CN208171318U - A kind of thermostatically controlled sensor die block device - Google Patents
A kind of thermostatically controlled sensor die block device Download PDFInfo
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- CN208171318U CN208171318U CN201820760669.4U CN201820760669U CN208171318U CN 208171318 U CN208171318 U CN 208171318U CN 201820760669 U CN201820760669 U CN 201820760669U CN 208171318 U CN208171318 U CN 208171318U
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- sensor
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- die block
- block device
- thermostatically controlled
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Abstract
A kind of thermostatically controlled sensor die block device provided by the utility model, including groove body are packaged with sensor module and insulating materials wherein in groove body, and the horizontal plane of insulating materials is higher than the horizontal plane of sensor module；Sensor die block device is encapsulated in groove body by the structure by insulating materials; the sensor environment partition method of the innovation; do not influencing the case where product batch metaplasia produces; sensor reliably working is protected to the greatest extent; due to no longer needing using three-proofing coating coating operation; material cost of labor is greatly reduced, while environmental pollution greatly reduces.It solves existing technologies to cause serious pollution to the environment, to the adverse effect of direct labor's health.
Description
Technical field
The utility model belongs to electronic information technical field, is related to a kind of thermostatically controlled sensor die block device.
Background technique
With the rapid development of new and high technology, more and more places need to use intelligentized control method, in actual technology
The important role of various types of sensors performer in intelligentized control method in.In order to enable product energy in tradition application
Continually changing environment is adapted to greatest extent, generally requiring the relatively expensive sensor of selection price, wherein sensor makes
It is important a technical indicator with environment temperature, directly decides the reliability of product entirety and the adaptability to environment.Separately
Outside, sensor exists in harsh environment to dust-proof, moisture-proof, and Corrosion Protection has an objective demand, conventional mopping or
Gluing mode undoubtedly will cause great pollution to environment, and can adversely affect to the health of direct labor.
Summary of the invention
The purpose of this utility model is to provide a kind of thermostatically controlled sensor die block devices, solve existing sensor
Existing in harsh environment has objective demand, conventional mopping or gluing mode to dust-proof, moisture-proof and Corrosion Protection
Great pollution undoubtedly will cause to environment, and unfavorable defect can be caused to the health of direct labor.
In order to achieve the above object, the technical solution adopted in the utility model is：
A kind of thermostatically controlled sensor die block device provided by the utility model, including groove body are packaged with biography in groove body
Sensor module and insulating materials；Wherein, sensor module package is in insulating materials.
Preferably, sensor module includes sensor, substrate and pin, and sensor integration is on an end face of substrate；Draw
Foot is integrated in the other end of substrate, including the first pin, and the Interface for digital communication of a termination sensor of the first pin is another
Terminate external control devices.
Preferably, substrate and sensor are packaged in insulating materials.
Preferably, sensor module further includes constant temperature control circuit, and there are two constant temperature control circuit settings, is with sensor
It is centrosymmetrically arranged, and is integrated on substrate；Constant temperature control circuit connects external control by the second pin being integrated on substrate
Equipment.
Preferably, constant temperature control circuit includes the triode Q1 of model 8050, and the base stage of triode Q1 passes sequentially through electricity
Resistance R3, HEAT pin connects one end of second pin (42), another termination external control devices of second pin (42)；Triode Q1
Collector power supply+5V is connect by parallel resistance R1 and resistance R2, the emitter ground connection of triode Q1, meanwhile, resistance R3 is also logical
Cross resistance R4 altogether.
Preferably, the model Kraft spy K-9761 of insulating materials.
Preferably, groove body is prepared by brass or ABS engineering plastics.
Compared with prior art, the utility model has the beneficial effects that：
A kind of thermostatically controlled sensor die block device provided by the utility model, passes through insulation for sensor die block device
Material package is in groove body, the sensor environment partition method of the innovation, is not influencing the case where product batch metaplasia produces, maximum
Degree protects sensor reliably working, and due to no longer needing using three-proofing coating coating operation, material cost of labor substantially drops
It is low, while environmental pollution greatly reduces.It solves existing technologies to cause serious pollution to the environment, to the unfavorable shadow of direct labor's health
It rings.
