CN203659202U - Dynamic signal collector under high-overload environment - Google Patents

Dynamic signal collector under high-overload environment Download PDF

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Publication number
CN203659202U
CN203659202U CN201320884592.9U CN201320884592U CN203659202U CN 203659202 U CN203659202 U CN 203659202U CN 201320884592 U CN201320884592 U CN 201320884592U CN 203659202 U CN203659202 U CN 203659202U
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China
Prior art keywords
module
dynamic signal
data
device under
acquisition device
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Expired - Fee Related
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CN201320884592.9U
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Chinese (zh)
Inventor
吴瑞斌
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BEIJING SPACE STAR TECHNOLOGY EQUIPMENT Co
China Academy of Launch Vehicle Technology CALT
Beijing Institute of Structure and Environment Engineering
Original Assignee
BEIJING SPACE STAR TECHNOLOGY EQUIPMENT Co
China Academy of Launch Vehicle Technology CALT
Beijing Institute of Structure and Environment Engineering
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Application filed by BEIJING SPACE STAR TECHNOLOGY EQUIPMENT Co, China Academy of Launch Vehicle Technology CALT, Beijing Institute of Structure and Environment Engineering filed Critical BEIJING SPACE STAR TECHNOLOGY EQUIPMENT Co
Priority to CN201320884592.9U priority Critical patent/CN203659202U/en
Application granted granted Critical
Publication of CN203659202U publication Critical patent/CN203659202U/en
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Abstract

The utility model belongs to the technical field of signal collection, and specifically relates to a dynamic signal collector under a high-overload environment, which aims at solving a problem that an existing data collector is not applicable to application occasions with high condition requirements such as small size, limited space, environment overload and impact. The dynamic signal collector is characterized by comprising a signal collecting front end module, a data coding module, a data storage module, a data transmission module, a power supply management module and a housing. The dynamic signal collector disclosed by the utility model adopts the collecting front end module, the data coding module, the data storage module and the data transmission module to realize dynamic signal collection. The housing consisting of an external metal box, an internal metal box and a metal damping spring is adopted, so that a circuit board can be used without being damaged under the environment with high impact and great overload. Being verified by a laboratory test and actual use, the dynamic signal collector under the high-overload environment is not damaged under 2.5- Mach 30-second overload and impact.

