework is also few, and both bond strengths also decrease, and easily cause framework from coming off and lamination plastic-sealed body.Because product trends towards to high power development, and current many discretes are slim poor without pin package body radiating condition, very easily affect stability and the life-span of product.Therefore be badly in need of now one and can make full use of lead frame area, increase unit arrangement, and can improve frame structure, the high density discrete that product quality and production efficiency are improved is slim without pin package body structure.
Utility model content
Technical purpose of the present utility model is, one is provided can effectively to improve product quality and reliability, the discrete holding high-power die is slim without pin package body, and provide one can make full use of lead frame area, increase unit arrangement, and effectively can improve product production flow, the discrete avoiding affecting product quality and production efficiency is in process of production slim without pin package body.
For solving above technical problem, the technical solution of the utility model is:
A kind of super-high density discrete is slim without pin package body, it is characterized in that: include lead frame, framework Ji Dao is provided with in described lead frame, described framework Ji Dao is provided with one deck elargol, described elargol is provided with chip, chip is connected with bonding line, the outer of bonding line connecting frame Ji Dao draws frame part, the below of framework Ji Dao is provided with flat pin, the periphery of framework Ji Dao is provided with plastic-sealed body, the side metal cross section of described framework Ji Dao exposes to outside plastic-sealed body, between the unit of lead frame and the cell edges of lead frame be provided with irregular hole.
The long 1.0mm of described packaging body, wide 0.6mm, thick 0.45mm.
The density of material of described plastic-sealed body is Φ 14*4.9G.
Described plastic-sealed body is only packaged in the one side of framework Ji Dao.
Periphery, described framework base island has multiple cross section and contacts with plastic-sealed body.
Described framework Ji Dao has multiple metal cross section to expose to four sides of plastic-sealed body respectively.
Described framework base island metal cross section one has ten, 3 respectively, the positive back side, 2 respectively, two sides.
Described framework base island metal cross section is of a size of 0.12mm × 0.063mm, 0.08mm × 0.063mm.
Described flat pin directly with bottom framework base island is connected, and exposes to bottom plastic-sealed body.
Described flat pin overall dimension is 0.5 × 0.25mm and 0.15 × 0.25mm;
Described lead frame is long is 250mm, wide 70mm, thick 0.127mm.
High temperature pad pasting is posted at the described lead frame back side.
In the utility model, flat pin is directly connected with the bottom of framework Ji Dao, the shape of framework Ji Dao makes it have more cross section to contact with plastic-sealed body, enhance the bond strength with plastic-sealed body, plastic-sealed body forms one side encapsulation on framework, bonding line, chip, elargol are sealed together with framework Ji Dao and flat pin, and the part metals cross section of Ji Dao exposes to packaging body side, can greatly for heat radiation, flat pin surface directly exposes to package bottom, also can be used for heat radiation on circuit boards for directly being pasted by packaging body.
The utility model, in order to solve its technical problem, additionally uses following technical scheme to realize in addition: be specially and use glass briquetting and plastic packaging briquetting to press the framework after plastic packaging.Because framework easily to deform warpage during capsulation material cooling after plastic packaging, difficulty can be brought to follow-up cutting operation, therefore the utility model provides and is lived by ccf layer lamination with outling of truss and close glass briquetting thereof and plastic packaging briquetting, makes the frame plane maintenance level after plastic packaging.The long 249mm of described glass briquetting, wide 69mm, thick 5mm; The long 249mm of described plastic packaging briquetting, wide 69mm, weight 5kg.
The utility model is in order to solve its technical problem, additionally use following technical scheme in addition to realize further: the operating rate in conjunction with mould and the use amount to material, mould plastic packaging framework quantity of plastic packaging is 2, thus capsulation material consumption can be saved again while guarantee operating efficiency, save cost.
The utility model is in order to solve its technical problem, additionally use following technical scheme in addition to realize further: according to above-mentioned designed frame structure, described cutting equipment adopts the mode of hilted broadsword blade cuts, plastic packaging material and frame metal is cut during cutting, the speed of mainshaft is 30KRPm, and the speed of cutting is 20mm/s.