Further, the sensor device of the utility model design greatly extends the plastic range to sensor, should
Thermostatic control mode is used in structure, by physics stationary temperature state so that developer need not select again it is at high cost
The sensor of length of high and procurement cycle, and the staking-out work to sensor is greatly simplified by the device, so that research and development
With the big reduction of production cycle cost of labor；In actual product production, the failure of sensor can be allowed using thermostatic control mode
Rate reduces by 20%, while production test efficiency improves twice.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of sensor die block device；
Fig. 2 is the circuit diagram of constant temperature control circuit；；
Wherein, 1, sensor 2, constant temperature control circuit 3, substrate 41, the first pin 42, second pin 5, insulation material
Expect 6, groove body.
Specific embodiment
The utility model is described in detail with reference to the accompanying drawings and detailed description.
As shown in Figure 1, a kind of thermostatically controlled sensor die block device provided by the utility model, improvements be by
Present Sensor Temperature Compensation mode is changed to guarantee the mode of physics steady state by algorithmic approach.
Specifically：Sensor die block device provided by the utility model, including sensor module, insulating materials 5 and groove body
6, wherein sensor module includes sensor 1, constant temperature control circuit 2, substrate 3 and pin 4, sensor 1 and constant temperature control circuit
2 are integrated on an end face of substrate 3, and there are two the settings of constant temperature control circuit 2, are arranged symmetrically centered on sensor 1；Substrate 3
Other end on integrate there are two pin, respectively the first pin 41 and second pin 42.
The Interface for digital communication of sensor 1 connects one end of the first pin 41, the other end of the first pin 41 and external control
Equipment connection, for acquiring the observed quantity data and temperature data of sensor 1 in real time, collected temperature data passes through external control
After control equipment calculates, the HEAT signal pins signal of constant temperature control circuit 2 is driven, completes the thermostatic control to module.
It is connect by the HEAT signaling interface with constant temperature control circuit 2, for completing the computer heating control to entire module；
As shown in Fig. 2, constant temperature control circuit includes the triode Q1 of model 8050, the base stage of triode Q1 is passed sequentially through
Resistance R3, HEAT signaling interface are connect with one end of second pin 42, the other end external control devices connection of second pin 42；
The collector of triode Q1 meets power supply+5V by parallel resistance R1 and resistance R2, and the emitter of triode Q1 is grounded, meanwhile, electricity
Resistance R3 also passes through resistance R4 altogether.
When HEAT high level, Q1 triode 8050 is connected, and+5V power supply is added on two power resistance R1 and R2 in parallel, by
It is very big in electric current, R1 and R2 can be hindered by power generate heat；
When HEAT low level, Q1 triode 8050 is turned off, and no electric current flows through on power resistance R1 and R2, and power hinders R1 at this time
With do not generate heat on R2；The structure realizes the function of heated at constant temperature by the low and high level variation of HEAT pin.
Sensor module is placed in groove body 6, and the insulating materials 5 of model Kraft spy K-9761 is injected in groove body 6,
Meanwhile the liquid level of insulating materials 5 is higher than the horizontal plane of substrate 3.
A kind of preparation method of thermostatically controlled sensor die block device provided by the utility model is as follows：
Sensor 1 and constant temperature control circuit 2 are designed together, are integrated on one piece of substrate 3 jointly；Connect on the substrate 3
Pin 4 is connected, and the module that this is combined is put into designed encapsulation groove body 6, sensor 1 is horizontal in encapsulation groove body 6
Facial planes；The insulating materials 5 modulated is injected in the encapsulation groove body 6 being prepared by brass or ABS engineering plastics, and is covered
Substrate 3 stands and places so that bubble is discharged, guarantees that circuit part is completely submerged.The module got ready is put into heating incubator, into
Row forming and hardening, upper tooling device carries out 24 hours roasting machines after the completion of solidification.
