CN201549496U - High-power patch-type lead frame - Google Patents
High-power patch-type lead frame Download PDFInfo
- Publication number
- CN201549496U CN201549496U CN2009202446187U CN200920244618U CN201549496U CN 201549496 U CN201549496 U CN 201549496U CN 2009202446187 U CN2009202446187 U CN 2009202446187U CN 200920244618 U CN200920244618 U CN 200920244618U CN 201549496 U CN201549496 U CN 201549496U
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- CN
- China
- Prior art keywords
- lead frame
- chip island
- pins
- chip
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a manufacturing technology of a high-power patch-type lead frame, overcoming the defects that the existing similar products have large punching, processing and stamping pressure and high cost of molds, and comprising radiating fins at the top part, chip islands at the middle part and a plurality of pins at the bottom part, wherein connecting sheets are arranged between the adjacent pins and connected fixedly and mutually; the connecting part of the chip island and the radiating fin is provided with a transverse through hole; a surface part of the chip island at the two sides of the transverse through hole is provided with a groove; and the positive surfaces and the negative surfaces at the roots of welding zones of the pins are provided with a plurality of V-shaped grooves. The left side surface, the right side surface and the lower side surface of the chip island are distributed with raised ribs in a ring manner; and the top end of the raised ribs is sharp. The product greatly enhances the binding force of a sealing material and the chip islands, thus not only improving the shock resistance, but also effectively preventing the immersion of aqueous vapor; and the high-power patch-type lead frame has the advantages of novel structure, convenient punching and processing and good radiating effect, and can be widely applicable to the industry of automotive electronics.
Description
Technical field
The utility model relates to semi-conductor discrete device manufacturing technology field, especially refers to a kind of manufacturing technology of high-power SMD lead frame.
Background technology
The market application of semi-conductor discrete device product is very extensive, and it has contained consumer electronics, computer and peripheral hardware, network service, many aspects such as electronics special equipment and instrument and meter, automotive electronics, LED display and electrical lighting; Wherein be mainly used in the high-power SMD lead frame product of automotive electronics, since higher at the performance requirement of aspects such as heat radiation temperature rise, antidetonation, need bond strength preferably between its matrix and the plastics envelope material.This type of early stage like product has effectively improved both bond strengths by suppress the mode of pit at the matrix back side; But owing to be subjected to the influence of operational environment, this series products is after using a period of time, and make moist short circuit and lamination happen occasionally, and very easily causes the discrete device fault and can't operate as normal; The people was also arranged afterwards by the adhesion that a plurality of breach modes improve base material and plastics envelope material is set in the matrix both sides of the edge, but setting up of breach makes that punching out processing stamping press increases, die cost improves greatly, the lost of life.
The utility model content
The technical problems to be solved in the utility model is to overcome defective and the deficiency that punching out processing stamping press is big, die cost is high, the life-span is short that existing like product exists, to society provide that a kind of base shape is simple, punching out is easy to process, good heat dissipation effect, base material expect to combine firm high-power SMD lead frame product with the plastics envelope.
The technical scheme that its technical problem that solves the utility model adopts is: high-power SMD lead frame comprises the fin at top, the chip island at middle part and a plurality of pins of bottom, being provided with brace between the adjacent described pin is connected to a fixed, the described chip island position that links to each other with described fin is provided with cross through hole, the described chip island table portion of described cross through hole both sides is provided with groove, and the welding zone root tow sides of described pin are provided with the multiple tracks V-groove.
Left and right, following three sides of described chip island prominent muscle that has been periphery, described prominent muscle top is sharp-pointed.
The high-power SMD lead frame product of the utility model, the envelope material is filled in the positions such as cross through hole, groove, multiple tracks V-groove during encapsulation, has promptly strengthened the adhesion of envelope material with chip island, improves anti-seismic performance, also can effectively stop the immersion of steam; After three sides of described chip island are periphery prominent muscle, can prevent to seal material and heave, thereby improve the semi-conductor discrete device reliability of operation greatly at the front or the reverse side of described chip island.After the encapsulation, described fin still is exposed to the external world and is used for heat radiation, is beneficial to cooling.Compare than prior art products, this product has that novel structure, punching out are easy to process, the advantage of good heat dissipation effect, can be widely used in Automobile Electronic Industry.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is that the A-A of Fig. 1 is to the sectional structure schematic diagram.
Fig. 3 is the M portion structure for amplifying schematic diagram of Fig. 1.
Fig. 4 is that the B-B of Fig. 3 is to the sectional structure schematic diagram.