Advantageous Effects of the present utility model is: 1. flat pin and the base island metal cross section that exposes, improve the hot property of product, it is more firm that special base island structure and plastic-sealed body material combine, improve the reliability of product further, and product is drawn close to the developing direction of more small size.2. the lead frame that the utility model uses has the arrangement architecture of super-high density, lead frame area can be utilized more fully, considerably increase lead wire unit arrangement quantity, and then improve packaging efficiency, compared with current conventional manufacture method, the utilance of frame material improves 41%, and the consumption of unit product plastic packaging material saves 30.3%, and the pre-pad pasting of the anti-flash of unit product plastic packaging economizes 29.3%.3. the design of framework upper groove has disperseed the gravitation from plastic-sealed body and the external world, ensure that the stability of product in manufacturing process, facilitates the operation of plastic packaging cutting action.3. the packaging body that the utility model uses compares the conventional method of industry, and plastic packaging process efficiency wants high by 41%; Cutting action efficiency is high by 20%.Difform irregular hole is all provided with between the edges of regions of lead frame and region, this some holes can play the object of dispersive stress in the plastic packaging machine cutting process of product, greatly reduces the technological problems such as slight crack and distortion that product produces because of stress.It is an outstanding improvement with unobviousness.Being the flat pin for pasting encapsulating products bottom framework base island, framework Ji Dao being also designed with multiple irregular pore structure, can in plastic packaging and cutting action dispersive stress, prevent frame deformation.During encapsulation, the frame unit carrying chip one side all covers and seals by capsulation material, and the high temperature pad pasting being affixed on the framework back side prevents capsulation material from overflowing, thus forms one side encapsulation.Plastic packaging briquetting and glass briquetting are used for the framework after plastic packaging to push down, and avoid framework warpage.Again through cutting action, a monoblock plastic-sealed body is cut into independently encapsulating products along the Cutting Road at the framework back side.
Accompanying drawing explanation
Fig. 1 is that the super-high density discrete of the utility model embodiment is slim without pin package body structure schematic diagram;
Fig. 2 is the framework front schematic view that the utility model uses;
Fig. 3 is the partial schematic diagram of the framework that the utility model embodiment uses;
Fig. 4 is the schematic diagram of the glass briquetting that uses of the utility model and the work of plastic packaging briquetting;
Wherein: 1 is plastic-sealed body; 2 is bonding line; 3 is chip; 4 elargol; 5 is framework Ji Dao; 6 is base island metal cross section; 7 is flat pin; 8 is framework; 9 is region; 10 is irregular hole; 12 is irregular hole; 13 is irregular hole; 11 is lead frame unit; 14 is plastic packaging briquetting; 15 is glass briquetting.
Embodiment
As shown in Figure 1, in enforcement of the present utility model, include lead frame, each independently lead frame is the unit of a lead frame; Framework Ji Dao is provided with in described lead frame, described framework Ji Dao is provided with one deck elargol, described elargol is provided with chip, chip is connected with bonding line, the outer of bonding line connecting frame Ji Dao draws frame part, and the below of framework Ji Dao is provided with flat pin, and the periphery of framework Ji Dao is provided with plastic-sealed body, the side metal cross section of described framework Ji Dao exposes to outside plastic-sealed body, between the unit of lead frame and the cell edges of lead frame be provided with irregular hole.That the utility model super-high density discrete is slim without pin package body preferably perspective view, include plastic-sealed body 1, bonding line 2, chip 3, elargol 4, framework base island 5, base island metal cross section 6, flat pin 7, described flat pin 7 is directly connected with the bottom on framework base island 5, plastic-sealed body 1 forms one side encapsulation on framework 8, by bonding line 2, chip 3, elargol 4 seals together with framework base island 5 and flat pin 7, base island metal cross section 6 part exposes to packaging body side, can be used for heat radiation, flat pin 7 surface directly exposes to package bottom, for packaging body is directly pasted on circuit boards, also heat dissipation capacity can be increased.
As Fig. 2 be depicted as the utility model the framework front schematic view that uses, Fig. 3 is the partial schematic diagram of the framework that the utility model embodiment uses; Comprising: framework 8; Region 9; Irregular hole 10, irregular hole 12, irregular hole 13; Lead frame unit 11; The overall dimension of framework 8 is long 250mm, wide 70mm, thick 0.127mm, described framework 8 is divided into 4 regions 9,47 row are provided with in each region 9, often row 67 row lead frame unit 11,4 regions, namely whole piece lead frame amounts to 12596 lead frame unit 11, between region 9 and edges of regions be provided with an irregular hole 10, irregular hole 12, irregular hole 13, spacing between described lead frame unit 11 is equal, and the Cutting Road between lead frame unit is 0.234mm, posts high temperature pad pasting at the back side of lead frame 8.
Fig. 4 is the schematic diagram that the glass briquetting 15 that uses of the utility model and plastic packaging briquetting 14 work; Comprising plastic packaging briquetting 14, glass briquetting 15, and the carrier plastic packaging cartridge clip of necessity.First one piece of glass briquetting 15 is put into cartridge clip base plate, then above being put in by framework, after repeating the some of interval placement in this order, then place plastic packaging briquetting 14 in the superiors.
