CN201430136Y - Lead frame of square flat integrated circuit - Google Patents
Lead frame of square flat integrated circuit Download PDFInfo
- Publication number
- CN201430136Y CN201430136Y CN200920077878XU CN200920077878U CN201430136Y CN 201430136 Y CN201430136 Y CN 201430136Y CN 200920077878X U CN200920077878X U CN 200920077878XU CN 200920077878 U CN200920077878 U CN 200920077878U CN 201430136 Y CN201430136 Y CN 201430136Y
- Authority
- CN
- China
- Prior art keywords
- chip island
- lead frame
- rectangular chip
- island
- described chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses the manufacture technology of a lead frame of a square flat integrated circuit, which overcomes the disadvantages of the existing product of low shake proof and shock resistant performance and poor sealing performance between adjacent pins. The lead frame of a square flat integrated circuit comprises a rectangular chip island at the center and a plurality of pins evenlydistributed at the surrounding of the rectangular chip island, wherein connection ribs are arranged between adjacent pins for connecting and fixing; the rectangular chip island is connected with a base piece of the lead frame through connection pieces arranged at four corners of the rectangular chip island; the connection end parts of the connection pieces and the rectangular chip island bend downward to enable the surface of the rectangular chip island below the surface of the base piece of the lead frame; drop pits regularly arranged are evenly distributed at the back of the rectangular chip island; the welding areas of the roots of the pins surround the rectangular chip island; and silver is plated at the welding areas of the roots and the edge of the rectangular chip island. Comparedwith the existing product, the utility model has the advantages of mechanical shock resistance, thermal fatigue resistance and long service life, and can be widely applied to the manufacture field ofsemiconductor electronic devices and components.
Description
Technical field
The utility model relates to semiconductor electronic components and parts manufacturing technology, especially refers to a kind of circuit lead frame technology of tool quad flat profile.
Background technology
Fast development along with science and technology, especially the fast development of microelectronics intellectualized technology, ic component presents the integrated developing state of miniaturization, slimming and function just day by day, therefore match with it, as the circuit lead frame parts of basic device, its thickness is tending towards slim, and pin number is more and more, and is individual surplus in the of ten at least, dozens of at most, its processing and manufacturing difficulty is far longer than common lead frame of triode product; How guaranteeing the good conducting of each pin and integrated circuit (IC) chip and possess enough anti-knock shock resistance performances, is the important leverage that improves large scale integrated circuit product functional reliability; In addition, again because pin number dozens of at most improves its waterproof and sealing property conscientiously, effectively stopping the generation of infiltration short circuit phenomenon between the adjacent leads, also is the prerequisite of enhancing product performance.At present, large scale integrated circuit product common in the industry is many by external import, its main obstacles is that the design of domestic circuit lead frame components and parts is limited with manufacturing capacity, and the anti-knock shock resistance performance is low, poor sealing performance between the adjacent leads, causes the integrated circuit end product quality to be difficult to improve.
The utility model content
The technical problems to be solved in the utility model is after overcoming existing large-scale integrated circuit lead frame and Chip Packaging, finished product anti-knock shock resistance performance is low, the defective and the deficiency of poor sealing performance between the adjacent leads, a kind of large-scale integrated circuit lead frame product of tool new structure is provided to society, conscientiously improve the anti-knock shock resistance performance of integrated circuit finished product, effectively promote end product quality and class.
The technical scheme that its technical problem that solves the utility model adopts is: the circuit lead frame of quad flat comprises the rectangular dies island that is positioned at the central area and is distributed in a plurality of pins of described chip island four sides, be provided with the dowel reinforcement by connection between the adjacent described pin, described chip island is connected with the lead frame substrate by being located at its brace of four jiaos; Described brace bends downwards with the end that described chip island is connected, and makes described chip island plane be lower than described lead frame substrate plane; The back side of described chip island is evenly equipped with regularly arranged pit.
The root weld district of described pin around described chip island, described root weld district, described chip island edge positive silver-plated.
11 pins of every side tool of described chip island.
