CN201741518U - T0-92 and T0-92S encapsulation of NTC thermistor - Google Patents
T0-92 and T0-92S encapsulation of NTC thermistor Download PDFInfo
- Publication number
- CN201741518U CN201741518U CN2010202146927U CN201020214692U CN201741518U CN 201741518 U CN201741518 U CN 201741518U CN 2010202146927 U CN2010202146927 U CN 2010202146927U CN 201020214692 U CN201020214692 U CN 201020214692U CN 201741518 U CN201741518 U CN 201741518U
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- encapsulation
- frame sheet
- pin
- thermistor
- electrode
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Abstract
The utility model discloses a T0-92 and T0-92S encapsulation of an NTC thermistor. The encapsulation has good consistency and stable quality and comprises two electrodes, wherein one electrode is connected with an encapsulation frame sheet base; the base is connected with a pin, and another electrode is connected with another pin to form a resistor; and the encapsulation frame sheet base is in a T0-92 or T0-92S type encapsulation structure commonly used in the semiconductor encapsulation technique. The encapsulated thermistor is convenient for use by a client, and can be used in automatic assembling line, the product has good consistency and stable quality, and the problems easily generated in other encapsulated thermistors, such as open circuit or short circuit and the like, can not appear once the production test is finished.
Description
Technical field
The utility model relates to thermistor.
Background technology
Encapsulation is meant the electrode on the chip, connects with lead and guides to external lug place, so that be connected with other device.It not only plays a part to install, fixes, seals, protects aspects such as chip and enhancing electric heating property; but also be wired to by the electrode on the chip on the pin of package casing; these pins are connected with other devices by the lead on the printed circuit board (PCB) again, thereby realize being connected of inside chip and external circuit.Because chip must be isolated from the outside, to prevent that airborne impurity is to the corrosion of chip and cause the change or the decline of electric property.On the other hand, the chip after the encapsulation also is more convenient for installing and transportation.
Thermistor is a kind of, nonlinear resistor that resistance can along with variation of temperature change responsive to thermotonus, is made by monocrystalline, polycrystalline semiconductor material usually.
At present, the thermistor of existing on the market epoxy encapsulation form, the packaging part consistency is relatively poor; Open circuit or short circuit problem in use can appear in the thermistor of axial glass packaging form, packaging part.
The utility model content
At the problems referred to above, the utility model aims to provide the T0-92 and the T0-92S encapsulation of a kind of high conformity, stay-in-grade NTC thermistor.
For realizing this technical purpose, scheme of the present utility model is: a kind of T0-92 of NTC thermistor and T0-92S encapsulation, comprise two electrodes and packaging frame sheet base, one of them electrode is connected with packaging frame sheet base, this base is connected with one of them pin, the another one electrode is connected with another pin, constitutes a resistance.
As further improvement, packaging frame sheet base is 92 or the encapsulating structure of 92S type.
The thermistor of this encapsulation makes things convenient for the client to use, and can be used for production line for automatically assembling, and its good product consistency and steady quality can not occur opening a way or problem that other encapsulation thermistors such as short circuit occur easily in case production test is finished.
Description of drawings
Fig. 1 is the structural representation of 92 encapsulation of the present utility model.
Fig. 2 is the structural representation of 92S encapsulation of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in further details.
As shown in Figure 1, the T0-92 of a kind of NTC thermistor of the present utility model and T0-92S encapsulation comprise two electrodes, one of them electrode is connected with packaging frame sheet base, this base is connected with one of them pin, and the another one electrode is connected with another pin, constitutes a resistance.Packaging frame sheet base is 92 or the encapsulating structure of 92S type.
On the principle, the utility model is exactly T0-92 commonly used in the semiconductor packaging process, triodes such as T0-92S, and the diode process application forms T0-92 on the NTC thermistor, the NTC thermistor of T0-92S encapsulation.
Its general making flow process is:
1, some scolder or other electric conducting materials on the packaging frame sheet.
2, go up thermistor chip on frame sheet.
3, with copper cash or gold thread welding manner connect one of thermistor chip not with the frame sheet electrodes in contact to the another one pin.
4, plastic packaging
Pin in the middle of if 5 clients do not need, the pin in the middle of can cutting out stays two pins in both sides.
6, electroplate.
7, test.
This encapsulating products is a kind of NTC thermistor, along with variation of temperature changes resistance value, is used in all and need measures or control temperature, perhaps carries out the occasion of temperature-compensating and protection.
Claims (1)
1. the T0-92 of a NTC thermistor and T0-92S encapsulation, comprise two electrodes, it is characterized in that: also comprise packaging frame sheet base, one of them electrode is connected with packaging frame sheet base, this base is connected with one of them pin, the another one electrode is connected with another pin, constitutes a resistance, and described packaging frame sheet base is 92 or the encapsulating structure of 92S type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202146927U CN201741518U (en) | 2010-06-03 | 2010-06-03 | T0-92 and T0-92S encapsulation of NTC thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202146927U CN201741518U (en) | 2010-06-03 | 2010-06-03 | T0-92 and T0-92S encapsulation of NTC thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201741518U true CN201741518U (en) | 2011-02-09 |
Family
ID=43556796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202146927U Expired - Lifetime CN201741518U (en) | 2010-06-03 | 2010-06-03 | T0-92 and T0-92S encapsulation of NTC thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201741518U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751061A (en) * | 2011-04-22 | 2012-10-24 | 苏州锐龙塑胶五金制品有限公司 | Thermistor packaging technology |
| CN104501981A (en) * | 2014-12-10 | 2015-04-08 | 北京七芯中创科技有限公司 | Temperature sensor chip with communication function |
-
2010
- 2010-06-03 CN CN2010202146927U patent/CN201741518U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751061A (en) * | 2011-04-22 | 2012-10-24 | 苏州锐龙塑胶五金制品有限公司 | Thermistor packaging technology |
| CN104501981A (en) * | 2014-12-10 | 2015-04-08 | 北京七芯中创科技有限公司 | Temperature sensor chip with communication function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110209 |
|
| CX01 | Expiry of patent term |