CN201994293U

CN201994293U - Packaging structure of large power LED

Info

Publication number: CN201994293U
Application number: CN2011200104430U
Authority: CN
Inventors: 支柱
Original assignee: SHENZHEN LEYOND OPTO ELECTRONICS CO Ltd
Current assignee: SHENZHEN LEYOND OPTO ELECTRONICS CO Ltd
Priority date: 2011-01-14
Filing date: 2011-01-14
Publication date: 2011-09-28
Anticipated expiration: 2021-01-14

Abstract

The utility model discloses a packaging structure of a large power LED. The packaging structure includes a substrate layer, and is characterized in that the substrate layer is provided with an insulating layer which is made of insulating glue; the insulating layer is provided with a copper plating layer; the copper plating layer is provided with a white oil layer; a copper column which is inserted into a guide column location hole of the substrate layer is tightly combined with the substrate layer; the copper column is provided with an LED chip on the top; the LED chip employs gold threads to connect the anode and cathode of the LED chip with a circuit of the substrate layer; a lens is arranged on the top of the cooper column and outside the LED chip and the gold threads; and the lens is filled with fluorescent glue. The structure of the utility model can packet the large power LED to the substrate directly, thus saving the welding process of fixing a single product on the substrate, and consequently eliminating the defects of poor heat radiation and poor conductivity of an LED product that may happen in a high temperature welding.

Description

A kind of encapsulating structure of great power LED

[technical field]

The utility model relates to a kind of encapsulating structure of great power LED.

[background technology]

Existing on the market at present LED encapsulating structure generally adopts single encapsulation, it also is the present main packaging structure of LED on the market, because single LEDs package brightness is limited, the not enough situation of brightness can appear when use in some field, need plurality of LEDs could realize needed brightness, but the encapsulation of plurality of LEDs need be arranged its circuit, the caloric requirement that LED self produces is derived, so present single LEDs all is that it is welded on the substrate in use, and then substrate is fixed on architectural feature on the radiating element, the shortcoming of doing like this is because single high-power LED need use welding manner and substrate junction to lump together, very difficult assurance has desirable heat radiation and electric conductivity, and the defective value of described prior art must improve.

[utility model content]

The purpose of this utility model is at above-mentioned technological deficiency, a kind of encapsulating structure of great power LED is provided, structure of the present utility model can directly be encapsulated in great power LED on the substrate, saved single product has been fixed on welding procedure on the substrate, eliminated the LED product because welding at high temperature may cause the defective that radiating effect is bad and conductivity is bad.

The technical solution of the utility model is as described below: a kind of encapsulating structure of great power LED, comprise a substrate layer, it is characterized in that, described substrate layer is provided with the insulating barrier that one deck insulating cement constitutes, be provided with one deck copper plate above the described insulating barrier, be provided with one deck white oil layer above the described copper plate, copper post insert in the guide pillar location hole in the described substrate layer and and substrate layer combine closely, described copper column top is provided with led chip, described led chip adopts gold thread that the both positive and negative polarity of led chip is connected with circuit on the substrate layer, described copper column top and led chip and gold thread are outside equipped with lens, are filled with fluorescent glue in the described lens.

According to the utility model of said structure, its feature is that also described substrate layer is provided with some screw location hole and pad.

In said structure, substrate layer is the carrying main body, the hole that its substrate layer itself has milling machine to bore, and its hole is used for fixing copper post and lens.

Insulating barrier is that its insulating barrier has enough insulating capacities with insulating cement on the substrate layer surface-coated, can guarantee that under the certain voltge surge circuit of its substrate and surface of insulating layer can not have the phenomenon of puncture.

Copper plate is by the mode of electroplating the surface of insulating layer of substrate to be electroplated to go up needed circuit.

The utility model according to said structure, its beneficial effect is, structure of the present utility model can directly be encapsulated in great power LED on the substrate, saved single product has been fixed on welding procedure on the substrate, eliminated the LED product because welding at high temperature may cause the defective that radiating effect is bad and conductivity is bad.

[description of drawings]

Accompanying drawing 1 is a front view of the present utility model;

Accompanying drawing 2 is the side structure view of Fig. 1;

Accompanying drawing 3 be among Fig. 1 A-A to amplification rearview.

Lens in the accompanying drawings, 2; 3, white oil layer; 4, copper post; 5, led chip; 6, gold thread; 7, fluorescent glue; 8, white oil layer; 9, copper plate; 10, insulating barrier; 11, substrate layer; 12, screw location hole; 13, pad.

[embodiment]

Below in conjunction with accompanying drawing and execution mode the utility model is further described:

As accompanying drawing 1, accompanying drawing 2, shown in the accompanying drawing 3, the encapsulating structure of great power LED, comprise a substrate layer 11, it is characterized in that, described substrate layer 11 is provided with the insulating barrier 10 that one deck insulating cement constitutes, be provided with one deck copper plate 9 above the described insulating barrier 10, be provided with one deck white oil layer 8 above the described copper plate 9, copper post 4 insert in the guide pillar location hole in the described substrate layer 11 (not expressing among the figure) and and substrate layer 11 combine closely, described copper post 4 tops are provided with led chip 5, described LED chip 5 adopts gold threads 6 that the both positive and negative polarity of led chip 5 is connected with circuit on the substrate layer 11, described copper post 4 tops and led chip 5 and gold thread 6 are outside equipped with lens 2, are filled with fluorescent glue 7 in the described lens 2.

Described substrate layer 11 is provided with some screw location holes 12 and pad 13.

Claims

1. the encapsulating structure of a great power LED, comprise a substrate layer, it is characterized in that, described substrate layer is provided with the insulating barrier that one deck insulating cement constitutes, be provided with one deck copper plate above the described insulating barrier, be provided with one deck white oil layer above the described copper plate, copper post insert in the guide pillar location hole in the described substrate layer and and substrate layer combine closely, described copper column top is provided with led chip, described LED chip adopts gold thread that the both positive and negative polarity of led chip is connected with circuit on the substrate layer, described copper column top and led chip and gold thread are outside equipped with lens, are filled with fluorescent glue in the described lens.

2. the encapsulating structure of great power LED according to claim 1, it is characterized in that: described substrate layer is provided with some screw location hole and pad.