CN102548312B - The method of a kind of high overload recorder local segmentation embedding - Google Patents
The method of a kind of high overload recorder local segmentation embedding Download PDFInfo
- Publication number
- CN102548312B CN102548312B CN201110436481.7A CN201110436481A CN102548312B CN 102548312 B CN102548312 B CN 102548312B CN 201110436481 A CN201110436481 A CN 201110436481A CN 102548312 B CN102548312 B CN 102548312B
- Authority
- CN
- China
- Prior art keywords
- embedding
- steel body
- circuit board
- printed circuit
- little steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Abstract
A method for high overload recorder local segmentation embedding, the method comprises: according to the structure printing part, little steel body structure reasonable in design; According to actual needs, steel body case reasonable in design; Part embedding will be printed in little steel body; Little steel body is fixed on the centre position of steel body case and embedding completes four large steps.The present invention, by adopt unique formula bi-component epoxide-resin by first by recorder embedding in little steel body structure, and then this small shell is placed in large housing carries out secondary embedding, under the prerequisite reaching overall embedding effect, reduce epoxy resin effect of stress to printed circuit board and electronic devices and components under solidification process or high and low temperature environment, improve finished product rate.
Description
Technical field
The present invention relates to a kind of technical-constructive design method of high overload recorder, be specifically related to the method for a kind of high overload recorder local segmentation embedding, it is on the basis of existing dosing technology, reduces the stress influence of embedding raw material-epoxy resin to printed circuit board and electronic devices and components under the prerequisite ensureing overload-resistant buffer capacity.
Background technology
In recent years, along with the development of controlled arrow bullet technology, embedded system is widely used in these products with its low-power consumption, high-performance, the feature such as real-time.But test monitoring or the limitation run because of its operational environment of these products make technical staff follow the tracks of and record, so recorder just becomes the essential device of arrow bullet Real-Time Monitoring on a kind of bullet by real-time live.
The device becoming arrow bullet must possess following characteristics:
1) very high anti-overload ability.
2) independently-powered ability.
3) independently data store and the ability of recovery.
4) long standby storage capacity.
Make rapid progress the today of developing in present electronic technology, along with the appearance of low-power consumption MCU and electric power management circuit, above 2-4 bar all can obtain reasonable realization, here no longer illustrate, but anti-overload ability is often because the impact of the factors such as the process structure of product own, electronic circuit printed board, electronic devices and components, welding procedure can not get good realization.
In order to improve overload capacity, general way be by debugging, pass the test the airtight embedding of recorder in steel body structure.Embedding thing is generally bi-component epoxide-resin, but often because epoxy resin produces the effect of stress of horizontal or vertical direction under solidification process or high-low-temperature environmental testing to printed circuit board and electronic devices and components, solder joint, components and parts etc. in printed board are caused to be subject to damage to a certain extent, affect the normal work of product, the rate of finished products of product is very low.
Summary of the invention
The object of the present invention is to provide the method for a kind of high overload recorder local segmentation embedding, it reduces epoxy resin effect of stress to printed circuit board and electronic devices and components under solidification process or high and low temperature environment.
Technical solution of the present invention is:
A method for high overload recorder local segmentation embedding, its special character is, the method comprises:
1] according to the structure printing part, little steel body structure reasonable in design;
2] according to actual needs, steel body case reasonable in design;
3] part embedding will be printed in little steel body;
4] little steel body is fixed on the centre position of steel body case and embedding completes.
Bi-component epoxide-resin embedding is used in above-mentioned embedding; Its bi-component epoxide-resin formula is epoxy resin and aromatic amine curing agent is the proportions of 1.8 ~ 2.2 ﹕ 1 with weight proportion.
Above-mentioned printing part reduces the area of veneer printed circuit board to greatest extent, and it is designed to the stress that circle makes it reduce from all directions to greatest extent.
Above-mentioned epoxy resin and aromatic amine curing agent are good with the proportions that weight proportion is 2 ﹕ 1.
Above-mentioned printed circuit board is polylith, adopts silver-plated silk to connect between printed circuit board, and the communication signal between printed circuit board is low speed signal as far as possible and reduces interface quantity as best one can.
The bi-component epoxide-resin of the present invention's unique formula by first by recorder embedding in little steel body structure, and then this small shell is placed in large housing carries out secondary embedding, under the prerequisite reaching overall embedding effect, reduce the impact of epoxy resin on printed circuit board and electronic devices and components, improve finished product rate.
The invention has the advantages that:
1) adopt and separate dosing technology and bi-component epoxide-resin unique formula, epoxy resin effect of stress to printed circuit board and electronic devices and components under solidification process or high and low temperature environment can be greatly reduced.
2) additional housing substantially increases the external ability of being hit of recorder complete machine, improves the actual survival ability of product complete machine.
3) adopt overall dosing technology technology, complete machine is had bear the ability of high overload performance, also improve the sealing of recorder, protection against the tide, the performance such as shockproof simultaneously, improve the reliability of product.
A kind of high overload record instrument that empirical tests the present invention makes can bear the high overload of 10000G.
Accompanying drawing explanation
Fig. 1 is nesting type structure schematic diagram of the present invention;
Fig. 2 is an embedding physical model;
Fig. 3 is twice embedding physical model;
Fig. 4 is printed circuit board fabric communication schematic diagram of the present invention.
Embodiment
See Fig. 1, shell of the present invention adopts nesting type structure design, reduces the stress influence to printed circuit board and electronic devices and components in Curing Process of Epoxy or high and low temperature environment.
1) according to the structure printing part, little steel body structure reasonable in design.
2) steel body case according to actual needs, reasonable in design.
3) part embedding will be printed in little steel body.
4) little steel body is fixed on the centre position of steel body case and embedding.
Suppose that the cumulative volume of embedding epoxy resin is V, expansion ratio corresponding to unit volume is K, and the expanding volume that so an embedding produces is V △=V*K, and the stress coefficient that unit volume expansion produces is M, then its stress F=M*V △ finally produced.
Physical model can be set up see Fig. 2 according to the method for an embedding:
If adopt local segmentation embedding, due to the separation of steel body case, suppose that the epoxy resin volume of first time embedding is V1, the epoxy resin volume of second time embedding is V2, then its expanding volume is V1 △=V1*K, V2 △=V2*K, its stress finally produced is F1=M*V1 △, F2=M*V2 △.
Due to V=V1+V2, then V1 △ <V △, so can draw to draw a conclusion from F=M*V △, F1=M*V1 △:
F1<F
Namely the epoxy resin of first time embedding is less than to the stress that printed circuit board and electronic devices and components produce the stress that embedding epoxy resin produces printed circuit board and electronic devices and components, and the stress that produces of second time embedding on printed circuit board and electronic devices and components almost without affecting.
Method according to twice segmentation embedding can set up physical model see Fig. 3.
Suppose that twice segmentation embedding is S, then S=F1/F=V1/V with the ratio of an embedding epoxy resin to the stress that printed circuit board and electronic devices and components produce, obviously, S is less, and the stress that epoxy resin produces printed circuit board and electronic devices and components is less.
Adopt foil gauge to carry out strain contrast test to above two kinds of encapsulating methods, verify above reasoning by the STRESS VARIATION amount analyzing epoxy resin suffered by foil gauge under distinct methods, test method and analysis data as follows:
Test method:
1) foil gauge is arranged on test bracket, requires respectively foil gauge to be installed at horizontal plane, vertical plane.
2) foil gauge mounting bracket is placed in housing.
3) by epoxy resin bi-component ratio preparation epoxide-resin glue.
4) by two kinds of distinct methods, the epoxy resin that proportioning is good is circulated in different housings, foil gauge is drawn out to outside housing, with instrument, foil gauge is measured in Curing Process of Epoxy, thermocycling, derived the dependent variable of foil gauge by foil gauge change in resistance.
Same foil gauge (R=1000 Ω is adopted in test, K=2.18), ε=△ R/(R*K) can be derived from formula △ R/R=K* ε (ε is dependent variable, and K is the coefficient of strain), thus calculating the dependent variable of two kinds of dosing technology epoxy resin generations, test data is in table 1.
Dependent variable contrast test data in table 1 two kinds of dosing technologies
Can see from test data, epoxy resin is split embedding for twice and is obviously reduced the stress that printed circuit board and electronic devices and components produce than an embedding.
Epoxy resin bi-component is carried out to the allotment of optimal proportion, make the coagulum anti-overload ability after solidification reach maximum, epoxy resin hardness >70 ShoreD, impact strength >13KJ/m
2, simultaneously less to the stress influence of printed circuit board and electronic devices and components.
By testing epoxy resin bi-component different ratio ratio, select bi-component optimum weight ratio can reach above requirement, test method and test data as follows:
Test method:
1) foil gauge is arranged on test bracket, requires respectively foil gauge to be installed at horizontal plane, vertical plane.
2) foil gauge mounting bracket is placed in housing.
3) by epoxy resin bi-component ratio preparation H1, H2 two kinds of epoxide-resin glues.
4) H1, H2 epoxy resin sealant is circulated in same housing, foil gauge is drawn out to outside housing, with instrument, foil gauge is measured in adhesive curing process, high-temperature test, low-temperature test, and derive the dependent variable of foil gauge by foil gauge change in resistance.
Adopt same foil gauge (R=1000 Ω, K=2.18) in test, can calculate from ε=△ R/(R*K) dependent variable that different rings epoxy resins produces under different conditions, test data is in table 2.
Table 2 bi-component different ratio ratio epoxy resin dependent variable test data
In the scope that product structure allows, reduce the area of veneer printed circuit board to greatest extent, and be designed to the stress that circle makes it reduce from all directions to greatest extent.If one piece of printed circuit board cannot meet device layout, can be polylith by Printed Circuit Board Design, adopt silver-plated silk to connect between printed circuit board, the communication signal between printed circuit board be low speed signal as far as possible and reduces interface quantity as best one can, see Fig. 4.
Claims (1)
1. a method for high overload recorder local segmentation embedding, it is characterized in that, the method comprises:
1] according to the structure printing part, little steel body structure reasonable in design;
2] according to actual needs, steel body case reasonable in design;
3] part embedding will be printed in little steel body;
4] little steel body is fixed on the centre position of steel body case and embedding completes;
Described printing part reduces the area of veneer printed circuit board to greatest extent, and it is designed to the stress that circle makes it reduce from all directions to greatest extent;
Bi-component epoxide-resin embedding is used in described embedding; Its bi-component epoxide-resin formula is epoxy resin and aromatic amine curing agent is the proportions of 2 ︰ 1 with weight proportion;
Described printed circuit board is polylith, adopts silver-plated silk to connect between printed circuit board, and the communication signal between printed circuit board is low speed signal as far as possible and reduces interface quantity as best one can.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110436481.7A CN102548312B (en) | 2011-12-23 | 2011-12-23 | The method of a kind of high overload recorder local segmentation embedding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110436481.7A CN102548312B (en) | 2011-12-23 | 2011-12-23 | The method of a kind of high overload recorder local segmentation embedding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102548312A CN102548312A (en) | 2012-07-04 |
| CN102548312B true CN102548312B (en) | 2015-09-23 |
Family
ID=46353908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110436481.7A Active CN102548312B (en) | 2011-12-23 | 2011-12-23 | The method of a kind of high overload recorder local segmentation embedding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102548312B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657312A (en) * | 2016-03-18 | 2016-06-08 | 西安奇维科技股份有限公司 | High-reliability video recording device |
| CN106852055A (en) * | 2017-02-07 | 2017-06-13 | 西安奇维科技有限公司 | A kind of encapsulating method of medium-sized high overload tape deck |
| CN109065081B (en) * | 2018-08-24 | 2021-10-29 | 湖北三江航天险峰电子信息有限公司 | Storage device resistant to large overload impact and preparation method thereof |