In force, the long 1.0mm of packaging body, wide 0.6mm, thick 0.45mm.The density of material of plastic-sealed body is Φ 14*4.9G.Plastic-sealed body is only packaged in the one side of framework.Periphery, framework base island has multiple cross section and contacts with plastic-sealed body.Framework Ji Dao has multiple metal cross section to expose to four sides of plastic-sealed body respectively.Base island metal cross section one has ten, 3 respectively, the positive back side, 2 respectively, two sides.Base island metal cross section is of a size of 0.12mm × 0.063mm, 0.08mm × 0.063mm.Flat pin directly with bottom framework base island is connected, and exposes to bottom plastic-sealed body; Flat pin overall dimension is 0.5 × 0.25mm and 0.15 × 0.25mm; Lead frame is long is 250mm, wide 70mm, thick 0.127mm.Described package leadframe is divided into altogether the identical region of 4 sizes to arrange lead frame unit.Be provided with 47 row in leadframe area, often row 67 row lead frame unit, whole piece lead frame amounts to 12596 lead frame unit.The edge between leadframe area and region is all provided with irregular hole.Lead frame cellular construction as shown in the drawing.Cutting Road between lead frame unit is 0.234mm.High temperature pad pasting is posted at the described lead frame back side.After described lead frame plastic packaging, separate with the layering of glass briquetting and push down, and fasten at the superiors' plastic packaging briquetting.The long 249mm of described glass briquetting, wide 69mm, thick 5mm; The long 249mm of described plastic packaging briquetting, wide 69mm, weight 5kg.Mould plastic packaging framework quantity of described plastic packaging is 2.Described cutting equipment adopts the mode of hilted broadsword cutting, and the speed of mainshaft is 30KRPm, and the speed along framework cutting is 20mm/s.
Must be pointed out, some non-restrictive explanations that above-mentioned embodiment is just made the utility model.But technical staff of the present utility model can understand, do not departing under aim of the present utility model and scope, can make amendment to the utility model, replace and change, these amendments, replacement and change still belong to protection range of the present utility model.
Claims (10)
1. a super-high density discrete is slim without pin package body, it is characterized in that: include lead frame, framework Ji Dao is provided with in described lead frame, described framework Ji Dao is provided with one deck elargol, described elargol is provided with chip, chip is connected with bonding line, the outer of bonding line connecting frame Ji Dao draws frame part, the below of framework Ji Dao is provided with flat pin, the periphery of framework Ji Dao is provided with plastic-sealed body, the side metal cross section of described framework Ji Dao exposes to outside plastic-sealed body, between the unit of lead frame and the cell edges of lead frame be provided with irregular hole.
2. a kind of super-high density discrete according to claim 1 is slim without pin package body, it is characterized in that: the long 1.0mm of described packaging body, wide 0.6mm, thick 0.45mm.
3. a kind of super-high density discrete according to claim 1 and 2 is slim without pin package body, it is characterized in that: described flat pin overall dimension is 0.5 × 0.25mm and 0.15 × 0.25mm.
4. a kind of super-high density discrete according to claim 3 is slim without pin package body, it is characterized in that: described plastic-sealed body is located at the one side of framework Ji Dao.
5. a kind of super-high density discrete according to claim 3 is slim without pin package body, it is characterized in that: be arranged with multiple cross section outside described framework Ji Dao and contact with plastic-sealed body.
6. a kind of super-high density discrete according to claim 3 is slim without pin package body, it is characterized in that: described framework Ji Dao has multiple metal cross section to expose to four sides of plastic-sealed body respectively.
7. a kind of super-high density discrete according to claim 3 is slim without pin package body, it is characterized in that: described framework base island metal cross section one has ten, 3 respectively, the positive back side, 2 respectively, two sides.
8. a kind of super-high density discrete according to claim 3 is slim without pin package body, it is characterized in that: described framework base island metal cross section is of a size of 0.12mm × 0.063mm, 0.08mm × 0.063mm.
9. a kind of super-high density discrete according to claim 3 is slim without pin package body, it is characterized in that: described flat pin directly with bottom framework base island is connected, and exposes to bottom plastic-sealed body.
10. a kind of super-high density discrete according to claim 3 is slim without pin package body, it is characterized in that: the described lead frame back side is provided with high temperature pad pasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420628714.2U CN204189780U (en) | 2014-10-28 | 2014-10-28 | A kind of super-high density discrete is slim without pin package body |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420628714.2U CN204189780U (en) | 2014-10-28 | 2014-10-28 | A kind of super-high density discrete is slim without pin package body |
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| CN204189780U true CN204189780U (en) | 2015-03-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104319267A (en) * | 2014-10-28 | 2015-01-28 | 气派科技股份有限公司 | Super-high density discrete thin package without pins and packaging method of super-high density thin discrete package |
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2014
- 2014-10-28 CN CN201420628714.2U patent/CN204189780U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104319267A (en) * | 2014-10-28 | 2015-01-28 | 气派科技股份有限公司 | Super-high density discrete thin package without pins and packaging method of super-high density thin discrete package |
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| C14 | Grant of patent or utility model | ||
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