CN205810797U - A kind of rectifier bridge welding structure - Google Patents
A kind of rectifier bridge welding structure Download PDFInfo
- Publication number
- CN205810797U CN205810797U CN201620610495.4U CN201620610495U CN205810797U CN 205810797 U CN205810797 U CN 205810797U CN 201620610495 U CN201620610495 U CN 201620610495U CN 205810797 U CN205810797 U CN 205810797U
- Authority
- CN
- China
- Prior art keywords
- tablet
- crystal grain
- wire jumper
- utility
- rectifier bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The utility model discloses a kind of rectifier bridge welding structure, structure includes that tablet, wire jumper and crystal grain, described crystal grain are fixed on tablet by soldering paste, and one end of described wire jumper is connected on the P face of crystal grain, and the other end of wire jumper is connected on tablet.The beneficial effects of the utility model: change traditional double-sheet structure, use thin material sheet and wire jumper welding, can shorten the production cycle, utilize thin material sheet to produce and reduce tablet cost.
Description
Technical field
This utility model relates to electronic components technical field, particularly relates to a kind of rectifier bridge welding structure.
Background technology
At present, rectifier bridge welding structure all uses double-sheet Welding Structure, and its technological process is: 1, first take upper and lower tablet
Each a piece of it is placed on welded plate；2, tin cream on the location point needing welding of welded plate tablet；3, crystal grain wand is inhaled
Attached, it is placed on tablet and has put on the position of tin cream；4, upper tablet takes out 180 upsets to cover on lower tablet；5, will complete
The material assembled enters high temperature welding furnace welding；6, the material plastic molding of welding will be completed；This technique is used to produce
Infrastructure cost is high, the production cycle is long.
Utility model content
The purpose of this utility model is to provide a kind of rectifier bridge welding structure, to overcome the deficiency in currently available technology.
For realizing above-mentioned technical purpose, the technical solution of the utility model is achieved in that
A kind of rectifier bridge welding structure, including tablet, wire jumper and crystal grain, described crystal grain is fixed on tablet by soldering paste,
One end of described wire jumper is connected on the P face of crystal grain, and the other end of wire jumper is connected on tablet.
Further, described wire jumper is gold thread or aluminum steel.
Further, described crystal grain is blue film crystal grain.
Further, described soldering paste is silver paste.
The beneficial effects of the utility model: change traditional double-sheet structure, use thin material sheet and wire jumper welding, can shorten
Production cycle, utilize thin material sheet to produce and reduce tablet cost.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
The accompanying drawing used required in is briefly described, it should be apparent that, the accompanying drawing in describing below is the most of the present utility model
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to according to this
A little accompanying drawings obtain other accompanying drawing.
Fig. 1 is the structural representation according to the rectifier bridge welding structure described in this utility model embodiment；
Fig. 2 is the overall structure schematic diagram according to the tablet described in this utility model embodiment.
In figure:
1, tablet；2, wire jumper；3, crystal grain.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art are obtained, all belong to
Scope in this utility model protection.
As shown in Figure 1-2, according to a kind of rectifier bridge welding structure described in this utility model embodiment, including tablet 1, jump
Line 2 and crystal grain 3, described crystal grain 3 is fixed on tablet 1 by soldering paste, and one end of described wire jumper 2 is connected on the P face of crystal grain 3,
The other end of wire jumper 2 is connected on tablet 1.
In a specific embodiment, described wire jumper 2 is gold thread or aluminum steel.
In a specific embodiment, described crystal grain 3 is blue film crystal grain.
In a specific embodiment, described soldering paste is silver paste.
