CN201623033U - Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole - Google Patents
Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole Download PDFInfo
- Publication number
- CN201623033U CN201623033U CN2010201157182U CN201020115718U CN201623033U CN 201623033 U CN201623033 U CN 201623033U CN 2010201157182 U CN2010201157182 U CN 2010201157182U CN 201020115718 U CN201020115718 U CN 201020115718U CN 201623033 U CN201623033 U CN 201623033U
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- Prior art keywords
- chip
- heat
- dissipating block
- inner pin
- heat dissipating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a packaging structure with an exposed inner pin, a flip chip and a heat dissipating block with a T-shaped locking hole, which comprises the chip (3), the metal inner pin (4) supported below the chip, convex blocks (10) for interconnecting signals from the chip to the metal inner pin, a conductive or non-conductive heat conducting bonding material I (2) between the chip and the metal inner pin and a plastic packaging body (8). The metal inner pin (4) is exposed out of the plastic packaging body (8). The packaging structure is characterized in that the upper part of the chip (3) is provided with the heat dissipating block (7); the heat dissipating block (7) is provided with the locking hole (7.1); a conductive or non-conductive heat conducting bonding material II (6) is embedded between the heat dissipating block (7) and the chip (3); and the heat dissipating block (7) is of an inverted T-shaped structure. The utility model plays a function of heat dissipation of high heat by additionally arranging the heat dissipating block above the chip, can provide strong capability of dissipating heat and enables the heat of the chip to be rapidly conducted to the outside of the packaging body.
Description
(1) technical field
The utility model relates to a kind of interior pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure and method for packing thereof.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong interior pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure and method for packing thereof.
The purpose of this utility model is achieved in that a kind of interior pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure, include conduction or nonconducting heat conduction bonding material I and plastic-sealed body between pin in the metal that is carried of chip, chip below, the chip interior pin of metal coupling, chip and metal that the signal interconnection of pin is used in the metal, pin exposes plastic-sealed body in the described metal, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; This radiating block is inverted T-shape structure.
The beneficial effects of the utility model are:
The utility model is served as the function of the heat radiation of high heat by addition radiating block above chip, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is a pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure schematic diagram in the utility model.
Reference numeral among the figure:
(5) embodiment
Referring to Fig. 5, Fig. 5 is a pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure schematic diagram in the utility model.As seen from Figure 5, pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure in the utility model, include chip 3, pin 4 in the metal that is carried of chip below, the metal coupling 10 that chip is used to the signal interconnection of the interior pin of metal, conduction or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8 in chip and the metal between the pin, pin 4 exposes plastic-sealed body 8 in the described metal, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; This radiating block 7 is inverted T-shape structure.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
Claims (2)
1. pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure in a kind, include chip (3), pin (4) in the metal that is carried of chip below, the metal coupling (10) that chip is used to the signal interconnection of the interior pin of metal, conduction or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8) in chip and the metal between the pin, pin (4) exposes plastic-sealed body (8) in the described metal, it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); This radiating block (7) is inverted T-shape structure.
2. a kind of interior pin exposed chip upside-down mounting band inverted T shape lock hole heat dissipation block packaging structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201157182U CN201623033U (en) | 2010-01-28 | 2010-01-28 | Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201157182U CN201623033U (en) | 2010-01-28 | 2010-01-28 | Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole |
Publications (1)
Publication Number | Publication Date |
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CN201623033U true CN201623033U (en) | 2010-11-03 |
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Application Number | Title | Priority Date | Filing Date |
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CN2010201157182U Expired - Fee Related CN201623033U (en) | 2010-01-28 | 2010-01-28 | Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole |
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CN (1) | CN201623033U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111326486A (en) * | 2018-12-14 | 2020-06-23 | 深圳市中兴微电子技术有限公司 | Packaging structure and manufacturing method thereof |
-
2010
- 2010-01-28 CN CN2010201157182U patent/CN201623033U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111326486A (en) * | 2018-12-14 | 2020-06-23 | 深圳市中兴微电子技术有限公司 | Packaging structure and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20140128 |