CN201369329Y - Heat-resistant moisture-proof high-power lead frame - Google Patents
Heat-resistant moisture-proof high-power lead frame Download PDFInfo
- Publication number
- CN201369329Y CN201369329Y CN 200920142080 CN200920142080U CN201369329Y CN 201369329 Y CN201369329 Y CN 201369329Y CN 200920142080 CN200920142080 CN 200920142080 CN 200920142080 U CN200920142080 U CN 200920142080U CN 201369329 Y CN201369329 Y CN 201369329Y
- Authority
- CN
- China
- Prior art keywords
- lead frame
- heat
- chip holder
- chip island
- power lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses the manufacturing technique of high-power lead frame products, which overcomes shortages that the existing like products are high in rolling stamping force and short in mold service life. The heat-resistant moisture-proof high-power lead frame comprises a chip holder for bearing chips, a middle guiding pin and two lateral guiding pins, wherein connecting sheets are arranged among the middle guiding pin and the two lateral guiding pins, a rectangular groove is arranged on a frame portion of the front surface of the chip holder, a plurality of horizontal grooves are uniformly distributed on the surface of the chip holder inside the rectangular groove, both a left lateral edge and a right lateral edge of the back of the chip holder extend to form radiating flanges, the radiating flanges and the back surface of the chip holder are equipped with stepped grooves for transition, and transverse grooves are arranged on bending portions of welding areas of roots of the two lateral guiding pins. An annular counter groove is arranged on a port on the back portion of a connecting hole on the head portion of the chip holder, and a convex snap ring is arranged on a crossed portion of the annular counter groove and the inner wall of the connecting hole. The chip holder is simple in lateral edge shape and convenient in rolling processing. The heat-resistant moisture-proof high-power lead frame obviously improves mechanical shock resistance and thermal fatigue resistance, and prolongs service life of finished products.
Description
Technical field
The utility model relates to the manufacturing technology field of semiconductor electronic components and parts, especially refers to a kind of lead frame discrete device manufacturing technology of triode components and parts.
Background technology
Triode is the extremely wide electronic devices and components of a kind of range of application, and it is widely used in making the field such as electrical equipment such as electricity-saving lamp, charger, power transmission and transformation and Switching Power Supplies; The lead frame of triode product used of high power device wherein, because the performance requirement of heat radiation temperature rise aspect, it is higher with the bond strength and the heat radiation requirement of plastics envelope material to matrix.This type of early stage product generally adopts the direct packaged type of planar substrates to produce triode, and this triode is easy to generate layering and the short circuit phenomenon of making moist after using; The someone had invented a kind of product that breach is set in the chip section both sides of the edge afterwards, had strengthened the adhesion of lead frame base material and plastics envelope material effectively.But this series products is owing to be provided with a plurality of breach at chip edge, and complicated, the long-pending increase of surrounded surface that its side edge shape becomes causes rolling processing stamping press to increase thus, and shorten die life greatly.
The utility model content
The technical problems to be solved in the utility model is to overcome chip edge that existing like product exists to be provided with and to make that surrounded surface long-pendingly increases, rolling processing stamping press increases defective and the deficiency that causes shorten die life behind a plurality of breach, provides a kind of sides of chip simple shape, rolling easy to process, good heat dissipation effect, base material to expect to combine firm lead frame product with the plastics envelope to society.
The technical scheme that its technical problem that solves the utility model adopts is: the high-power lead frame of heat-resisting protection against the tide comprises the chip island of carries chips, middle lead foot and two side lead foots; Be provided with brace between lead foot and two side lead foots in the middle of described; Described chip island front frame portion is provided with rectangular recess, and the chip island surface that is positioned at described rectangular recess is evenly equipped with the multiple tracks horizontal groove; There is the heat radiation bead left and right sides at described chip island back along stretching, and the described heat radiation bead and the chip island back side are provided with the stepped recesses transition; The weld zone bending part of described two side lead foot roots is provided with lateral trench.
The back port of described chip island head connecting hole is established the ring-type deep gouge, and described ring-type deep gouge and described connecting hole inwall cross-shaped portion are provided with protruding snap ring.Be provided with oblique groove between described rectangular recess both sides, upper end and the described connecting hole.The not electronickelling of rectangular area of described chip island carries chips, all nickel plating of lead frame fine copper surface that other is regional.