This utility model additionally provides the processing technology of said structure, specifically includes following steps:
S1, charging sheet: tablet 1 is loaded tablet dish by dress bare bones automatically, and is sent to fixed position；
S2, some soldering paste: some cream machine is by soldering paste point appointment position on tablet 1；
S3, dress crystal grain: crystal grain 3 is taken out from blue film by bonder, and being placed on tablet 1 has above soldering paste, the P of crystal grain 3
Face up；
S4, die bond: sending into die bond heating furnace, solder paste melts, crystal grain 3 is i.e. fixed on the appointment position of tablet 1；
S5, routing: the two ends of four wire jumpers 2 are beaten on the P face and tablet 1 of crystal grain 3 by wire bonder respectively, complete welding；
S6, plastic packaging: the tablet completing welding send moulding press plastic packaging；
S7, solidification: send oven for solidifying by the tablet of plastic packaging；
S8, rush glue: washed down by the cull on tablet on glue machine rushing；
S9, plating: by tin plating for the pin of tablet；
S10, pelletizing molding: the tablet pelletizing molding that will have electroplated, obtain the rectifier bridge structure completed；
S11, TMTT(cohoront machine): send TMTT(cohoront machine by the material of pelletizing molding) test electrically, print, pack；
S12, outer inspection: the material tested, print, pack is carried out appearance test；
S13, produce inspection: inspected by random samples by the material of appearance test；
S14, shipment: the finished product vanning warehouse-in shipment qualified by producing inspection inspection.
In step s 5, described wire jumper 2 is gold thread or the aluminum steel that can cross 1A electric current.
This utility model thin material sheet Welding Structure, welded compared to two-piece type has the advantage that
1, reducing the cost of 1 tablet (copper material) again, 4 short and small bonding wires replace upper tablet, the cost of 4 bonding wires is the lowest
Cost in a upper tablet；
2, using bonder directly directly to take crystal grain from blue film avoids crystal grain to produce during grain sucker shakes
Collision causes damage, improves the electrical functionality guarantee property of product；
3, compared with two-piece type welding, after crystal grain is loaded by one chip welding bonder, it is accurate that crystal grain is put, it is to avoid
Feeding is overturn the time crystal grain covering in blanking and produces mobile, generation off normal by two-piece type assembling, goes out ready-made article electrically shakiness
Phenomenon；
4, compared with two panels welding, the upper and lower tablet that one chip welding is avoided upper and lower tablet fixed precision inaccurate and caused
Inconsistent phenomenon；
5, compared with two-piece type welding, the centre of monolithic welding, reduce a material thickness, the thickness of plastic body
Still can reduce on the body base of two panels welding, more save the consumption of black glue, when its internal grain road electricity uses, the effect of heat radiation is more
Can improve；
6, one chip welds to remove from and shakes crystal grain, and tablet in covering enters sintering furnace high-temperature soldering, reduces consumption and the nitrogen of electric energy
The cost of labor that gas consumes.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Within the spirit of utility model and principle, any modification, equivalent substitution and improvement etc. made, should be included in this utility model
Protection domain within.
Claims (4)
1. a rectifier bridge welding structure, it is characterised in that: include that tablet, wire jumper and crystal grain, described crystal grain are fixed by soldering paste
On tablet, one end of described wire jumper is connected on the P face of crystal grain, and the other end of wire jumper is connected on tablet.
Rectifier bridge welding structure the most according to claim 1, it is characterised in that: described wire jumper is gold thread or aluminum steel.
Rectifier bridge welding structure the most according to claim 1, it is characterised in that: described crystal grain is blue film crystal grain.
Rectifier bridge welding structure the most according to claim 1, it is characterised in that: described soldering paste is silver paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620610495.4U CN205810797U (en) | 2016-06-21 | 2016-06-21 | A kind of rectifier bridge welding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620610495.4U CN205810797U (en) | 2016-06-21 | 2016-06-21 | A kind of rectifier bridge welding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205810797U true CN205810797U (en) | 2016-12-14 |
Family
ID=57504986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620610495.4U Expired - Fee Related CN205810797U (en) | 2016-06-21 | 2016-06-21 | A kind of rectifier bridge welding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205810797U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957853A (en) * | 2016-06-21 | 2016-09-21 | 九江浩峰电子科技有限公司 | Rectifier bridge welding structure and manufacturing technology thereof |
-
2016
- 2016-06-21 CN CN201620610495.4U patent/CN205810797U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957853A (en) * | 2016-06-21 | 2016-09-21 | 九江浩峰电子科技有限公司 | Rectifier bridge welding structure and manufacturing technology thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20180621 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |