CN202678303U - Lead frame - Google Patents

Lead frame Download PDF

Info

Publication number
CN202678303U
CN202678303U CN 201220210778 CN201220210778U CN202678303U CN 202678303 U CN202678303 U CN 202678303U CN 201220210778 CN201220210778 CN 201220210778 CN 201220210778 U CN201220210778 U CN 201220210778U CN 202678303 U CN202678303 U CN 202678303U
Authority
CN
China
Prior art keywords
lead frame
pin
utility
frame
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220210778
Other languages
Chinese (zh)
Inventor
钱军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU TAIJIA ELECTRONICS CO Ltd
Original Assignee
SUZHOU TAIJIA ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU TAIJIA ELECTRONICS CO Ltd filed Critical SUZHOU TAIJIA ELECTRONICS CO Ltd
Priority to CN 201220210778 priority Critical patent/CN202678303U/en
Application granted granted Critical
Publication of CN202678303U publication Critical patent/CN202678303U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model provides a lead frame for manufacturing a rectifier. The lead frame comprises a lead frame and a connection sheet frame, wherein the lead frame comprises more than two chip supporting areas and inner pins of the corresponding number, and simultaneously an external signal is imported into the chip supporting areas and the inner pins by outer pins. A tin groove is formed on the inner pin, and when the lead frame is soldered with the connection sheet frame by tin, the solder paste is able to flow into the tin groove, thus the combination strength of the lead frame and the connection sheet frame is greatly increased, the defect rate due to not firm welding during the packaging process is reduced, and the production efficiency is increased, therefore the cost is reduced.

Description

A kind of lead frame
Technical field
The utility model relates to a kind of lead frame for the manufacture of rectifier.
Background technology
Rectifier is to utilize the unilateal conduction characteristic of diode that alternating current is carried out rectification, converts in the galvanic circuit so be widely used in alternating current.
The existing lead frame that is applied in the rectifier does not often do anyly preventing the measure that scolding tin is not firm or just being provided with a V groove in the above that the effect of playing is more limited on wherein the interior pin of lead frame.
Therefore how to guarantee that lead frame is in the bonding strength of the brace frame problem that will study of the utility model just.
The utility model content
In order to overcome the technical problem that exists in the prior art, the utility model provides following technical scheme:
A kind of lead frame is used for the manufacturing of rectifier, and this lead frame comprises: lead frame and brace frame.
Further, described lead frame comprises the interior pin of two above chip Support and corresponding number, and chip Support and interior pin all import external signal by outer pin simultaneously.
Further, the interior pin of described lead frame has an appearance molten tin bath.
Further, described brace frame comprises two kinds, and each is equipped with chips welding district and pin weld zone.
Further, described chips welding district is used for welding by tin cream with the chip Support of described lead frame; The pin weld zone is used for welding by tin cream with the interior pin of described lead frame.
The beneficial effect that the utility model brings is: offer one by internal pin and hold molten tin bath, when lead frame is connected with brace frame scolding tin, tin cream can flow into and hold in the molten tin bath, greatly increased the intensity that lead frame is combined with the brace frame, reduced encapsulation process because of not prison welding cause bad, improve production efficiency, thereby reduced cost.
Description of drawings
The lead frame structure schematic diagram that Fig. 1 provides for the utility model embodiment
The lead frame structure schematic diagram that Fig. 2 provides for the utility model embodiment
The Facad structure schematic diagram of the brace frame that Fig. 3 provides for the utility model embodiment
The structure schematic diagram of the brace frame that Fig. 4 provides for the utility model embodiment
The lead frame front schematic view that Fig. 5 provides for the utility model embodiment
The lead frame schematic rear view that Fig. 6 provides for the utility model embodiment
Embodiment
The below is to elaborating preferred embodiment of the present utility model by reference to the accompanying drawings, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection range of the present utility model made more explicit defining.
To shown in Figure 6, a kind of lead frame for the manufacture of rectifier, this lead frame comprise lead frame 1 and the first brace frame 2, the second brace frame 3 such as Fig. 1;
Described lead frame 1 comprises the first interior pin 13, the second interior pin 14 of the first chip Support 11, the second chip Support 12 and corresponding number;
The first chip Support 11 of described lead frame 1, the second chip Support 12 and the first interior pin 13, the second interior pin 14 all import external signal by outer pin 15;
Open on the described first interior pin 13 and the second interior pin 14 to be equipped with and hold molten tin bath 16;
Described the first brace frame 2 and the second brace frame 3 comprise the first chips welding district 21 and the 31 and first pin weld zone 22 and the second pin weld zone 32;
Described the first chips welding district 21, the second chips welding district 31 and the first pin weld zone 22, the second pin weld zone 32 are respectively applied to and the first chip Support 11, the second chip Support 12 and the first interior pin 13, the 2 14 welding.
Offer one by internal pin and hold molten tin bath 16, when lead frame 1 is connected with brace frame scolding tin, tin cream can flow into and hold in the molten tin bath 16, greatly increased the intensity that lead frame 1 is combined with the brace frame, reduced encapsulation process because of not prison welding cause bad, improve production efficiency, thereby saved cost.
The above; it only is one of embodiment of the present utility model; but protection range of the present utility model is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the utility model; variation or the replacement that can expect without creative work all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range that claims were limited.