| CN111061222A (en) * | 2019-12-30 | 2020-04-24 | 扬州大学 | Ultrasonic composite electromachining process parameter detection system |
| CN114007358A (en) * | 2021-10-27 | 2022-02-01 | 湖北三江航天险峰电子信息有限公司 | Data link device suitable for high-overload impact environment and encapsulation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1226590A (en) * | 1998-02-18 | 1999-08-25 | 中国科学院化学研究所 | Epoxy fill-sealing materials cured by liquid aromatic amine and preparation thereof |
| CN102279014A (en) * | 2011-06-29 | 2011-12-14 | 中北大学 | Design method of shock-resistance protection shell structure of test equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005043928B4 (en) * | 2004-09-16 | 2011-08-18 | Sharp Kk | Optical semiconductor device and method for its production |
| CN101985515B (en) * | 2010-06-30 | 2012-06-13 | 苏州贝得科技有限公司 | Refrigerant-resistant sealing glue for high-voltage motor and preparation method thereof |
-
2011
- 2011-12-23 CN CN201110436481.7A patent/CN102548312B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1226590A (en) * | 1998-02-18 | 1999-08-25 | 中国科学院化学研究所 | Epoxy fill-sealing materials cured by liquid aromatic amine and preparation thereof |
| CN102279014A (en) * | 2011-06-29 | 2011-12-14 | 中北大学 | Design method of shock-resistance protection shell structure of test equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102548312A (en) | 2012-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102548312B (en) | The method of a kind of high overload recorder local segmentation embedding | |
| CN205049166U (en) | Maglev train suspension sensor static characteristic test system | |
| CN113885394A (en) | Airborne data comprehensive acquisition and recording system and method | |
| CN106771362B (en) | A kind of uniaxial, integral type strapdown acceleration measurement device | |
| CN203535549U (en) | BMC module applicable to application of multiple server main boards | |
| CN103049048B (en) | Method for designing high-density blade server by using Compact Peripheral Component Interconnect-Serial.0 (CPCI-S.0) standard | |
| CN209673296U (en) | A kind of containment bulge test parameter acquisition devices | |
| CN207908047U (en) | Motor NVH based on LabView tests system | |
| CN207050782U (en) | A kind of extractive equipment intelligent detection device | |
| CN207964240U (en) | A kind of wireless pressure tester for high-speed wind tunnel rotating model | |
| CN203349854U (en) | High precision digital sensor calibration test system based on PC machine | |
| CN203276525U (en) | Embedded test system convenient for near-field data transmission | |
| CN208171318U (en) | A kind of thermostatically controlled sensor die block device | |
| CN204374814U (en) | A kind of aquaculture is large data monitoring system in real time | |
| CN204832891U (en) | High performance multipurpose treater card | |
| CN203616475U (en) | Device for measuring landing speed of air-dropped product through radio fuses | |
| CN203385751U (en) | Acceleration sensor | |
| CN103049616B (en) | Surface mount microwave device emulation design method | |
| CN108332935A (en) | A kind of wireless pressure tester and pressure testing method for high-speed wind tunnel rotating model | |
| CN206450769U (en) | A kind of multifunction wireless high-voltage nuclear phase instrument | |
| CN203659202U (en) | Dynamic signal collector under high-overload environment | |
| CN205580373U (en) | Bearing position moves measuring device | |
| CN105403830A (en) | DSP-based stroke test system of high-voltage circuit breaker | |
| CN204359842U (en) | A kind of computer based cable data tester | |
| CN208921275U (en) | A kind of built-in antenna type wireless vibration sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 710077 Xi'an high tech Zone, Jin Industrial Road, No., No. C Venture Park, No. 8, Patentee after: Xi'an Qiwei Technology Co. Ltd. Address before: 710077 Xi'an high tech Zone, Jin Industrial Road, No., No. C Venture Park, No. 8, Patentee before: Xi'an Keyway Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170928 Address after: 710065 Xi'an high tech Zone, Jin Industrial Road, No., No. C Venture Park, No. 8, Co-patentee after: Beijing Polytechnic Leike Electronic Information Technology Co., Ltd. Patentee after: Xi'an Qiwei Technology Co. Ltd. Address before: 710077 Xi'an high tech Zone, Jin Industrial Road, No., No. C Venture Park, No. 8, Patentee before: Xi'an Qiwei Technology Co. Ltd. |
|
| TR01 | Transfer of patent right |