CN201623043U - Packaging structure with exposed inner pin, a flip chip and a heat dissipating block - Google Patents

Packaging structure with exposed inner pin, a flip chip and a heat dissipating block Download PDF

Info

Publication number
CN201623043U
CN201623043U CN2010201158043U CN201020115804U CN201623043U CN 201623043 U CN201623043 U CN 201623043U CN 2010201158043 U CN2010201158043 U CN 2010201158043U CN 201020115804 U CN201020115804 U CN 201020115804U CN 201623043 U CN201623043 U CN 201623043U
Authority
CN
China
Prior art keywords
chip
heat
metal
packaging structure
inner pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010201158043U
Other languages
Chinese (zh)
Inventor
王新潮
梁志忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN2010201158043U priority Critical patent/CN201623043U/en
Application granted granted Critical
Publication of CN201623043U publication Critical patent/CN201623043U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to a packaging structure with an exposed inner pin, a flip chip and a heat dissipating block, which comprises the chip (3), the metal inner pin (4) supported below the chip, convex blocks (10) for interconnecting signals from the chip to the metal inner pin, a conductive or non-conductive heat conducting bonding material I (2) between the chip and the metal inner pin and a plastic packaging body (8). The metal inner pin (4) is exposed out of the plastic packaging body (8). The packaging structure is characterized in that the upper part of the chip (3) is provided with the heat dissipating block (7); and a conductive or non-conductive heat conducting bonding material II (6) is embedded between the heat dissipating block (7) and the chip (3). The utility model plays a function of heat dissipation of high heat by additionally arranging the heat dissipating block above the chip, can provide strong capability of dissipating heat and enables the heat of the chip to be rapidly conducted to the outside of the packaging body.

Description

Interior pin exposed chip flip strip heat dissipation block packaging structure
(1) technical field
The utility model relates to a kind of interior pin exposed chip flip strip heat dissipation block packaging structure and method for packing thereof.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong interior pin exposed chip flip strip heat dissipation block packaging structure and method for packing thereof.
The purpose of this utility model is achieved in that a kind of interior pin exposed chip flip strip heat dissipation block packaging structure, include conduction or nonconducting heat conduction bonding material I and plastic-sealed body between pin in the metal that is carried of chip, chip below, the chip interior pin of metal coupling, chip and metal that the signal interconnection of pin is used in the metal, pin exposes plastic-sealed body in the described metal, above described chip, be provided with radiating block, be equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip.
The beneficial effects of the utility model are:
The utility model is served as the function of the heat radiation of high heat by addition radiating block above chip, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is a pin exposed chip flip strip heat dissipation block packaging structure schematic diagram in the utility model.
Reference numeral among the figure:
Pin 4, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, plastic-sealed body 8, metal coupling 10 in conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal.
(5) embodiment
Referring to Fig. 5, Fig. 5 is a pin exposed chip flip strip heat dissipation block packaging structure in the utility model, include conduction or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8 between pin 4 in the metal that is carried of chip 3, chip below, the chip interior pin of metal coupling 10, chip and metal that the signal interconnection of pin is used in the metal, pin 4 exposes plastic-sealed body 8 in the described metal, above described chip 3, be provided with radiating block 7, be equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.

Claims (3)

1. pin exposed chip flip strip heat dissipation block packaging structure in a kind, include conduction or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8) between pin (4) in the metal that is carried of chip (3), chip below, the chip interior pin of metal coupling (10), chip and metal that the signal interconnection of pin is used in the metal, pin (4) exposes plastic-sealed body (8) in the described metal, it is characterized in that being provided with radiating block (7), be equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3) in described chip (3) top.
2. a kind of interior pin exposed chip flip strip heat dissipation block packaging structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of interior pin exposed chip flip strip heat dissipation block packaging structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
CN2010201158043U 2010-01-28 2010-01-28 Packaging structure with exposed inner pin, a flip chip and a heat dissipating block Expired - Lifetime CN201623043U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201158043U CN201623043U (en) 2010-01-28 2010-01-28 Packaging structure with exposed inner pin, a flip chip and a heat dissipating block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201158043U CN201623043U (en) 2010-01-28 2010-01-28 Packaging structure with exposed inner pin, a flip chip and a heat dissipating block

Publications (1)

Publication Number Publication Date
CN201623043U true CN201623043U (en) 2010-11-03

Family

ID=43026500

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010201158043U Expired - Lifetime CN201623043U (en) 2010-01-28 2010-01-28 Packaging structure with exposed inner pin, a flip chip and a heat dissipating block

Country Status (1)

Country Link
CN (1) CN201623043U (en)

Similar Documents

Publication Publication Date Title
CN201623107U (en) Packaging structure of printed circuit board with flip chip and radiating block connected with external radiating board
CN101770997A (en) Down and up arranged resin circuit board and chip packaging structure with radiation block
CN201623033U (en) Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole
CN201623043U (en) Packaging structure with exposed inner pin, a flip chip and a heat dissipating block
CN201623064U (en) Package structure for inverted T radiating block externally connected with radiator and inversed on chip with exposed inner lead
CN201623022U (en) Packaging structure of printed circuit board with flip chip connected with external radiating board
CN201629318U (en) Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole
CN201623032U (en) Packaging structure with exposed inner pin, flip chip and heat dissipating block with locking hole
CN201623090U (en) Packaging structure with exposed inner pin, flip chip and heat dissipating block with rectangular locking hole
CN201623038U (en) Package structure for radiating block with convex surface inversed on chip with exposed inner lead
CN201623089U (en) Package structure for rectangular radiating block inversed on chip with exposed inner lead
CN201629325U (en) Packaging structure with printed circuit board, flip chip and fully encapsulated heat dissipating block
CN201623020U (en) Upside-down mounting rectangular type heat radiation block external connecting heat radiator encapsulation structure with inner pin exposing chip
CN201629319U (en) Flip sealing structure of resin circuit board chip with heat dissipation block
CN201623092U (en) Completely-coated package structure for radiating block inversed on chip with exposed inner lead
CN201623091U (en) Package structure for inverted T radiating block inversed on chip with exposed inner lead
CN201623120U (en) Packaging structure of printed circuit board chip flip belt radiating block
CN201623040U (en) Completely-coated package structure for inverted T radiating block inversed on chip with exposed inner lead
CN201751980U (en) Encapsulation structure provided with exposed inner feet, invertedly-installed chip, radiation block and external radiator
CN201623031U (en) Package structure for radiating block inversed on chip with embedded inner lead
CN201623098U (en) Packaging structure of printed circuit board with flip chip connected with external radiator
CN201623094U (en) Package structure for radiating block externally connected with radiating cap and inversed on chip with exposed inner lead
CN201623136U (en) Packaging structure of printed circuit board chip flip inverted T-shaped radiating block
CN201623042U (en) Package structure for rectangular radiating block inversed on chip with embedded inner lead
CN201623035U (en) Completely-coated package structure for radiating block inversed on chip with embedded inner lead

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20101103

CX01 Expiry of patent term