Claims (5)

1. a lead frame is used for the manufacturing of rectifier, it is characterized in that this lead frame comprises: lead frame and brace frame.
2. a kind of lead frame according to claim 1 is characterized in that, described lead frame comprises the interior pin of two above chip Support and corresponding number, and chip Support and interior pin all import external signal by outer pin simultaneously.
3. a kind of lead frame according to claim 2 is characterized in that, the interior pin of described lead frame has one and holds molten tin bath.
4. a kind of lead frame according to claim 1 is characterized in that, described brace frame comprises two kinds, and each is equipped with chips welding district and pin weld zone.
5. a kind of lead frame according to claim 4 is characterized in that, described chips welding district is used for welding by tin cream with the chip Support of described lead frame; The pin weld zone is used for welding by tin cream with the interior pin of described lead frame.
CN 201220210778 2012-05-11 2012-05-11 Lead frame Expired - Fee Related CN202678303U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220210778 CN202678303U (en) 2012-05-11 2012-05-11 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220210778 CN202678303U (en) 2012-05-11 2012-05-11 Lead frame

Publications (1)

Publication Number Publication Date
CN202678303U true CN202678303U (en) 2013-01-16

Family

ID=47499185

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220210778 Expired - Fee Related CN202678303U (en) 2012-05-11 2012-05-11 Lead frame

Country Status (1)

Country Link
CN (1) CN202678303U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103700640A (en) * 2013-06-17 2014-04-02 泰兴市永志电子器件有限公司 High-density lead frame for packaging discrete semiconductor device
CN104347555A (en) * 2013-07-23 2015-02-11 西安永电电气有限责任公司 Electrode welding pins of welding type IGBT module
CN105590907A (en) * 2016-03-01 2016-05-18 江苏捷捷微电子股份有限公司 Automobile diode device and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103700640A (en) * 2013-06-17 2014-04-02 泰兴市永志电子器件有限公司 High-density lead frame for packaging discrete semiconductor device
CN104347555A (en) * 2013-07-23 2015-02-11 西安永电电气有限责任公司 Electrode welding pins of welding type IGBT module
CN105590907A (en) * 2016-03-01 2016-05-18 江苏捷捷微电子股份有限公司 Automobile diode device and manufacturing method thereof

Similar Documents

Publication Publication Date Title
CN204144243U (en) A kind of structure of chip diode
CN108461459A (en) A kind of cathode docking biphase rectification diode and its manufacturing process
CN202678303U (en) Lead frame
CN203589042U (en) Axial diode
CN203967124U (en) A kind of LED lamp of flip-chip packaged multifaceted light-emitting
CN203338794U (en) Bending solder strip used for photovoltaic assembly
CN201910431U (en) Solar assembly being capable of preventing interconnection line and bus line from rosin joint
CN202917527U (en) Hybrid-welded solar component
CN201994293U (en) Packaging structure of large power LED
CN202662615U (en) Axial diode
CN204885149U (en) Lead wire frame construction of rectifier bridge
CN203721720U (en) Double-diode series-connected device
CN204558521U (en) A kind of LED lamp bead
CN202977524U (en) A surface-mounted LED lamp bead
CN106783762A (en) The diode encapsulating structure and manufacture method of a kind of vertical parallel way of dual chip
CN203536423U (en) Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction
CN203839407U (en) Paster type diode
CN202373578U (en) Ultrathin paster diode
CN202871802U (en) Plastic packaging epitaxial ultrafast recovery diode
CN201812815U (en) Rectifier for preventing crystal grains from drifting
CN208127189U (en) A kind of cathode docking biphase rectification diode
CN202405274U (en) Highly fit and conductive photovoltaic welding strip
CN203871317U (en) Structure of bridge rectifier
CN205810797U (en) A kind of rectifier bridge welding structure
CN204441305U (en) Solar module lamination row plate frock

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
DD01 Delivery of document by public notice

Addressee: Suzhou Taijia Electronics Co., Ltd.

Document name: Notification to Pay the Fees

DD01 Delivery of document by public notice

Addressee: Suzhou Taijia Electronics Co., Ltd.

Document name: Notification of Termination of Patent Right

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130116

Termination date: 20160511