CN201584407U - Dual-diode lead frame piece - Google Patents
Dual-diode lead frame piece Download PDFInfo
- Publication number
- CN201584407U CN201584407U CN2009202446153U CN200920244615U CN201584407U CN 201584407 U CN201584407 U CN 201584407U CN 2009202446153 U CN2009202446153 U CN 2009202446153U CN 200920244615 U CN200920244615 U CN 200920244615U CN 201584407 U CN201584407 U CN 201584407U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip island
- positive pin
- sealing material
- side pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a dual-diode lead frame piece which overcomes the defect of the existing like product that the sealing material is easy to generate malposition sliding with a lead frame matrix. The lead frame piece is formed by transversely and continuously arraying the units comprising a plurality of same lead frames by connecting sheets; the upper side and the lower side of the unit are provided with side bands mutually and transversely connected; the lead frame comprises a chip island, one positive pin and two side pins; the positive pin is connected with the chip island; the surface of the positive pin, close to the edge of the chip island, is penetrated with a groove; ribs are arranged between the two side pins for connection and fixation; and the paster surface of the chip island and the welding surfaces of the two side pins are plated with nickel. The dual-diode lead frame piece greatly enhances the binding force between the sealing material and the positive pin as well as a chip island matrix, can effectively prevent the malposition sliding between the sealing material and the lead frame matrix and plumping and layering of the sealing material on the surface of the chip island, and can be widely applied to switching a plurality of control circuits of chargers, USB power supplies, battery supply feed and the like.
Description
Technical field
The utility model relates to semi-conductor discrete device manufacturing technology field, especially refers to a kind of double diode lead frame spare manufacturing technology of electronic applications extensive use.
Background technology
The market application of semi-conductor discrete device product is very extensive, and it has contained consumer electronics, computer and peripheral hardware, network service, a plurality of fields such as electronics special equipment and instrument and meter, automotive electronics, LED display and electrical lighting; These lead frame profile and performance requirements of using in different field also have nothing in common with each other; for example SIC code is the double diode encapsulation lead frame of SC59-3LD; the length and width size of its profile is all less than 3mm; pin is narrow and thin; so the series products packaged chip used after a period of time; often have envelope material and lead frame matrix produce the dislocation slippage or with the phenomenon of lead frame matrix surface layering, have a strong impact on the electronic devices and components reliability of operation.For this reason, technical staff in the industry expects to invent a kind of simple in structure, easily manufactured, novel double diode encapsulation lead frame product that can effectively prevent to seal material and lead frame matrix dislocation slippage always, to overcome the deficiency that exists in the existing product application process, satisfy this type of double diode electronic component products and in switching various control circuit such as charger, USB power supply and powered battery, use required.
The utility model content
The technical problems to be solved in the utility model be overcome existing like product encapsulation back envelope material easily with the lead frame matrix produce misplace slippage or with the defective and the deficiency of lead frame matrix surface layering, to society provide a kind of simple in structure, easily manufactured, can effectively prevent to seal material and use lead frame product with the double diode encapsulation of lead frame matrix dislocation slippage, it is required to satisfy in switching various control circuit such as charger, USB power supply and powered battery application.
The technical scheme that its technical problem that solves the utility model adopts is: double diode lead frame spare laterally is consecutively arranged to form through brace by the cell cube that comprises a plurality of same lead frame; Each described cell cube is provided with 12 lead frames of vertical two row, horizontal six row's settings, and the both sides up and down of described cell cube are established sideband and laterally are connected to each other; Described lead frame comprises chip island, a positive pin and two side pins, and described positive pin is connected with described chip island; Described positive pin is penetrated with groove at the edge surface near described chip island.
Being provided with the muscle sheet between described two side pins is connected to a fixed; All nickel plating of welding zone surface of described chip island paster surface and described two side pins.
The utility model double diode lead frame spare, the envelope material is filled in described positive pin near in the groove of described chip island edge surface during encapsulation, strengthened the vertical adhesion of envelope material greatly with positive pin, chip island matrix, can prevent effectively that envelope material and the dislocation slippage of lead frame matrix and envelope material are in chip island cokled surface, layering, anti-mechanical shock of finished product and heat-resistant anti-fatigue intensity are obviously promoted, thereby improved double diode electronic devices and components reliability of operation greatly.Compare than prior art products, this product structure is simple, easily manufactured, extensively is suitable for switching various control circuit application such as charger, USB power supply and powered battery.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is the A portion structure for amplifying schematic diagram of Fig. 1.
