CN209000909U - A kind of compact-sized lead frame row - Google Patents
A kind of compact-sized lead frame row Download PDFInfo
- Publication number
- CN209000909U CN209000909U CN201822032079.2U CN201822032079U CN209000909U CN 209000909 U CN209000909 U CN 209000909U CN 201822032079 U CN201822032079 U CN 201822032079U CN 209000909 U CN209000909 U CN 209000909U
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- China
- Prior art keywords
- lead frame
- pin
- positioning plate
- compact
- interconnecting piece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a kind of compact-sized lead frame rows, belong to semiconductor components and devices technical field, including multiple lead frames, the multiple lead frame is connected in series；It is characterized by: the lead frame includes positioning plate, interconnecting piece, the slide glass being connected with positioning plate；There is interconnecting piece between the adjacent positioning plate, precutting trough is offered between interconnecting piece and positioning plate；The side of the adjacent positioning plate surrounds location hole, and the side of location hole penetrates through setting, and the other side is communicated with interconnecting piece；The precutting trough separates adjacent positioned plate, and precutting trough evacuation location hole setting.The beneficial effects of the utility model are: being arranged location hole between two neighboring positioning plate, when being punched lead frame, interconnecting piece need to only be cut away, interconnecting piece it is small in size, it is compact-sized, significantly reduce waste material, the utilization rate for improving resource, reduces manufacturing cost；And the area of radiating part is increased, heat dissipation effect is more preferable.
Description
Technical field
The utility model relates to semiconductor components and devices technical fields, more particularly to a kind of compact-sized lead frame
Row.
Background technique
Lead frame is one of the main material of semi-conductor discrete device and integrated antenna package.Lead frame is as integrated
The chip carrier of circuit is a kind of by means of bonding material (spun gold, aluminium wire, copper wire) realization chip internal circuits exit and outer
The electrical connection of lead, forms the key structure part of electric loop, it plays the function served as bridge connected with outer lead, big absolutely
It requires to be basic material important in electronics and information industry using lead frame in partial semiconductor integrated block.Currently, half
Conducting electrons component is usually assembled by chip, plastic-sealed body part, spun gold or aluminium wire, lead frame, automatic in order to improve
Change production efficiency, lead frame is generally arranged by multiple identical copper-based units, and each copper-based unit includes successively connecting
It is connected into integrated cooling fin, slide glass, lead and outer lead, slide glass is used to carry the chip of electronic component, and chip passes through modeling
Body part encapsulating post package is sealed on slide glass.
In order to improve the production efficiency, lead frame row often is made in the combination of multiple lead frames, after the completion of plastic packaging, needed
Multiple lead frames are punched into single lead frame, are punched frequently with die cutting die.Such as Fig. 9, lead frame row includes multiple
Lead frame 1, the multiple lead frame 1 are connected in series；It is characterized by: the lead frame 1 includes positioning plate 2 and determines
The connected slide glass 3 of position plate 2；Location hole 4 is offered on the positioning plate 2, is opened up on positioning plate 2 there are two symmetrically arranged cutting
Fabrication hole 5；Described two Cutting process holes 5 are communicated with location hole 4；Positioning plate 2 is divided into top by the Cutting process hole 5
Interconnecting piece 6 and lower part radiating part 7；The two sides of the interconnecting piece 6 have protrusion 8, and the protrusion 8 of abutting connection 6 integrally connects
It connects；The radiating part 7 and 3 integrally connected of slide glass；Precutting trough 9 there are two being opened up between the interconnecting piece 6 and radiating part 7, it is described
The hole wall in precutting trough 9 from Cutting process hole 5 extends to the side of positioning plate 2.
Before punching, adjacent lead frame row is connected by positioning plate 2, and in order to guarantee to be punched quality, is being positioned
Location hole 4 is offered on plate 2, current location hole 4 is provided with the middle part of positioning plate 2, and positioning plate is divided into connection by location hole 4
Portion 6 and radiating part 7, in order to guarantee finished product lead frame structural stability and good heat dissipation performance, often by interconnecting piece 6 and dissipate
Hot portion 7 separates, and the interconnecting piece 6 cut away is waste, and existing 6 volume of interconnecting piece is big, and manufacturing cost is high, asks for above-mentioned
Topic, present applicant proposes solutions.
Utility model content
In order to solve the above technical problems, the technical solution that the utility model uses is: providing a kind of compact-sized
Lead frame row solves the technical problem that punching process is complicated, manufacturing cost is high.