The chip island side edge shape of the utility model product is simple, rolling easy to process; In the chip island front rectangular recess, lateral trench, horizontal groove and oblique groove are set, stepped recesses and ring-type deep gouge are set overleaf, encapsulation back plastics envelope material is filled in positions such as these grooves, groove and deep gouge, improve plastics envelope material and metal base adhesion greatly, effectively prevent the generation of lamination, also help to improve sealing and waterproof and dampproof performance; Triode product after the encapsulation, the heat radiation bead of the left and right sides, chip island back still is exposed to the external world, the chip island heat can be transmitted fast and distributes.Remove the chip island not electronickelling of rectangular area of carries chips, all nickel plating protections of other regional lead frame fine copper surface both can prevent surface oxidation, also were beneficial to and adopted aluminium wire line solder bonds chip, reduced the encapsulating material cost.
Description of drawings
Fig. 1 is the utility model lead frame structure schematic diagram.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is that the A-A of Fig. 1 is to cutaway view.
Fig. 4 is that the B-B of Fig. 1 is to cutaway view.
Embodiment
As shown in Figures 1 to 4, be that the high-power lead frame product of TO-247 model is an example with the SIC code, the utility model comprises chip island 6, middle lead foot 5 and two side lead foots 7 of carries chips; Lead foot 5 and two 7 of side lead foots are provided with brace 3 and fix in the middle of described, to guarantee the dislocation that do not deform of this product three lead foots when the continuous rolling.Weld zone 10 bending parts of described two side lead foot 7 roots are provided with lateral trench 14; Described chip island 6 front frame portions are provided with rectangular recess 4, and chip island 6 surfaces that are positioned at described rectangular recess 4 are evenly equipped with multiple tracks horizontal groove 8; The left and right sides at described chip island 6 backs is along stretching out heat radiation bead 9, and described heat radiation bead 9 is provided with stepped recesses 11 transition with chip island 6 back sides.The back port of described chip island 6 head connecting holes 1 is established ring-type deep gouge 2, and described ring-type deep gouge 2 is provided with protruding snap ring 12 with described connecting hole 1 inwall cross-shaped portion, effectively prevents plastics envelope material and metal base layering.Be provided with oblique groove 13 between described rectangular recess both sides, 4 upper end and the described connecting hole 1, improve adhesion and water resistance.The not electronickelling of rectangular area of described chip island 6 carries chips keeps the fine copper surface with the combine firmness of raising with integrated circuit (IC) chip; All nickel plating 15 protections of other regional lead frame fine copper surface prevent the preceding surface oxidation of this product encapsulation, also are beneficial to adopt aluminium wire line solder bonds chip.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.After using the encapsulation of this product, the welding region of described chip island 6, described middle lead foot 5 and two side lead foots 7 is filled and be coated on to plastics envelope material, and bilateral heat radiation bead 9 still is exposed to the external world, so the heat that produces during chip island 6 regional works can distribute fast by the bead 9 of dispelling the heat; After plastics envelope material is filled in positions such as lateral trench 14, rectangular recess 4, ring-type deep gouge 2, oblique groove 13, stepped recesses 11 and horizontal groove 8, improved the adhesion of plastics envelope material greatly with metal base.
Claims (3)
1, the high-power lead frame of a kind of heat-resisting protection against the tide comprises the chip island (6) of carries chips, middle lead foot (5) and two side lead foots (7); Be provided with brace (3) between lead foot (5) and two side lead foots (7) in the middle of described; Described chip island (6) front frame portion is provided with rectangular recess (4), and chip island (6) surface that is positioned at described rectangular recess (4) is evenly equipped with multiple tracks horizontal groove (8); It is characterized in that: there is heat radiation bead (9) left and right sides at described chip island (6) back along stretching, and described heat radiation bead (9) is provided with stepped recesses (11) transition with chip island (6) back side; Weld zone (10) bending part of described two side lead foots (7) root is provided with lateral trench (11).
2, the high-power lead frame of heat-resisting according to claim 1 protection against the tide, it is characterized in that: the back port of described chip island (6) head connecting hole (1) is established ring-type deep gouge (2), and described ring-type deep gouge (2) is provided with protruding snap ring (12) with described connecting hole (1) inwall cross-shaped portion; Be provided with oblique groove (13) between described rectangular recess (4) both sides, upper end and the described connecting hole (1).
