CN212303647U - Semiconductor plastic packaging structure - Google Patents
Semiconductor plastic packaging structure Download PDFInfo
- Publication number
- CN212303647U CN212303647U CN202021900243.8U CN202021900243U CN212303647U CN 212303647 U CN212303647 U CN 212303647U CN 202021900243 U CN202021900243 U CN 202021900243U CN 212303647 U CN212303647 U CN 212303647U
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- CN
- China
- Prior art keywords
- frame
- plastic packaging
- base island
- frame base
- semiconductor plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor plastic packaging structure, which comprises a plastic packaging material wrapping layer, a frame base island and at least one group of frame pins, wherein the frame pins are respectively arranged on the left side and the right side of the frame base island, the outer side of each frame pin is bent, a convex part extends outwards, and the frame pins are provided with metal leads for connecting chips; the plastic packaging material wrapping layer wraps the semiconductor plastic packaging structure integrally, and the bottom of the frame base island and the bottom of the frame pin are exposed to the outside of the plastic packaging material wrapping layer. The beneficial effects are that: because the design of the outer side of the frame pin is in a bent shape and the raised part extends outwards, the product after plastic packaging has good anti-external stretching effect due to the design, the binding force between epoxy resin plastic and the frame base island can be enhanced, the heat dissipation capability and the thermal stress change resistance capability of components can be improved, and thus delamination can be prevented.
Description
Technical Field
The utility model relates to a semiconductor package technical field, especially a semiconductor plastic packaging structure.
Background
With the vigorous development of electronic industry, since the birth of plastic package materials, the plastic package materials gradually replace ceramic and metal package materials with the advantages of low cost, simple production process and the like, and become the main materials of the current semiconductor package, because the plastic package devices are basically non-airtight products, at the same time, the plastic packaging material used for packaging also has the problem of water absorption in different degrees, so that the product is easy to delaminate in the packaging process and the actual use process, the packaging delamination is the most common failure mode, and generally occurs under the synergistic action of water vapor, thermal stress, electrolysis and other factors, so that the delamination is very easy to occur.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect, the utility model aims to provide an improve the interior components and parts layering technological problem of semiconductor plastic package to be favorable to improving the heat-sinking capability and the thermal stress resistance change ability of components and parts, the semiconductor plastic packaging structure that leakproofness, functional parameter and the reliability of product are high.
To achieve the purpose, the utility model adopts the following technical proposal:
a semiconductor plastic packaging structure comprises a plastic packaging material wrapping layer, a frame base island and at least one group of frame pins, wherein the frame pins are respectively arranged on the left side and the right side of the frame base island, the outer sides of the frame pins are bent, protruding parts of the frame pins extend outwards, and metal leads for connecting chips are arranged on the frame pins; the plastic packaging material wrapping layer wraps the semiconductor plastic packaging structure integrally, and the bottom of the frame base island and the bottom of the frame pin are exposed to the outside of the plastic packaging material wrapping layer.
Preferably, in the above semiconductor plastic package structure, the inner side of the frame pin is curved, and the protruding portion extends inward.
Preferably, in the above semiconductor plastic package structure, two side edges of the frame base island extend outwards.
Preferably, in the semiconductor plastic package structure, the frame base island is provided with an anchor hole.
Preferably, in the above semiconductor plastic package structure, at least one groove is formed on the top of the frame base island.
Preferably, in the above semiconductor plastic package structure, a heat sink is disposed at the bottom of the frame base island.
The utility model has the advantages that:
after a chip to be packaged is placed on the frame base island, the chip is welded with the metal lead on the frame pin, then plastic packaging is carried out, and the design on the outer side of the frame pin is bent and the protruding part extends outwards, so that the product after plastic packaging has a good outward stretching resistant effect, the bonding force between epoxy resin plastic and the frame base island can be enhanced, the heat dissipation capability and the thermal stress change resistance capability of components can be improved, and layering can be prevented.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a top view of fig. 1.