Description

Dynamic signal acquisition device under a kind of high overload environment
Technical field
The utility model belongs to Signal Collection Technology field, is specifically related to the dynamic signal acquisition device under a kind of high overload environment.
Background technology
Existing data acquisition unit is changed the simulating signals such as vibration, impact, noise, pressure, displacement, be encoded into after digital signal, then is stored, processes, shown by the solid-state memory such as computing machine or FLASH.The main task of Data Acquisition Design is, the simulation of pick-up transducers output number also converts the digital quantity that calculates function identification to, sends into computing machine, need to carry out corresponding calculating and processing by computing machine according to difference, obtains required data.
Current data acquisition unit generally has two kinds of implementations.One is based on conventional P C framework, adopts single-chip microcomputer or DSP to carry out Based Intelligent Control.SCM Based mode control is relatively flexible, but is limited to its lower clock frequency, and acquisition function can be subject to considerable restraint as sampling channel number and sampling rate.Adopt the fast operation of DSP mode, be good at and process intensive multiply-add operation, but be difficult to peripheral complex hardware logic control.Various functions when these two kinds of modes are moved all will lean on the operation of software to realize, and the running software time accounts for very large ratio in the whole sampling time, and efficiency is low, is difficult to adapt to the requirement of high speed data acquisition system.And all also has very large deficiency at the speed of the extendability of memory capacity, storage, reliability, fault-tolerance, the dirigibility of configuration, the aspects such as adaptability that take up room.Another kind of framework is to adopt FPGA to realize collection and the storage of data as main control chip.The integrated scale of FPGA is larger, is applicable to the various logic circuitry such as sequential, combination application scenario, have concurrently string, concurrent working mode and high integration, at a high speed, the feature such as high reliability.Its major defect is that steering logic programming realizes more complicated, and its interface peripheral hardware kind of supporting is less, and business-like IP kernel is expensive, and poor expandability.
In implementation, most of data acquisition units adopt board plug type design, realize data acquisition by data collecting plate card.Be characterized in, data acquisition unit board is directly connected with the form of plug-in card and the mainboard of supervisory control comuter, and the standardized slot of the general employing of this implementation, can select the data collecting plate card adapting according to different needs.But the data acquisition unit that adopts board mode is installed trouble, is subject to the interference of environment in cabinet, can not adapt to limited space, the severe use occasion of environment.Existing a kind of plank frame data collecting plate card as shown in Figure 1.These acquisition system complicated structures, cost is higher, is applicable to standardized industrial applications.
Existing data acquisition unit is fewer to the consideration of applied environment, along with aerospace and the development of technology such as communicating by letter, in fields such as rocket, guided missile, large aircraft, high-speed railways, the requirement of data acquisition process is improved constantly, the higher application scenario of the conditional requests such as existing data acquisition unit is narrow and small at volume, limited space, environment overload and impact cannot be suitable for.
Summary of the invention
The purpose of this utility model is to solve the problem that the higher application scenario of the conditional requests such as existing data acquisition unit, limited space narrow and small at volume, environment overload and impact cannot be applicable, and the dynamic signal acquisition device under a kind of high overload environment is provided.
The utility model is achieved in that
A dynamic signal acquisition device under high overload environment, it comprises signals collecting front-end module, data coding module, data memory module, data transmission module, power management module and shell; Wherein, signals collecting front-end module is connected with data coding module and power management module respectively, data coding module is connected with power management module, also be connected with data memory module by internal bus, data transmission module is connected with power management module, and signals collecting front-end module, data coding module, data memory module, data transmission module and power management module are installed in the enclosure.
Signals collecting front-end module as above comprises charge type, single-ended voltage mode, differential electrical die mould three class signal conditioning circuits.
Data coding module as above is built and is adjusted circuit realization by amplifier AD8231.
Data transmission module as above uses Ethernet interface or RS422 mouth.
Data transmission module network interface as above uses the compatible fast Ethernet controller of NE2000.
Signals collecting front-end module as above, data coding module, data memory module, data transmission module and power management module are all produced on circuit board; Described shell comprises outer can, interior can and metal shock reducing spring; Circuit board is arranged in interior can, between circuit board and interior can, vibration isolation rubber is installed; Interior can adopts fluid sealant to carry out embedding; Interior metal box is arranged in outer can, between metal Nell wall outside and interior can outer wall, installs metal shock reducing spring additional.
The in-plane of circuit board as above is subject to force direction towards overload.
The inner rubber damping pad of filling of outer can as above.
The beneficial effects of the utility model are:
The utility model adopts and gathers front-end module, data coding module, data memory module and data transmission module, has realized dynamic signal acquisition.Adopt the shell that formed by outer can, interior can and metal shock reducing spring, circuit board can be used under the environment of the large overload of HI high impact and not impaired.Use checking through laboratory test with actual, the dynamic signal acquisition device under high overload environment of the present utility model has stood the not damage with impact of 2.5 Mach of overloads of 30 seconds.
Accompanying drawing explanation
Fig. 1 is the circuit part structure principle chart of the dynamic signal acquisition device under a kind of high overload environment of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, the dynamic signal acquisition device under a kind of high overload environment of the present utility model is specifically introduced:
A dynamic signal acquisition device under high overload environment, comprises signals collecting front-end module, data coding module, data memory module, data transmission module, power management module and shell.
Wherein, signals collecting front-end module is connected with data coding module and power management module respectively, and it receives from extraneous high speed analog signal, and signal is carried out to amplitude modulation, filtering, then sends it to data coding module.In the present embodiment, it comprises charge type, single-ended voltage mode, differential electrical die mould three class signal conditioning circuits, is respectively used to adjust the amplitude of the signal that receives, is adjusted in the scope that data coding module can receive.Charge type, single-ended voltage mode, differential electrical die mould three class signal conditioning circuits all can adopt existing techniques in realizing.
Data coding module is connected with power management module, is also connected with data memory module by internal bus, and the signal from signals collecting front-end module is carried out high speed acquisition by it, and the signal collecting is sent to data memory module by internal bus.In the present embodiment, data coding module adopts prior art to build by amplifier AD8231 and adjusts circuit realization.
Data transmission module is connected with power management module, is also connected with peripheral control unit, outwards sends the data of storage under the control of the data reading command that it sends at peripheral control unit.In the present embodiment, data transmission module uses Ethernet interface or RS422 mouth.The compatible fast Ethernet controller of NE2000 that network interface uses Taiwan Asix company to release, adopts 4 lines can realize analog input card data and is transferred on supervisory control comuter by control bus.RS422 mouth uses in transmission range far away from being greater than the occasion of 150 meters.
Power management module is also connected with external power source, the DC voltage that it supplies with outside adopts DC/DC to carry out isolated variable, and the power supply after isolated variable offers internal signal and gathers front-end module, data coding module, data memory module and data transmission module use.
Signals collecting front-end module, data coding module, data memory module, data transmission module and power management module are all produced on circuit board.
Shell comprises outer can, interior can and metal shock reducing spring.Outer can and interior can are stainless steel box, and the size of interior can is less than outer can, and interior can be packed in outer can.Circuit board is arranged in interior can, and the in-plane of circuit board is subject to force direction towards overload, to reduce overload impact.Between circuit board and interior can, vibration isolation rubber is installed, in order to vibration isolation, with the impact of avoiding being rigidly connected and being hit.Adopt fluid sealant to carry out embedding interior can, interior metal box is arranged in outer can, and installs metal shock reducing spring additional between metal Nell wall outside and interior can outer wall, further reduces the interference of impact shock.In a preferred embodiment, the inner rubber damping pad of filling of outer can, all avoids being rigidly connected.Metal shock reducing spring, vibration isolation rubber, fluid sealant and rubber damping pad all can adopt the universal product to realize.
The utility model adopts and gathers front-end module, data coding module, data memory module and data transmission module, has realized dynamic signal acquisition.Adopt the shell that formed by outer can, interior can and metal shock reducing spring, circuit board can be used under the environment of the large overload of HI high impact and not impaired.Use checking through laboratory test with actual, the dynamic signal acquisition device under high overload environment of the present utility model has stood the not damage with impact of 2.5 Mach of overloads of 30 seconds.

Claims (8)

1. the dynamic signal acquisition device under high overload environment, is characterized in that: it comprises signals collecting front-end module, data coding module, data memory module, data transmission module, power management module and shell; Wherein, signals collecting front-end module is connected with data coding module and power management module respectively, data coding module is connected with power management module, also be connected with data memory module by internal bus, data transmission module is connected with power management module, and signals collecting front-end module, data coding module, data memory module, data transmission module and power management module are installed in the enclosure.
2. the dynamic signal acquisition device under a kind of high overload environment according to claim 1, is characterized in that: described signals collecting front-end module comprises charge type, single-ended voltage mode, differential electrical die mould three class signal conditioning circuits.
3. the dynamic signal acquisition device under a kind of high overload environment according to claim 1, is characterized in that: described data coding module is built and adjusted circuit realization by amplifier AD8231.
4. the dynamic signal acquisition device under a kind of high overload environment according to claim 1, is characterized in that: described data transmission module uses Ethernet interface or RS422 mouth.
5. the dynamic signal acquisition device under a kind of high overload environment according to claim 4, is characterized in that: described data transmission module network interface uses the compatible fast Ethernet controller of NE2000.
6. the dynamic signal acquisition device under a kind of high overload environment according to claim 1, is characterized in that: described signals collecting front-end module, data coding module, data memory module, data transmission module and power management module are all produced on circuit board; Described shell comprises outer can, interior can and metal shock reducing spring; Circuit board is arranged in interior can, between circuit board and interior can, vibration isolation rubber is installed; Interior can adopts fluid sealant to carry out embedding; Interior metal box is arranged in outer can, between metal Nell wall outside and interior can outer wall, installs metal shock reducing spring additional.
7. the dynamic signal acquisition device under a kind of high overload environment according to claim 6, is characterized in that: the in-plane of described circuit board is subject to force direction towards overload.
8. the dynamic signal acquisition device under a kind of high overload environment according to claim 6, is characterized in that: the inner rubber damping pad of filling of described outer can.
CN201320884592.9U 2013-12-30 2013-12-30 Dynamic signal collector under high-overload environment Expired - Fee Related CN203659202U (en)

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Application Number Priority Date Filing Date Title
CN201320884592.9U CN203659202U (en) 2013-12-30 2013-12-30 Dynamic signal collector under high-overload environment

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108151772A (en) * 2017-11-30 2018-06-12 江西洪都航空工业集团有限责任公司 A kind of LVDT signal pickup assemblies and its overload-resistant method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108151772A (en) * 2017-11-30 2018-06-12 江西洪都航空工业集团有限责任公司 A kind of LVDT signal pickup assemblies and its overload-resistant method

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140618

Termination date: 20211230