Embodiment
As shown in Figure 1, be that the high-power SMD lead frame of TO-263 type is an example with the SIC code, the utility model laterally is consecutively arranged to form through bottom sideband 10 by the lead frame 1 that comprises a plurality of same unit bodies; Described lead frame 1 comprises the fin 11 at top, the chip island 6 at middle part and a plurality of pins 2 of bottom, the fin 11 of adjacent described lead frame 1 is connected to each other, be provided with brace 3 between the adjacent described pin 2 and be connected to a fixed, buckling deformation does not take place to guarantee this product pin 2 when the continuous punching out; Described chip island 6 position that links to each other with described fin 11 is provided with cross through hole 4.
As depicted in figs. 1 and 2, the described chip island 6 table portions of described cross through hole 4 both sides are provided with groove 5; The welding zone 8 root tow sides of described pin 2 are provided with multiple tracks V-groove 9.
As shown in Figure 3 and Figure 4, left and right, following three sides of described chip island 6 prominent muscle 7 that has been periphery, described prominent muscle 7 tops are sharp-pointed.For preventing the oxidation before encapsulation of this product surface, also be beneficial to the welding of bonding silk thread, this product is except the described chip island 6 positive rectangular areas of carries chips, and other zone all nickel plating is protected.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.When using the encapsulation of this product, the envelope material is filled in the positions such as cross through hole 4, groove 5, multiple tracks V-groove 9, has promptly strengthened the adhesion of envelope material with chip island 6, improves anti-seismic performance, also can effectively stop the immersion of steam; After three sides of described chip island 6 are periphery prominent muscle 7, can prevent to seal material and heave, thereby improve the semi-conductor discrete device reliability of operation greatly equally at the front or the reverse side of described chip island 6.After the encapsulation, described fin 11 still is exposed to the external world and is used for heat radiation, is beneficial to cooling.The utility model product can be widely used in Automobile Electronic Industry.
Claims (2)
1. high-power SMD lead frame, comprise the fin (11) at top, the chip island (6) at middle part and a plurality of pins (2) of bottom, being provided with brace (3) between the adjacent described pin (2) is connected to a fixed, it is characterized in that: described chip island (6) position that links to each other with described fin (11) is provided with cross through hole (4), described chip island (6) the table portion of described cross through hole (4) both sides is provided with groove (5), and welding zone (8) the root tow sides of described pin (2) are provided with multiple tracks V-groove (9).
2. high-power according to claim 1 SMD lead frame is characterized in that: left and right, following three sides of described chip island (6) prominent muscle (7) that has been periphery, described prominent muscle (7) top is sharp-pointed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202446187U CN201549496U (en) | 2009-12-22 | 2009-12-22 | High-power patch-type lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202446187U CN201549496U (en) | 2009-12-22 | 2009-12-22 | High-power patch-type lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201549496U true CN201549496U (en) | 2010-08-11 |
Family
ID=42604675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202446187U Expired - Lifetime CN201549496U (en) | 2009-12-22 | 2009-12-22 | High-power patch-type lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201549496U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101937898A (en) * | 2010-08-12 | 2011-01-05 | 苏州固锝电子股份有限公司 | Rectifier structure for moisture protection |
| CN103617972A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power device-used lead frame |
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
| CN103943589A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame on which bosses are arranged in pressing mode |
| CN108831873A (en) * | 2018-06-28 | 2018-11-16 | 长电科技（宿迁）有限公司 | A kind of totally enclosed type lead frame and its encapsulating structure |
| CN113967692A (en) * | 2021-10-22 | 2022-01-25 | 吴江翔实模具有限公司 | Stamping manufacturing process of SMA-400 lead frame |
-
2009
- 2009-12-22 CN CN2009202446187U patent/CN201549496U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101937898A (en) * | 2010-08-12 | 2011-01-05 | 苏州固锝电子股份有限公司 | Rectifier structure for moisture protection |
| CN103617972A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | High-power device-used lead frame |
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
| CN103943589A (en) * | 2014-03-20 | 2014-07-23 | 张轩 | Lead frame on which bosses are arranged in pressing mode |
| CN108831873A (en) * | 2018-06-28 | 2018-11-16 | 长电科技（宿迁）有限公司 | A kind of totally enclosed type lead frame and its encapsulating structure |
| CN113967692A (en) * | 2021-10-22 | 2022-01-25 | 吴江翔实模具有限公司 | Stamping manufacturing process of SMA-400 lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100811 |