Wherein: the chip comprises a chip 11, a frame base island 12, a frame pin 13, a metal lead 14, a heat sink 15, an anchor hole 16 and a groove 17.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1 and 2, a semiconductor plastic package structure includes a plastic package material wrapping layer, a frame base island 12 and at least one group of frame pins 13, wherein the frame pins 13 are respectively disposed on the left side and the right side of the frame base island 12, the outer side of the frame pins 13 is curved, the protruding portion extends outward, and the frame pins 13 are provided with metal leads 14 for connecting a chip 11; the plastic packaging material wrapping layer wraps the semiconductor plastic packaging structure integrally, the bottom of the frame base island 12 and the bottom of the frame pin are exposed to the outside of the plastic packaging material wrapping layer, a chip 11 to be packaged is placed behind the frame base island 12, the metal lead 14 on the frame pin 13 welds the chip 11, then plastic packaging is carried out, the design outside the frame pin 13 is in a bending shape, the protruding part extends outwards, the product after plastic packaging is good in outward stretching resistance effect due to the design, the bonding force between epoxy resin plastic and the frame base island 12 can be enhanced, the heat dissipation capacity and the thermal stress change resistance of components can be improved, and layering is prevented.
In the semiconductor plastic package structure in this embodiment, the inner side of the frame pin 13 is curved and the protruding portion extends inward, and the inner side of the frame pin 13 is curved and the protruding portion extends inward, so that the product after plastic package has a good outward stretching resistance effect, the bonding force between the epoxy resin plastic and the frame base island 12 can be increased, the heat dissipation capability and the thermal stress change resistance capability of the component can be improved, and delamination can be prevented.
In the semiconductor plastic package structure in this embodiment, the two side edges of the frame base island 12 extend outward, so that the product after plastic package has better anti-outward stretching effect, and the bonding force between the epoxy resin plastic and the frame base island 12 can be increased, which is beneficial to improving the heat dissipation capability and the thermal stress change resistance of the component and preventing delamination.
In the semiconductor plastic package structure in this embodiment, the frame base island 12 is provided with the anchor holes 16, and the anchor holes 16 formed in the frame base island 12 allow the epoxy resin molding compound to penetrate through the anchor holes 16, so that the plastic package and the frame base island 12 have better anti-external stretching effect, and the bonding force between the epoxy resin plastic and the frame base island 12 can be increased, which is beneficial to improving the heat dissipation capability and the thermal stress change resistance of components and parts, and preventing delamination.
In the semiconductor plastic packaging structure in the embodiment, the top of the frame base island 12 is provided with at least one groove 17, and the groove 17 is arranged at the top of the frame base island 12, so that the design can effectively increase the bonding area and depth of the epoxy resin plastic packaging material and the frame, increase the external stretching resistance of the plastic packaged product and the frame base island 12 and the bonding of the epoxy resin plastic and the frame, and is beneficial to improving the heat dissipation capacity and the thermal stress change resistance of components and parts and preventing delamination.
In the semiconductor plastic package structure in the embodiment, the heat sink 15 is disposed at the bottom of the frame base island 12, so that the heat dissipation effect of the frame base island 12 is better.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor plastic packaging structure, includes plastic packaging material parcel layer, frame base island and at least a set of frame pin, its characterized in that: the frame pins are respectively arranged on the left side and the right side of the frame base island, the outer sides of the frame pins are bent, the protruding parts of the frame pins extend outwards, and metal leads used for connecting chips are arranged on the frame pins; the plastic packaging material wrapping layer wraps the semiconductor plastic packaging structure integrally, and the bottom of the frame base island and the bottom of the frame pin are exposed to the outside of the plastic packaging material wrapping layer.
2. The semiconductor plastic package structure of claim 1, wherein: the inner side of the frame pin is bent, and the convex part extends inwards.
3. The semiconductor plastic package structure of claim 1, wherein: two side edges of the frame base island extend outwards.
4. The semiconductor plastic package structure of claim 1, wherein: the frame foundation island is provided with an anchor hole.
5. The semiconductor plastic package structure of claim 1, wherein: at least one groove is arranged at the top of the frame base island.
6. The semiconductor plastic package structure of claim 1, wherein: and the bottom of the frame base island is provided with a radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021900243.8U CN212303647U (en) | 2020-09-03 | 2020-09-03 | Semiconductor plastic packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021900243.8U CN212303647U (en) | 2020-09-03 | 2020-09-03 | Semiconductor plastic packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212303647U true CN212303647U (en) | 2021-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021900243.8U Active CN212303647U (en) | 2020-09-03 | 2020-09-03 | Semiconductor plastic packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN212303647U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088224A (en) * | 2021-02-26 | 2021-07-09 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
-
2020
- 2020-09-03 CN CN202021900243.8U patent/CN212303647U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088224A (en) * | 2021-02-26 | 2021-07-09 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
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