The purpose of this utility model is achieved through the following technical solutions: a kind of compact-sized lead frame row,
Including multiple lead frames, the multiple lead frame is connected in series；It is characterized by: the lead frame include positioning plate,
Interconnecting piece, the slide glass being connected with positioning plate；There is interconnecting piece between the adjacent positioning plate, opened up between interconnecting piece and positioning plate
There is precutting trough；The side of the adjacent positioning plate surrounds location hole, and the side of location hole penetrates through setting, the other side and interconnecting piece phase
It is logical；The precutting trough separates adjacent positioned plate, and precutting trough evacuation location hole setting.
Preferably, the side of the positioning plate includes inclined plane part, transverse part and arc sections, and the inclined plane part is precutting trough punching
Forming surface afterwards, transverse part are the hole wall for connecting arc sections and inclined plane part, and arc sections are the hole wall of location hole；The arc sections are greater than
The 1/4 of location hole.
Preferably, the precutting trough is obliquely installed.
Preferably, the precutting trough is V-shaped groove.
Preferably, the lower part of each slide glass is equipped with pin, and the root of pin is provided with middle muscle, i.e., middle muscle is on pin
Be located proximate to slide glass；The adjacent middle muscle integrally connected.
Preferably, the pin is not connected directly with slide glass close to one end of slide glass, but is equipped with pin in this one end
Welding stage；The position of the middle muscle is closer to slide glass, and middle muscle is vertical with pin to be connected, and pin is divided into interior pin by middle muscle up and down
With outer pin, the pin welding stage is arranged on interior pin.
Preferably, the position that the interior pin is connect with pin welding stage is equipped with lock glue hole；The lower end of each outer pin
Equipped with bottom muscle；The adjacent bottom muscle integrally connected.
Preferably, the outer pin with a thickness of 0.5~0.6mm.
Preferably, the pin is equipped with bending section, and the bending section is arranged below middle muscle.
Preferably, the material of the lead frame is copper alloy.
The beneficial effects of the utility model are:
One, location hole is arranged between two neighboring positioning plate, when being punched lead frame, interconnecting piece need to be only cut away i.e.
Can, interconnecting piece it is small in size, it is compact-sized, significantly reduce waste material, improve the utilization rate of resource, reduce manufacturing cost；
The positioning plate on lead frame after punching is radiating part, and the middle part of radiating part does not have gap, increases the area of radiating part,
Heat dissipation effect is more preferable.
Two, before lead frame plastic removal envelope, precutting trough is opened up on the positioning plate of lead frame, when lead frame plastic removal
It seals and then lead frame is punched along precutting trough using bicker, substantially reduce punching amount, reduce vibration when punching, keep away
Exempt to generate vibration cracking between lead frame and plastic-sealed body, improves the quality of production of product, improve production efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the best embodiment of the utility model；
Fig. 2 is the structural schematic diagram of single lead frame；
Fig. 3 is the structural schematic diagram of precutting trough；
Fig. 4 is the plastic-sealed body position view after plastic packaging；
Fig. 5 is the side view of Fig. 4；
Fig. 6 is the schematic diagram after plastic packaging bending outer pin；
Fig. 7 is the side view of Fig. 6；
Fig. 8 is the structural schematic diagram after lead frame installation；
Fig. 9 is the structural schematic diagram of existing lead frame row；
In figure: 1- lead frame, 2- positioning plate, 3- slide glass, 4- location hole, 5- Cutting process hole, 6- interconnecting piece, 7- heat dissipation
Portion, 8- is raised, 9- precutting trough, 10- dovetail groove, muscle in 11-, 12- pin welding stage, pin in 13-, 14- outer pin, and 15- locks glue
Hole, the bottom 16- muscle, the bending section 17-, the straight line portion 18-, 19- plastic-sealed body, 20- radiator, 21- circuit board.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing, to this reality
With novel further description.Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than complete
The embodiment in portion.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Every other embodiment obtained is put, is fallen within the protection scope of the utility model.
As shown in Figures 1 to 8, a kind of compact-sized lead frame row, including multiple lead frames 1, it is the multiple to draw
Wire frame 1 is connected in series；It is characterized by: the lead frame 1 includes positioning plate 2, interconnecting piece 6, the load being connected with positioning plate 2
Piece 3；There is interconnecting piece 6 between the adjacent positioning plate 2, precutting trough 9 is offered between interconnecting piece 6 and positioning plate 2；It is adjacent described
The side of positioning plate 2 surrounds location hole 4, and the side of location hole 4 penetrates through setting, and the other side is communicated with interconnecting piece 6；The precutting trough
9 separate adjacent positioned plate 2, and precutting trough 9 avoids location hole 4 and is arranged.
Location hole 4 is arranged between two neighboring positioning plate 2, when being punched lead frame, interconnecting piece 6 need to only be cut away i.e.