Fig. 3 is that the C-C of Fig. 2 is to the cross section structure schematic diagram.
Fig. 4 is the B portion structure for amplifying schematic diagram of Fig. 3.
Embodiment
As shown in Figure 1, the double diode encapsulating products that is encoded to SC59-3LD with the industry encapsulation is an example, and the utility model double diode lead frame spare laterally is consecutively arranged to form through brace 5 by the cell cube 1 that comprises a plurality of same lead frame 4; Each described cell cube 1 is provided with 12 lead frames 4 of vertical two row, horizontal six row's settings; Link to each other through described brace 5 between the described lead frame 4 of two row in the described cell cube 1, described brace 5 longitudinally is evenly equipped with through hole 11; The both sides up and down of described cell cube 1 are established sideband 9 and laterally are connected to each other.
As shown in Figure 2, described lead frame 4 comprises chip island 6, positive pin 7 and two side pins 2, is provided with muscle sheet 3 between described two side pins 2 and is connected to a fixed, and to guarantee this product positive pin 7, side pin 2 when the punching press continuously buckling deformation does not take place; Described positive pin 7 is connected with described chip island 6; All nickel plating protections of welding zone 8 surfaces of described chip island 6 pasters surface and described two side pins 2 are to improve the bonding welding performance.
As shown in Figure 3 and Figure 4, described positive pin 7 is penetrated with groove 10 at the edge surface near described chip island 6.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.Designing requirement according to encapsulation factory processes qualified double diode encapsulating lead spare in being equipped with the stamping machine of corresponding mould; Because each cell cube 1 of this product is provided with totally 12 lead frames 4 of vertical two row, horizontal six rows, therefore not only production efficiency improves, and declines to a great extent as leftover pieces consumptions such as the sideband 9 of transition piece, braces 5.When using the encapsulation of this product, the envelope material is filled in described positive pin 7 near in the groove 10 of described chip island 6 edge surfaces, strengthened the vertical adhesion of envelope material greatly with positive pin 7, chip island 6 matrixes, can prevent effectively that envelope material and the dislocation slippage of lead frame matrix and envelope material are in chip island 6 cokled surfaces, layering, anti-mechanical shock of finished product and heat-resistant anti-fatigue intensity are obviously promoted, thereby improved double diode electronic devices and components reliability of operation greatly.
Claims (2)
1. a double diode lead frame spare laterally is consecutively arranged to form through brace (5) by the cell cube that comprises a plurality of same lead frame (4) (1); It is characterized in that: each described cell cube (1) is provided with 12 lead frames (4) of vertical two row, horizontal six row's settings, and the both sides up and down of described cell cube (1) are established sideband (9) and laterally are connected to each other; Described lead frame (4) comprises chip island (6), a positive pin (7) and two side pins (2), and described positive pin (7) is connected with described chip island (6); Described positive pin (7) is penetrated with groove (10) at the edge surface near described chip island (6).
2. double diode lead frame spare according to claim 1 is characterized in that: be provided with muscle sheet (3) between described two side pins (2) and be connected to a fixed; All nickel plating of welding zone (8) surface of described chip island (6) paster surface and described two side pins (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202446153U CN201584407U (en) | 2009-12-22 | 2009-12-22 | Dual-diode lead frame piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202446153U CN201584407U (en) | 2009-12-22 | 2009-12-22 | Dual-diode lead frame piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201584407U true CN201584407U (en) | 2010-09-15 |
Family
ID=42726419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202446153U Expired - Lifetime CN201584407U (en) | 2009-12-22 | 2009-12-22 | Dual-diode lead frame piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201584407U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783793A (en) * | 2017-03-24 | 2017-05-31 | 王刚 | A kind of leads of semiconductor device framework of use TO types encapsulation |
-
2009
- 2009-12-22 CN CN2009202446153U patent/CN201584407U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783793A (en) * | 2017-03-24 | 2017-05-31 | 王刚 | A kind of leads of semiconductor device framework of use TO types encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100915 |
|
| CX01 | Expiry of patent term |