After the bending downwards of the circuit lead frame of the utility model quad flat, the end that described brace is connected with described chip island, improved the mechanical strength of described lead frame substrate greatly; When using this product envelope material, plastics envelope material is filled in the uniform pit in the described chip island back side, has strengthened the adhesion of lead frame substrate and plastics envelope material greatly, helps the raising of sealing and waterproof and dampproof performance; The silver-plated root weld district of described pin is around described chip island, and the silver-plated position of described chip island is positioned at its edge, and regular shape can adopt mould rotary island spraying plating process to carry out silver-plated operation, the production efficiency height.This product has the characteristic of anti-mechanical shock, heat-resistant anti-fatigue and long service life.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is that the A-A of Fig. 1 is to the cross section structure schematic diagram.
Fig. 3 is the rearview at position, the utility model product chips island.
Embodiment
As shown in Figure 1, the circuit lead frame of the utility model quad flat comprises rectangular dies island 6 that is positioned at the central area and a plurality of pins 4 that are distributed in described chip island 6 four sides, with the industry model is that the series of products of LQFP44F are example, and 11 pins of every side tool 4 of described chip island 6 amount to 44; Described chip island 6 is used for the bearing integrated chip, is provided with dowel 3 reinforcement by connection between the adjacent described pin 4, to guarantee not misplace the evenness of raising product in the processing and manufacturing process.The root weld district 5 of described pin 4 around described chip island 6, described root weld district 5, described chip island 6 edges 10 positive silver-plated.Being positioned at the rectangular area that described dowel 3 inboard chain-dotted lines surround is encapsulation region 1, and the described pin 4 in described encapsulation region 1 outside is used for the welding that patches with wiring board.
As shown in Figure 2, described chip island 6 is connected with lead frame substrate 8 by being located at its brace of four jiaos 7; Described brace 7 bends downwards with the end that described chip island 6 is connected, and makes described chip island 6 planes be lower than described lead frame substrate 8 planes.
As shown in Figure 3, the back side of described chip island 6 is evenly equipped with regularly arranged pit 9.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.Requirement according to encapsulation factory processes in being equipped with the milling train of corresponding mould and is provided with the lead frame product that lower sideband 2 is connected.Because the silver-plated root weld district 5 of described pin 4 is around described chip island 6, described chip island 6 silver-plated positions are positioned at its edge, therefore can adopt mould rotary island spraying plating process to carry out silver-plated operation, silver-plated district shape high conformity, production efficiency height.After the bending downwards of the end that described brace 7 is connected with described chip island 6, improved the mechanical strength of described lead frame substrate 8 greatly; When using this product envelope material, plastics envelope material is filled in the uniform pit 9 in described chip island 6 back sides, strengthened described lead frame substrate 8 greatly and sealed the adhesion of expecting with plastics, help the raising of sealing and waterproof and dampproof performance, thereby final anti-mechanical shock of integrated circuit finished product and heat-resistant anti-fatigue intensity are obviously promoted, and product prolongs useful life.
Claims (3)
1, a kind of circuit lead frame of quad flat, comprise the rectangular dies island (6) that is positioned at the central area and be distributed in a plurality of pins (4) of described chip island (6) four sides, be provided with dowel (3) reinforcement by connection between the adjacent described pin (4), it is characterized in that: described chip island (6) is connected with lead frame substrate (8) by being located at its brace of four jiaos (7); Described brace (7) bends downwards with the end that described chip island (6) is connected, and makes described chip island (6) plane be lower than described lead frame substrate (8) plane; The back side of described chip island (6) is evenly equipped with regularly arranged pit (9).
2, the circuit lead frame of quad flat according to claim 1, it is characterized in that: the root weld district (5) of described pin (4) around described chip island (6) all around, described root weld district (5), described chip island (6) edge (10) positive silver-plated.
3, the circuit lead frame of quad flat as claimed in claim 1 or 2 is characterized in that: 11 pins of every side tool (4) of described chip island (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920077878XU CN201430136Y (en) | 2009-07-02 | 2009-07-02 | Lead frame of square flat integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920077878XU CN201430136Y (en) | 2009-07-02 | 2009-07-02 | Lead frame of square flat integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201430136Y true CN201430136Y (en) | 2010-03-24 |
Family
ID=42033878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920077878XU Expired - Lifetime CN201430136Y (en) | 2009-07-02 | 2009-07-02 | Lead frame of square flat integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201430136Y (en) |
-
2009
- 2009-07-02 CN CN200920077878XU patent/CN201430136Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100324 |