Can, interconnecting piece 6 it is small in size, it is compact-sized, significantly reduce waste material, improve the utilization rate of resource, reduce manufacturing cost；
Positioning plate 2 on lead frame after punching is radiating part 7, and the middle part of radiating part 7 does not have gap, increases radiating part 7
Area, heat dissipation effect are more preferable.
Before 1 plastic removal of lead frame envelope, such as Fig. 1, precutting trough 9 is opened up on the positioning plate 2 of lead frame 1, works as lead
1 plastic removal of frame seals and then is punched lead frame 1 along precutting trough 9 using bicker, substantially reduces punching amount, reduces punching
When vibration, avoid generating vibration cracking between lead frame 1 and plastic-sealed body 19, improve the quality of production of product, improve production
Efficiency.
The precutting trough 9 is obliquely installed, and after punching, becomes chamfering along the inclined-plane that precutting trough 9 generates, and is not had to again single
Only chamfering reduces workload, improves production efficiency.
The side of the positioning plate 2 includes inclined plane part, transverse part and arc sections, and the inclined plane part is after precutting trough 9 is punched
Forming surface, transverse part are the hole wall for connecting arc sections and inclined plane part, and arc sections are the hole wall of location hole 4；The arc sections are greater than fixed
The 1/4 of position hole 4, this is the location area in order to increase location hole 4 as far as possible, improves positioning accuracy.Positioning plate 2 with a thickness of
1.2mm~1.5mm guarantees enough rigidity.Positioning plate 2 is radiating part 7 after being punched, and the end of radiating part 7 is horizontal plane.
Such as Fig. 3, the precutting trough 9 is V-shaped groove.In the present embodiment, the angle of V-shaped groove is 60 °, depth 0.15mm.
As shown in Figure 1, Figure 4, Figure 5, the lower part of each slide glass 3 is equipped with pin, and the root of pin is provided with middle muscle
11, i.e., middle muscle 11 is located proximate to slide glass 3 on pin.In the present embodiment, pin 2 in total, setting side by side is in slide glass 3
Lower section.Integrally connected between adjacent middle muscle 11.
The pin is not connected directly with slide glass 3 close to one end of slide glass 3, but is equipped with pin welding stage in this one end
12.The position of middle muscle 11 is closer to slide glass 3, and middle muscle 11 is vertical with pin to be connected, and pin is divided into interior draw by middle muscle 11 up and down
Foot 13 and outer pin 14, the pin welding stage 12 just mentioned namely are located on interior pin 13, in interior pin 13 and pin welding stage
The position of 12 connections is equipped with lock glue hole 15, and the effect in lock glue hole 15 is the stability for enhancing pin welding stage 12 in plastic-sealed body 19,
Pin welding stage 12 when 14 bending of outer pin is avoided to be drawn displacement.Bottom muscle 16, adjacent bottom are equipped in the lower end of each outer pin 14
Integrally connected between muscle 16 guarantees that entire lead frame 1 has enough rigidity.
It is equipped with dovetail groove 10 between slide glass 3 and radiating part 7, keeps the combination of plastic-sealed body 19 and slide glass 3 more stable, secured,
To further improve electronic component reliability and extend service life.
The pin is equipped with bending section 17, and such as Fig. 7, the bending section 17 is arranged below middle muscle 11, i.e., middle muscle 11 is located at
Straight line portion 18, rather than be placed exactly on bending section 17；Reason for this is that: the off-position of muscle 11 is stayed in when finished product bending
In the position of interior 13 plane of pin, rather than on the incline position after bending, in Bending Processing, even if 13 side of interior pin has
Remaining plastic cement, will not fall down to fall in mold because of the vibration of bending the matter such as is weighing wounded so as to avoid plastic packaging finished product
Amount problem will affect fitting if the plastic cement of 13 side of interior pin falls on 3 surface of slide glass, to influence product heat dissipation.
Current outer pin 14 frequently with a thickness of 0.38mm, but since outer pin 14 needs to weld, often be easy
Now break foot, in the present embodiment outer pin 14 with a thickness of 0.5~0.6mm, guarantee the enough mechanical properties of outer pin 14.
The lead frame 1 metal material good using heat conductivity, such as copper alloy.
Above-mentioned integrally connected is integrally formed.
When lead frame 1 after plastic packaging and punching is installed, such as Fig. 8, outer pin 14 is connected to circuit board 21 by tin welding
On, radiating part 7 is connected on radiator 20 by tin welding.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, there can be various modifications and variations in the spirit and principles of the utility model, these are equivalent
Variation or replacement etc., are included in the protection scope of the present invention.