3, the high-power lead frame of heat-resisting as claimed in claim 1 or 2 protection against the tide is characterized in that: the not electronickelling of rectangular area of described chip island (6) carries chips, all nickel plating of lead frame fine copper surface (15) that other is regional.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920142080 CN201369329Y (en) | 2009-03-19 | 2009-03-19 | Heat-resistant moisture-proof high-power lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920142080 CN201369329Y (en) | 2009-03-19 | 2009-03-19 | Heat-resistant moisture-proof high-power lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201369329Y true CN201369329Y (en) | 2009-12-23 |
Family
ID=41488220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920142080 Expired - Lifetime CN201369329Y (en) | 2009-03-19 | 2009-03-19 | Heat-resistant moisture-proof high-power lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201369329Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101937898A (en) * | 2010-08-12 | 2011-01-05 | 苏州固锝电子股份有限公司 | Rectifier structure for moisture protection |
| CN102034785A (en) * | 2010-11-23 | 2011-04-27 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN102064151A (en) * | 2010-11-08 | 2011-05-18 | 宁波康强电子股份有限公司 | Lead frame for manufacturing discrete semiconductor and manufacturing method thereof |
| CN102637674A (en) * | 2012-05-14 | 2012-08-15 | 宜兴市东晨电子科技有限公司 | TO247 lead frame |
| CN102683317A (en) * | 2012-05-14 | 2012-09-19 | 宜兴市东晨电子科技有限公司 | TO3PB lead frame |
| WO2022048866A1 (en) | 2020-09-02 | 2022-03-10 | Hitachi Energy Switzerland Ag | Pre-product, method and electronic device |
-
2009
- 2009-03-19 CN CN 200920142080 patent/CN201369329Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101937898A (en) * | 2010-08-12 | 2011-01-05 | 苏州固锝电子股份有限公司 | Rectifier structure for moisture protection |
| CN102064151A (en) * | 2010-11-08 | 2011-05-18 | 宁波康强电子股份有限公司 | Lead frame for manufacturing discrete semiconductor and manufacturing method thereof |
| CN102064151B (en) * | 2010-11-08 | 2014-01-22 | 宁波康强电子股份有限公司 | Lead frame for manufacturing discrete semiconductor and manufacturing method thereof |
| CN102034785A (en) * | 2010-11-23 | 2011-04-27 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN102637674A (en) * | 2012-05-14 | 2012-08-15 | 宜兴市东晨电子科技有限公司 | TO247 lead frame |
| CN102683317A (en) * | 2012-05-14 | 2012-09-19 | 宜兴市东晨电子科技有限公司 | TO3PB lead frame |
| WO2022048866A1 (en) | 2020-09-02 | 2022-03-10 | Hitachi Energy Switzerland Ag | Pre-product, method and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201369329Y (en) | Heat-resistant moisture-proof high-power lead frame | |
| CN201435388Y (en) | Lead frame used for encapsulating MOSFET | |
| CN101692448A (en) | Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof | |
| CN206194730U (en) | Power module that chip upper surface flushed | |
| CN203150541U (en) | LED light source based on COB packaging | |
| CN104810462A (en) | ESOP8 lead frame of medium-and high-power LED driving chip | |
| CN108110459B (en) | High-power IPM module terminal connection structure | |
| CN101807658A (en) | High power LED encapsulating method | |
| CN202120897U (en) | High power chip packaging structure and lead frame thereof | |
| CN204596842U (en) | A kind of ESOP8 lead frame of middle great power LED driving chip | |
| CN203707166U (en) | All-metal integrated LED lamp bead packaging structure | |
| CN218939668U (en) | Lead frame for improving poor PAD soldering tin | |
| CN201163624Y (en) | Labeling type insulation packaging structure | |
| CN201122590Y (en) | Electronic device with cooling member | |
| CN102034922A (en) | High-power LED (Light Emitting Diode) lighting module and preparation method | |
| CN202651203U (en) | Metal sheet | |
| CN201623033U (en) | Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole | |
| CN201853699U (en) | Anti-crack and anti-seepage integrated circuit lead wire framework | |
| CN204516752U (en) | A kind of lead frame structure of square flat pinless encapsulation | |
| CN201623048U (en) | Normal chip packaging structure with exposed substrate and inverted T-shaped heat sink | |
| CN201623140U (en) | Normal chip packaging structure with embedded substrate and heat sink connected with external heat-dissipating plate | |
| CN201623141U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external heat-dissipating plate | |
| CN201751997U (en) | Encapsulation structure provided with embedded inner feet, invertedly-installed chip, radiation block with lock hole, and radiation panel | |
| CN201623054U (en) | Normal chip packaging structure with embedded substrate and heat sink having protruded surface | |
| CN201623050U (en) | Normal chip packaging structure with exposed substrate and inverted T-shaped totally-encapsulated heat sink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091223 |
|
| CX01 | Expiry of patent term |