CN202853787U - Thermistor temperature sensor gold electrode chip for COB bonding technology - Google Patents
Thermistor temperature sensor gold electrode chip for COB bonding technology Download PDFInfo
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- CN202853787U CN202853787U CN201220429505.6U CN201220429505U CN202853787U CN 202853787 U CN202853787 U CN 202853787U CN 201220429505 U CN201220429505 U CN 201220429505U CN 202853787 U CN202853787 U CN 202853787U
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- gold electrode
- temperature sensor
- chip
- thermistor temperature
- electrode chip
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Abstract
The utility model relates to the electronic element manufacturing technology field, particularly to a thermistor temperature sensor gold electrode chip for the COB bonding technology. The thermistor temperature sensor gold electrode chip of the utility model comprises a ceramic base, wherein both the upper surface and the lower surface of the ceramic base are provided with a surface electrode; and the surface electrode is a gold electrode. The temperature sensor made with the gold electrode chip features high reliability and better stability.
Description
Technical field
The utility model belongs to the Manufacturing Technology of Electronic Components ﹠ Devices field, and particularly a kind of COB nation decides technology with thermistor temperature sensor gold electrode chip.
Background technology
By NTC temperature-sensitive chip as core component, the temperature sensor of taking different packing forms to consist of is widely used in various temperature sensings, temperature compensation, temperature-control circuit, and it plays the central role that the variable of temperature is changed into required electronic signal in circuit.
Fast development along with electronic consumer products, utilization to chip is more and more extensive, in the prior art, about the packaged type of chip commonly used be SMT mount technology and Bang Ding technology: the first, the SMT mount technology is that the pin with chip is welded on the circuit board, this production technology not too is fit to the processing of module package product, in the test of encapsulation, there is rosin joint, dry joint, the problems such as solder skip, in the routine use process since wiring board on the solder joint long term exposure in air, be subject to humidity, static, physical abrasion, the nature such as little acid corrosion and human factor impact cause product short circuit to occur easily, open circuit, even the situation such as burn.The second, it is that the chip internal circuit is connected with the circuit board package pin by gold thread that nation decides chip, cover with the organic material with special protection function is accurate again, finish the later stage encapsulation, chip is subject to the protection of organic material fully, be isolated from the outside, do not have the generation of humidity, static, corrosion condition; Simultaneously, organic material covers on the chip and dries through instrument afterwards by high temperature melt, and seamless link between the chip, stops the physical abrasion of chip fully, and stability is higher.For the nation of matching chip decides technology, researching and developing a kind of CON nation, to decide technology extremely urgent with thermistor temperature sensor gold electrode chip.
The utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, discloses COB nation and has decided technology thermistor temperature sensor gold electrode chip, and the temperature sensor reliability that this gold electrode chip is made is high, has better stability.
In order to overcome above-mentioned technical purpose, the utility model is realized by following technical scheme:
COB described in the utility model nation decides technology with thermistor temperature sensor gold electrode chip, comprises ceramic matrix, and upper surface and the lower surface of described ceramic matrix are equipped with surface electrode, and described surface electrode is gold electrode.
As the further improvement of above-mentioned technology, described gold electrode thickness range is 2～20 microns.
In the utility model, described gold electrode is by combining after gold paste material and the ceramic matrix burning infiltration.
Compared with prior art, the beneficial effects of the utility model are:
Thermistor gold electrode chip after the utility model nation is fixed is higher than the high-power NTC thermistor of SMT paster chip surface mount reliability, stability is better.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in detail:
Fig. 1 is that COB described in the utility model nation decides technology with thermistor temperature sensor gold electrode chip structure synoptic diagram.
Embodiment
As shown in Figure 1, COB described in the utility model nation decides technology with thermistor temperature sensor gold electrode chip, comprise ceramic matrix 1, the upper surface of described ceramic matrix 1 and lower surface are equipped with surface electrode 2,3, described surface electrode 2,3 is gold electrode, and described gold electrode thickness range is 2～20 microns.
In the utility model, described gold electrode is by combining after gold paste material and ceramic matrix 1 burning infiltration.
Following table is thermistor gold electrode chip and the high-power NTC thermistor contrast of existing chip surface mount that the present invention makes:
As seen from the above table: the thermistor gold electrode chip after nation is fixed is higher than the high-power NTC thermistor of SMT paster chip surface mount reliability, stability is better.
The utility model is not limited to above-mentioned embodiment, every various changes of the present utility model or modification are not broken away from spirit and scope of the present utility model, if these are changed and modification belongs within claim of the present utility model and the equivalent technologies scope, then the utility model also means and comprises these changes and modification.
Claims (3)
1.COB nation decides technology with thermistor temperature sensor gold electrode chip, comprises ceramic matrix, it is characterized in that: upper surface and the lower surface of described ceramic matrix are equipped with surface electrode, and described surface electrode is gold electrode.
2. COB according to claim 1 nation decides technology with thermistor temperature sensor gold electrode chip, and it is characterized in that: described gold electrode thickness range is 2～20 microns.
3. COB according to claim 1 nation decides technology with thermistor temperature sensor gold electrode chip, it is characterized in that: described gold electrode is to be combined after to the ceramic matrix burning infiltration by the gold paste material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220429505.6U CN202853787U (en) | 2012-08-27 | 2012-08-27 | Thermistor temperature sensor gold electrode chip for COB bonding technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220429505.6U CN202853787U (en) | 2012-08-27 | 2012-08-27 | Thermistor temperature sensor gold electrode chip for COB bonding technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202853787U true CN202853787U (en) | 2013-04-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220429505.6U Expired - Lifetime CN202853787U (en) | 2012-08-27 | 2012-08-27 | Thermistor temperature sensor gold electrode chip for COB bonding technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202853787U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880854A (en) * | 2021-01-13 | 2021-06-01 | 深圳市汇北川电子技术有限公司 | Use sensor that temperature detected on-vehicle power battery FPC |
-
2012
- 2012-08-27 CN CN201220429505.6U patent/CN202853787U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880854A (en) * | 2021-01-13 | 2021-06-01 | 深圳市汇北川电子技术有限公司 | Use sensor that temperature detected on-vehicle power battery FPC |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130403 |