Claims (10)
1. a kind of compact-sized lead frame row, including multiple lead frames, the multiple lead frame are connected in series；It is special
Sign is: the lead frame includes positioning plate, interconnecting piece, the slide glass being connected with positioning plate；Have between the adjacent positioning plate
There is interconnecting piece, precutting trough is offered between interconnecting piece and positioning plate；The side of the adjacent positioning plate surrounds location hole, location hole
Side penetrate through setting, the other side is communicated with interconnecting piece；The precutting trough separates adjacent positioned plate, and precutting trough evacuation is fixed
The setting of position hole.
2. compact-sized lead frame row according to claim 1, it is characterised in that: the side of the positioning plate includes
Inclined plane part, transverse part and arc sections, the inclined plane part are the forming surface after precutting trough punching, and transverse part is connection arc sections and inclined plane part
Hole wall, arc sections be location hole hole wall；The arc sections are greater than the 1/4 of location hole.
3. compact-sized lead frame row according to claim 1, it is characterised in that: the precutting trough is obliquely installed.
4. compact-sized lead frame row according to claim 1, it is characterised in that: the precutting trough is V-shaped groove.
5. compact-sized lead frame row according to claim 1, it is characterised in that: the lower part of each slide glass is set
There is pin, the root of pin is provided with middle muscle, i.e., middle muscle is located proximate to slide glass on pin；The adjacent middle muscle integrally connects
It connects.
6. compact-sized lead frame row according to claim 5, it is characterised in that: the pin close to slide glass one
End is not connected directly with slide glass, but is equipped with pin welding stage in this one end；The position of the middle muscle is closer to slide glass, middle muscle
Vertical with pin is connected, and pin is divided into interior pin and outer pin by middle muscle up and down, and the pin welding stage is arranged on interior pin.
7. compact-sized lead frame row according to claim 6, it is characterised in that: the interior pin and pin welding stage
The position of connection is equipped with lock glue hole；The lower end of each outer pin is equipped with bottom muscle；The adjacent bottom muscle integrally connected.
8. compact-sized lead frame row according to claim 6, it is characterised in that: the outer pin with a thickness of
0.5~0.6mm.
9. compact-sized lead frame row according to claim 5, it is characterised in that: the pin is equipped with bending section,
The bending section is arranged below middle muscle.
10. lead frame compact-sized described in any one row according to claim 1~9, it is characterised in that: the lead
The material of frame is copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822032079.2U CN209000909U (en) | 2018-12-05 | 2018-12-05 | A kind of compact-sized lead frame row |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822032079.2U CN209000909U (en) | 2018-12-05 | 2018-12-05 | A kind of compact-sized lead frame row |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209000909U true CN209000909U (en) | 2019-06-18 |
Family
ID=66808715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822032079.2U Active CN209000909U (en) | 2018-12-05 | 2018-12-05 | A kind of compact-sized lead frame row |
Country Status (1)
| Country | Link |
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| CN (1) | CN209000909U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110465587A (en) * | 2019-08-21 | 2019-11-19 | 四川金湾电子有限责任公司 | A kind of double stamping die Nestings of power device |
| WO2023103158A1 (en) * | 2021-12-07 | 2023-06-15 | 东莞市欧思科光电科技有限公司 | Led base module, led module, and led light strip |
-
2018
- 2018-12-05 CN CN201822032079.2U patent/CN209000909U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110465587A (en) * | 2019-08-21 | 2019-11-19 | 四川金湾电子有限责任公司 | A kind of double stamping die Nestings of power device |
| CN110465587B (en) * | 2019-08-21 | 2020-10-30 | 四川金湾电子有限责任公司 | Power device double-strip stamping die sample arrangement method |
| WO2023103158A1 (en) * | 2021-12-07 | 2023-06-15 | 东莞市欧思科光电科技有限公司 | Led base module, led module, and led light strip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A compact lead frame row Effective date of registration: 20200806 Granted publication date: 20190618 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: SICHUAN JINWAN ELECTRONIC Co.,Ltd. Registration number: Y2020980004749 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211019 Granted publication date: 20190618 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: SICHUAN JINWAN ELECTRONIC Co.,Ltd. Registration number: Y2020980004749 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A compact lead frame row Effective date of registration: 20211104 Granted publication date: 20190618 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: SICHUAN JINWAN ELECTRONIC Co.,Ltd. Registration number: Y2021980011872 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230109 Granted publication date: 20190618 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: SICHUAN JINWAN ELECTRONIC Co.,Ltd. Registration number: Y2021980011872 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A compact lead frame row Effective date of registration: 20230216 Granted publication date: 20190618 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: SICHUAN JINWAN ELECTRONIC Co.,Ltd. Registration number: Y2023980032666 |