The module being entirely cured and packaged is inverted into 180 degree when use, pin 4 is inserted on system board, on system board
After electricity, 3 control module of constant temperature control circuit is under temperature constant state in module.
Since sensor 1 and insulating materials 5 are solidified togather, entire inside modules operating temperature is consistent, so that in the external world
Sensor 1 is still able to maintain preferable stable accuracy output when environment changes.
Simultaneously as sensor 1 and the external world are completely isolated, so that sensing is anti-aging, impact resistance becomes very good, is
The reliability of system and service life greatly improve.
Claims (7)
1. a kind of thermostatically controlled sensor die block device, which is characterized in that including groove body (6), be packaged with sensing in groove body (6)
Device module and insulating materials (5)；Wherein, sensor module package is in insulating materials (5).
2. a kind of thermostatically controlled sensor die block device according to claim 1, which is characterized in that sensor module packet
Sensor (1), substrate (3) and pin are included, sensor (1) is integrated on an end face of substrate (3)；Pin is integrated in substrate (3)
Other end, including the first pin (41), the Interface for digital communication of termination sensor (1) of the first pin (41) is another
Terminate external control devices.
3. a kind of thermostatically controlled sensor die block device according to claim 2, which is characterized in that substrate (3) and biography
Sensor (1) is packaged in insulating materials (5).
4. a kind of thermostatically controlled sensor die block device according to claim 2, which is characterized in that sensor module is also
Including constant temperature control circuit (2), there are two constant temperature control circuit (2) settings, is arranged symmetrically centered on sensor (1), and collect
At on substrate (3)；Constant temperature control circuit (2) connects external control devices by the second pin (42) being integrated on substrate (3).
5. a kind of thermostatically controlled sensor die block device according to claim 4, which is characterized in that constant temperature control circuit
Triode Q1 including model 8050, the base stage of triode Q1 pass sequentially through resistance R3, HEAT pin and connect second pin (42)
One end, another termination external control devices of second pin (42)；The collector of triode Q1 passes through parallel resistance R1 and electricity
Resistance R2 meets power supply+5V, and the emitter of triode Q1 is grounded, meanwhile, resistance R3 also passes through resistance R4 altogether.
6. a kind of thermostatically controlled sensor die block device according to claim 1, which is characterized in that insulating materials (5)
Model Kraft spy K-9761.
7. a kind of thermostatically controlled sensor die block device according to claim 1, which is characterized in that groove body (6) is by Huang
Copper or ABS engineering plastics are prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820760669.4U CN208171318U (en) | 2018-05-21 | 2018-05-21 | A kind of thermostatically controlled sensor die block device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820760669.4U CN208171318U (en) | 2018-05-21 | 2018-05-21 | A kind of thermostatically controlled sensor die block device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208171318U true CN208171318U (en) | 2018-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820760669.4U Active CN208171318U (en) | 2018-05-21 | 2018-05-21 | A kind of thermostatically controlled sensor die block device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113410141A (en) * | 2021-06-03 | 2021-09-17 | 上海丸旭电子科技有限公司 | Method for reducing coating bubble rate of three-proofing paint of QFP (quad Flat Package) packaged integrated circuit chip |
-
2018
- 2018-05-21 CN CN201820760669.4U patent/CN208171318U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113410141A (en) * | 2021-06-03 | 2021-09-17 | 上海丸旭电子科技有限公司 | Method for reducing coating bubble rate of three-proofing paint of QFP (quad Flat Package) packaged integrated circuit chip |
| CN113410141B (en) * | 2021-06-03 | 2022-03-22 | 上海丸旭电子科技有限公司 | Method for reducing coating bubble rate of three-proofing paint of QFP (quad Flat Package) packaged integrated circuit chip |
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